CN208570585U - A kind of electrified radiator of semiconductor devices - Google Patents
A kind of electrified radiator of semiconductor devices Download PDFInfo
- Publication number
- CN208570585U CN208570585U CN201821410623.6U CN201821410623U CN208570585U CN 208570585 U CN208570585 U CN 208570585U CN 201821410623 U CN201821410623 U CN 201821410623U CN 208570585 U CN208570585 U CN 208570585U
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- radiator
- dust
- semiconductor devices
- battery
- fixed plate
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Abstract
The utility model relates to a kind of electrified radiators of semiconductor devices, including mounting plate, semiconductor devices is equipped at the top of the mounting plate, four corners of the mounting plate are equipped with the first connecting hole, radiator is equipped at the top of the semiconductor devices, four corners of the radiator are equipped with the second connecting hole, collection box is equipped at the top of the radiator, dust-collecting box is equipped at the top of the collection box, the radiator includes the first battery, second battery, the first fixed plate is equipped on the right side of first battery, blowing mouth is equipped at the top of first fixed plate, the second fixed plate is equipped on the left of second battery, dust-exhausting port is equipped at the top of second fixed plate, protection sleeve pipe is respectively connected at the top of the dust-exhausting port, cooling fin is equipped between first fixed plate and the second fixed plate, effective solution heat dissipation, The excessive problem of dust, greatly improves heat dissipation effect, effectively reduces the generation of noise.
Description
Technical field
The utility model relates to a kind of electrified radiators of semiconductor devices, belong to semiconductor heat-dissipating technical field.
Background technique
Currently popular radiator for semiconductor, because of its structure and design principle, all exist different degrees of hot and cold side every
Heat is bad, is unfavorable for dust-separation, is not easy to the defect installed and used, in many electronic equipments, due to having used multi-fan etc. to dissipate
Thermal device is such as cleared up not in time so that entering a large amount of dust inside equipment with radiation air, is easy to cause equipment
There are the problems such as air duct blocking, temperature raising, short circuit etc., and then lead to high failure rate, causes or burning apparatus or unexpected
Various faults or the accidents such as shutdown, and in fact, attached device such as fan itself can also be considered as one of source of trouble, and these
Electronic equipment equipped with fan also issues biggish noise while heat dissipation, needs noiseless work, audio-visual etc. to many
Equal environment cause adverse effect, for this purpose, providing a kind of electrified radiator of semiconductor devices.
Utility model content
The technical problems to be solved in the utility model overcomes existing defect, and the electrification for providing a kind of semiconductor devices dissipates
Thermal can effectively solve the problems in background technique.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solution:
A kind of electrified radiator of semiconductor devices, including mounting plate, the mounting plate top are equipped with semiconductor device
Part, four corners of the mounting plate are equipped with the first connecting hole, and radiator is equipped at the top of the semiconductor devices, described to dissipate
Four corners of thermal are equipped with the second connecting hole, and collection box is equipped at the top of the radiator, is set at the top of the collection box
There is dust-collecting box, the radiator includes the first battery, the second battery, and it is fixed to be equipped with first on the right side of first battery
Plate, the first fixed plate top are equipped with blowing mouth, the second fixed plate are equipped on the left of second battery, and described second is fixed
Be equipped with dust-exhausting port at the top of plate, be respectively connected with protection sleeve pipe at the top of the dust-exhausting port, first fixed plate and the second fixed plate it
Between be equipped with cooling fin, the first fixed plate intracavity bottom is equipped with electric motor, and the electric motor is connected with by rotation axis
Flabellum, the second fixed plate left side are equipped with suction inlet, are symmetrically arranged with support plate, the support in second fixed plate inner cavity
Dust sucting motor is fixedly connected between plate, output end is connected with sweep-up pipe on the right side of the dust sucting motor, and first battery is logical
It crosses conducting wire to connect with electric motor electric wire, second battery is connect by conducting wire with dust sucting motor electric wire.
Furthermore, the position of dust sucting motor left end input port is corresponding with suction inlet position.
Furthermore, the dust-collecting box inner wall is equipped with absorption felt.
Furthermore, the bottom plate of the radiator is heat-conducting plate, and the cooling fin runs through the bottom plate of radiator, and
The cooling fin bottom is equipped with thermally conductive thin plate.
Furthermore, the sweep-up pipe top is corresponding with protection sleeve pipe bottom position, and the protection sleeve pipe top is run through
Collection box, and protrude into inside dust-collecting box.
