CN216163131U - Heat dissipation mechanism for mechanical automation control cabinet - Google Patents
Heat dissipation mechanism for mechanical automation control cabinet Download PDFInfo
- Publication number
- CN216163131U CN216163131U CN202122256702.4U CN202122256702U CN216163131U CN 216163131 U CN216163131 U CN 216163131U CN 202122256702 U CN202122256702 U CN 202122256702U CN 216163131 U CN216163131 U CN 216163131U
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- Prior art keywords
- heat dissipation
- heat
- control cabinet
- wall
- copper
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 55
- 230000007246 mechanism Effects 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 239000004519 grease Substances 0.000 claims abstract description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 8
- 239000010439 graphite Substances 0.000 claims abstract description 8
- 238000010521 absorption reaction Methods 0.000 claims abstract description 5
- 238000009423 ventilation Methods 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 238000005057 refrigeration Methods 0.000 claims description 5
- 229920000742 Cotton Polymers 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 7
- 238000001914 filtration Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of control cabinets, and particularly relates to a heat dissipation mechanism for a mechanical automation control cabinet. This heat dissipation mechanism of mechanical automation control cabinet, in heat conduction to the copper through heat absorption fin messenger switch board inside heat, in heat conduction graphite flake is conducting the heat to the radiator oil, and make the heat conduction of radiator oil in the copper through the copper pole, on conducting the heat to the radiator fin through heat conduction silicone grease and heat conduction silicone piece, the cold junction through the semiconductor refrigerator descends the gas temperature in to the cooling chamber, thereby make the temperature decline on radiator fin surface, thereby reach and dispel the inside temperature of switch board.
Description
Technical Field
The utility model belongs to the technical field of control cabinets, and particularly relates to a heat dissipation mechanism for a mechanical automation control cabinet.
Background
The control cabinet is formed by assembling switch equipment, measuring instrument, protective electric appliance and auxiliary equipment in a closed or semi-closed metal cabinet or on a screen according to the electric wiring requirement, the arrangement of the control cabinet should meet the requirement of normal operation of an electric power system, the maintenance is convenient, the safety of human bodies and surrounding equipment is not endangered, the circuit can be switched on or switched off by a manual or automatic switch in normal operation, the circuit is switched off or the alarm is given by the protective electric appliance in fault or abnormal operation, various parameters in operation can be displayed by the measuring instrument, certain electric parameters can be adjusted, and the deviation from the normal working state is prompted or signaled and is commonly used in various power generation, distribution and transformation substations, the control cabinet comprises a plurality of types, including an electric control cabinet, a variable frequency control cabinet, a low voltage control cabinet, a high voltage control cabinet, a water pump control cabinet, a power supply control cabinet, an explosion-proof control cabinet, an elevator control cabinet, a PLC control cabinet, a high voltage control cabinet, a water pump control cabinet, a power supply control cabinet, an explosion-proof control cabinet, a PLC control cabinet, a power supply system and a power supply system, Fire control switch board, brick machine switch board etc..
In the switch board use, inside equipment is changeed the fever under sealed environment and is scalded, if do not have the problem that effectual solution generates heat, easily cause the equipment in the switch board to take place to damage or the trouble, and most in the market is used for the heat dissipation mechanism of mechanical automation control cabinet, and most all is carried out the wind-blowing by radiator fan to the inside of switch board, and external dust gets into wherein easily.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a heat dissipation mechanism for a mechanical automation control cabinet, which solves the problems that most of the heat dissipation mechanisms for the mechanical automation control cabinet on the market are blown by a heat dissipation fan, and external dust easily enters the heat dissipation mechanisms.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a heat dissipation mechanism for mechanical automation control cabinet, includes the base member, the fixed surface of base member installs fixed equipment, the surface of base member both sides is equallyd divide and is do not connected with first ventilation side pipe and second ventilation side pipe, the surface of base member one side is connected with the copper, the surface of copper one side is connected with endothermic fin, the copper opposite side is connected with main heat dissipation equipment, air cooling chamber and air-out chamber have been seted up respectively to the inside of base member, the inner wall connection of air cooling chamber has the semiconductor refrigeration piece, the surface connection of air cooling intracavity wall has the through-flow fan.
