CN208507667U - Four crystalline substance LED of one kind show lamp bead structure - Google Patents
Four crystalline substance LED of one kind show lamp bead structure Download PDFInfo
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- CN208507667U CN208507667U CN201820736099.5U CN201820736099U CN208507667U CN 208507667 U CN208507667 U CN 208507667U CN 201820736099 U CN201820736099 U CN 201820736099U CN 208507667 U CN208507667 U CN 208507667U
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Abstract
The utility model discloses four crystalline substance LED of one kind to show lamp bead structure, including four LED wafers, PCB substrate and route thereon, PCB substrate is made of the unit substrate of multiple square structures, unit substrate is provided centrally with public pole bonding region, not common pole die bond bonding region is respectively set on four angles, the back side of unit substrate is provided with public pole bonding welding pad and not common pole bonding welding pad；Public pole bonding region is connected by public pole via hole with public pole bonding welding pad, and not common pole die bond bonding region covers copper via hole by surface and is connected with not common pole bonding welding pad one-to-one correspondence；Not common pole die bond bonding region bonds the LED wafer there are four types of different colours respectively；The utility model realizes the color scheme of four primaries, while greatly promoting the color fidelity of LED display, while optimize connection line, meets the thermally conductive demand of LED.
Description
Technical field
The utility model relates to a kind of LED to encapsulate display device, refer in particular to four crystalline substance LED of one kind and show lamp bead structure.
Background technique
Semiconductor lighting has the remarkable advantages such as service life length, energy-saving and environmental protection, safety as new and effective solid light source, will
Leaping again after incandescent lamp, fluorescent lamp in history is illuminated as the mankind, application field is expanding rapidly, positive to drive
The upgrading of the industries such as traditional lighting, display, economic benefit and social benefit are huge.Just because of this, semiconductor lighting quilt
Generally regard one of 21st century new industry most with prospects and the most important system of coming years optoelectronic areas as
One of high point.Due to various advantages such as its energy conservation and environmental protection, safety, light emitting diode is widely used in the neck such as illumination, electronic device
Domain, wherein in display screen using especially prominent.
Light emitting diode (LED) display screen is that Chinese light emitting diode market development is more early also larger light emitting diode
Application field, the light emitting diode (LED) display screen market sales volume and sales volume expand year by year.Chinese light emitting diode (LED) display screen according to
Market structure is divided into single primary colours display screen, dual base color display screen and full color display.Single primary colours market share is minimum, full-color display
It is maximum to shield the market share.What full color display was generallyd use is traditional RGB three primary colours technology, is sealed on a display unit
Red primaries, green primary color, blue primary Tricolor LED chip have been filled, by being limited by the colour gamut of RGB three primary colours, tradition
The diode displaying lamp bead based on RGB technology be difficult to true reappearance original color, exist and lack color fidelity
Defect.Moreover, small clearance display screen is smaller and smaller to pel spacing requirement, color rendition degree is required higher and higher.Then to LED
Size require it is smaller and smaller；Also higher and higher, the colour gamut of traditional primitive colours LED is required to the color saturation of LED simultaneously
Be no longer satisfied requirement.
It is continued to increase now with the intensity of illumination of LED light, lighting color requires increasingly to enrich, it is necessary to will be different
The LED chip of luminescent color (red, green, blue, white) is integrated into the region of very little, and the red LED chip of single electrode is because of its light efficiency height
It is widely applied in required field, the chip of single double two kinds of Different electrodes, common line plate is just integrated in this way in the region of very little
The demand for the route that the thermally conductive and single bipolar electrode chip of LED coexists cannot be met simultaneously.
Utility model content
The utility model overcomes the deficiencies in the prior art, provides four crystalline substance LED of one kind and shows lamp bead structure, may be implemented more
The color scheme of kind four primaries, while greatly promoting the color fidelity of LED display.
In order to achieve the above object, the utility model is achieved by the following technical solution.
