CN208240671U - A kind of RGB-LED encapsulation module and its display screen with virtual isolated area - Google Patents
A kind of RGB-LED encapsulation module and its display screen with virtual isolated area Download PDFInfo
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- CN208240671U CN208240671U CN201820275846.XU CN201820275846U CN208240671U CN 208240671 U CN208240671 U CN 208240671U CN 201820275846 U CN201820275846 U CN 201820275846U CN 208240671 U CN208240671 U CN 208240671U
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Abstract
The utility model provides a kind of RGB-LED encapsulation module and its display screen with virtual isolated area, including substrate and the multiple luminescence units being disposed on the substrate, the luminescence unit respectively includes one group of RGB-LED chip, one layer of glue-line is provided on the luminescence unit, virtual isolated area is provided between the luminescence unit, the virtual isolated area includes the black light-absorption layer being disposed on the substrate.The utility model is by being arranged virtual isolated area, being absorbed using black light-absorption layer may cause the light interfered with each other between luminescence unit, simultaneously, by the way that isolation channel is arranged, refractive index using air refraction and packaging plastic is inconsistent, so that the light that luminescence unit issues reflects back, the influence to adjacent light-emitting units is reduced；Further, black is filled in isolation channel and frame is isolated, avoid the interference between luminescence unit to the maximum extent.
Description
Technical field
The utility model relates to arrive SMD LED(Surface Mounted Devices, surface mount device) encapsulation skill
Art, more particularly to a kind of RGB-LED encapsulation module and its display screen with virtual isolated area.
Background technique
The history of existing 40 years of the encapsulation of LED component, in recent years with the rapid development of LED industry, the application neck of LED
Domain constantly expands, then to the packing forms of LED component and performance propose it is higher, more particularly require.
For LED display, LED display is with its high brightness, weatherability in advertisement, stage, public information display, body
Means of transportation etc. are educated to be widely applied using field.LED display is divided into monochromatic screen, double-colored screen and full-color by display color
Screen.The most critical component of full-color LED display screen is LED component.In the past, since the brightness of patch SMD is relatively low, and waterproof, it is moisture-proof,
The requirement of outdoor adverse circumstances is not achieved in anti-ultraviolet function, therefore outdoor full color display screen is the world of direct insertion LED component.With
The progress of LED core chip technology and LED encapsulation technology, the brightness of SMD and degree of protection have been able to the need for meeting outdoor application
Ask, and SMD is used for outdoor full color SMD display screen, have extra small pixel spacing, high production efficiency, horizontal vertical angle it is big,
The advantages that color blending effect is good, contrast is high, therefore obtain quick application.
For RGB-LED, LED light source can utilize the red, green, blue principle of three primary colours, make three under computer technology control
Kind color has 256 grades of gray scales and arbitrarily mixes, that is, can produce 256 × 256 × 256=16777216 kinds of colors, is formed not
It is changeful with photochromic combination, realize colourful dynamic change effect and various images.
In existing SMD LED manufacture, product generally uses PLCC4 structure (such as 3528,2121,1010 equal-specifications),
But above structure is all individually to exist, and in actual production, can only be pasted one by one, and production efficiency is low, and maintenance difficulty is big,
Especially when LED display produces, the quantity of the LED used is usually the order of magnitude up to ten thousand or even up to a million, when being produced into
When the product of small size, as 1.0mm*1.0mm specification and following specification when, the production difficulty of product is multiplied, product
Mechanical strength also can be very low, be easy to damage under external force, production efficiency also can be very low, and wants mounting device
Asking also can be very high.Aiming at the problem that single attachment, applicant once used the form of encapsulation module, i.e., encapsulates multiple groups in same mould group
RGB-LED chip, such as the Chinese patent that notification number is CN106847801A, CN106847800A.But above-mentioned patent is in practical life
There can be some problems in production.As shown in Figure 1, in encapsulation module, due to shining as diffusion, adjacent luminescence unit for LED
Between the light that issues can generate interference, since single luminescence unit is inherently formed by tri- kinds of chip light mixings of RGB, adjacent hair
The light of light unit such as generates interference, will directly affect light made of its light mixing, to influence its clarity and acutance.
Therefore, the existing technology needs to be improved and developed.
Utility model content
The purpose of this utility model is to provide a kind of with the RGB-LED encapsulation module of virtual isolated area and its display
Screen, it is intended to solve the problem of that the adjacent light-emitting units of existing RGB-LED encapsulation module are easy to produce interference and influence clarity.
