CN208386997U - 一种电路板 - Google Patents
一种电路板 Download PDFInfo
- Publication number
- CN208386997U CN208386997U CN201820926740.1U CN201820926740U CN208386997U CN 208386997 U CN208386997 U CN 208386997U CN 201820926740 U CN201820926740 U CN 201820926740U CN 208386997 U CN208386997 U CN 208386997U
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- CN
- China
- Prior art keywords
- conducting wire
- pattern
- circuit board
- wire area
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 56
- 229910052802 copper Inorganic materials 0.000 claims description 56
- 239000010949 copper Substances 0.000 claims description 56
- 238000007711 solidification Methods 0.000 claims description 11
- 230000008023 solidification Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 94
- 238000000034 method Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 Side wall Chemical compound 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820926740.1U CN208386997U (zh) | 2018-06-14 | 2018-06-14 | 一种电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820926740.1U CN208386997U (zh) | 2018-06-14 | 2018-06-14 | 一种电路板 |
Publications (1)
Publication Number | Publication Date |
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CN208386997U true CN208386997U (zh) | 2019-01-15 |
Family
ID=64967842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201820926740.1U Active CN208386997U (zh) | 2018-06-14 | 2018-06-14 | 一种电路板 |
Country Status (1)
Country | Link |
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CN (1) | CN208386997U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110429071A (zh) * | 2019-08-13 | 2019-11-08 | 丰鹏创科科技(珠海)有限公司 | 功率器件模组及其制备方法 |
CN114171663A (zh) * | 2021-12-07 | 2022-03-11 | 丰鹏电子(珠海)有限公司 | 散热基板及其制备方法 |
CN114828438A (zh) * | 2021-01-22 | 2022-07-29 | 健鼎(无锡)电子有限公司 | 复合式电路板及其制造方法 |
-
2018
- 2018-06-14 CN CN201820926740.1U patent/CN208386997U/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110429071A (zh) * | 2019-08-13 | 2019-11-08 | 丰鹏创科科技(珠海)有限公司 | 功率器件模组及其制备方法 |
CN110429071B (zh) * | 2019-08-13 | 2021-09-21 | 丰鹏创科科技(珠海)有限公司 | 功率器件模组及其制备方法 |
CN114828438A (zh) * | 2021-01-22 | 2022-07-29 | 健鼎(无锡)电子有限公司 | 复合式电路板及其制造方法 |
CN114171663A (zh) * | 2021-12-07 | 2022-03-11 | 丰鹏电子(珠海)有限公司 | 散热基板及其制备方法 |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Assignor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Contract record no.: X2022980020419 Denomination of utility model: A circuit board Granted publication date: 20190115 License type: Exclusive License Record date: 20221108 |
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EE01 | Entry into force of recordation of patent licensing contract | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A circuit board Effective date of registration: 20221111 Granted publication date: 20190115 Pledgee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Pledgor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Registration number: Y2022980021699 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Assignor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Contract record no.: X2022980020419 Date of cancellation: 20240118 |
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EC01 | Cancellation of recordation of patent licensing contract | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20190115 Pledgee: Hengqin Financial Investment International Finance Leasing Co.,Ltd. Pledgor: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd. Registration number: Y2022980021699 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |