CN204118113U - A kind of built-in driving full angle emitting led light source - Google Patents
A kind of built-in driving full angle emitting led light source Download PDFInfo
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- CN204118113U CN204118113U CN201420293439.3U CN201420293439U CN204118113U CN 204118113 U CN204118113 U CN 204118113U CN 201420293439 U CN201420293439 U CN 201420293439U CN 204118113 U CN204118113 U CN 204118113U
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Abstract
The utility model provides a kind of built-in drive-type full angle emitting led light source, and this LED light source comprises: transparency carrier, and the front of transparency carrier is provided with printed circuit, and the portion of upper surface of printed circuit is provided with some conductive welding disks; At least one luminescence chip, each luminescence chip is bonded in the front of transparency carrier, and each luminescence chip is all electrically connected by metal wire and conductive welding disk; Drive circuit assembly, drive circuit assembly is bonded on transparency carrier and conductive welding disk, and drive circuit assembly is electrically connected by metal wire and conductive welding disk.The utility model, by being applied in LED by transparent material, effectively can improve luminous efficiency and the lighting angle of LED, realize 360 degree omnibearing luminous, save energy consumption to a certain extent; Simultaneously the LED light source that provides of the utility model is owing to being built-in with drive circuit, therefore perhaps can realize luminescence without the need to external driver module, applied range.
Description
Technical field
The utility model relates to lighting field, specifically, relates to a kind of built-in driving full angle emitting led light source.
Background technology
In traditional lighting technology, use osram lamp, because power consumption and volume are large, luminous efficiency is low, and the life-span is short, more and more can not adapt to the needs of modern society more.Along with the development of semiconductor technology, power consumption and volume little, luminous efficiency is high, and life-span long LED (Light Emitting Diode, light-emitting diode the are called for short LED) application in electric light source technology is more and more subject to people's attention.
Along with the progress of technology, the application of LED is increasingly extensive, and especially the power of LED is constantly upgraded and improved, LED gradually by the field infiltration and development of Signal aspects to lighting source, as road lighting, tunnel illumination, the large-power lamp fields such as factories and miness illumination.With conventional light source mutually this, LED also has a lot of unique advantage, such as luminous point is little, is easy to carry out optical design, and luminaire efficiency can do very high, therefore has huge energy-saving potential compared with conventional light source.There is better advantage in the great power LEDs such as in addition, the LED life-span is long, and shock resistance is good, and these features all make LED in road lighting, tunnel illumination, factories and miness illumination application, be widely used.
LED chip is made up of two parts, and a part is P type semiconductor, and inside it, occupy an leading position in hole; Another part is N type semiconductor, and it is mainly electronics.When these two kinds of semiconductors couple together time, between P type semiconductor and N type semiconductor, have a transition zone, industry is referred to as P-N junction.After applying a forward voltage to light-emitting diode, electric current is by transistor, and electronics will flow to P district from N district by P-N junction, near P-N junction in several microns respectively with the electronics in N district and the hole-recombination in P district, and then sending energy at P-N junction generation photon, this is the general principle of LED luminescence.
At present, traditional LED light source generally adopts metal, PCB (Printed Circuit Board, printed circuit board (PCB)) as the substrate of light emitting source, due to the limitation of metal and PCB material, be generally that one side is luminous and lighting angle is little, cause optical power down, cause the utilance of the blue chip of LED itself low simultaneously, affect the luminous efficiency of LED light source.
Meanwhile, the LED of prior art carrys out driving LED light source by external power supply to carry out luminescence, therefore has certain limitation in actual applications.
Utility model content
A kind of built-in driving full angle emitting led light source, wherein, described LED light source comprises:
Transparency carrier, the front of described transparency carrier is provided with printed circuit, and the portion of upper surface of described printed circuit is provided with some conductive welding disks;
At least one luminescence chip, each described luminescence chip is bonded in the front of described transparency carrier, and each described luminescence chip is all electrically connected by metal wire and described conductive welding disk;
Drive circuit assembly, described drive circuit assembly is bonded on described transparency carrier and described conductive welding disk, and described drive circuit assembly is electrically connected by metal wire and described conductive welding disk.
Above-mentioned built-in driving full angle emitting led light source, wherein, described transparency carrier is transparent alumina ceramics substrate.
Above-mentioned built-in driving full angle emitting led light source, wherein, described transparency carrier adopts α-Al
2o
3fire formation.
Above-mentioned built-in driving full angle emitting led light source, wherein, the straight-line luminous transmittance of described transparency carrier is greater than 10%, and total light transmittance is greater than 90%.
Above-mentioned built-in driving full angle emitting led light source, wherein, is positioned on described printed circuit and is coated with transparent high temperature resistant glue, and this transparent high temperature resistant glue does not cover the upper surface of described conductive welding disk.
Above-mentioned built-in driving full angle emitting led light source, wherein, described printed circuit and described conductive welding disk are transparent conductive material.
Above-mentioned built-in driving full angle emitting led light source, wherein, each described luminescence chip is bonded on described transparency carrier by transparent crystal-bonding adhesive.
Above-mentioned built-in driving full angle emitting led light source, wherein, described drive circuit assembly comprises driving IC chip, rectifier diode chip and resistance.
Above-mentioned built-in driving full angle emitting led light source, wherein, described rectifier diode chip and described resistance are bonded on described conductive welding disk by die bond solder paste, and described driving IC chip is bonded on described transparency carrier by die bond solder paste.
Above-mentioned built-in driving full angle emitting led light source, wherein, described luminescence chip is one or more combinations in red, green, blue LED luminescence chip.
Above-mentioned built-in driving full angle emitting led light source, wherein, described luminescence chip is the transparent chips of no-reflection layer.
Above-mentioned built-in driving full angle emitting led light source, wherein, the obverse and reverse of described transparency carrier is coated with encapsulation rare-earth fluorescent silica gel, described encapsulation rare-earth fluorescent silica gel and each described luminescence chip are formed overlapping, and the top of each described luminescence chip is covered by the encapsulation rare-earth fluorescent silica gel being positioned at described transparency carrier front;
The top coating adularescent IC packaging silicon rubber of described drive circuit.
Above-mentioned built-in driving full angle emitting led light source, wherein, described encapsulation rare-earth fluorescent silica gel is for having pattern top glue of one's own.
Above-mentioned built-in driving full angle emitting led light source, wherein, described encapsulation rare-earth fluorescent silica gel content comprises red lanthanide, green rare-earth and silica gel;
The viscosity of described encapsulation rare-earth fluorescent silicon is greater than 16000mPas.
Above-mentioned built-in driving full angle emitting led light source, wherein, the mixed proportion of described red lanthanide, green rare-earth and silica gel is 1:4:20.
A method for packing for built-in driving full angle emitting led light source, wherein, comprises the steps:
Step S1 a: transparency carrier is provided, the front of described transparency carrier is provided with printed circuit, and the portion of upper surface of described printed circuit is provided with some conductive welding disks;
Step S2: bond in the front of described transparency carrier at least one luminescence chip, and one drive circuit assembly is bonded on described conductive welding disk and described transparency carrier;
Be cured technique;
Step S3: utilize metal wire described drive circuit assembly and described luminescence chip to be connected with described conductive welding disk;
Step S4: apply one deck encapsulation rare-earth fluorescent silica gel respectively at the tow sides of described transparency carrier, and at top coating one deck IC packaging silicon rubber of described drive circuit;
Be cured technique;
Step S5: electrical detection and packaging technology.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described transparency carrier is transparent alumina ceramics substrate.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described transparency carrier adopts α-Al
2o
3fire formation.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, the straight-line luminous transmittance of described transparency carrier is greater than 10%, and total light transmittance is greater than 90%.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, is positioned on described printed circuit and is coated with transparent high temperature resistant glue, and this transparent high temperature resistant glue does not cover the surface of described conductive welding disk.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described printed circuit and described conductive welding disk are transparent conductive material.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, is bonded in described luminescence chip on described transparency carrier by transparent crystal-bonding adhesive.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described drive circuit assembly comprises driving IC chip, rectifier diode chip and resistance.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, is bonded on described conductive welding disk by die bond solder paste by described rectifier diode chip and described resistance; And
By die bond solder paste, described driving IC chip is bonded on described transparency carrier.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described luminescence chip is one or more combinations in red, green, blue LED luminescence chip.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described luminescence chip is the transparent chips of no-reflection layer.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described encapsulation rare-earth fluorescent silica gel and each described luminescence chip are formed overlapping, and the encapsulation rare-earth fluorescent silica gel being positioned at described transparency carrier front covers the top of each described luminescence chip.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described encapsulation rare-earth fluorescent silica gel is for having pattern top glue of one's own.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, described encapsulation rare-earth fluorescent silica gel content comprises red lanthanide, green rare-earth and silica gel;
The viscosity of described encapsulation rare-earth fluorescent silicon is greater than 16000mPas.
The method for packing of above-mentioned built-in driving full angle emitting led light source, wherein, the mixed proportion of described red lanthanide, green rare-earth and silica gel is 1:4:20.
Because the utility model have employed above technical scheme, by being packaged with drive circuit in LED light source, can without the need to realizing luminous by external driving power, LED light source provided by the utility model can realize full angle luminescence simultaneously, output light efficiency is also higher, while raising luminous efficiency, also reduce power consumption.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, the utility model and feature, profile and advantage will become more obvious.Mark identical in whole accompanying drawing indicates identical part.Deliberately proportionally do not draw accompanying drawing, focus on purport of the present utility model is shown.
Fig. 1 is the vertical view after a kind of LED light source of the utility model completes metal on line;
Fig. 2 is the vertical view after a kind of LED light source coating of the utility model encapsulates rare-earth fluorescent silica gel and IC packaging silicon rubber;
A kind of flow chart preparing LED light source that Fig. 3 provides for the utility model.
Embodiment
In the following description, give a large amount of concrete details to provide to understand more thoroughly the utility model.But, it is obvious to the skilled person that the utility model can be implemented without the need to these details one or more.In other example, in order to avoid obscuring with the utility model, technical characteristics more well known in the art are not described.
Should be understood that, the utility model can be implemented in different forms, and should not be interpreted as the embodiment that is confined to propose here.On the contrary, provide these embodiments will expose thoroughly with complete, and scope of the present utility model is fully passed to those skilled in the art.In the accompanying drawings, in order to clear, the size in Ceng He district and relative size may be exaggerated.Same reference numerals represents identical element from start to finish.
Be understood that, when element or layer be called as " ... on ", " with ... adjacent ", " being connected to " or " being coupled to " other element or layer time, its can directly on other element or layer, with it adjacent, connect or be coupled to other element or layer, or the element that can exist between two parties or layer.On the contrary, when element be called as " directly exist ... on ", " with ... direct neighbor ", " being directly connected to " or " being directly coupled to " other element or layer time, then there is not element between two parties or layer.Although it should be understood that and term first, second, third, etc. can be used to describe various element, parts, district, floor and/or part, these elements, parts, district, floor and/or part should not limited by these terms.These terms be only used for differentiation element, parts, district, floor or part and another element, parts, district, floor or part.Therefore, do not departing under the utility model instruction, the first element discussed below, parts, district, floor or part can be expressed as the second element, parts, district, floor or part.
Spatial relationship term such as " ... under ", " ... below ", " below ", " ... under ", " ... on ", " above " etc., here can be used thus the relation of the element of shown in description figure or feature and other element or feature for convenience of description.It should be understood that except the orientation shown in figure, spatial relationship term intention also comprises the different orientation of the device in using and operating.Such as, if the device upset in accompanying drawing, then, be described as " below other element " or " under it " or " under it " element or feature will be oriented to other element or feature " on ".Therefore, exemplary term " ... below " and " ... under " upper and lower two orientations can be comprised.Device can additionally orientation (90-degree rotation or other orientation) and as used herein spatial description language correspondingly explained.
The object of term is only to describe specific embodiment and not as restriction of the present utility model as used herein.When this uses, " one ", " one " and " described/to be somebody's turn to do " of singulative is also intended to comprise plural form, unless context is known point out other mode.It is also to be understood that term " composition " and/or " comprising ", when using in this specification, determine the existence of described feature, integer, step, operation, element and/or parts, but do not get rid of one or more other feature, integer, step, operation, element, the existence of parts and/or group or interpolation.When this uses, term "and/or" comprises any of relevant Listed Items and all combinations.
In order to thoroughly understand the utility model, by proposing detailed step and detailed structure in following description, to explain the technical solution of the utility model.Preferred embodiment of the present utility model is described in detail as follows, but except these are described in detail, the utility model can also have other execution modes.
Embodiment one
Present embodiments provide a kind of built-in driving full angle LED light source, shown in seeing figures.1.and.2, this LED light source comprises: 1. transparency carrier 1, and the front of this transparency carrier 1 is provided with printed circuit 6, and the portion of upper surface of printed circuit 6 is provided with some conductive welding disks (not indicating in figure); 2. at least one luminescence chip 6, each luminescence chip 6 is bonded in the front of transparency carrier 1, and luminescence chip 6 is all electrically connected by metal wire and conductive welding disk; 3. drive circuit assembly, drive circuit assembly is bonded on transparency carrier 1 and conductive welding disk, and drive circuit assembly is electrically connected by metal wire and conductive welding disk.
Be that transparency carrier 2 is transparent alumina ceramics substrate at an Alternate embodiments of the present embodiment.Because aluminium oxide ceramic substrate conductive coefficient is high, Heat stability is good, preparation technology is simple, and simultaneously because this aluminium oxide ceramic substrate is transparent material, therefore while guarantee stability of material, also help LED light source and can launch light in all directions, and then improve the luminous efficiency of LED.Preferred further, adopt α-Al
2o
3fire and form this transparent alumina ceramics substrate.In the lattice of alpha-type aluminum oxide, oxonium ion is that six sides are tightly packed, Al
3 +be distributed in the octahedral coordination center that oxonium ion surrounds symmetrically, lattice energy is very large, therefore fusing point, boiling point are very high.Alpha-type aluminum oxide is water insoluble and sour, industrially also claims alumina, is the base stock of metallic aluminium processed; Also for making various refractory brick, fire-clay crucible, refractory tube, high temperature resistant laboratory apparatus; Also can make grinding agent, fire retardant, inserts etc.; Also for the production of the substrate of modern large scale integrated circuit.By α-Al
2o
3effectively can play thermolysis in materials application to the utility model, extend the useful life of LED light source, and improve the stability of LED light source under working long hours.
Meanwhile, the utility model adopts α-Al
2o
3fire the transparency carrier of formation, its straight-line luminous transmittance is greater than 10%, and total light transmittance is greater than 90%, and this full angle being conducive to LED light source is luminous, improves luminous efficiency and lighting angle.Concrete sintering process is conventionally known to one of skill in the art, and therefore it will not go into details.Those skilled in the art should be understood that, the utility model adopts α-Al
2o
3the transparent alumina ceramics substrate firing formation is only a kind of preferred embodiment, and adopt other transparent materials not affect the utility model as substrate, the selection of concrete other materials does not repeat them here.
Be that above-mentioned printed circuit 6 is made by transparent conductive material, to improve luminous efficiency and the lighting angle of this LED light source with conductive welding disk at an Alternate embodiments of the present embodiment.In addition, printed circuit 6 is coated with transparent high temperature resistant glue, and this transparent high temperature resistant glue does not cover the surface of conductive welding disk, thus give the device headspace connecting conductive welding disk, also the electric connection between conductive welding disk and interface unit can not be impacted, adopt transparent high temperature resistant glue also can improve luminous efficiency and the lighting angle of this LED light source further simultaneously; Be conducive to extending LED useful life simultaneously.
At an Alternate embodiments of the present embodiment be, luminescence chip 2 can one or more in red, green, blue LED luminescence chip, come according to the actual requirements specifically to select luminescence chip, such as select single LEDs luminescence chip or all identical LED luminescence chip of many colors, or select the combination of many red, green, blue LED luminescence chip random colors and any amount, do not repeat them here in related embodiment.Further preferred, luminescence chip 2 provided by the utility model be the stereo luminous transparent chips of no-reflection layer, and employing transparent chips can ensure the luminous efficiency of luminescence chip to greatest extent.Preferably, each luminescence chip 2 is not formed with printed circuit 6 and contacts; In some embodiments, printed circuit 6 has some fractures, and each luminescence chip 2 is fixed on the transparency carrier 1 of incision position by transparent crystal-bonding adhesive.Simultaneously, the bond locations of luminescence chip 2 is controlled according to process requirements, the region that such as luminescence chip 2 shown in Fig. 1 surrounds is annular, but those skilled in the art are to be understood that and are not limited to this execution mode in actual applications, also other arrangement modes can be adopted according to process requirements, the such as regular figure such as rectangle, star or other irregular figures, do not affect the utility model.