To solve the above problems, the technical solution of the utility model is as follows:
A kind of RGB-LED encapsulation module with virtual isolated area, including substrate and the multiple hairs being disposed on the substrate
Light unit, the luminescence unit respectively include one group of RGB-LED chip, and one layer of glue-line is provided on the luminescence unit, described
Virtual isolated area is provided between luminescence unit, the virtual isolated area includes the black light-absorption layer being disposed on the substrate.
The RGB-LED encapsulation module with virtual isolated area, wherein the black light-absorption layer includes carbon black, stone
One of ink, carbon nanotube, melanin, iron oxide black, graphene or other same type black light-absorbing materials or a variety of combinations.
The RGB-LED encapsulation module with virtual isolated area, wherein the virtual isolated area further includes being located at institute
State the isolation channel between luminescence unit.
The RGB-LED encapsulation module with virtual isolated area, wherein the virtual isolated area further includes being filled in
Frame is isolated in black in the isolation channel.
The RGB-LED encapsulation module with virtual isolated area, wherein the width and height of the black isolation frame
Consistent with the width and height of isolation channel, the black isolation frame is mixed with carbon black, graphite, carbon nanotube, melanin, iron oxide black, stone
One of black alkene is a variety of.
The RGB-LED encapsulation module with virtual isolated area, wherein the material of the glue-line is epoxy resin
Any one of glue, silica gel, modified silica-gel, modified epoxy glue.
The RGB-LED encapsulation module with virtual isolated area, wherein RGB-LED chip is positive cartridge chip, vertical
Any one of chip or flip-chip, including red light chips, green light chip and blue chip.
A kind of RGB-LED display screen with virtual isolated area is virtually isolated with having described in any one as above
The RGB-LED encapsulation module in area.
The RGB-LED display screen with virtual isolated area, wherein the width of the virtual isolated area and adjacent
Spacing between RGB-LED encapsulation module is consistent.
The beneficial effects of the utility model include: the RGB-LED encapsulation provided by the utility model with virtual isolated area
Mould group and its display screen, by the way that virtual isolated area is arranged, being absorbed using black light-absorption layer be may cause mutually between luminescence unit
The light of interference, meanwhile, by the way that isolation channel is arranged, the refractive index using air refraction and packaging plastic is inconsistent, so that shining
The light that unit issues reflects back, and reduces the influence to adjacent light-emitting units；Further, in isolation channel fill black every
From frame, the interference between luminescence unit is avoided to the maximum extent.
Detailed description of the invention
Fig. 1 is a kind of existing cross-sectional view of RGB-LED encapsulation module.
Fig. 2 is a kind of cross-sectional view of the RGB-LED encapsulation module with virtual isolated area provided by the utility model.
Fig. 3 is the cross-sectional view of another RGB-LED encapsulation module with virtual isolated area provided by the utility model.
Fig. 4 is the cross-sectional view of another RGB-LED encapsulation module with virtual isolated area provided by the utility model.
Fig. 5 is the Facad structure of another RGB-LED encapsulation module with virtual isolated area provided by the utility model
Schematic diagram.
Description of symbols: 1, substrate；2, luminescence unit；3, RGB-LED chip；4, epoxy resin layer；5, black light-absorbing
Layer；6, isolation channel；7, frame is isolated in black；8, virtual isolated area.
Specific embodiment
The embodiments of the present invention is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein
Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as practical to this
Novel limitation.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model
It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure
It makes and operates, therefore should not be understood as limiting the present invention.In the description of the present invention, it should be noted that
Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixed
Connection, may be a detachable connection, or be integrally connected；Can be mechanical connection, be also possible to electrical connection or can be mutual
Communication；It can be directly connected, the connection inside two elements or two can also be can be indirectly connected through an intermediary
The interaction relationship of element.For the ordinary skill in the art, above-mentioned term can be understood as the case may be
Concrete meaning in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to
Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above "
One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.First is special
Sign is directly below and diagonally below the second feature including fisrt feature under the second feature " below ", " below " and " below ", or only
Indicate that first feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, the example of various specific techniques and material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
- Fig. 5 referring to fig. 2 is multiple realities of the RGB-LED encapsulation module provided by the utility model with virtual isolated area
Apply example.As shown in Fig. 2, the embodiment includes substrate 1 and setting multiple luminescence units 2 on substrate 1, in the embodiment,
The quantity of luminescence unit 2 is 2, and each luminescence unit 2 respectively includes one group of RGB-LED chip 3, is provided on luminescence unit 2
One layer of glue-line, the glue-line are epoxy resin layer 4 in this embodiment, and virtual isolated area is provided between luminescence unit 2, described
Virtual isolated area includes the black light-absorption layer 5 of setting on a substrate 2.Being absorbed using black light-absorption layer 5 may between luminescence unit
Cause the light interfered with each other.Although black light-absorption layer 5 is not actually formed the isolation between luminescence unit 2, it is inhaled
Interference light lateral between luminescence unit 2 has been received, virtual isolated area has been formed it into.