Four crystalline substance LED of one kind show lamp bead structure, which includes four LED wafers, the PCB substrate of insulated type and arrangement
Route in the PCB substrate；The PCB substrate is made of the unit substrate of multiple square structures, each of described
There are four area, four areas are provided centrally with public pole bonding region, described for the front even symmetrical setting of unit substrate
Four areas on be respectively arranged with not common pole die bond bonding region, be provided on the public pole bonding region public pole conducting
Hole is provided with surface on the not common pole die bond bonding region and covers copper via hole；The back side of each unit substrate exists
Be provided with public pole bonding welding pad on position corresponding with public pole bonding region, the back side of each unit substrate with
Not common pole die bond bonding region is provided with not common pole bonding welding pad on corresponding position；The public pole bonding region passes through
Public pole via hole is connected with public pole bonding welding pad, and the not common pole die bond bonding region covers copper via hole by surface
It is connected with not common pole bonding welding pad one-to-one correspondence；The not common pole die bond bonding region of four be arranged on the unit substrate
Middle position be bonded with LED wafer respectively, the not common pole of the LED wafer is not common by lead and respective place
Pole die bond bonding region is connected, and the public pole of the LED wafer is connected by lead with public pole bonding region；The PCB
Row cutting line, column cutting line are provided on substrate.
The LED wafer is the LED wafer of three kinds or four kinds different colours.
Further, the PCB substrate is BT plate or resin plate or ceramic wafer material.
The four crystalline substance LED show that lamp bead can according to need single four crystalline substance LED for being cut into 1*1 in cutting, can also
Two four crystalline substance LED for being cut into 1*2 are connected, and can also be cut into the composite structure of 1*3,1*4,2*2.
Four crystalline substance LED can be RGBO, or the combining form of 2R1G1B, 2G1R1B, 2B1R1G.
Wherein, not common pole die bond bonding region plays the role of die bond and bonding simultaneously.
The utility model has following column beneficial effect compared with prior art.
Not common pole bonding region is arranged by the way that public pole bonding region to be arranged in the centre of unit substrate for the utility model
In the quadrangle of unit substrate, the positional relationship of the not common pole bonding region in public pole bond area is optimized, makes it in the mistake of connection
Distance is shorter and more effective in journey, while substrate front side being connected with the pad at the back side by the route of most shortcut, only leads to
The route that the mono- bipolar electrode of LED coexists can be realized by crossing one layer of PCB substrate, and fully meet the thermally conductive demand of LED.The utility model
Wiring board can be applied to the encapsulation of the light-emitting diode chip for backlight unit using four kinds of different colours or three kinds of colors, i.e., in tradition
RGB three-color light-emitting diode technically joined the light emitting diode of another color and replace traditional three primary colors, four
The colour gamut that primary colors includes is significantly greater than traditional RGB three primary colours and also may be implemented so that four primaries RGBY may be implemented in LED
The color scheme such as 2R1G1B or 1R2G1B, 1R1G2B, RGBO, four primaries can realize the accurate light modulation of color domain, can be more accurate
The colour gamut of NTSC is showed, therefore display color saturation can be improved, keeps display more bright and bright-coloured.Pass through simultaneously
The combination of 2R1G1B or 2G1R1B, 2B1R1G may be implemented the virtual display of color mutually, reaches the display of more small pixel spacing
Effect.
Detailed description of the invention
Fig. 1 is the utility model wiring board front schematic view.
Fig. 2 is the utility model wiring board schematic rear view.
Fig. 3 is unit substrate front schematic view.
Fig. 4 is unit substrate schematic rear view.
Fig. 5 is the schematic diagram that four LED wafers are encapsulated on unit substrate.
Fig. 6 is the combined finished product of 2 unit substrates.
Fig. 7 is the brilliant product schematic diagram of 2R1G1B tetra-.
Fig. 8 is the application schematic diagram that 2R1G1B is virtually shown.
