CN207947781U

CN207947781U - The photoelectric converter of integration packaging

Info

Publication number: CN207947781U
Application number: CN201820101116.8U
Authority: CN
Inventors: 赖东举
Original assignee: Shenzhen Xi Rui Light Communication Co Ltd
Current assignee: Shenzhen Xinli Ultra Precision Connector Technology Co ltd
Priority date: 2018-01-22
Filing date: 2018-01-22
Publication date: 2018-10-09
Anticipated expiration: 2028-01-22

Abstract

The utility model discloses the photoelectric converters of integration packaging, including integrated optoelectronic circuit plate, and programmable gate array module, optical module and card-edge optical transceiver module are equipped on integrated optoelectronic circuit plate；Programmable gate array module is connect with optical module, and card-edge optical transceiver module is electrically connected with programmable gate array module；Two corners of programmable gate array module are equipped with the first female contact region and the second female contact region, and the first, second female contact region input terminal is connect with programmable gate array module respectively；First, second female contact region input terminal respectively with optical module contact portion；The utility model passes through in integrated high-speed optical module to the encapsulation equipped with FPGA, shorten FPGA integrated circuit modules input and output to the signal path to 1 English inch of optical transceiver input terminal or less, shorter path can mitigate Signal Degrade and shake, improve signal integrity and reduce the error in data in signal path caused by parasitic element.

Description

The photoelectric converter of integration packaging

Technical field

The utility model more particularly to a kind of photoelectric converter of integration packaging.

Background technology

Although optical fiber connection comes into datacom industry at present, many lines need the card-edge light of very power consumption Interface module, and system logic is still suffered to the electric interconnection problem of optical module, the logical gate of High Speed Serial would generally be Implement in FPGA, is selected in circuit board characteristics, function and input and output the reason is that this kind of device can provide design engineer High flexibility ratio, but the pin for doing so FPGA must connect optical module, and the high speed on circuit board is inevitably brought to walk Line.

FPGA has integrated the even higher data transfer rates of 10Gbps at present, although integrated circuit is to light under 10Gbps data transfer rates The distance of module only counts English inch, and the wiring path of English inch is counted on circuit board and may all damage the quality of signal, in the prior art, Integrated circuit is only connected to the input of light connects port transmitters and receiver output apart from minimization, just can ensure that optical mode Block obtains best signal.

Utility model content

The utility model provides the photoelectric converter of integration packaging, the above problem of solution.

To solve the above problems, the technical scheme that the utility model is provided is as follows：The photoelectric converter of integration packaging, including Integrated optoelectronic circuit plate is equipped with programmable gate array module, optical module and card-edge light on the integrated optoelectronic circuit plate Transceiver module；The programmable gate array module is connect with the optical module, the card-edge optical transceiver module with it is described Programmable gate array module is electrically connected；Two corners of the programmable gate array module be equipped with the first female contact region and Second female contact region, first, second female contact region input terminal connect with the programmable gate array module respectively It connects；First, second female contact region input terminal respectively with the optical module contact portion.

Preferably, the programmable gate array module is FPGE integrated circuit modules, and the FPGE integrated circuit modules are set There are at least 24 connectivity ports, wherein 12 connectivity ports are connect with first female contact area by connection line of optic fibre, separately Outer 12 connectivity ports are connect by connection line of optic fibre with second female contact region.

Preferably, the optical module is equipped with optical transmitting set and optical receiver；The optical transmitting set connects mounted on the first socket Touch area on and the two contact portion connect to form 12 transmission channels, the optical receiver be mounted on the second female contact area on and The two contact portion forms 12 receiving channels.

Preferably, two LT connectors are separately mounted on the optical transmitting set and optical receiver.

Preferably, 12 optical cable input terminals are connect with 12 ports of the optical receiver, in addition 12 optical cable output ends It is connect with 12 ports of the optical transmitting set.

Preferably, the transmitter includes 12 low-power consumption 850nm VCSEL laser diodes, and each diode power consumption is about 130mW, the receiver include single stone GaAs PIN diode induction arrays.

Preferably, photoelectric converter encapsulates advantageous effect compared with the existing technology with FPGA is, using the above scheme, this Utility model is by integrated high-speed optical module to the encapsulation equipped with FPGA, shortening the input and output of FPGA integrated circuit modules to light The signal path of transceiver input terminal improves signal to 1 English inch hereinafter, shorter path can mitigate Signal Degrade and shake Integrality simultaneously reduces the error in data in signal path caused by parasitic element；Since the interconnection distance of chip to module is by substantially Degree shortens, thus the overall power consumption of FPGA and module can also reduce, because being again not required to waste power to carry out traditional non-integration The significantly wear leveling that chip is interconnected to intermodule.

Description of the drawings

Illustrate embodiment or technical solution in the prior art in order to clearer, it below will be to embodiment or the prior art The required attached drawing used is briefly described in description, it is clear that, the accompanying drawings in the following description is only the one of utility model A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these Attached drawing obtains other attached drawings.

Fig. 1 is one of the structural schematic diagram of the utility model；

Fig. 2 is the second structural representation of the utility model；

Fig. 3 is the operation principle flow chart of the utility model.

Specific implementation mode

For the ease of understanding the utility model, in the following with reference to the drawings and specific embodiments, the utility model is carried out more detailed Thin explanation.The preferred embodiment of the utility model is given in attached drawing.But the utility model can be with many different Form is realized, however it is not limited to this specification described embodiment.Make to this on the contrary, purpose of providing these embodiments is The understanding of the disclosure of utility model is more thorough and comprehensive.

It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.Term used in this specification " fixation ", " integrated molding ", For illustrative purposes only, the similar unit of structure is to identical label in the figure for "left", "right" and similar statement Mark.

