CN208019988U - Self-cleaning semiconductor crystal wafer milling apparatus - Google Patents
Self-cleaning semiconductor crystal wafer milling apparatus Download PDFInfo
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- CN208019988U CN208019988U CN201820041884.9U CN201820041884U CN208019988U CN 208019988 U CN208019988 U CN 208019988U CN 201820041884 U CN201820041884 U CN 201820041884U CN 208019988 U CN208019988 U CN 208019988U
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- fast pulley
- abrasive disk
- cleaning
- water pipe
- motor
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Abstract
The utility model provides self-cleaning semiconductor crystal wafer milling apparatus, including motor, fast pulley, abrasive disk, it is set to fast pulley bottom, live spindle is set in the fast pulley, and is provided with gap between live spindle and fast pulley inner wall, one end of live spindle and motor axis connection, the other end is connect with abrasive disk, and live spindle drives its rotation by motor, to drive abrasive disk to be rotated；Fast pulley bottom is provided with apopore；Water pipe is cleaned, the water outlet for cleaning water pipe is set in the abrasive disk and the fast pulley gap.The utility model has the beneficial effects that being rinsed between abrasive disk and fast pulley in use, cleaning between the two is kept；Pass through frequent cleaning so that abrasive disk keeps clean, also allows for subsequent dismounting, improves replacement efficiency, reduces the loss brought due to replacing abrasive disk；Ejected wash water is also used as the cooling water of grinding silicon chip, reaches the abrasive action for contributing to silicon chip while cleaning.
Description
Technical field
The utility model belongs to semiconductor grinding technical field, and in particular to one kind having the grinding of self-cleaning semiconductor crystal wafer
Equipment.
Background technology
Wafer is the basic material for manufacturing semiconductor chip, and the most important raw material of semiconductor integrated circuit is silicon, therefore right
What is answered is exactly Silicon Wafer.Can manufacture various circuit component structures on silicon, and as have specific electrical functionality it
IC products.Wafer needs to be ground it when coming into operation.Currently, be ground by grinding wafer equipment, but in crystalline substance
The sludge pollution being easy during circle grinding, between abrasive disk and fast pulley after accumulation grinding.After general pollution, need to grinding
Mill is dismantled, but pollution can cause to be not easy dismounting and change between abrasive disk and fast pulley, if dismantled by force, can cause
Abrasive disk is pounded fall suddenly, and abrasive disk can be smashed, since abrasive disk and fast pulley cost are high, if damage, will cause prodigious
Economic loss.
Utility model content
In order to solve the deficiencies in the prior art, the utility model provides a kind of self-cleaning semiconductor crystal wafer milling apparatus.
The purpose of this utility model is achieved through the following technical solutions：
Self-cleaning semiconductor crystal wafer milling apparatus, including motor, the driving mechanism for driving equipment operating；Fast pulley,
It is set to the lower section of the motor, the equipment further includes abrasive disk, is set to the fast pulley bottom, for being connect with wafer
It touches and is ground；Live spindle is set in the fast pulley, and is arranged between the live spindle and the fast pulley inner wall
There are gap, one end and the motor axis connection of the live spindle, the other end to be connect with abrasive disk, the live spindle passes through motor
Its rotation is driven, to drive the abrasive disk to be rotated；The fast pulley bottom is provided with apopore；Water pipe is cleaned, is used
The water outlet in the gap between cleaning abrasive disk and fixed disk, the cleaning water pipe is set to the abrasive disk and the fixation
It takes turns in gap.
Preferably, the fast pulley is arranged in concave, and the grinding pan bottom is provided with apopore, and fast pulley and
The apopore unicom of abrasive disk.
Preferably, the equipment further includes having the second cleaning water pipe, and the water outlet of the second cleaning water pipe is set to institute
It states in fast pulley inner wall and the live spindle gap.
Preferably, the apopore is distributed in the fast pulley and grinding pan bottom.
Preferably, the motor is magnetic suspension motor.
Preferably, the cleaning water pipe cleans water pipe with described second and is set to the motor border.
Preferably, the abrasive disk upper surface is provided with an annular groove, and multiple apopores, institute are offered in the groove
The apopore for stating fast pulley is set to above the groove, and the water in the second cleaning water pipe passes through the apopore of fast pulley,
It is flowed out into groove from the apopore of abrasive disk.
The beneficial effects of the utility model are embodied in：1, it is rushed between abrasive disk and fast pulley in use
It washes, keeps cleaning between the two；
2, passing through frequent cleaning so that abrasive disk keeps clean, also allows for subsequent dismounting, improves replacement efficiency,
Reduce the loss brought due to replacing abrasive disk；
3, ejected wash water is also used as the cooling water of grinding silicon chip, reaches the grinding for contributing to silicon chip while cleaning
Effect.