Preferably, the fixing device comprises a fixing plate, the surface of the fixing plate is in threaded connection with a fixing bolt, and the surface of one end of the fixing bolt is connected with a rubber gasket.
Preferably, the main heat dissipation equipment comprises a heat dissipation base body, the inner wall of the heat dissipation base body is connected with a heat conduction graphite flake, the surface of the inner wall of the heat dissipation base body is connected with a copper sheet, the surface of one side of the copper sheet is connected with a copper rod, the surface of the other side of the copper sheet is provided with heat conduction silicone grease, the surface of the heat conduction silicone grease is connected with a heat conduction silica gel sheet, a cooling cavity is formed in one side of the heat conduction silica gel sheet, the surface of one side of the heat conduction silica gel sheet is connected with heat dissipation fins, exhaust holes are formed in the inner wall of the cooling cavity, and the surface of the heat dissipation base body is connected with a semiconductor refrigerator.
Preferably, the inner wall of the air outlet cavity is connected with three exhaust fans.
Preferably, a heat insulation cavity is formed in one side of the cold air cavity, and the inner wall of the first ventilation square pipe is connected with dust-free cloth filter cotton.
Preferably, the shape of the base body is rectangular, and the wall thickness of the base body is 0.6 cm.
Preferably, the sizes of the cold air cavity and the air outlet cavity are matched, and the inner wall of the second ventilating square pipe is connected with a shutter.
Compared with the prior art, the utility model has the beneficial effects that:
1. the heat dissipation mechanism of the mechanical automation control cabinet conducts the heat inside the control cabinet to the copper plate through the heat absorption fins, conducts the heat to the heat dissipation oil through the heat conduction graphite sheets, conducts the heat of the heat dissipation oil to the copper plate through the copper rods, conducts the heat to the heat dissipation fins through the heat conduction silicone grease and the heat conduction silicone sheets, lowers the temperature of gas in the cooling cavity through the cold end of the semiconductor refrigerator, lowers the surface temperature of the heat dissipation fins, and dissipates the temperature inside the control cabinet, when the temperature of the heat dissipation cabinet is too high, the temperature of the gas inside the cold air cavity can be lowered through the cold end of the semiconductor refrigeration sheet, the outside gas enters the control cabinet through the cold air cavity and the first ventilation square pipe through the cross-flow fan to dissipate the heat of the outside gas, and the impact force of the gas can be weakened through the cold air cavity and the first ventilation square pipe, avoid causing the influence to inside equipment, filter the cotton through dustless cloth and also carry out filtration treatment to gas, avoid the dust to enter into in the switch board.
2. This mechanical automation control cabinet's heat dissipation mechanism's main radiating mode dispels the heat through main radiating equipment to in fundamentally avoiding causing the influence and the dust to the equipment of inside and entering into the switch board, also make the heat dissipation more energy-conserving.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a first perspective view of the present invention;
FIG. 2 is a second perspective view of the present invention;
FIG. 3 is a cross-sectional view of a substrate according to the present invention;
fig. 4 is a sectional view of the heat dissipating substrate according to the present invention.
In the figure: 1, a substrate; 2, a copper plate; 3 heat absorbing fins; 4, filtering cotton with dust-free cloth; 5 fixing the plate; 6, a semiconductor refrigerator; 7, a first ventilation square tube; 8, fixing a bolt; 9 a cross-flow fan; 10 a heat dissipation substrate; 11 an exhaust fan; 12 semiconductor refrigerating sheets; 13 a cold air cavity; 14 a cooling chamber; 15 a second ventilating square tube; 16 air outlet cavities; 17 a thermally conductive graphite sheet; 18 heat-conducting silicone grease; 19 heat-conducting silica gel sheets; 20 heat dissipation fins; 21 a copper rod; 22 copper sheets; 23 heat dissipation chamber.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides a heat dissipation mechanism for mechanical automation control cabinet, including base member 1, the fixed surface of base member 1 installs fixed equipment, the surface of 1 both sides of base member is equallyd divide and is connected with first ventilation side pipe 7 and second ventilation side pipe 15 respectively, the surface of 1 one side of base member is connected with copper 2, the surface of 2 one sides of copper is connected with heat absorption fin 3, 2 opposite sides of copper are connected with main heat dissipation equipment, cold air chamber 13 and air outlet chamber 16 have been seted up respectively to the inside of base member 1, the inner wall connection of cold air chamber 13 has semiconductor refrigeration piece 12, the surface connection of cold air chamber 13 inner wall has through-flow fan 9.