At an Alternate embodiments of the present embodiment be, built-in drive circuit comprises driving IC chip 3, rectifier diode chip 4 and resistance 5, being combined to form one drive circuit by driving IC chip 3, rectifier diode chip 4 and resistance 5, making LED light source provided by the utility model also can realize luminescence without the need to connecting external drive circuit.Further preferred, driving IC chip 3 provided by the utility model is for having constant-current characteristics driving IC chip.
Be that rectifier diode chip 4 and resistance 5 are bonded on conductive welding disk by die bond solder paste, and driving IC chip 3 is bonded on transparency carrier 2 by die bond solder paste at an Alternate embodiments of the present embodiment.Why adopt die bond solder paste, because die bond solder paste take thermal conductivity as the bonding material that the metal alloys such as about 40W/MK SnAgCu make matrix, not only meet the environmental protection standard such as RoHS and halogen completely, apply it in LED chip packaging technology, the fusion between metal can be realized very well, significantly can reduce the thermal resistance of LED heat dissipation channel, realize better conductivity and bonding strength simultaneously, voidage is also less.Die bond solder paste is adopted to realize boning to drive circuit in the utility model, better heat conductivility can be had, the heat radiation bottleneck of great power LED can be alleviated, thus improve the reliability of LED, extend the useful life of LED, simultaneously, in the bonding material of great power LED heat conduction and heat radiation demand, the cost of die bond solder paste is well below elargol, silver slurry or other bonding materials, and die bond process energy consumption is lower simultaneously, is conducive to reducing production cost.
Be that the obverse and reverse of transparency carrier 1 is coated with encapsulation rare-earth fluorescent silica gel 7, the top coating adularescent IC packaging silicon rubber 8 of drive circuit at an optional execution mode of the present embodiment.Wherein, encapsulation rare-earth fluorescent silica gel 7 is formed vertical overlapping with each luminescence chip 2, and the encapsulation rare-earth fluorescent silica gel 7 being positioned at transparency carrier 1 front covers the top of each luminescence chip 2.Preferably, this encapsulation rare-earth fluorescent silica gel 7 is for having pattern top glue of one's own, and its main component comprises red lanthanide, green rare-earth and silica gel, and the viscosity of described encapsulation rare-earth fluorescent silicon is greater than 16000mPas, and then ensures good adhesiving effect.In an optional execution mode, the mixed proportion of red lanthanide, green rare-earth and silica gel is 1:4:20.Because the utility model is provided with encapsulation rare-earth fluorescent silica gel 7 in the upper and lower surface of luminescence chip 2, when luminescence chip is luminous, the effect of encapsulation rare-earth fluorescent silica gel 7 can be utilized to adjust the tone finally sent.The mixed proportion such as encapsulating red lanthanide, green rare-earth and silica gel in rare-earth fluorescent silica gel 7 is 1:4:20, and when adopting blue LED die, then can send daily required white light.It will be appreciated by those skilled in the art that in actual applications, according to demand by adjusting the ratio encapsulating coloured rare earth in rare-earth fluorescent silica gel 7 thus the adjustment realized tone, concrete related embodiment does not repeat them here.
It is luminous that LED light source provided by the utility model can realize 360 degree of full angles, and the light efficiency of traditional LED light source of comparing improves 50 ﹪; Simultaneously owing to being built-in with drive circuit assembly, therefore luminescence can be realized without the need to external driver module, applied range.
At an optional execution mode of the present embodiment be, when in encapsulation rare-earth fluorescent silica gel 7, the mixed proportion of red lanthanide, green rare-earth and silica gel is 1:4:20, and when adopting blue LED die, the LED light source test result prepared is: colour temperature Tc=2896K, color rendering index Ra=80.3, light efficiency: 115.2Lm/W, as can be seen here, traditional LED light source of comparing greatly improves luminous efficiency.
Embodiment two
Present embodiments provide a kind of packaging technology of built-in drive-type full angle emitting led light source, shown in Fig. 3 composition graphs 1 and Fig. 2, specifically comprise the steps:
Step S1: provide a transparency carrier 1, the front of this transparency carrier 1 is provided with printed circuit 2, and the portion of upper surface of printed circuit 2 is provided with some conductive welding disks.