Description of the drawings
Fig. 1：The structural schematic diagram of the utility model.
Wherein：1, motor；2, live spindle；3, abrasive disk；4, fast pulley；5, the second cleaning water pipe；Wafer 6；Ejected wash water
Pipe 7；34, rotary gap；14, apopore.
Specific implementation mode
The utility model discloses a kind of self-cleaning semiconductor crystal wafer milling apparatus, for being ground to semiconductor die person
Mill, is specifically described, including motor 1, and the fast pulley 4 being set under motor 1 below in conjunction with shown in Fig. 1, and the fast pulley 4 invaginates
It is arranged concave, the motor shaft of the motor is connect with a live spindle 2, and the live spindle 2 is set in fast pulley 4.
4 bottom of the fast pulley is provided with abrasive disk 3, and the live spindle 2 is connect with the abrasive disk 3, when grinding, the motor 1
Rotation drives the abrasive disk 3 to be rotated in 4 bottom of the fast pulley, is ground to wafer.
The bottom of the fast pulley 4 is both provided with apopore, and fast pulley 4 and abrasive disk 3 with 3 bottom of the abrasive disk
Apopore unicom.Specifically, being provided with an annular groove on the upper surface of the abrasive disk 3, it is provided in the annular groove
The bottom apopore of apopore 14, the fast pulley 4 is set to above the groove.Certainly, the fast pulley and the grinding
Apopore between disk can also use other forms to carry out unicom, for example, annular through-hole is directly used, due to fast pulley bottom
For apopore, slowly lasting water outlet can be kept in water outlet.
Due in process of lapping, wafer can be generated heat by continuous grinding, and in process of lapping, have powder generation, be and
When removal powder be preferably ground, be provided with the second cleaning water pipe 5 in the fast pulley 4 and 2 gap of the live spindle,
Specifically, the water outlet of the second cleaning water pipe 5 is set between the fast pulley 4 and the live spindle 2.Water is by the
Two cleaning water pipes 5, flow into fast pulley, the apopore of abrasive disk 3 are entered by the apopore of fast pulley 4, to abrasive disk and
Grinding crystal wafer is rinsed.
For the smooth rotation of live spindle energy, the second cleaning water pipe 5 is set on the motor 1, is specifically located at
When the fixed part of motor, i.e. motor rotate, the second cleaning water pipe 5 is kept fixed, and the water outlet of the second cleaning water pipe 5 is set
It is placed in the gap of the fast pulley 4 and the main shaft 2.Since equipment own vol is larger, to ensure cleaning and cooling effect,
The second cleaning water pipe 5 can be provided with a plurality of, be respectively arranged at the border of motor 1.
Due to being provided with rotary gap 34 between 4 bottom of 3 main body of abrasive disk and fast pulley, in the grinding by being used for a long time
In the process, accumulation dust or wafer powder etc. are easy to pollute, influences the service life of equipment, this equipment is additionally provided with one specially
Cleaning water route of the door for cleaning rotary gap 34, the water route are connect with the second cleaning water pipe 5 using parallel way, i.e.,
A cleaning water pipe 7 is opened up in 1 fixed part of motor, the water outlet of the cleaning water pipe 7 is set at rotary gap 34, works as equipment
When in use, rotary gap 34 is rinsed by cleaning the flow in water pipe 7, meanwhile, the flow of flushing flows to crystalline substance indirectly
Circle 6 can carry out crystal column surface scrubbing for cooling and powder again.Likewise, the cleaning water pipe 7 can be arranged with it is more
Item, particular number depend on the circumstances.
It is out-of-date in order to ensure to flow through in water since cleaning water pipe 7 is arranged outside fast pulley 4, energy fixed position, the cleaning
Hard water pipe may be used in water pipe 7.Meanwhile rotary gap 34 is directed toward in the inside bending in water outlet of the cleaning water pipe 7.Certainly, institute
Hose form can also be used by stating cleaning water pipe 7, but water outlet and the fast pulley 4 of the cleaning water pipe 7 by buckle or other
Type of attachment is fixed, to prevent from causing the shaking of cleaning water pipe 7 when water flows through water pipe so that water exit position does not prepare
Cleaning performance is not achieved.
As more optimized embodiment, in order to which more accurate position is directed toward, the water outlet of the cleaning water pipe 7 uses osculum
Diameter water outlet under same hydraulic pressure, is discharged intensity bigger, more has for the dust in rotary gap since water outlet is small
Impact force.Since rotary gap is smaller, using small-bore water outlet, ensure that can clean while, moreover it is possible to save water,
So that the step is more environmentally friendly.The utility model is the grinding to silicon wafer, and the water generally uses deionized water.