Specifically, the fixed equipment includes fixed plate 5, and the surperficial threaded connection of fixed plate 5 has fixing bolt 8, and the surface of 8 one ends of fixing bolt is connected with the rubber gasket, makes the main part threaded connection of mechanism on the switch board inner wall through fixing bolt 8.
Specifically, main heat dissipation equipment is including heat dissipation base member 10, the inner wall connection of heat dissipation base member 10 has heat conduction graphite flake 17, the surface connection of heat dissipation base member 10 inner wall has copper sheet 22, the surface connection of copper sheet 22 one side has copper pole 21, the surface of copper sheet 22 opposite side is provided with heat conduction silicone grease 18, the surface connection of heat conduction silicone grease 18 has heat conduction silicone piece 19, cooling chamber 14 has been seted up to one side of heat conduction silicone piece 19, the surface connection of heat conduction silicone piece 19 one side has heat radiation fins 20, the exhaust hole has been seted up to the inner wall of cooling chamber 14, the surface connection of heat dissipation base member 10 has semiconductor cooler 6, be formed with a cavity between heat conduction graphite flake 17 and the copper sheet 22, the inside packing of cavity has the conduction oil.
Specifically, the inner wall of air outlet cavity 16 is connected with exhaust fan 11, and exhaust fan 11's quantity is three, takes out the inside gas of switch board through three exhaust fan 11, and at the in-process that gaseous taking out, comparatively light dust granule also can be along with taking out.
Specifically, the thermal-insulated chamber has been seted up to one side of air conditioning chamber 13, and the inner wall connection of first ventilation side's pipe 7 has dustless cloth filter pulp 4, and gas leads to cold air chamber 13 and first ventilation side's pipe 7 can make the impact force of gas weaken, avoids causing the influence to inside equipment, also carries out filtration treatment to gas through dustless cloth filter pulp 4, avoids the dust to enter into inside the switch board.
Specifically, the shape of the base 1 is rectangular, and the wall thickness of the base 1 is 0.6 cm.
Specifically, the size of the cold air cavity 13 is matched with that of the air outlet cavity 16, the inner wall of the second ventilating square tube 15 is connected with a shutter, the exhaust fan 11 pumps out air inside the control cabinet through the air outlet cavity 16 and the second ventilating square tube 15, and the air is circulated under the action of the cross-flow fan 9 and the exhaust fan 11, so that the heat dissipation efficiency is accelerated.
The working principle and the using process of the utility model are as follows: after the utility model is installed, the heat in the control cabinet is conducted into the copper plate 2 through the heat absorption fins 3, the heat is conducted into the heat dissipation oil through the heat conduction graphite sheets 17, the heat of the heat dissipation oil is conducted into the copper sheets 22 through the copper rods 21, the heat is conducted onto the heat dissipation fins 20 through the heat conduction silicone grease 18 and the heat conduction silicone sheets 19, the temperature of the gas in the cooling cavity 14 is reduced through the cold end of the semiconductor refrigerator 6, so that the surface temperature of the heat dissipation fins 20 is reduced, the temperature in the control cabinet is dissipated, if the temperature of the heat dissipation cabinet is too high, the temperature of the gas in the cold air cavity 13 is reduced through the cold end of the semiconductor refrigeration sheet 12, the outside gas enters the control cabinet through the air cavity 13 and the first ventilation square tube 7 through the cross-flow fan 9 to dissipate the heat of the gas, and the impact force of the gas is weakened when the gas passes through the cold air cavity 13 and the first ventilation square tube 7, avoid causing to rock the equipment of inside, also carry out filtration treatment to gas through dustless cloth filter pulp 4, avoid the dust to enter into inside the switch board, exhaust fan 11 takes out the inside gas of switch board through air-out chamber 16 and second ventilation side pipe 15, under the effect of cross-flow fan 9 and exhaust fan 11, makes gas circulate for radiating efficiency, all consumer all supply power through external power supply in this device.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a heat dissipation mechanism for mechanical automation control cabinet, includes base member (1), its characterized in that: the fixed surface of base member (1) installs fixed equipment, the surface of base member (1) both sides is equallyd divide and is do not connected with first ventilation side pipe (7) and second ventilation side pipe (15), the surface of base member (1) one side is connected with copper (2), the surface of copper (2) one side is connected with heat absorption fin (3), copper (2) opposite side is connected with main heat abstractor, cold air chamber (13) and air-out chamber (16) have been seted up respectively to the inside of base member (1), the inner wall of cold air chamber (13) is connected with semiconductor refrigeration piece (12), the surface of cold air chamber (13) inner wall is connected with through-flow fan (9).