Be that this transparency carrier 2 is transparent alumina ceramics substrate at an Alternate embodiments of the present embodiment.Because aluminium oxide ceramic substrate conductive coefficient is high, Heat stability is good, preparation technology is simple, and therefore preparation cost is lower; Simultaneously because this aluminium oxide ceramic substrate is transparent material, therefore while guarantee stability of material, also help luminescence chip and can launch light in all directions, and then improve the luminous efficiency of LED.Preferred further, adopt α-Al
2o
3fire and form this transparent alumina ceramics substrate.In the lattice of alpha-type aluminum oxide, oxonium ion is that six sides are tightly packed, Al
3 +be distributed in the octahedral coordination center that oxonium ion surrounds symmetrically, lattice energy is very large, therefore fusing point, boiling point are very high.Alpha-type aluminum oxide is water insoluble and sour, industrially also claims alumina, is the base stock of metallic aluminium processed; Also for making various refractory brick, fire-clay crucible, refractory tube, high temperature resistant laboratory apparatus; Also can make grinding agent, fire retardant, inserts etc.; Also for the production of the plate base of modern large scale integrated circuit.By α-Al
2o
3effectively can play thermolysis in materials application to the utility model, extend the useful life of LED light source, and improve the stability of LED light source under working long hours.
Meanwhile, at employing α-Al
2o
3fire the transparency carrier of formation, its straight-line luminous transmittance is greater than 10%, and total light transmittance is greater than 90%, and this full angle being conducive to LED light source is luminous, improves luminous efficiency and lighting angle.Concrete sintering process is conventionally known to one of skill in the art, and therefore it will not go into details.But those skilled in the art should be understood that, the utility model adopts α-Al
2o
3the transparent alumina ceramics substrate firing formation is only a kind of preferred embodiment, and adopt other transparent materials not affect the utility model as substrate, the selection of concrete other materials does not repeat them here.
Be that above-mentioned printed circuit 6 is made by transparent conductive material with conductive welding disk at an Alternate embodiments of the present embodiment, for the luminous efficiency and the lighting angle that improve this LED light source.In addition, printed circuit 6 is coated with transparent high temperature resistant glue, and this transparent high temperature resistant glue does not cover the surface of conductive welding disk, thus give the device headspace connecting conductive welding disk, also the electric connection between conductive welding disk and interface unit can not be impacted, adopt transparent high temperature resistant glue also can improve luminous efficiency and the lighting angle of this LED light source further simultaneously; Be conducive to extending LED useful life simultaneously.
Step S2: bond in the front of transparency carrier 1 at least one luminescence chip 2, and be bonded on conductive welding disk and transparency carrier 1 by one drive circuit assembly, is cured technique afterwards.
At an Alternate embodiments of the present embodiment be, luminescence chip 2 can one or more combinations in red, green, blue LED luminescence chip, come according to the actual requirements specifically to select luminescence chip, such as select single LEDs luminescence chip or all identical LED luminescence chip of many colors, or select the combination of many red, green, blue LED luminescence chip random colors and any amount, do not repeat them here in related embodiment.Preferred further, luminescence chip 2 provided by the utility model is the transparent chips of no-reflection layer, and each luminescence chip 2 is fixed on transparency carrier 2 by transparent crystal-bonding adhesive, therefore can improve luminous efficiency and the lighting angle of each luminescence chip 2.Simultaneously, the bond locations of luminescence chip 2 is controlled according to process requirements, the region that such as luminescence chip 2 shown in Fig. 1 surrounds is annular, but those skilled in the art are to be understood that and are not limited to this execution mode in actual applications, also other arrangement modes can be adopted according to process requirements, the such as regular figure such as rectangle, star or other irregular figures, do not affect the utility model.
