CN207987095U - A kind of hot melt adhesive film with high adhesion force buffer layer - Google Patents
A kind of hot melt adhesive film with high adhesion force buffer layer Download PDFInfo
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- CN207987095U CN207987095U CN201820285321.4U CN201820285321U CN207987095U CN 207987095 U CN207987095 U CN 207987095U CN 201820285321 U CN201820285321 U CN 201820285321U CN 207987095 U CN207987095 U CN 207987095U
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Abstract
A kind of hot melt adhesive film with high adhesion force buffer layer, including substrate layer, buffer layer and hot melt adhesive layer；The buffer layer includes modified poly ester glue-line, modified elastomer glue-line and modified acroleic acid methyl esters glue-line；Modified poly ester glue-line is set to the lower surface of the substrate layer, the modified elastomer glue-line is set to the lower surface of the modified poly ester glue-line, the modified acroleic acid methyl esters glue-line is set to the lower surface of the modified elastomer glue-line, the hot melt adhesive layer is set to the lower surface of the modified acroleic acid methyl esters glue-line, and is fitted closely between adjacent layer；The thickness of the buffer layer is 4~16 μm；The utility model proposes a kind of hot melt adhesive film with high adhesion force buffer layer, effectively improve the adhesion effect of substrate layer and hot melt adhesive layer, adhesive force intensity is high, keeps the comprehensive stability performance of hot melt adhesive film more preferable.
Description
Technical field
The utility model is related to hot melt adhesive film field more particularly to a kind of hot melt adhesive films with high adhesion force buffer layer.
Background technology
FFC winding displacements are also known as Fexibe Flat Cable (FFC), i.e. flexible flat cable, are a kind of to be insulated with upper layer and lower layer
The upper tin plating flat copper wire of folder among material, presses manufactured new types of data cable, has many advantages, such as softness, random bending fold.
Existing FFC winding displacements are the hot melt adhesion that insulating materials and tin plating flat copper wire are realized by hot melt adhesive film, and hot melt adhesive film is to use
Certain thickness film is made in the material of fusible bonding adherend, is placed between adherend, implements hot melt adhesion.
And in the product of current hot melt adhesive film, the multilayer knot that is typically made of substrate layer and functional hot melt adhesive layer
Structure, and between substrate layer and functional hot melt adhesive layer, the method or coating production work of processing are often cast using extrusion
Skill is handled, and makes to fit closely between each layer, but still remained between substrate layer and functional hot melt adhesive layer adhesive force it is insufficient,
The problem of structural instability, or even the case where delamination detaches is generated, performance, the stability for greatly reducing hot melt adhesive film are low.
Utility model content
The purpose of this utility model is that proposing a kind of hot melt adhesive film with high adhesion force buffer layer, effectively improve
The adhesion effect of substrate layer and hot melt adhesive layer, adhesive force intensity is high, keeps the comprehensive stability performance of hot melt adhesive film more preferable.
For this purpose, the utility model uses following technical scheme：
A kind of hot melt adhesive film with high adhesion force buffer layer, including substrate layer, buffer layer and hot melt adhesive layer；The buffering
Layer includes modified poly ester glue-line, modified elastomer glue-line and modified acroleic acid methyl esters glue-line；Modified poly ester glue-line is set to described
The lower surface of substrate layer, the modified elastomer glue-line are set to the lower surface of the modified poly ester glue-line, the modified propylene
Sour methyl esters glue-line is set to the lower surface of the modified elastomer glue-line, and the hot melt adhesive layer is set to the modified acroleic acid first
The lower surface of ester gum layer, and fitted closely between adjacent layer；The thickness of the buffer layer is 4~16 μm.
It further illustrates, the thickness of the modified poly ester glue-line is 1-5 μm；The thickness of the modified elastomer glue-line is 2-
6μm；The thickness of the modified acroleic acid methyl esters glue-line is 1-5 μm.
It further illustrates, the substrate layer is that biaxial tension pet film or polyimides are thin
Film.