In the utility model, the motor is magnetic suspension motor.Since general motor is made of stator and mover, stator
Coupled by mechanical bearing between mover or there are Mechanical Contacts, therefore there are mechanical frictions in mover motion process.Machinery
Friction not only increases the frictional resistance of mover, and moving component is made to wear, and generates mechanical oscillation and noise, and component can be caused to send out
Heat makes lubricant degradation, serious that motor gas-gap can be made uneven, heating in winding, and temperature, which rises, to be increased, to reduce motor effect
Can, it is final to shorten motor service life.But magnetic suspension motor is using " identical charges repel each other, different between stator and mover excitation field
Property it is attracting " principle so that mover is suspended, while generating propulsive force and mover driven to be moved under suspended state.Therefore, stator
Any Mechanical Contact is not present between mover, higher acceleration and deceleration can be generated, mechanical wear is small, machinery and electricity
Gas shielded is easy, and it is convenient to safeguard, overhaul and replace, and is suitable for adverse circumstances, extremely clean nonpollution environment and special requirement
Field.
Finally it should be noted that：Above example is only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：
It still can be with technical scheme described in the above embodiments is modified, or is carried out to which part technical characteristic etc.
With replacement；And these modifications or replacements, various embodiments of the utility model technology that it does not separate the essence of the corresponding technical solution
The spirit and scope of scheme.
Claims (7)
1. self-cleaning semiconductor crystal wafer milling apparatus, including motor, the driving mechanism for driving equipment operating；Fast pulley, if
It is placed in the lower section of the motor, it is characterised in that：The equipment further includes abrasive disk, is set to the fast pulley bottom, is used for
It is ground with wafer contacts；Live spindle is set in the fast pulley, and the live spindle and the fast pulley inner wall
Between be provided with gap, one end and the motor axis connection of the live spindle, the other end are connect with abrasive disk, the live spindle
Its rotation is driven by motor, to drive the abrasive disk to be rotated；The fast pulley bottom is provided with apopore；Cleaning
Water pipe, for cleaning the gap between abrasive disk and fixed disk, the water outlet of the cleaning water pipe be set to the abrasive disk with
In the fast pulley gap.
2. self-cleaning semiconductor crystal wafer milling apparatus as described in claim 1, it is characterised in that：The fast pulley is in " recessed " word
Shape is arranged, and the grinding pan bottom is provided with apopore, and the apopore unicom of fast pulley and abrasive disk.
3. self-cleaning semiconductor crystal wafer milling apparatus as claimed in claim 2, it is characterised in that：The equipment further includes having
The water outlet of two cleaning water pipes, the second cleaning water pipe is set in the fast pulley inner wall and the live spindle gap.
4. self-cleaning semiconductor crystal wafer milling apparatus as claimed in claim 2, it is characterised in that：The apopore is distributed in institute
State fast pulley and grinding pan bottom.
5. self-cleaning semiconductor crystal wafer milling apparatus as described in claim 1, it is characterised in that：The motor is magnetic suspension electricity
Machine.
6. self-cleaning semiconductor crystal wafer milling apparatus as claimed in claim 3, it is characterised in that：The cleaning water pipe with it is described
Second cleaning water pipe is set to the motor border.
7. self-cleaning semiconductor crystal wafer milling apparatus as claimed in claim 3, it is characterised in that：The abrasive disk upper surface is set
It is equipped with an annular groove, multiple apopores are offered in the groove, the apopore of the fast pulley is set on the groove
Side, the described second water cleaned in water pipe pass through the apopore of fast pulley, are flowed out into groove from the apopore of abrasive disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820041884.9U CN208019988U (en) | 2018-01-11 | 2018-01-11 | Self-cleaning semiconductor crystal wafer milling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820041884.9U CN208019988U (en) | 2018-01-11 | 2018-01-11 | Self-cleaning semiconductor crystal wafer milling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208019988U true CN208019988U (en) | 2018-10-30 |
Family
ID=63901891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820041884.9U Active CN208019988U (en) | 2018-01-11 | 2018-01-11 | Self-cleaning semiconductor crystal wafer milling apparatus |
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| Country | Link |
|---|---|
| CN (1) | CN208019988U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112518573A (en) * | 2020-11-06 | 2021-03-19 | 西安奕斯伟硅片技术有限公司 | Polishing apparatus, polishing machine, and polishing method |
-
2018
- 2018-01-11 CN CN201820041884.9U patent/CN208019988U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112518573A (en) * | 2020-11-06 | 2021-03-19 | 西安奕斯伟硅片技术有限公司 | Polishing apparatus, polishing machine, and polishing method |
| CN112518573B (en) * | 2020-11-06 | 2022-06-07 | 西安奕斯伟硅片技术有限公司 | Polishing apparatus, polishing machine, and polishing method |
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