CN208477459U - A kind of good chip of thermal diffusivity - Google Patents

Abstract

The utility model discloses a kind of good chips of thermal diffusivity, including chip body and central processing unit, the intermediate position of chip body front end is provided with SATA interface, SATA interface is fixedly connected with chip body, cooling fin is arranged in the rear side of SATA interface, cooling fin and SATA interface are electrically connected, thermally conductive sheet is provided at the top of cooling fin, intermediate position inside chip body is provided with line layer, line layer is fixedly connected with chip body, the upper end of line layer is provided with detection circuit layer, detection circuit layer and line layer are electrically connected, since thermally conductive sheet is made of heat-conducting silicone grease, so the thermal resistance of thermally conductive sheet is relatively small, so that the better heat-radiation effect of chip, delay chip aging phenomenon, when crossing detector circuit is the case where encountering doubtful theft chip interior information, it sends a warning, in being transmitted to Internal information be locked in reservoir by central processor, central processing unit immediately, and chip interior information is prevented to be leaked.

Description

A kind of good chip of thermal diffusivity

Technical field

The utility model relates to the technical field of chip, specially a kind of good chip of thermal diffusivity.

Background technique

Chip also has its unique place, broadly, as long as the semiconductor chip manufactured using microfabrication means Son, can be called chip, and the inside might not have circuit.Such as semiconductor light source chips；Such as mechanical chip, such as MEMS top Spiral shell instrument；Or biochip such as DNA chip.In communication and information technology, when range is confined to silicon integrated circuit, chip Intersection with integrated circuit is exactly on " circuit on silicon wafer ".Chipset is then a series of chip portfolios that are mutually related, They interdepend, and bigger effect can be played by combining, such as the processor inside computer and southern north bridge chipset, Radio frequency, base band and power management chip group inside mobile phone.

Existing electronic chip is primarily present Railway Project, although having certain heat sinking function, heat dissipation performance It is not fine, and be easy to cause the aging of chip, while damping effect is also poor, is chip having certain impact It is easily damaged, and information generates the phenomenon that losing, when chip is entered by criminal when being stored and being transmitted sometimes When invading, chip can not make corresponding emergency trouble shooting measures, so as to cause the leakage of information.

So how to design a kind of good chip of thermal diffusivity, becoming us will currently be solved the problems, such as.

Utility model content

The purpose of this utility model is to provide a kind of good chips of thermal diffusivity, to solve to propose in above-mentioned background technique Heat dissipation performance is bad, the problems such as stability is poor and safety is more insufficient.

To achieve the above object, the utility model provides the following technical solutions: a kind of good chip of thermal diffusivity, including core The front end right side of piece main body and central processing unit, the chip body is provided with chip interface, the chip interface and chip master Body welding, the intermediate position of the chip body front end are provided with SATA interface, the SATA interface and the fixed company of chip body It connects, cooling fin is arranged in the rear side of the SATA interface, and the cooling fin and SATA interface are electrically connected, the top of the cooling fin It is provided with thermally conductive sheet, the thermally conductive sheet and cooling fin insertion connect, and the right side inside the thermally conductive sheet is provided with the first thermally conductive sheet, The thermally conductive sheet is fixedly connected with cooling fin, and the left side inside the cooling fin is provided with the second thermally conductive sheet, and described second is thermally conductive Piece is fixedly connected with cooling fin, and the bottom setting inside the cooling fin is fluted, and the groove and cooling fin weld, the core It is provided with central processing unit on the left of the rear end of piece main body, is fitted closely between the central processing unit and chip body, the core Protective resistance is provided on the right side of the rear end of piece main body, the protective resistance and chip body are welded, the lower end of the chip body It is provided with chip pocket, is fitted closely between the chip pocket and chip body, the intermediate position inside the chip body It is provided with line layer, the line layer is fixedly connected with chip body, and the lower end inside the chip body is provided with damping bullet Spring, the damping spring are fixedly connected with chip body.

Further, it is provided with capacitor on the left of the front end of the chip body, between the capacitor and chip body It fits closely.

Further, reservoir is provided on the right side of the cooling fin, the reservoir and cooling fin are electrically connected.

Further, the upper end of the groove is provided with heat pipe, and the heat pipe and groove insertion connect.

Further, the upper end of the line layer is provided with detection circuit layer, the detection circuit layer.With line layer electrical property Connection.

Further, the damping spring is provided with two groups, and damping spring is uniformly arranged.

Further, the thermally conductive sheet is made of heat-conducting silicone grease.