Preferably, black light-absorption layer 5 include one of carbon black, graphite, carbon nanotube, melanin, iron oxide black, graphene or
The combination of multiple material.Above-mentioned material has excellent extinction effect, can effectively absorb interference light.
In the present embodiment, epoxy resin layer 5 can also select other materials such as silica gel, modified silica-gel, modified epoxy glue
Material, the presence of epoxy resin layer 5 can form the protection to luminescence unit 2, reinforce the mechanical strength of encapsulation module, also help
Improve luminous efficiency.
In actual production, RGB-LED chip 3 includes red light chips, green light chip and blue chip, can be formal dress
Any one of chip, vertical chip or flip-chip.RGB-LED chip 3 is positive cartridge chip in the present embodiment, passes through bonding
Line is electrically connected.
Referring to Fig. 3, in addition to black light-absorption layer 5 is arranged, the virtual isolated area can also include between luminescence unit 2
Isolation channel 6.Because of the presence of isolation channel 6, in the light that luminescence unit can be made to be issued, some, which is able to carry out, is all-trans
It penetrates, so as to effectively reduce the interference between luminescence unit.
It referring to fig. 4 and Fig. 5, is the effect for further strengthening extinction and reflection light, on the basis of the above embodiments, this
Utility model can also fill the black isolation frame 7 with extinction effect in isolation channel 6, i.e., by black light-absorption layer 5, isolation channel
6 and black isolation frame 7 collectively constitute virtual isolated area 8.In practical applications, black isolation frame 7 width and height with every
Width and height from slot 6 is consistent, to keep entire encapsulation module high consistency.Black be isolated frame 7 can mixed with carbon black,
One of graphite, carbon nanotube, melanin, iron oxide black, graphene or multiple material, to enhance its absorbing ability.
For the utility model in production, production procedure is as follows:
The die bond bonding wire first on substrate sets RGB-LED chip, black light-absorption layer is coated between luminescence unit,
Be molded one layer of glue-line, cut on glue-line, formed isolation channel, can also molding when form isolation channel, then every
Frame is isolated from black is filled by modes such as dispensing or injecting glues on slot, last cutting products form RGB-LED encapsulation module.
The utility model additionally provides a kind of RGB-LED display screen with virtual isolated area, has tool as described above
There is the RGB-LED encapsulation module of virtual isolated area.Preferably, the spacing phase between the spacing of isolation channel 7 and RGB-LED encapsulation module
Deng making entire RGB-LED display screen overall appearance more neat and consistent, see to form single LED pixel in appearance.
RGB-LED encapsulation module and its display screen provided by the utility model with virtual isolated area, it is empty by setting
Quasi- isolated area, being absorbed using black light-absorption layer may cause the light interfered with each other between luminescence unit, meanwhile, by setting every
From slot, the refractive index using air refraction and packaging plastic is inconsistent, so that the light that luminescence unit issues reflects back, reduces
Influence to adjacent light-emitting units；Further, black is filled in isolation channel and frame is isolated, avoid luminescence unit to the maximum extent
Between interference.
It should be understood that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
It says, it can be modified or changed according to the above description, and all these modifications and variations all should belong to the appended power of the utility model
The protection scope that benefit requires.
Claims (9)
1. a kind of RGB-LED encapsulation module with virtual isolated area, which is characterized in that including substrate and be disposed on the substrate
Multiple luminescence units, the luminescence unit respectively includes one group of RGB-LED chip, one layer of glue is provided on the luminescence unit
Layer, it is provided with virtual isolated area between the luminescence unit, the virtual isolated area includes the black light-absorbing being disposed on the substrate
Layer.
2. the RGB-LED encapsulation module according to claim 1 with virtual isolated area, which is characterized in that the black
Light-absorption layer includes one in carbon black, graphite, carbon nanotube, melanin, iron oxide black, graphene or other same type black light-absorbing materials
Kind or a variety of combinations.
3. the RGB-LED encapsulation module according to claim 2 with virtual isolated area, which is characterized in that described virtual
Isolated area further includes the isolation channel between the luminescence unit.
4. the RGB-LED encapsulation module according to claim 3 with virtual isolated area, which is characterized in that described virtual
Isolated area further includes the black isolation frame being filled in the isolation channel.
5. the RGB-LED encapsulation module according to claim 4 with virtual isolated area, which is characterized in that the black
Width and the height that frame is isolated are consistent with the width and height of isolation channel, and the black isolation frame is mixed with carbon black, graphite, carbon nanometer
One of pipe, melanin, iron oxide black, graphene are a variety of.
6. the RGB-LED encapsulation module according to claim 1 with virtual isolated area, which is characterized in that the glue-line
Material be any one of epoxide-resin glue, silica gel, modified silica-gel, modified epoxy glue.
7. the RGB-LED encapsulation module according to claim 1 with virtual isolated area, which is characterized in that RGB-LED core
Piece is positive any one of cartridge chip, vertical chip or flip-chip, including red light chips, green light chip and blue chip.
8. a kind of RGB-LED display screen with virtual isolated area, which is characterized in that have such as claim 1-7 any one
The RGB-LED encapsulation module with virtual isolated area.
9. the RGB-LED display screen according to claim 8 with virtual isolated area, which is characterized in that it is described virtually every
It is consistent from the spacing between the width in area and adjacent RGB-LED encapsulation module.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820275846.XU CN208240671U (en) | 2018-02-26 | 2018-02-26 | A kind of RGB-LED encapsulation module and its display screen with virtual isolated area |
| JP2019030219A JP6799627B2 (en) | 2018-02-26 | 2019-02-22 | RGB-LED package module and its display |
| EP19159052.0A EP3531451B1 (en) | 2018-02-26 | 2019-02-25 | Rgb-led packaging modules and display screen formed thereof |
| US16/285,159 US10756240B2 (en) | 2018-02-26 | 2019-02-25 | RGB-LED packaging modules and display screen formed thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820275846.XU CN208240671U (en) | 2018-02-26 | 2018-02-26 | A kind of RGB-LED encapsulation module and its display screen with virtual isolated area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208240671U true CN208240671U (en) | 2018-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820275846.XU Active CN208240671U (en) | 2018-02-26 | 2018-02-26 | A kind of RGB-LED encapsulation module and its display screen with virtual isolated area |
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| Country | Link |
|---|---|
| CN (1) | CN208240671U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112148A (en) * | 2019-05-20 | 2019-08-09 | 京东方科技集团股份有限公司 | Light emitting diode module and its manufacturing method, display device |
| CN114023866A (en) * | 2021-10-19 | 2022-02-08 | 武汉大学 | Mini-LED chip array for automobile illumination and manufacturing method thereof |
| CN114924444A (en) * | 2022-03-30 | 2022-08-19 | 绵阳惠科光电科技有限公司 | Display device, display panel and array substrate thereof |
-
2018
- 2018-02-26 CN CN201820275846.XU patent/CN208240671U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112148A (en) * | 2019-05-20 | 2019-08-09 | 京东方科技集团股份有限公司 | Light emitting diode module and its manufacturing method, display device |
| WO2020233242A1 (en) * | 2019-05-20 | 2020-11-26 | 京东方科技集团股份有限公司 | Light-emitting diode module and manufacturing method therefor, and display device |
| CN114023866A (en) * | 2021-10-19 | 2022-02-08 | 武汉大学 | Mini-LED chip array for automobile illumination and manufacturing method thereof |
| CN114924444A (en) * | 2022-03-30 | 2022-08-19 | 绵阳惠科光电科技有限公司 | Display device, display panel and array substrate thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200623 Address after: 271000 intersection of Taihe Road and Hesheng Road, Xintai Economic Development Zone, Tai'an City, Shandong Province Patentee after: Shandong jierunhong Photoelectric Technology Co.,Ltd. Address before: 271200 Xintai Economic Development Zone, Shandong, Tai'an Patentee before: SHANDONG PROSPEROUS STAR OPTOELECTRONICS Co.,Ltd. |
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| TR01 | Transfer of patent right |