CN208378998U - 12 inches of Multi-function extension chemical deposition processing procedure chamber equipment - Google Patents
12 inches of Multi-function extension chemical deposition processing procedure chamber equipment Download PDFInfo
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- CN208378998U CN208378998U CN201820955515.0U CN201820955515U CN208378998U CN 208378998 U CN208378998 U CN 208378998U CN 201820955515 U CN201820955515 U CN 201820955515U CN 208378998 U CN208378998 U CN 208378998U
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Abstract
12 inches of Multi-function extension chemical deposition processing procedure chamber equipment, including transmission cavity, preparation chamber, processing procedure chamber, cooling chamber, wafer carrying platform, workbench and mechanical arm.The workbench is rectangle, and is connected with transmission cavity；The transmission cavity is square, and there is circular hole in centre, and for placing mechanical arm, transmission cavity is connected with workbench, cooling chamber and processing procedure chamber；The cooling chamber is in transmission cavity and prepares between chamber, and wafer carrying platform is contained in inside, in transmission cavity and prepares to transmit transfer between chamber for wafer；The preparation chamber is square, and is connected with cooling chamber, processing procedure chamber.The utility model can at most carry out 10 processing procedure reactions, and equipment entirety production efficiency is greatly improved, and carry out processing procedure and distribute rationally.
Description
Technical field
The utility model relates to semiconductor crystal wafer manufacturing field more particularly to 12 inches of Multi-function extension chemical deposition processing procedures
Chamber equipment.
Background technique
Wafer manufacturing industry is hi-tech industry, and industry chain length is with high content of technology, and production control difficulty is big.Partly lead
Body manufacturing represents national core technology competence.At this stage, high-end manufacture of microchips, advanced semiconductor equipment have few
The American-European-Japanese state monopoly of number, China's semiconductor manufacturing industry are in urgent need to be improved;
Wafer manufacture is produced by 6 inch wafers, gradually develops to the production of 12 inch wafers.China must catch 12 inches
Wafer manufactures key point, realizes that IC manufacturing industry is overtaken other vehicles.If manufacturing and designing 12 autonomous inch wafers is made equipment
It is particularly critical, wherein one of Typical Representative equipment, i.e. wafer chemical depositing device.Existing external 12 inches of chemical depositions are set
Standby, majority is all made of single main cavity, and plug-in three processing procedure chambers, since cavity is less, in order to improve the production efficiency, the present invention is set
A 12 cun of wafer chemicals deposition apparatus of ad hoc meter is counted, optimization processing procedure configuration improves production efficiency.
Summary of the invention
The technical problem to be solved is that provide 12 inches of Multi-function extension chemical deposition processing procedure chambers for the utility model patent
Equipment is matched by designing multiple processing procedure chambers, transformation transmission cooling chamber, and optimization processing procedure configuration improves production efficiency;
To achieve the above object, the technical scheme adopted by the utility model to solve the technical problem is as follows: function more than 12 inches
Can extend chemical deposition manufacture process chamber equipment, including transmission cavity, prepare chamber, processing procedure chamber, cooling chamber, wafer carrying platform, workbench and
Mechanical arm.The workbench is rectangle, and is connected with transmission cavity；The transmission cavity is square, and there is circular hole in centre,
For placing mechanical arm, transmission cavity is connected with workbench, cooling chamber and processing procedure chamber；The cooling chamber is in transmission cavity and preparation
Between chamber, wafer carrying platform is contained in inside, in transmission cavity and prepares to transmit transfer between chamber for wafer；The preparation chamber is in side
Shape is connected with cooling chamber, processing procedure chamber;
The workbench, in equipment front position, one end is the station of facing to manufacture personnel, and multiple machines are contained in inside
Tool arm is used for wafer transfer；The other end is connected with transmission cavity;
There is aperture at the transmission cavity, four sides, and one end is connected with workbench, and one end is connected with cooling chamber；Two side opening
For installing processing procedure chamber, left and right can external two manufacturing process chambers simultaneously；Vacuum degree can reach 10 in transmission cavity-7mT;
The cooling chamber is connected to transmission cavity and prepares between chamber, and there is circular opening in inside, for placing wafer carrying
Platform；Wafer carrying platform is made of two round tray superpositions, and bottom is fixed with cooling chamber, can be moved vertically up and down by cylinder.
Wafer carrying platform, upside pallet in transmission cavity and prepare to transmit transfer between chamber for wafer, and downside pallet is passing through for wafer
It is cooling after processing procedure reaction;
The preparation chamber shape is square, and is connected with cooling chamber and processing procedure chamber, and preparing three face of chamber can be with external three work
Skill processing procedure chamber prepares hole among chamber, and for placing mechanical arm, preparing chamber vacuum degree can reach 10-9mT;
The processing procedure chamber, shape are rectangle, and there are two cavity groove is reacted on processing procedure chamber, a processing procedure chamber can carry out simultaneously
Two processing procedure reactions;
In conclusion the utility model transmission cavity and processing procedure chamber, at most can external five processing procedure chambers, due to each processing procedure chamber
2 different processing procedure reactions can be carried out equipment is greatly improved and integrally gives birth to so the utility model can at most carry out 10 processing procedure reactions
Efficiency is produced, processing procedure is carried out and distributes rationally.It, can since cooling chamber interior design is contained the wafer carrying platform being made of two pallets
It is transmitted and cools down simultaneously, further improve production efficiency of equipment.
Detailed description of the invention
Fig. 1 is the utility model general structure schematic diagram；
Fig. 2 is the utility model wafer carrying platform schematic diagram；
1. workbench；2. processing procedure chamber；3. transmission cavity；4. preparing chamber；5. cooling chamber；6. mechanical arm；7. wafer carrying platform；
8. upside pallet；9. downside pallet.