Compared with prior art, the utility model has the beneficial effects that the good chip of this kind of thermal diffusivity improve it is original The disadvantage that product heat dissipation performance is bad, stability is poor and safety is more insufficient, compared to existing product, the utility model thermal diffusivity Good chip is equipped with thermally conductive sheet and heat pipe, and while chip operation, cooling fin can radiate to circuit, pass through the first bronze medal Piece and the second copper sheet cooperation detour shape closure cooperation heat pipe, then distributed by thermally conductive sheet, so that chip reaches preferably heat dissipation effect Fruit, and since thermally conductive sheet is made of heat-conducting silicone grease, it so the thermal resistance of thermally conductive sheet is relatively small, and is not in be evaporated Phenomenon will not cause a large amount of silicone oil to volatilize, so that the better heat-radiation effect of chip, delays chip aging phenomenon, improve The service life of chip uses detection circuit layer and reservoir, when detection circuit layer is encountering doubtful theft chip interior letter It when the case where breath, sends a warning, is transmitted to central processing unit, central processing unit carries out internal information to be locked in storage immediately In storage, chip interior information is prevented to be leaked, the SATA hard disc of SATA interface access carries out data transmission, and stores to storage In storage, reservoir can store information, prevent from making a fault when extraneous access memory card, lead to the loss of information, Damping spring is utilized, damping spring when chip is by impact force, generate it is flexible, can buffer chip impacted when dropping Power plays a certain protective role chip, avoids impact and damages to chip, and two groups of damping springs make damping Effect is more preferable.

Detailed description of the invention

Fig. 1 is the overall structure diagram of the utility model；

Fig. 2 is partial schematic diagram inside the cooling fin of the utility model；

Fig. 3 is the chip body diagrammatic cross-section of the utility model.

1- chip body in figure；101- line layer；102- damping spring；103- detection circuit layer；2- chip interface；3- core Piece slot；4- capacitor；5- protective resistance；6- central processing unit；7- reservoir；8-SATA interface；9- cooling fin；901- is thermally conductive Piece；The first copper sheet of 902-；The second copper sheet of 903-；904- heat pipe；905- groove.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of good chip of thermal diffusivity, including chip Main body 1 and central processing unit 6, the front end right side of chip body 1 are provided with chip interface 2, and chip interface 2 and chip body 1 are welded It connects, the intermediate position of 1 front end of chip body is provided with SATA interface 8, and SATA interface 8 is fixedly connected with chip body 1, and SATA connects Cooling fin 9 is arranged in the rear side of mouth 8, and cooling fin 9 and SATA interface 8 are electrically connected, and the top of cooling fin 9 is provided with thermally conductive sheet 901, Thermally conductive sheet 901 and the insertion of cooling fin 9 connect, and the right side inside thermally conductive sheet 9 is provided with the first thermally conductive sheet 902, thermally conductive sheet 902 with it is scattered Backing 9 is fixedly connected, and the left side inside cooling fin 9 is provided with the second thermally conductive sheet 903, and the second thermally conductive sheet 903 and cooling fin 9 are fixed It connects, the bottom setting fluted 905 inside cooling fin 9, groove 905 and cooling fin 9 weld, on the left of the rear end of chip body 1 It is provided with central processing unit 6, is fitted closely between central processing unit 6 and chip body 1, setting on the right side of the rear end of chip body 1 There is protective resistance 5, protective resistance 5 and chip body 1 are welded, and the lower end of chip body 1 is provided with chip pocket 3, chip pocket 3 It is fitted closely between chip body 1, the intermediate position inside chip body 1 is provided with line layer 101, line layer 101 and core Piece main body 1 is fixedly connected, and the lower end inside chip body 1 is provided with damping spring 102, and damping spring 102 and chip body 1 are solid Fixed connection.

Further, it is provided with capacitor on the left of the front end of chip body 1,1 close patch between capacitor 4 and chip body It closes, capacitor 4 is cooperateed with and adjusted to the electric current of component each in chip circuit, it is ensured that chip energy in chip operation Enough smooth stable operations.

Further, the right side of cooling fin 9 is provided with reservoir 7, and reservoir 7 and cooling fin 9 are electrically connected, SATA interface The SATA hard disc of 8 accesses carries out data transmission, and stores into reservoir 7, and reservoir 7 can store information, prevents It makes a fault when only accessing memory card from the external world, leads to the loss of information.

Further, the upper end of groove 905 is provided with heat pipe 904, and heat pipe 904 and the insertion of groove 905 connect, and passes through first Copper sheet 902 and the second copper sheet 903 cooperation detour shape closure cooperation heat pipe 904, so that the heat dissipation effect of chip is more preferable.

Further, the upper end of line layer 101 is provided with detection circuit layer 103, detection circuit layer 103 and line layer 101 It is electrically connected, when detection circuit layer 103 is the case where encountering doubtful theft chip interior information, sends a warning, transmit To central processing unit 6, internal information be locked in reservoir 7 by central processing unit 6 immediately, prevents chip interior information quilt Leakage.

