CN208567764U - A kind of wafer frame flatness detection jig - Google Patents

Abstract

The utility model discloses a kind of wafer frame flatness detection jigs in technical field of semiconductors, including pedestal, feeding plate is tiltedly installed on the pedestal, the lower section on feeding plate top is equipped at least two support rods vertically, two support rods are symmetrical set, detection plate is equipped in the middle part of the feeding plate, detection plate is arranged in parallel with feeding plate, the spacing of detection plate lower surface and feeding plate upper surface is 1.29 ~ 1.31mm, the both ends of detection plate pass through connecting plate and connect with feeding plate, can be by the wafer frame of detection plate with a thickness of 1.19 ~ 1.29mm on feeding plate.The utility model can more accurately detect the flatness of wafer frame, exclude staff with wafer frame is pulled, avoid the wafer frame for generating deformation from being flowed into subsequent work process, cause the quality abnormal of product, can smoothly produce.

Description

A kind of wafer frame flatness detection jig

Technical field

The utility model belongs to technical field of semiconductors, in particular to a kind of wafer frame flatness detection jig.

Background technique

In the prior art, there is a kind of plug-type wafer frame detection jig of level, be to push and pull wafer frame by personnel or so Frame enters the detection entrance of jig, then the mode pulled it from the other end detects the form of wafer frame.Staff is logical The mode for crossing horizontal plug-type wafer frame detection jig detects the form of wafer frame, and it is inaccurate to will cause testing result, Because wafer frame has preferable elasticity, as wafer frame has one end that can fill in jig window, then being pulled by personnel can There will be the wafer frame of deformation to pass through jig, when the wafer frame of deformation is flowed into the next stop, abnormal generation is had, When the wafer frame that such as deformation occurs enters cutting station, the clamping jaw inside cutting machine can have the risk that can't clip wafer frame, Cause blade to switch on wafer frame, cause brokenly knife, to damage wafer.Disadvantage is that: work people in detection process The external force factor of member has a great impact to the detection of wafer frame, and there are the risks of wafer abnormal damage.

Utility model content

The purpose of the utility model is to provide a kind of wafer frame flatness detection jigs, can more accurately detect wafer The flatness of frame excludes staff with wafer frame is pulled, the wafer frame for generating deformation is avoided to be flowed into subsequent work Process causes the quality abnormal of product, can smoothly produce.

Purpose of the utility model is realized as follows: a kind of wafer frame flatness detection jig, including pedestal, it is described Feeding plate is tiltedly installed on pedestal, the lower section on feeding plate top is equipped at least two support rods, two support rods or so vertically It is symmetrical arranged, detection plate is equipped in the middle part of the feeding plate, detection plate is arranged in parallel with feeding plate, detection plate lower surface and feeding plate The spacing of upper surface is 1.29 ~ 1.31mm, and the both ends of detection plate pass through connecting plate and connect with feeding plate, can pass through on feeding plate The wafer frame of detection plate with a thickness of 1.19 ~ 1.29mm.

When utility model works, wafer frame to be detected is transported on feeding plate by feeding device, generates deformation Wafer frame can be stuck between detection plate and feeding plate, can not be passed through, and the wafer frame for not generating deformation can pass through inspection Drafting board guarantees to reach requirement by the flatness of the wafer frame detected, meets safety in production standard.With a thickness of 1.19 ~ The wafer frame of 1.29mm can not be passed through by detection plate, wafer frame of the thickness greater than 1.29mm.With the prior art It compares, the utility model has the beneficial effects that: the flatness of wafer frame can be detected more accurately, excludes staff and use Wafer frame is pulled, avoids the wafer frame for generating deformation from being flowed into subsequent work process, causes the quality abnormal of product, it can Smoothly production.

Side corresponding with the pedestal is equipped with fixing seat as a further improvement of the utility model, fixing seat The left and right sides is equipped with baffle, is equipped with guide rail on two baffles, and horizontal movable plate is slidably connected on guide rail, is set below movable plate There is a driving mechanism, is symmetrically equipped with two upright bars on movable plate, it is horizontal between two upright bar upper ends to be equipped with fixing axle, in fixing axle It is rotatably connected to upper flitch, mounting plate is equipped in two upright bars, cylinder one is hinged on mounting plate, the piston rod of cylinder one stretches out It holds hinged with the corresponding position of upper flitch.Wafer frame to be detected is placed in upper flitch, and driving mechanism is horizontal with movable plate Mobile, before wafer frame is sent to feeding plate, cylinder one drives upper flitch to swing around fixing axle, and wafer frame is slipped to blanking On plate, detected.