It further illustrates, the lower surface of the substrate layer is formed after sided corona treatment or film surface chemical treatment pastes
Face, the modified poly ester glue-line printing or coating are covered in the adhesive surface of the substrate layer.
It further illustrates, the hot melt adhesive layer is polyolefins modified thermoplastic elastomer material.
It further illustrates, the thickness of the substrate layer is 12-50 μm；The thickness of the hot melt adhesive layer is 20-55 μm.
Further explanation, the modified elastomer offset printing brush or coating are covered in the lower surface of the modified poly ester glue-line.
It further illustrates, the modified acroleic acid methyl esters glue-line printing or coating are covered in the modified elastomer glue-line
Lower surface.
It further illustrates, the hot melt adhesive layer prints or be coated with the lower surface for being covered in the modified acroleic acid methyl esters glue-line
The beneficial effects of the utility model：By the way that high adhesion force buffer layer knot is arranged between substrate layer and hot melt adhesive layer
Structure plays the role of the internal hot melt adhesive layer of protection by substrate layer, improves the electric property of hot melt adhesive layer；And buffer layer is as base material
Bridge structure between layer and hot melt adhesive layer, utilizes modified poly ester glue-line, modified elastomer glue-line and modified acroleic acid methyl esters glue
Cushioning effect between layer, can be effectively improved the adhesion effect of substrate layer and hot melt adhesive layer, while controlling the thickness of buffer layer, keep away
Exempt from excessively thin or the case where cause structure to be detached from later, it is ensured that substrate layer and buffer layer and buffer layer and hot melt adhesive are between
Fitting active force it is big, be not readily separated, to effectively improve adhesive force intensity between the two, make the comprehensive stability of hot melt adhesive film
Performance is more preferable, which can be widely used in wire product or high-speed transfer FFC cable fields.
Description of the drawings
Fig. 1 is the structural schematic diagram of the hot melt adhesive film with high adhesion force buffer layer of the utility model one embodiment；
Wherein：Substrate layer 1, buffer layer 2, hot melt adhesive layer 3, modified poly ester glue-line 21, modified elastomer glue-line 22, modified third
E pioic acid methyl ester glue-line 23.
Specific implementation mode
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
A kind of hot melt adhesive film with high adhesion force buffer layer, including substrate layer 1, buffer layer 2 and hot melt adhesive layer 3；It is described
Buffer layer 2 includes modified poly ester glue-line 21, modified elastomer glue-line 22 and modified acroleic acid methyl esters glue-line 23；Modified poly ester glue-line
21 are set to the lower surface of the substrate layer 1, and the modified elastomer glue-line 22 is set under the modified poly ester glue-line 21
Surface, the modified acroleic acid methyl esters glue-line 23 are set to the lower surface of the modified elastomer glue-line 22, the hot melt adhesive layer 3
It is set to the lower surface of the modified acroleic acid methyl esters glue-line 23, and is fitted closely between adjacent layer；The thickness of the buffer layer 2
It is 4~16 μm.
The utility model proposes a kind of hot melt adhesive film with high adhesion force buffer layer, mainly by the substrate layer
High adhesion force buffer layer structure is set between 1 and hot melt adhesive layer 3, wherein playing the internal hot melt adhesive layer of protection by the substrate layer 1
Effect, so that hot melt adhesive layer is disclosure satisfy that complete etc. the electrical resistance of the high-speed transfer in FFC high frequency wire demands, signal picture
Energy；And the buffer layer 2 is broadly divided into 3 one functional layer structures then as the bridge structure between substrate layer and hot melt adhesive layer,
Using the cushioning effect between modified poly ester glue-line 21, modified elastomer glue-line 22 and modified acroleic acid methyl esters glue-line 23, can have
Effect improve substrate layer and hot melt adhesive layer adhesion effect, while control the buffer layer thickness be 4~16 μm, avoid it is excessively thin or
Later the case where causing structure to be detached from, it is ensured that the substrate layer 1 and buffer layer 2 and buffer layer 2 and hot melt adhesive are between 3
Fitting active force it is big, be not readily separated, to effectively improve adhesive force intensity between the two, adhesive force intensity is in 3-
5kg/in ranges, the hot melt adhesive film prepared can be widely used in 4K television display screens, computer display screen, intelligence
In the wire products such as household appliances or high-speed transfer FFC cable fields, effectively enhance the comprehensive stability performance of hot melt adhesive film.