2. The heat dissipation mechanism for the mechanical automation control cabinet according to claim 1, characterized in that: the fixing equipment comprises a fixing plate (5), wherein a fixing bolt (8) is connected to the surface of the fixing plate (5) in a threaded manner, and a rubber gasket is connected to the surface of one end of the fixing bolt (8).
3. The heat dissipation mechanism for the mechanical automation control cabinet according to claim 1, characterized in that: the main heat dissipation equipment comprises a heat dissipation base body (10), the inner wall of the heat dissipation base body (10) is connected with a heat conduction graphite sheet (17), the surface of the inner wall of the heat dissipation base body (10) is connected with a copper sheet (22), the surface of one side of the copper sheet (22) is connected with a copper rod (21), the surface of the other side of the copper sheet (22) is provided with heat conduction silicone grease (18), the surface of the heat conduction silicone grease (18) is connected with a heat conduction silica gel sheet (19), one side of the heat conduction silica gel sheet (19) is provided with a cooling cavity (14), the surface of one side of the heat conduction silica gel sheet (19) is connected with a heat dissipation fin (20), the inner wall of the cooling cavity (14) is provided with an exhaust hole, and the surface of the heat dissipation base body (10) is connected with a semiconductor refrigerator (6).
4. The heat dissipation mechanism for the mechanical automation control cabinet according to claim 1, characterized in that: the inner wall of air outlet cavity (16) is connected with exhaust fan (11), the quantity of exhaust fan (11) is three.
5. The heat dissipation mechanism for the mechanical automation control cabinet according to claim 1, characterized in that: and a heat insulation cavity is formed in one side of the cold air cavity (13), and the inner wall of the first ventilation square pipe (7) is connected with dust-free cloth filter cotton (4).
6. The heat dissipation mechanism for the mechanical automation control cabinet according to claim 1, characterized in that: the shape of the base body (1) is rectangular, and the wall thickness of the base body (1) is 0.6 cm.
7. The heat dissipation mechanism for the mechanical automation control cabinet according to claim 1, characterized in that: the size of the cold air cavity (13) is matched with that of the air outlet cavity (16), and the inner wall of the second ventilating square tube (15) is connected with a shutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122256702.4U CN216163131U (en) | 2021-09-17 | 2021-09-17 | Heat dissipation mechanism for mechanical automation control cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122256702.4U CN216163131U (en) | 2021-09-17 | 2021-09-17 | Heat dissipation mechanism for mechanical automation control cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216163131U true CN216163131U (en) | 2022-04-01 |
Family
ID=80851548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122256702.4U Expired - Fee Related CN216163131U (en) | 2021-09-17 | 2021-09-17 | Heat dissipation mechanism for mechanical automation control cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216163131U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116773027A (en) * | 2023-08-22 | 2023-09-19 | 合肥航谱时代科技有限公司 | Heat radiation system based on explosion-proof refrigeration type thermal infrared imager |
-
2021
- 2021-09-17 CN CN202122256702.4U patent/CN216163131U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116773027A (en) * | 2023-08-22 | 2023-09-19 | 合肥航谱时代科技有限公司 | Heat radiation system based on explosion-proof refrigeration type thermal infrared imager |
| CN116773027B (en) * | 2023-08-22 | 2023-11-14 | 合肥航谱时代科技有限公司 | Heat radiation system based on explosion-proof refrigeration type thermal infrared imager |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220401 |