Wherein, 1 is public pole bonding region, and 2 be not common pole die bond bonding region, and 3 be public pole bonding welding pad, and 4 be non-public affairs
Copolar bonding welding pad, 5 be public pole via hole, and 6 cover copper via hole for surface, and 7 be Mark point, and 8 be row cutting line, and 9 cut for column
Secant 10 is LED wafer, 11 be LED blue dies, 12 be LED green chip, 13 be LED red chip, 14 be LED yellow
Chip.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Under in conjunction with the embodiments, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only
Only to explain the utility model, it is not used to limit the utility model.This reality is described in detail below with reference to examples and drawings
With novel technical solution, but the scope of protection is not limited by this.
As shown in Figs. 1-5, four crystalline substance LED of one kind show lamp bead structure, the ontology include four LED wafers 10, PCB substrate and
The route being arranged in the PCB substrate, PCB substrate use BT(BismaleimideTriazine bismaleimide-triazine
Resin) plate is substrate, each unit of square structure, the front even symmetrical of each unit substrate are provided in PCB substrate
There are four area, four areas are provided centrally with public pole bonding region 1 for setting, and not common pole die bond key is respectively arranged in four areas
Area 2 is closed, public pole via hole 5 is provided on public pole bonding region 1, is provided with surface on not common pole die bond bonding region 2 and covers copper
Via hole 6；The back side of each unit substrate is provided with public pole bonding welding pad on position corresponding with public pole bonding region 1
3, the back side of each unit substrate be provided with not common pole on the corresponding position of not common pole die bond bonding region 2 and be bonded weldering
Disk 4；Public pole bonding region 1 is connected by public pole via hole 5 with public pole bonding welding pad 3, not common pole die bond bonding region 2
Copper via hole 6 is covered by surface to be connected with not common pole bonding welding pad 4 one-to-one correspondence；Four non-public affairs being arranged on unit substrate
The middle position of copolar die bond bonding region 2 bonds the LED wafer 10 there are four types of different colours respectively, four LED wafers 10 it is non-
Public pole is connected by lead with the not common pole die bond bonding region 2 at respective place, and the public pole of four LED wafers 10 passes through
Lead is connected with public pole bonding region 1.
This wiring board is specific the preparation method comprises the following steps: BT plate is drilled out public pole via hole according to actual demand size and hole location
5 and surface cover copper via hole 6, public pole via hole 5 and surface are covered into copper via hole 6 and carry out copper facing, clogged using resin described in
Two kinds of through-holes；Make the positive not common pole die bond bonding region 2 of PCB and public pole bonding region 1；Make the not common pole at the back side
Bonding welding pad 4 and public pole bonding welding pad 3；Mark point 7 is done using white or other conspicuous colors paint, is prepared above-mentioned
Surface of semi-finished plating or chemical nickel plating, gold or silver；It is formed using the size of CNC numerical control processing or mold as requested,
PCB surface mark row cutting line 8 and column cutting line 9.
Embodiment 1
In Fig. 6, with conductive silver glue by LED red chip 13 and LED yellow chip 14 with vertical construction bonds adjacent
Two not common pole die bond bonding regions 2 on, with insulating cement by LED blue dies 11 and LED green chip 12 with horizontal structure
It is bonded on remaining two not common pole die bond bonding regions 2；Admittedly good chip, the PCB full wafer for being bonded bonding line are put into height
In warm molding die, resin is added, is molded using 150 ~ 220 tons of hydraulic couplings, under 100 ~ 2220 DEG C of mould temperature heating conditions, tree
Rouge primary solidification takes out the half-finished product plate for being molded completion after die sinking, be put into 130 ~ 200 DEG C of environment and toast, and sets molding
Rouge thoroughly solidifies；It is transferred to cutting action, by making to fix in the back side semi-finished product PCB pad pasting, according to row cutting line 8 and column cutting line
9 start to cut, and form single finished product；The row shape combined article or 2*2 combined article of 1*2 or 1*4 can also be cut into.This example moulded package
It is designed to frosted flat shape, may be made as dome-type moulded lens.
Embodiment 2
As shown in fig. 7, LED red chip 13 and LED yellow chip 14 are existed with vertical construction bonds with conductive silver glue
On the not common pole die bond bonding region 2 of diagonal two, with insulating cement by LED blue dies 11 and LED green chip 12 with level
Construction bonds are on remaining two not common pole die bond bonding regions 2；Other steps are same as Example 1.
