CN208418189U - A kind of LED light encapsulating structure conducive to heat dissipation - Google Patents
A kind of LED light encapsulating structure conducive to heat dissipation Download PDFInfo
- Publication number
- CN208418189U CN208418189U CN201820762543.0U CN201820762543U CN208418189U CN 208418189 U CN208418189 U CN 208418189U CN 201820762543 U CN201820762543 U CN 201820762543U CN 208418189 U CN208418189 U CN 208418189U
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- CN
- China
- Prior art keywords
- thermally conductive
- cup body
- mounting plate
- cooling fin
- wick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of LED light encapsulating structures conducive to heat dissipation, including thermally conductive mounting plate, thermally conductive lamp holder, wick, Lamp cup body, cooling fin mounting plate and cooling fin, thermally conductive lamp holder is fixedly installed on thermally conductive mounting plate, wick is fixed on thermally conductive lamp holder, the lower end of Lamp cup body is fixedly connected with the edge of thermally conductive lamp holder, wick is located at the middle position of bottom in Lamp cup body, cooling fin mounting plate is fixed on the periphery of Lamp cup body and thermally conductive lamp holder, cooling fin is uniformly distributed and is fixed on the periphery of cooling fin mounting plate, the inside of Lamp cup body and wick are encapsulated within by potting resin, reflective layer is provided on the inner wall of Lamp cup body.The utility model is not provided only with heat-conducting base and thermally conductive mounting plate, Lamp cup body that can be thermally conductive is used simultaneously, the periphery of Lamp cup body, which is uniformly distributed, is provided with multi-disc cooling fin, it is capable of the heat dissipation performance of good raising wick, simultaneously, reflective layer is set in Lamp cup body, wick can be made to have the effect of optically focused, had the value of popularization and application.
Description
Technical field
The utility model relates to a kind of lamps and lanterns more particularly to a kind of LED light encapsulating structures conducive to heat dissipation.
Background technique
LED light is a kind of solid state semiconductor devices that can convert electrical energy into visible light, it can directly turn electricity
Turn to light.The heart of LED is the chip of a semiconductor, and one end of chip is attached on a bracket, and one end is cathode, the other end
The anode for connecting power supply, is encapsulated entire chip by epoxy resin.In the prior art, LED light is a direct bottom mostly
Plate as radiating element needs that radiator is cooperated to radiate when in use, and heat dissipation performance is low, empty accordingly, there exist improving
Between.
Utility model content
The purpose of this utility model is that solve the above-mentioned problems and provides a kind of LED light encapsulation knot conducive to heat dissipation
Structure.
The utility model achieves the above object through the following technical schemes:
The utility model includes thermally conductive mounting plate, thermally conductive lamp holder, wick, Lamp cup body, cooling fin mounting plate and cooling fin, institute
It states thermally conductive lamp holder to be fixedly installed on the thermally conductive mounting plate, the wick is fixed on the thermally conductive lamp holder, the Lamp cup body
Lower end be fixedly connected with the edge of the thermally conductive lamp holder, the wick is located at the middle position of bottom in Lamp cup body, described to dissipate
Backing mounting plate is fixed on the periphery of the Lamp cup body and the thermally conductive lamp holder, and the cooling fin is uniformly distributed and is fixed on described
The inside of the Lamp cup body and the wick are encapsulated within by the periphery of cooling fin mounting plate, potting resin.
Preferably, reflective layer is provided on the inner wall of the Lamp cup body.
The utility model has the beneficial effects that:
The utility model is a kind of LED light encapsulating structure conducive to heat dissipation, and compared with prior art, the utility model is not only
It is provided with heat-conducting base and thermally conductive mounting plate, while the Lamp cup body that using can be thermally conductive, the periphery of Lamp cup body, which is uniformly distributed, to be set
It is equipped with multi-disc cooling fin, is capable of the heat dissipation performance of good raising wick, meanwhile, reflective layer is set in Lamp cup body, lamp can be made
Core has the effect of optically focused, has the value of popularization and application.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
In figure: the thermally conductive mounting plate of 1-, the thermally conductive lamp holder of 2-, 3- wick, 4- Lamp cup body, 5- cooling fin mounting plate, 6- heat dissipation
Piece, 7- potting resin, 8- reflective layer.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing:
The utility model includes thermally conductive mounting plate, thermally conductive lamp holder, wick, Lamp cup body, cooling fin mounting plate as shown in Figure 1:
And cooling fin, the thermally conductive lamp holder are fixedly installed on the thermally conductive mounting plate, the wick is fixed on the thermally conductive lamp holder,
The lower end of the Lamp cup body is fixedly connected with the edge of the thermally conductive lamp holder, and the wick is located at the interposition of bottom in Lamp cup body
Set, the cooling fin mounting plate is fixed on the periphery of the Lamp cup body and the thermally conductive lamp holder, the cooling fin be uniformly distributed and
It is fixed on the periphery of the cooling fin mounting plate, the inside of the Lamp cup body and the wick are packaged in by the potting resin
It is interior.Thermally conductive mounting plate, thermally conductive lamp holder, Lamp cup body, cooling fin mounting plate and cooling fin be all made of the higher aluminium alloy of heating conduction,
The materials such as copper are made.
Preferably, reflective layer is provided on the inner wall of the Lamp cup body.
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (2)
1. a kind of LED light encapsulating structure conducive to heat dissipation, it is characterised in that: including thermally conductive mounting plate, thermally conductive lamp holder, wick, lamp
Cup body, cooling fin mounting plate and cooling fin, the thermally conductive lamp holder are fixedly installed on the thermally conductive mounting plate, and the wick is fixed
In on the thermally conductive lamp holder, the lower end of the Lamp cup body is fixedly connected with the edge of the thermally conductive lamp holder, and the wick is located at lamp
The middle position of bottom in cup body, the cooling fin mounting plate are fixed on the periphery of the Lamp cup body and the thermally conductive lamp holder, institute
State the periphery that cooling fin is uniformly distributed and is fixed on the cooling fin mounting plate, potting resin is by the inside of the Lamp cup body and institute
Wick is stated to be encapsulated within.
2. the LED light encapsulating structure according to claim 1 for being conducive to heat dissipation, it is characterised in that: the inner wall of the Lamp cup body
On be provided with reflective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820762543.0U CN208418189U (en) | 2018-05-21 | 2018-05-21 | A kind of LED light encapsulating structure conducive to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820762543.0U CN208418189U (en) | 2018-05-21 | 2018-05-21 | A kind of LED light encapsulating structure conducive to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208418189U true CN208418189U (en) | 2019-01-22 |
Family
ID=65115368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820762543.0U Expired - Fee Related CN208418189U (en) | 2018-05-21 | 2018-05-21 | A kind of LED light encapsulating structure conducive to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208418189U (en) |
-
2018
- 2018-05-21 CN CN201820762543.0U patent/CN208418189U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190122 Termination date: 20210521 |