Be that the drive circuit assembly that the utility model provides includes driving IC chip 3, rectifier diode chip 4 and resistance 5 at an Alternate embodiments of the present embodiment.By die bond solder paste, rectifier diode chip 4 and resistance 5 are bonded on conductive welding disk, utilize die bond solder paste driving IC chip 3 to be bonded on transparency carrier 1 simultaneously.Why drive circuit assembly bonds by die bond solder paste, because die bond solder paste take thermal conductivity as the bonding material that the metal alloys such as about 40W/MK SnAgCu make matrix, not only meet the environmental protection standard such as RoHS and halogen completely, apply it in LED chip packaging technology, the fusion between metal can be realized very well, significantly can reduce the thermal resistance of LED heat dissipation channel, realize better conductivity and bonding strength simultaneously, voidage is also less.Die bond solder paste is adopted to realize boning to drive circuit in the utility model, better heat conductivility can be had, the heat radiation bottleneck of great power LED can be alleviated, thus improve the reliability of LED, extend the useful life of LED, simultaneously, in the bonding material of great power LED heat conduction and heat radiation demand, the cost of die bond solder paste is well below elargol, silver slurry or other bonding materials, and die bond process energy consumption is lower simultaneously, is conducive to reducing production cost
After drive circuit assembly and luminescence chip 2 having been bondd, be cured technique, so that the transparent crystal-bonding adhesive of above-mentioned coating and die bond solder paste are cured, thus luminescence chip 2, driving IC chip 3, rectifier diode chip 4 and resistance 5 be fixed.In the utility model, utilize baking oven to toast, to be cured transparent crystal-bonding adhesive and die bond solder paste, simultaneously in some other execution mode, also can to adopt microwave, Ultraviolet radiation to be cured, not repeat them here.
Step S3: utilize metal wire drive circuit assembly and luminescence chip 2 to be connected with conductive welding disk.
At an Alternate embodiments of the present embodiment be, can by bonding equipment adopt gold thread as requested by the driving IC chip 3 included by luminescence chip 2 and drive circuit, rectifier diode chip 4 with conductive welding disk by being electrically connected, thus the operation of realizing circuit.
Step S4: apply one deck encapsulation rare-earth fluorescent silica gel 7 respectively at 1 tow sides of transparency carrier, and at top coating one deck IC packaging silicon rubber 8 of drive circuit, be cured technique.
An Alternate embodiments of the present embodiment is, encapsulation rare-earth fluorescent silica gel 1 is formed vertical overlapping with each luminescence chip 2, and encapsulation rare-earth fluorescent silicon 7 glue being positioned at transparency carrier 1 front covers the top of each luminescence chip 2.
Preferred further, this encapsulation rare-earth fluorescent silica gel 7 is for having pattern top glue of one's own, and its main component draws together red lanthanide, green rare-earth and silica gel, and the viscosity of described encapsulation rare-earth fluorescent silicon is greater than 16000mPas, and then ensures good adhesiving effect.In an optional execution mode, the mixed proportion of red lanthanide, green rare-earth and silica gel is 1:4:20.Because the utility model is provided with encapsulation rare-earth fluorescent silica gel 7 in the upper and lower surface of luminescence chip 2, when luminescence chip 2 is luminous, encapsulation rare-earth fluorescent silica gel 7 can be utilized to adjust the tone finally sent.Such as adopt blue LED die, and when the mixed proportion of red lanthanide, green rare-earth and silica gel is 1:4:20 in encapsulation rare-earth fluorescent silica gel 7, then send daily required white light.It will be appreciated by those skilled in the art that in actual applications, according to demand by adjusting the ratio encapsulating coloured rare earth in rare-earth fluorescent silica gel 7 thus the adjustment realized tone, concrete related embodiment does not repeat them here.
After above-mentioned technique completes, be again cured technique.
Step S5: carry out electrical detection and packaging technology, because follow-up electrical detection and packaging technology are well known in the art, therefore does not repeat them here.
In sum, because the utility model have employed as above technical scheme, by being applied in LED light source by transparent material, effectively can improve luminous efficiency and the lighting angle of LED, realize 360 degree omnibearing luminous, save energy consumption to a certain extent; Simultaneously the LED light source that provides of the utility model is owing to being built-in with drive circuit, therefore perhaps can realize luminescence without the need to external driver module, applied range.
Above preferred embodiment of the present utility model is described.It is to be appreciated that the utility model is not limited to above-mentioned particular implementation, the equipment wherein do not described in detail to the greatest extent and structure are construed as to be implemented with the common mode in this area; Any those of ordinary skill in the art, do not departing under technical solutions of the utility model ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solutions of the utility model, or being revised as the Equivalent embodiments of equivalent variations, this does not affect flesh and blood of the present utility model.Therefore, every content not departing from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solutions of the utility model protection.