It further illustrates, the thickness of the modified poly ester glue-line 21 is 1-5 μm；The thickness of the modified elastomer glue-line 22
It is 2-6 μm；The thickness of the modified acroleic acid methyl esters glue-line 23 is 1-5 μm.Wherein in the certain thickness for regulating and controlling the buffer layer
On the basis of, the thickness proportion of the modified poly ester glue-line 21, modified elastomer glue-line 22 and modified acroleic acid glue-line is adjusted, is made
Bonding between each layer is more stablized, and the adhesive force intensity higher between the substrate layer and hot melt adhesive layer is made.
It further illustrates, the substrate layer 1 is that biaxial tension pet film or polyimides are thin
Film.
It further illustrates, the lower surface of the substrate layer 1 is formed after sided corona treatment or film surface chemical treatment pastes
Face, the printing of modified poly ester glue-line 21 or coating are covered in the adhesive surface of the substrate layer 1.It is poly- to benzene two using biaxial tension
Formic acid glycol ester film, abbreviation PET film or Kapton, abbreviation PI films are used as substrate layer, and to its following table
After face carries out sided corona treatment or film surface chemical treatment, then is printed or be coated with by the modified poly ester glue-line 21 and be covered in the base
The adhesive surface of material layer 1, can further improve the adhesion effect between the substrate layer 1 and the buffer layer 2, and stress is more equal
It is even.
It further illustrates, the hot melt adhesive layer is polyolefins modified thermoplastic elastomer material.Hot melt adhesive layer is used
It is made of, can not only help the relevant polyolefins modified thermoplastic elastomer material such as SEBS/PP, SEPS/PP, SBS/PP
In the electric property for improving hot melt adhesive film, enable the requirement for meeting FFC high frequency wires, and can be more effectively by slow
It rushes under the action of layer 2, forms more securely adhesive force between the substrate layer, solved existing hot melt adhesive layer and substrate layer
Instability problem between structure.
It further illustrates, the thickness of the substrate layer is 12-50 μm；The thickness of the hot melt adhesive layer is 20-55 μm.
It further illustrates, the printing of modified elastomer glue-line 22 or coating are covered under the modified poly ester glue-line 21
Surface.
It further illustrates, the printing of modified acroleic acid methyl esters glue-line 23 or coating are covered in the modified elastomer glue-line
22 lower surface.
It further illustrates, the printing of the hot melt adhesive layer 3 or coating are covered under the modified acroleic acid methyl esters glue-line 23
Surface.For the substrate layer 1 and buffer layer 2, each interlayer structure and buffer layer 2 and the hot melt adhesive layer 3 of buffer layer 2
Between print production technique or print production technique can also be selected to be produced with coating by using coating production technology
The mode that technique be combined with each other is produced, and the adhesion effect of PET base material layer and hot melt adhesive layer can be effectively improved, wherein selecting print
Brush production technology, effectively shortens production cycle of product, improves the efficiency and benefit of production, and has in cost apparent
Advantage.
The technical principle of the utility model is described above in association with specific embodiment.These descriptions are intended merely to explain this reality
With novel principle, and it cannot be construed to the limitation to scope of protection of the utility model in any way.Based on the explanation herein,
Those skilled in the art would not require any inventive effort the other specific implementation modes that can associate the utility model,
These modes are fallen within the scope of protection of the utility model.