The driving mechanism includes two support bases, water between two support bases as a further improvement of the utility model, It is flat to be equipped with lead screw, it is arranged with feed screw nut on lead screw, feed screw nut is mutually fixed with movable plate, and one end of lead screw is through shaft coupling and electricity Machine transmission connection.Lead screw rotation, feed screw nut drive movable plate linear movement.

It is located at the position on front side of feeding plate on the pedestal as a further improvement of the utility model, and is equipped with blanking machine Structure, cutting agency include two pieces of vertical plates being fixed on the base, and the setting of vertical plate upper angled, vertical plate medial surface, which is equipped with, to incline Oblique guide slidably connects inclination blanking plate on inclined guide rails, is equipped with cylinder two, the piston rod of cylinder two below inclination blanking plate Extension end is hinged with blanking plate, and the cylinder body of cylinder two is hinged with the base；It is corresponding on front side of the blanking plate be equipped with it is horizontal Conveyer belt.It by the wafer frame of detection plate, falls on blanking plate, cylinder two drives blanking plate to move along inclined guide rails, moves Wafer frame is sent on conveyer belt by movable plate, and wafer frame is sent on subsequent production line by conveyer belt.

As the preferred of the utility model, the spacing of the detection plate lower surface and feeding plate upper surface is 1.3mm, blanking It can be by the wafer frame of detection plate with a thickness of 1.2mm on plate.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the utility model.

Fig. 2 is the A direction view of Fig. 1.

Fig. 3 is the BB of Fig. 1 to cross-sectional view.

Fig. 4 is the structural schematic diagram of cylinder two.

Fig. 5 is the CC of Fig. 1 to cross-sectional view.

Fig. 6 is the structural schematic diagram of lead screw.

Wherein, 1 pedestal, 2 feeding plates, 3 support rods, 4 detection plates, 4a connecting plate, 5 fixing seats, 5a baffle, 6 guide rails, 7 move Movable plate, 8 upright bars, 9 fixing axles, 10 upper flitch, 11 mounting plates, 12 cylinders one, 13 support bases, 14 lead screws, 14a feed screw nut, 15 Shaft coupling, 16 motors, 17 vertical plates, 18 inclined guide rails, 19 blanking plates, 20 cylinders two.

Specific embodiment

As shown in figures 1 to 6, it is a kind of wafer frame flatness detection jig, including pedestal 1, is tiltedly installed on pedestal 1 Feeding plate 2, the lower section on 2 top of feeding plate are equipped at least two support rods 3 vertically, and two support rods 3 are symmetrical set, blanking Detection plate 4 is equipped in the middle part of plate 2, detection plate 4 is arranged in parallel with feeding plate 2, between 2 upper surface of 4 lower surface of detection plate and feeding plate Away from for 1.29 ~ 1.31mm, the both ends of detection plate 4 pass through connecting plate 4a and connect with feeding plate 2, can pass through detection on feeding plate 2 The wafer frame of plate 4 with a thickness of 1.19 ~ 1.29mm.Side corresponding with pedestal 1 is equipped with fixing seat 5, the left and right of fixing seat 5 Two sides are equipped with baffle 5a, are equipped with guide rail 6 on two baffle 5a, slidably connect horizontal movable plate 7 on guide rail 6, under movable plate 7 Side is equipped with driving mechanism, and two upright bars 8 are symmetrically equipped on movable plate 7, and level is equipped with fixing axle 9 between two upright bars, 8 upper end, It is rotatably connected to upper flitch 10 in fixing axle 9, mounting plate 11 is equipped in two upright bars 8, cylinder 1 is hinged on mounting plate 11, The piston rod extension end of cylinder 1 and the corresponding position of upper flitch 10 are hinged.The driving mechanism includes two support bases 13, It is horizontal between two support bases 13 to be equipped with lead screw 14, feed screw nut 14a, feed screw nut 14a and 7 phase of movable plate are arranged on lead screw 14 Fixed, one end of lead screw 14 is sequentially connected through shaft coupling 15 and motor 16.The position for being located at 2 front side of feeding plate on pedestal 1 is equipped with Cutting agency, cutting agency include two pieces of vertical plates being fixed on pedestal 1 17, the setting of 17 upper angled of vertical plate, vertical plate 17 medial surfaces are equipped with inclined guide rails 186, and inclination blanking plate 19,19 lower section of inclination blanking plate are slidably connected on inclined guide rails 186 Equipped with cylinder 2 20, the piston rod extension end of cylinder 2 20 and blanking plate 19 are hinged, and cylinder body and 1 phase of pedestal of cylinder 2 20 are cut with scissors It connects；It is corresponding with 19 front side of blanking plate to be equipped with horizontal conveyer belt.4 lower surface of detection plate and the spacing of 2 upper surface of feeding plate are 1.3mm, can be by the wafer frame of detection plate 4 with a thickness of 1.2mm on feeding plate 2.