As shown in figure 8, four crystalline substance LED of one unit are split as four each other solely by four brilliant lamp beads of 2R1G1B arrangement
Vertical LED unit.Each LED unit reproduces the correspondence primary colours information of four adjacent pixels, each LED phase in a time multiplexed manner
It is equidistantly to be uniformly distributed between mutually.Advantage virtual pixel density is increased to 4 times；Effective visible sensation pixel density maximum can be improved 4
Times.
The above content is the further descriptions done in conjunction with specific preferred embodiment to the utility model, cannot
Assert that specific embodiment of the present utility model is only limitted to this, for the utility model person of an ordinary skill in the technical field
For, under the premise of not departing from the utility model, several simple deduction or replace can also be made, all shall be regarded as belonging to
The utility model determines scope of patent protection by the claims submitted.
Claims (3)
1. four crystalline substance LED of one kind show lamp bead structure, which is characterized in that the structure includes four LED wafers (10), insulated type
PCB substrate and the route being arranged in the PCB substrate；The PCB substrate by multiple square structures unit substrate structure
At there are four area, being provided centrally with for four areas is public for the front even symmetrical setting of each unit substrate
Pole bonding region (1) is respectively arranged with not common pole die bond bonding region (2), the public pole bonding region in four areas
(1) it is provided on public pole via hole (5), is provided with surface on the not common pole die bond bonding region (2) and covers copper via hole
(6)；The back side of each unit substrate is provided with public pole on position corresponding with public pole bonding region (1) and is bonded
The back side of pad (3), each unit substrate is provided on position corresponding with not common pole die bond bonding region (2)
Not common pole bonding welding pad (4)；The public pole bonding region (1) passes through public pole via hole (5) and public pole bonding welding pad
(3) it is connected, the not common pole die bond bonding region (2) covers copper via hole (6) and not common pole bonding welding pad by surface
(4) it corresponds and is connected；The middle position of the not common pole die bond bonding region (2) of four be arranged on the unit substrate point
It is not bonded with LED wafer (10), the not common pole of the LED wafer (10) is not common extremely solid by lead and respective place
Brilliant bonding region (2) is connected, and the public pole of the LED wafer (10) is connected by lead with public pole bonding region (1), institute
It states and is provided with row cutting line (8), column cutting line (9) in PCB substrate.
2. a kind of four crystalline substance LED according to claim 1 shows lamp bead structure, which is characterized in that the LED wafer (10)
For the LED wafer of three kinds or four kinds different colours.
3. a kind of four crystalline substance LED according to claim 1 or 2 shows lamp bead structure, which is characterized in that the PCB substrate
For BT plate or resin plate or ceramic wafer material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820736099.5U CN208507667U (en) | 2018-05-17 | 2018-05-17 | Four crystalline substance LED of one kind show lamp bead structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820736099.5U CN208507667U (en) | 2018-05-17 | 2018-05-17 | Four crystalline substance LED of one kind show lamp bead structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208507667U true CN208507667U (en) | 2019-02-15 |
Family
ID=65292686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820736099.5U Active CN208507667U (en) | 2018-05-17 | 2018-05-17 | Four crystalline substance LED of one kind show lamp bead structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208507667U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113526A (en) * | 2021-04-16 | 2021-07-13 | 安徽精卓光显技术有限责任公司 | Small-size LED transparent display screen and production method thereof |
| CN113506520A (en) * | 2021-06-22 | 2021-10-15 | 安徽精卓光显技术有限责任公司 | LED transparent display screen without edge wiring and production method thereof |
-
2018
- 2018-05-17 CN CN201820736099.5U patent/CN208507667U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113526A (en) * | 2021-04-16 | 2021-07-13 | 安徽精卓光显技术有限责任公司 | Small-size LED transparent display screen and production method thereof |
| CN113506520A (en) * | 2021-06-22 | 2021-10-15 | 安徽精卓光显技术有限责任公司 | LED transparent display screen without edge wiring and production method thereof |
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