Claims (9)
1. a kind of hot melt adhesive film with high adhesion force buffer layer, it is characterised in that：Including substrate layer, buffer layer and hot melt adhesive
Layer；The buffer layer includes modified poly ester glue-line, modified elastomer glue-line and modified acroleic acid methyl esters glue-line；Modified poly ester glue-line
It is set to the lower surface of the substrate layer, the modified elastomer glue-line is set to the lower surface of the modified poly ester glue-line, institute
The lower surface that modified acroleic acid methyl esters glue-line is set to the modified elastomer glue-line is stated, the hot melt adhesive layer is set to described change
The lower surface of property methyl acrylate glue-line, and fitted closely between adjacent layer；The thickness of the buffer layer is 4~16 μm.
2. a kind of hot melt adhesive film with high adhesion force buffer layer according to claim 1, it is characterised in that：The modification
The thickness of polyester glue-line is 1-5 μm；The thickness of the modified elastomer glue-line is 2-6 μm；The modified acroleic acid methyl esters glue-line
Thickness be 1-5 μm.
3. a kind of hot melt adhesive film with high adhesion force buffer layer according to claim 1, it is characterised in that：The base material
Layer is biaxial tension pet film or Kapton.
4. a kind of hot melt adhesive film with high adhesion force buffer layer according to claim 1, it is characterised in that：The base material
The lower surface of layer forms adhesive surface, the modified poly ester glue-line printing or coating after sided corona treatment or film surface chemical treatment
It is covered in the adhesive surface of the substrate layer.
5. a kind of hot melt adhesive film with high adhesion force buffer layer according to claim 1, it is characterised in that：The hot melt
Glue-line is polyolefins modified thermoplastic elastomer material.
6. a kind of hot melt adhesive film with high adhesion force buffer layer according to claim 1, it is characterised in that：The base material
The thickness of layer is 12-50 μm；The thickness of the hot melt adhesive layer is 20-55 μm.
7. a kind of hot melt adhesive film with high adhesion force buffer layer according to claim 1, it is characterised in that：The modification
Elastomer precursor gum prints or is coated with the lower surface for being covered in the modified poly ester glue-line.
8. a kind of hot melt adhesive film with high adhesion force buffer layer according to claim 1, it is characterised in that：The modification
Methyl acrylate glue-line prints or is coated with the lower surface for being covered in the modified elastomer glue-line.
9. a kind of hot melt adhesive film with high adhesion force buffer layer according to claim 1, it is characterised in that：The hot melt
Glue-line prints or is coated with the lower surface for being covered in the modified acroleic acid methyl esters glue-line.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201820285321.4U CN207987095U (en) | 2018-02-28 | 2018-02-28 | A kind of hot melt adhesive film with high adhesion force buffer layer |
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| CN201820285321.4U CN207987095U (en) | 2018-02-28 | 2018-02-28 | A kind of hot melt adhesive film with high adhesion force buffer layer |
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| CN207987095U true CN207987095U (en) | 2018-10-19 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114213991A (en) * | 2021-11-29 | 2022-03-22 | 安徽创研新材料有限公司 | Hot melt adhesive film with high-adhesion buffer layer and preparation method thereof |
| CN114311768A (en) * | 2020-09-15 | 2022-04-12 | 陈彪 | PET film-coated plate for water tank and decoration |
| CN115287004A (en) * | 2022-04-19 | 2022-11-04 | 广东莱尔新材料科技股份有限公司 | Adhesive tape for processing semiconductor wafer and preparation method thereof |
-
2018
- 2018-02-28 CN CN201820285321.4U patent/CN207987095U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114311768A (en) * | 2020-09-15 | 2022-04-12 | 陈彪 | PET film-coated plate for water tank and decoration |
| CN114213991A (en) * | 2021-11-29 | 2022-03-22 | 安徽创研新材料有限公司 | Hot melt adhesive film with high-adhesion buffer layer and preparation method thereof |
| CN115287004A (en) * | 2022-04-19 | 2022-11-04 | 广东莱尔新材料科技股份有限公司 | Adhesive tape for processing semiconductor wafer and preparation method thereof |
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