When the present apparatus works, lead screw 14 is rotated, and feed screw nut 14a drives movable plate 7 mobile, and cylinder 2 20 drives upper flitch 10 rotations, wafer frame to be detected are transported on feeding plate 2, the wafer frame for generating deformation can be stuck in detection plate 4 and fall Between flitch 2, it can not pass through, the wafer frame for not generating deformation can pass through detection plate 4, guarantee the wafer by detection The flatness of frame reaches requirement, meets safety in production standard.Inspection can be passed through with a thickness of the wafer frame of 1.19 ~ 1.29mm Drafting board 4, wafer frame of the thickness greater than 1.29mm can not pass through；Wafer frame is sent on conveyer belt by movable plate 7, and conveyer belt will Wafer frame is sent on subsequent production line.The advantages of present apparatus, is: can more accurately detect the flatness of wafer frame, arrange Except staff is with wafer frame is pulled, avoids the wafer frame for generating deformation from being flowed into subsequent work process, cause product Quality abnormal can be produced smoothly.

The utility model is not limited to above-described embodiment, on the basis of technical solution disclosed by the utility model, this For the technical staff in field according to disclosed technology contents, not needing creative labor can be special to some of which technology Sign makes some replacements and deformation, these replacements and deformation are within the protection scope of the present utility model.

Claims (5)

1. a kind of wafer frame flatness detection jig, which is characterized in that including pedestal, be tiltedly installed with blanking on the pedestal Plate, the lower section on feeding plate top are equipped at least two support rods vertically, and two support rods are symmetrical set, in the feeding plate Portion is equipped with detection plate, and detection plate is arranged in parallel with feeding plate, the spacing of detection plate lower surface and feeding plate upper surface for 1.29 ~ 1.31mm, the both ends of detection plate pass through connecting plate and connect with feeding plate, can pass through the wafer frame of detection plate on feeding plate With a thickness of 1.19 ~ 1.29mm.

2. a kind of wafer frame flatness detection jig according to claim 1, which is characterized in that opposite with the pedestal The side answered is equipped with fixing seat, and the left and right sides of fixing seat is equipped with baffle, is equipped with guide rail on two baffles, is slidably connected on guide rail There is horizontal movable plate, driving mechanism is equipped with below movable plate, is symmetrically equipped with two upright bars, two upright bar upper ends on movable plate Between it is horizontal be equipped with fixing axle, be rotatably connected to upper flitch in fixing axle, be equipped with mounting plate in two upright bars, it is hinged on mounting plate There is cylinder one, the piston rod extension end of cylinder one and the corresponding position of upper flitch are hinged.

3. a kind of wafer frame flatness detection jig according to claim 2, which is characterized in that the driving mechanism packet Two support bases are included, level is equipped with lead screw between two support bases, is arranged with feed screw nut, feed screw nut and movable plate phase on lead screw Fixed, one end of lead screw is connect through shaft coupling with motor drive.

4. a kind of wafer frame flatness detection jig according to claim 1-3, which is characterized in that the bottom It is located at the position on front side of feeding plate on seat and is equipped with cutting agency, cutting agency includes two pieces of vertical plates being fixed on the base, and is erected The setting of straight panel upper angled, vertical plate medial surface are equipped with inclined guide rails, slidably connect inclination blanking plate on inclined guide rails, tilt Cylinder two is equipped with below blanking plate, the piston rod extension end of cylinder two and blanking plate are hinged, and the cylinder body of cylinder two is mutually cut with scissors with pedestal It connects；It is corresponding on front side of the blanking plate to be equipped with horizontal conveyer belt.

5. a kind of wafer frame flatness detection jig according to claim 1-3, which is characterized in that the inspection The spacing of drafting board lower surface and feeding plate upper surface is 1.3mm, on feeding plate can by the wafer frame of detection plate with a thickness of 1.2mm。