Furthermore, noise reduction casing is equipped at the top of the blowing mouth, the noise reduction internal surface of sleeve pipe is equipped with sound-absorbing groove
Hole.
The utility model passes through the utility model has the advantages that the utility model relates to a kind of electrified radiator of semiconductor devices
Mounting plate is set, semiconductor devices can be installed on a mounting board, by the first hole in succession, mounting plate can be made to pass through screw
It is connected to inside equipment, is easily installed, by the way that radiator is arranged, radiating treatment can be carried out to semiconductor devices, prevent half
The danger of short circuit occurs for conductor device overheat, extends the service life of semiconductor devices, can by the way that the second connecting hole is arranged
Radiator is fixed at the top of semiconductor devices by screw, radiating treatment is convenient for, prevents when using shaking
Radiator is fallen off, and by the way that collection box is arranged, collection box bottom and radiator perforation are connected, carried out to radiator close
Envelope, preventing the dust of external environment from entering heat sink interior causes heat dissipation effect to decline, can by the way that the first battery is arranged
Energization connection is carried out with electric motor, is rotated by electric motor and flabellum is driven to be blowed, wind-force is blown out by blowing mouth,
The heat of radiator is blown, avoids generation heat aggregation from causing temperature excessively high, while can be by heat sink interior
Dust blown, prevent dust to be attached in radiator inner cavity, by the way that the second fixed plate is arranged, can dust sucting motor will
The heat of heat sink interior is absorbed, while the dust of heat sink interior also being absorbed, and is discharged by dust-exhausting port,
The dust and heat of discharge enter disposal box by protection sleeve pipe, dust will be attached to disposal box by the absorption hair of disposal box
On inner wall, effective solution heat dissipation, dust excessive problem can be generated semiconductor devices by the way that cooling fin is arranged
Heat carries out absorption heat dissipation, greatly improves heat dissipation effect, can be by the noise of electric motor generation by the way that noise reduction casing is arranged
It is filtered, the attraction groove on noise reduction internal surface of sleeve pipe effectively reduces the generation of noise.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.
Fig. 1 is a kind of electrified radiator surface structure schematic diagram of semiconductor devices of the utility model.
Fig. 2 is that a kind of electrified radiator radiator of semiconductor devices of the utility model and collection box split structure
Schematic diagram.
Fig. 3 is the electrified radiator radiator and collection box cross-section structure of a kind of semiconductor devices of the utility model
Schematic diagram.
Figure label: 1, mounting plate；2, semiconductor devices；3, the first connecting hole；4, radiator；5, the second connecting hole；
6, collection box；7, dust-collecting box；8, the first battery；9, the second battery；10, the first fixed plate；11, blowing mouth；12, second is solid
Fixed board；13, dust-exhausting port；14, protection sleeve pipe；15, cooling fin；16, electric motor；17, suction inlet；18, support plate；19, dust suction
Motor；20, sweep-up pipe；21, felt is adsorbed；22, thermally conductive thin plate；23, noise reduction casing.
Specific embodiment
It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
As shown in Figure 1-Figure 3, the electrified radiator of a kind of semiconductor devices, including mounting plate 1 are installed by setting
Semiconductor devices 2 can be mounted on mounting plate 1 by plate 1, and semiconductor devices 2, the installation are equipped at the top of the mounting plate 1
1 four corners of plate are equipped with the first connecting hole 3, by the first hole 3 in succession, mounting plate 1 can be made to set by screw connection
It is standby internal, it is easily installed, radiator 4 is equipped at the top of the semiconductor devices 2, by the way that radiator 4 is arranged, can half-and-half lead
Body device 2 carries out radiating treatment, prevents the overheat of semiconductor devices 2 from the danger of short circuit occurs, extends the use of semiconductor devices 2
Service life, 4 four corners of the radiator are equipped with the second connecting hole 5, by the way that the second connecting hole 5 is arranged, can pass through spiral shell
Radiator 4 is fixed on 2 top of semiconductor devices by silk, is convenient for radiating treatment, prevents heat dissipation when using shaking
Device 4 is fallen off, and collection box 6 is equipped at the top of the radiator 4, by the way that collection box 6,6 bottom of collection box and heat dissipation is arranged
The perforation connection of device 4, is sealed radiator 4, preventing the dust of external environment from entering inside radiator 4 causes to radiate
Effect declines, and dust-collecting box 7 is equipped at the top of the collection box 6, and the radiator 4 includes the first battery 8, the second battery 9,
By be arranged the first battery 8, energization connection can be carried out with electric motor 16, by electric motor 16 rotate drive flabellum into