Claims (9)
1. a built-in driving full angle emitting led light source, it is characterized in that, described LED light source comprises:
Transparency carrier, the front of described transparency carrier is provided with printed circuit, and the portion of upper surface of described printed circuit is provided with some conductive welding disks;
At least one luminescence chip, each described luminescence chip is bonded in the front of described transparency carrier, and each described luminescence chip is all electrically connected by metal wire and described conductive welding disk;
Drive circuit assembly, described drive circuit assembly is bonded on described transparency carrier and described conductive welding disk, and described drive circuit assembly is electrically connected by metal wire and described conductive welding disk.
2. built-in driving full angle emitting led light source as claimed in claim 1, it is characterized in that, described transparency carrier is transparent alumina ceramics substrate, and described transparency carrier adopts α-Al
2o
3fire formation.
3. built-in driving full angle emitting led light source as claimed in claim 1, it is characterized in that, be positioned on described printed circuit and be coated with transparent high temperature resistant glue, and this transparent high temperature resistant glue does not cover the upper surface of described conductive welding disk.
4. built-in driving full angle emitting led light source as claimed in claim 1, it is characterized in that, described printed circuit and described conductive welding disk are transparent conductive material.
5. built-in driving full angle emitting led light source as claimed in claim 1, it is characterized in that, each described luminescence chip is bonded on described transparency carrier by transparent crystal-bonding adhesive.
6. built-in driving full angle emitting led light source as claimed in claim 1, it is characterized in that, described drive circuit assembly comprises driving IC chip, rectifier diode chip and resistance.
7. built-in driving full angle emitting led light source as claimed in claim 6, it is characterized in that, described rectifier diode chip and described resistance are bonded on described conductive welding disk by die bond solder paste, and described driving IC chip is bonded on described transparency carrier by die bond solder paste.
8. built-in driving full angle emitting led light source as claimed in claim 1, is characterized in that, described luminescence chip is one or more combinations in red, green, blue LED luminescence chip, and each described luminescence chip is the transparent chips of no-reflection layer.
9. built-in driving full angle emitting led light source as claimed in claim 1, it is characterized in that, the obverse and reverse of described transparency carrier is coated with encapsulation rare-earth fluorescent silica gel, described encapsulation rare-earth fluorescent silica gel and each described luminescence chip are formed overlapping, and the top of each described luminescence chip is covered by the encapsulation rare-earth fluorescent silica gel being positioned at described transparency carrier front;
The top coating adularescent IC packaging silicon rubber of described drive circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420293439.3U CN204118113U (en) | 2014-06-04 | 2014-06-04 | A kind of built-in driving full angle emitting led light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420293439.3U CN204118113U (en) | 2014-06-04 | 2014-06-04 | A kind of built-in driving full angle emitting led light source |
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| CN204118113U true CN204118113U (en) | 2015-01-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103996785A (en) * | 2014-06-04 | 2014-08-20 | 宁波亚茂照明电器有限公司 | Built-in drive full-angle light-emitting LED light source and packaging process |
| CN111969096A (en) * | 2020-08-31 | 2020-11-20 | 福建天电光电有限公司 | Chip packaging structure |
-
2014
- 2014-06-04 CN CN201420293439.3U patent/CN204118113U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103996785A (en) * | 2014-06-04 | 2014-08-20 | 宁波亚茂照明电器有限公司 | Built-in drive full-angle light-emitting LED light source and packaging process |
| CN111969096A (en) * | 2020-08-31 | 2020-11-20 | 福建天电光电有限公司 | Chip packaging structure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: NINGBO YAMAO OPTOELECTRONICS CO., LTD. Free format text: FORMER NAME: NINGBO YAMAO LIGHTING ELECTRIC APPLIANCES CO., LTD. |
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| CP03 | Change of name, title or address |
Address after: ZTE road 315000 Zhejiang city of Ningbo province Fenghua Xikou No. 88 Patentee after: NINGBO YAMAO PHOTOELECTRIC CO., LTD. Address before: ZTE Xikou in Zhejiang province Ningbo City Road 315502 No. 88 Patentee before: Ningbo Yamao Lighting Electric Appliances Co., Ltd. |