Further, damping spring 102 is provided with two groups, and damping spring is uniformly arranged, damping spring 102 chip by When to impact force, generate it is flexible, can buffer chip when dropping by impact force, chip is played a certain protective role, is kept away Exempt from impact to damage chip, and two groups of damping springs 102 make damping effect more preferable.

Further, thermally conductive sheet 901 is made of heat-conducting silicone grease, so the thermal resistance of thermally conductive sheet 901 is relatively small, and not It will appear the phenomenon that being evaporated, a large amount of silicone oil will not be caused to volatilize, so that the better heat-radiation effect of chip, delays chip aging Phenomenon improves the service life of chip.

Working principle: staff takes out chip from keeping box first, and checks whether chip is intact, connects Staff chip body 1 is installed on electronic product by chip pocket 3, at the same time, then by chip interface 2 with Other components of electronic product connect, and SATA hard disc is then connected SAS interface 8, when chip is started to work, capacitor 4 Circuit on chip is adjusted, while protective resistance 5 carries out real-time monitoring and protection to the electric current in line layer 101, keeps away Exempt from current anomaly to damage chip, when staff issues end command from terminal electronic product, central processing unit 6 Information is handled, while being carried out data transmission by the SATA hard disc that SATA interface 8 accesses, and is stored to reservoir 7 In, while chip operation, cooling fin 9 can radiate to circuit, pass through the circuitous of the first copper sheet 902 and the second copper sheet 903 Closure is returned, while cooperating heat pipe 904, then is distributed by thermally conductive sheet 901, so that chip reaches better heat dissipation effect, is improved The service life of chip sounds an alarm letter when detection circuit layer 103 is the case where encountering doubtful theft chip interior information Breath, is transmitted to central processing unit 6, internal information be locked in reservoir 7, be prevented in chip by central processing unit 6 immediately Portion's information is leaked.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (7)

1. a kind of good chip of thermal diffusivity, including chip body (1) and central processing unit (6), it is characterised in that: the chip It is provided with chip interface (2) on the right side of the front end of main body (1), the chip interface (2) and chip body (1) are welded, the chip The intermediate position of main body (1) front end is provided with SATA interface (8), and the SATA interface (8) is fixedly connected with chip body (1), Cooling fin (9) are arranged in the rear side of the SATA interface (8), and the cooling fin (9) and SATA interface (8) are electrically connected, described to dissipate It is provided at the top of backing (9) thermally conductive sheet (901), the thermally conductive sheet (901) and cooling fin (9) insertion connect, the thermally conductive sheet (901) internal right side is provided with the first thermally conductive sheet (901), and the thermally conductive sheet (901) is fixedly connected with cooling fin (9), described The internal left side of cooling fin (9) is provided with the second thermally conductive sheet (903), second thermally conductive sheet (903) and cooling fin (9) fixed company It connects, fluted (905) are arranged in the internal bottom of the cooling fin (9), and the groove (905) and cooling fin (9) are welded, the core It is provided with central processing unit (6) on the left of the rear end of piece main body (1), it is close between the central processing unit (6) and chip body (1) The rear end right side of fitting, the chip body (1) is provided with protective resistance (5), the protective resistance (5) and chip body (1) Welding, the lower end of the chip body (1) is provided with chip pocket (3), between the chip pocket (3) and chip body (1) It fits closely, the internal intermediate position of the chip body (1) is provided with line layer (101), the line layer (101) and chip Main body (1) is fixedly connected, and the internal lower end of the chip body (1) is provided with damping spring (102), the damping spring (102) it is fixedly connected with chip body (1).

2. the good chip of a kind of thermal diffusivity according to claim 1, it is characterised in that: before the chip body (1) End left side is provided with capacitor (4), is fitted closely between the capacitor (4) and chip body (1).

3. the good chip of a kind of thermal diffusivity according to claim 1, it is characterised in that: the right side of the cooling fin (9) It is provided with reservoir (7), the reservoir (7) and cooling fin (9) are electrically connected.

4. the good chip of a kind of thermal diffusivity according to claim 1, it is characterised in that: the upper end of the groove (905) It is provided with heat pipe (904), the heat pipe (904) and groove (905) insertion connect.

5. the good chip of a kind of thermal diffusivity according to claim 1, it is characterised in that: the line layer (101) it is upper End is provided with detection circuit layer (103), and the detection circuit layer (103) and line layer (101) are electrically connected.

6. the good chip of a kind of thermal diffusivity according to claim 1, it is characterised in that: the damping spring (102) sets Two groups are equipped with, and damping spring (102) is uniformly arranged.

7. the good chip of a kind of thermal diffusivity according to claim 1, it is characterised in that: the thermally conductive sheet (901) is by leading Hot silicone grease is made.