Wind-force is blown out by blowing mouth 11, the heat of radiator 4 is blown by row blowing, and generation heat aggregation is avoided to cause
Temperature is excessively high, while can blow the dust inside radiator 4, and dust is prevented to be attached in 4 inner cavity of radiator,
It is equipped with the first fixed plate 10 on the right side of first battery 8, is equipped with blowing mouth 11 at the top of first fixed plate 10, described second
On the left of battery 9 be equipped with the second fixed plate 12, by be arranged the second fixed plate 12, can dust sucting motor 19 will be in radiator 12
The heat in portion is absorbed, while the dust inside radiator 4 also being absorbed, and is discharged by dust-exhausting port 13, discharge
Dust and heat pass through protection sleeve pipe 14 and enter disposal box 7, and dust is attached to disposal box by 21 by the absorption hair of disposal box 7
On 7 inner walls, the effective solution excessive problem of heat dissipation, dust can be produced semiconductor devices 2 by the way that cooling fin 15 is arranged
Raw heat carries out absorption heat dissipation, greatly improves heat dissipation effect, and dust-exhausting port 13 is equipped at the top of second fixed plate 12, described
It is respectively connected with protection sleeve pipe 14 at the top of dust-exhausting port 13, cooling fin is equipped between first fixed plate 10 and the second fixed plate 12
15,10 intracavity bottom of the first fixed plate is equipped with electric motor 16, and the electric motor 16 is connected with flabellum by rotation axis,
It is equipped with suction inlet 17 on the left of second fixed plate 12, is symmetrically arranged with support plate 18 in 12 inner cavity of the second fixed plate, it is described
Dust sucting motor 19 is fixedly connected between support plate 18, the 19 right side output end of dust sucting motor is connected with sweep-up pipe 20, described
First battery 8 is connect by conducting wire with 16 electric wire of electric motor, and second battery 9 passes through 19 electricity of conducting wire and dust sucting motor
Line connection.
More specifically, the position of the 19 left end input port of dust sucting motor is corresponding with 17 position of suction inlet, the dust
7 inner wall of box is equipped with absorption felt 21, and dust is attached on 7 inner wall of disposal box by 21 by the absorption hair of disposal box 7, described
The bottom plate of radiator 4 is heat-conducting plate, and the cooling fin 15 runs through the bottom plate of radiator 4, and 15 bottom of the cooling fin is set
There is thermally conductive thin plate 22,20 top of sweep-up pipe is corresponding with 14 bottom position of protection sleeve pipe, and 14 top of protection sleeve pipe is run through
Collection box 6, and protrude into inside dust-collecting box 7, noise reduction casing 23 is equipped at the top of the blowing mouth 11, by the way that noise reduction casing 23 is arranged,
The noise that electric motor 16 generates can be filtered, the attraction groove on 23 inner wall of noise reduction casing effectively reduces noise
Generation 23 inner wall of noise reduction casing be equipped with sound-absorbing recess hole.
Semiconductor devices 2 can be mounted on mounting plate 1, be passed through by mounting plate 1 by utility model works principle
First connecting hole 3 can be such that mounting plate 1 inside equipment, is easily installed by screw connection, can be right by radiator 4
Semiconductor devices 2 carries out radiating treatment, prevents the overheat of semiconductor devices 2 from the danger of short circuit occurs, extends semiconductor devices 2
Radiator 4 can be fixed on 2 top of semiconductor devices by screw, just by the second connecting hole 5 by service life
It in carrying out radiating treatment, prevents the radiator 4 when using shaking from falling off, by collection box 6,6 bottom of collection box and dissipates
The perforation connection of thermal 4, is sealed radiator 4, preventing the dust of external environment from entering inside radiator 4 causes to dissipate
Thermal effect decline, by the first battery 8, can carry out energization connection with electric motor 16, rotate band by electric motor 16
Dynamic flabellum is blowed, and wind-force is blown out by blowing mouth 11, the heat of radiator 4 is blown, avoids that heat occurs
Aggregation causes temperature excessively high, while can blow the dust inside radiator 4, and dust is prevented to be attached to radiator
In 4 inner cavities, by the second fixed plate 12, can dust sucting motor 19 heat inside radiator 12 is absorbed, simultaneously will
Dust inside radiator 4 is also absorbed, and is discharged by dust-exhausting port 13, and the dust and heat of discharge pass through protection sleeve pipe 14
Into disposal box 7,21 are attached to dust on 7 inner wall of disposal box by the absorption hair of disposal box 7, effective solution dissipates
The excessive problem of heat, dust, by cooling fin 15, the heat that can generate semiconductor devices 2 carries out absorption heat dissipation, makes to radiate
Effect greatly improves, and by noise reduction casing 23, can be filtered the noise that electric motor 16 generates, 23 inner wall of noise reduction casing
On attraction groove effectively reduce the generation of noise.