Specific embodiment
The utility model is described further with reference to the accompanying drawings and examples.
As shown in Figure 1,12 inches of Multi-function extension chemical deposition processing procedure chamber equipment, including transmission cavity 3, preparation chamber 4, processing procedure
Chamber 2, cooling chamber 5, wafer carrying platform 7, workbench 1 and mechanical arm 6.The workbench 1 is rectangle, with 3 phase of transmission cavity
Even；The transmission cavity 3 is square, and there is circular hole in centre, for placing mechanical arm 6, transmission cavity 3 and workbench 1, cooling
Chamber 5 is connected with processing procedure chamber 2；The cooling chamber 5 is in transmission cavity 1 and prepares between chamber 4, and wafer carrying platform 7 is contained in inside, is used for
Wafer is in transmission cavity 3 and prepares to transmit transfer between chamber 4；The preparation chamber 4 is square, and is connected with cooling chamber 5, processing procedure chamber 2.
There is aperture at the transmission cavity 3, four sides, and one end is connected with workbench 1, and one end is connected with cooling chamber 5；It opens two sides
For installing processing procedure chamber 2, left and right can external two manufacturing process chambers 2 simultaneously in hole.
The cooling chamber 5 is connected to transmission cavity 3 and prepares between chamber 4, and there is circular opening in inside, for placing wafer
Plummer 7；Wafer carrying platform 7 is made of two round tray superpositions, and upside pallet 8 in transmission cavity 3 and prepares chamber 4 for wafer
Between transmit transfer, downside pallet 9 is for wafer cooling after processing procedure reacts.
4 shape of preparation chamber is square, and is connected with cooling chamber 5 and processing procedure chamber 2, and preparing 4 three face of chamber can be with external three
A manufacturing process chamber 2 prepares the intermediate hole of chamber 4, for placing mechanical arm 6.
It is understood that embodiment of above is merely to illustrate that the principles of the present invention and uses exemplary
Embodiment, however the utility model is not limited thereto.For those skilled in the art, this is not being departed from
In the case where the spirit and essence of utility model, various changes and modifications can be made therein, these variations and modifications are also considered as this reality
With novel protection scope.
Claims (5)
1. 12 inches of Multi-function extension chemical deposition processing procedure chamber equipment, it is characterised in that: transmission cavity prepares chamber, is processing procedure chamber, cold
But chamber, wafer carrying platform, workbench and mechanical arm composition；The workbench is connected with transmission cavity, transmission cavity and cooling chamber
It is connected with processing procedure chamber, the cooling chamber is in transmission cavity and prepares between chamber, and wafer carrying platform, the preparation chamber are contained in inside
It is connected with cooling chamber and processing procedure chamber.
2. 12 inches of Multi-function extensions chemical deposition processing procedure chamber equipment according to claim 1, it is characterised in that: described
Transmission cavity is square, and there is circular hole in centre, and there is aperture at four sides, and one end is connected with workbench, and one end is connected with cooling chamber, and two
For side opening for installing processing procedure chamber, left and right can external two manufacturing process chambers simultaneously.
3. 12 inches of Multi-function extensions chemical deposition processing procedure chamber equipment according to claim 1, it is characterised in that: cooling
Chamber is connected to transmission cavity and prepares between chamber, and there is circular opening in inside, for placing wafer carrying platform.
4. 12 inches of Multi-function extensions chemical deposition processing procedure chamber equipment according to claim 3, it is characterised in that: described
Wafer carrying platform is made of two round tray superpositions, and respectively first volume pallet and downside pallet, bottom is fixed with cooling chamber, is led to
Crossing cylinder can move vertically up and down.
5. 12 inches of Multi-function extensions chemical deposition processing procedure chamber equipment according to claim 1, it is characterised in that: described
Prepare chamber shape to be square, be connected with cooling chamber and processing procedure chamber, chamber can be prepared with external three manufacturing process chambers by preparing three face of chamber
Intermediate hole, for placing mechanical arm, preparing chamber vacuum degree can reach 10-9mT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820955515.0U CN208378998U (en) | 2018-06-21 | 2018-06-21 | 12 inches of Multi-function extension chemical deposition processing procedure chamber equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820955515.0U CN208378998U (en) | 2018-06-21 | 2018-06-21 | 12 inches of Multi-function extension chemical deposition processing procedure chamber equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208378998U true CN208378998U (en) | 2019-01-15 |
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ID=64967410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820955515.0U Active CN208378998U (en) | 2018-06-21 | 2018-06-21 | 12 inches of Multi-function extension chemical deposition processing procedure chamber equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN208378998U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670049A (en) * | 2019-11-19 | 2020-01-10 | 武汉新芯集成电路制造有限公司 | Vapor deposition method and device |
| CN115376978A (en) * | 2022-07-05 | 2022-11-22 | 南京原磊纳米材料有限公司 | Multi-piece wafer transmission cooling mechanism |
-
2018
- 2018-06-21 CN CN201820955515.0U patent/CN208378998U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670049A (en) * | 2019-11-19 | 2020-01-10 | 武汉新芯集成电路制造有限公司 | Vapor deposition method and device |
| CN115376978A (en) * | 2022-07-05 | 2022-11-22 | 南京原磊纳米材料有限公司 | Multi-piece wafer transmission cooling mechanism |
| CN115376978B (en) * | 2022-07-05 | 2023-11-24 | 南京原磊纳米材料有限公司 | Multi-piece type wafer transmission cooling mechanism |
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