Unless otherwise defined, technical and scientific term all used in this specification and the skill for belonging to the utility model The normally understood meaning of technical staff in art field is identical.Art used in the description of the utility model in this specification Language, which is only for the purpose of describing specific embodiments, is not intended to limitation the utility model.

As shown in Figure 1, one embodiment of the utility model is：The photoelectric converter of integration packaging, including photoelectricity are integrated Circuit board 1 is equipped with programmable gate array module 2, optical module and card-edge optical transceiver on the integrated optoelectronic circuit plate Module 3；The programmable gate array module is connect with the optical module, and the card-edge optical transceiver module may be programmed with described Gate Array module is electrically connected；Two corners of the programmable gate array module are equipped with 4 domain of the first female contact area and second Female contact region 5, first, second female contact region input terminal are connect with the programmable gate array module respectively； First, second female contact region input terminal respectively with the optical module contact portion.

Further, card-edge optical transceiver module 3 is consistent with optical module function, when one of damage, it is only necessary to will Light connects line connect with card-edge transceiver module can, increase the fast quick-recovery of information, and can also to the two module into When row performance compares, optimum selecting.

Further, the first female contact area and the second female contact area are lga socket.

Further, optics FPGA integrated circuit modules have used the Stratix IV GT FPGA of altera corp, and The data transmission rate of 11Gbps can be reached by providing 24 or more the connectivity ports high speed SERDES, each ports, and have 24 companies Port is connect directly to connect with optical module.

Further, each of 24 optical channels can independent operating or the part as high power capacity channel, with side It will pass through high cost effective manner and target bandwidth be provided, parallel optical is similar to using parallel channel electric interfaces, such as PCI The multiplexor of Express reaches the electronic signal practice of target bandwidth.

Preferably, the optical module is equipped with optical transmitting set 6 and optical receiver 7；The optical transmitting set 6 is mounted on the first socket On contact zone 4 and the two contact portion connects to form 12 transmission channels, and the optical receiver 7 is mounted on the second female contact area On 5 and the two contact portion forms 12 receiving channels.

Preferably, two LT connectors 8 are separately mounted on the optical transmitting set and optical receiver.

Preferably, photoelectric converter is encapsulated with FPGA.

FPGA and optical transmitting set and receiver corporation form single integration packaging, can replace multiple external card edge-lights The product of transceiver；So that photoelectric converter is reduced parts, reduces cost, more rationalize.

Can be Distance Shortened between optical channel and optical module to being less than 1 centimetre by the above connectivity ports SERDES； And 5 to 50 centimetres are then needed when edge installation optical module, reduce signal path.

Liang Ge female contacts area is socket integrated interface, while also bringing substitutability, testability and high yield.

Advantageous effect compared with the existing technology is that using the above scheme, the utility model passes through integrated high-speed optical module Into the encapsulation equipped with FPGA, shortening FPGA integrated circuit modules input and output to the signal path of optical transceiver input terminal to 1 English inch improves signal integrity and reduces in signal path and post hereinafter, shorter path can mitigate Signal Degrade and shake Error in data caused by bioelement；Interconnection distance due to chip to module is greatly shortened, thus FPGA and module Overall power consumption can also reduce, and be interconnected significantly to intermodule because being again not required to waste power to carry out traditional non-integration chip Wear leveling.

It should be noted that above-mentioned each technical characteristic continues to be combined with each other, the various embodiments not being enumerated above are formed, It is accordingly to be regarded as the range of the utility model specification record；Also, it for those of ordinary skills, can be according to above stating It is bright to be improved or converted, and all these modifications and variations should all belong to the protection model of the appended claims for the utility model It encloses.

Claims

1. the photoelectric converter of integration packaging, including integrated optoelectronic circuit plate, which is characterized in that in the integrated optoelectronic circuit plate On programmable gate array module, optical module and card-edge optical transceiver module are installed；The programmable gate array module and institute Optical module connection is stated, the card-edge optical transceiver module is electrically connected with the programmable gate array module；It is described programmable Two corners of Gate Array module are equipped with the first female contact region and the second female contact region, first, second socket Contact area input terminal is connect with the programmable gate array module respectively；First, second female contact region input terminal Respectively with the optical module contact portion.

2. the photoelectric converter of integration packaging according to claim 1, which is characterized in that the programmable gate array module is FPGE integrated circuit modules, the FPGE integrated circuit modules are equipped at least 24 connectivity ports, wherein 12 connectivity ports with First female contact area is connected by connection line of optic fibre, and in addition 12 connectivity ports pass through connection line of optic fibre and described second Female contact region connects.

3. the photoelectric converter of integration packaging according to claim 2, which is characterized in that the optical module is equipped with optical transmitting set And optical receiver；The optical transmitting set is mounted in the first female contact area and the two contact portion connects that form 12 transmittings logical Road, the optical receiver is mounted in the second female contact area and the two contact portion forms 12 receiving channels.

4. the photoelectric converter of integration packaging according to claim 3, which is characterized in that two LT connectors are separately mounted to On the optical transmitting set and optical receiver.

5. the photoelectric converter of integration packaging according to claim 4, which is characterized in that 12 optical cable input terminals and the light 12 ports of receiver connect, and in addition 12 optical cable output ends are connect with 12 ports of the optical transmitting set.

6. the photoelectric converter of integration packaging according to claim 5, which is characterized in that the transmitter includes 12 low work( 850nm VCSEL laser diodes are consumed, each diode power consumption about 130mW, the receiver includes single stone GaAs PIN bis- Pole pipe induction arrays.

7. according to the photoelectric converter of integration packaging described in claim 1-6 any one, which is characterized in that photoelectric converter is used FPGA is encapsulated.