The above are the preferable embodiment of the utility model, the utility model those skilled in the art can also be to upper
It states embodiment to change and modify, therefore, the utility model is not limited to above-mentioned specific embodiment, all abilities
Field technique personnel made any conspicuous improvement, replacement or modification on the basis of the utility model belong to practical
Novel protection scope.
Claims (6)
1. a kind of electrified radiator of semiconductor devices, including mounting plate (1), which is characterized in that mounting plate (1) top
Portion is equipped with semiconductor devices (2), and (1) four corner of the mounting plate is equipped with the first connecting hole (3), the semiconductor devices
(2) top is equipped with radiator (4), and (4) four corners of the radiator are equipped with the second connecting hole (5), the heat dissipation
Collection box (6) are equipped at the top of device (4), are equipped with dust-collecting box (7) at the top of the collection box (6), the radiator (4) includes the
One battery (8), the second battery (9), the first battery (8) right side are equipped with the first fixed plate (10), and described first is solid
Blowing mouth (11) are equipped at the top of fixed board (10), are equipped with the second fixed plate (12) on the left of second battery (9), described second is solid
Dust-exhausting port (13) are equipped at the top of fixed board (12), are respectively connected with protection sleeve pipe (14) at the top of the dust-exhausting port (13), described first is solid
Cooling fin (15) are equipped between fixed board (10) and the second fixed plate (12), the first fixed plate (10) intracavity bottom is equipped with electronic
Motor (16), the electric motor (16) are connected with flabellum by rotation axis, are equipped with dust suction on the left of second fixed plate (12)
Mouthful (17) are symmetrically arranged with support plate (18) in the second fixed plate (12) inner cavity, are fixedly connected between the support plate (18)
Have dust sucting motor (19), output end is connected with sweep-up pipe (20) on the right side of the dust sucting motor (19), and first battery (8) is logical
It crosses conducting wire to connect with electric motor (16) electric wire, second battery (9) is connect by conducting wire with dust sucting motor (19) electric wire.
2. the electrified radiator of a kind of semiconductor devices according to claim 1, it is characterised in that: the dust sucting motor
(19) position of left end input port is corresponding with suction inlet (17) position.
3. the electrified radiator of a kind of semiconductor devices according to claim 1, it is characterised in that: the dust-collecting box
(7) inner wall is equipped with absorption felt (21).
4. the electrified radiator of a kind of semiconductor devices according to claim 1, it is characterised in that: the radiator
(4) bottom plate is heat-conducting plate, and the cooling fin (15) runs through the bottom plate of radiator (4), and the cooling fin (15) bottom is set
There are thermally conductive thin plate (22).
5. the electrified radiator of a kind of semiconductor devices according to claim 1, it is characterised in that: the sweep-up pipe
(20) top is corresponding with protection sleeve pipe (14) bottom position, and collection box (6) are run through on protection sleeve pipe (14) top, and protrude into collection
Dirt box (7) is internal.
6. the electrified radiator of a kind of semiconductor devices according to claim 1, it is characterised in that: the blowing mouth
(11) top is equipped with noise reduction casing (23), and noise reduction casing (23) inner wall is equipped with sound-absorbing recess hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821410623.6U CN208570585U (en) | 2018-08-30 | 2018-08-30 | A kind of electrified radiator of semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821410623.6U CN208570585U (en) | 2018-08-30 | 2018-08-30 | A kind of electrified radiator of semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208570585U true CN208570585U (en) | 2019-03-01 |
Family
ID=65451467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821410623.6U Expired - Fee Related CN208570585U (en) | 2018-08-30 | 2018-08-30 | A kind of electrified radiator of semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208570585U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115802192A (en) * | 2023-01-06 | 2023-03-14 | 福建宝锋电子有限公司 | Heat dissipation shell of wireless interphone and heat dissipation structure thereof |
-
2018
- 2018-08-30 CN CN201821410623.6U patent/CN208570585U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115802192A (en) * | 2023-01-06 | 2023-03-14 | 福建宝锋电子有限公司 | Heat dissipation shell of wireless interphone and heat dissipation structure thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190301 Termination date: 20190830 |