CN207873412U - Transparent fragile material process equipment - Google Patents
Transparent fragile material process equipment Download PDFInfo
- Publication number
- CN207873412U CN207873412U CN201721865705.5U CN201721865705U CN207873412U CN 207873412 U CN207873412 U CN 207873412U CN 201721865705 U CN201721865705 U CN 201721865705U CN 207873412 U CN207873412 U CN 207873412U
- Authority
- CN
- China
- Prior art keywords
- laser
- fragile material
- process equipment
- module
- transparent fragile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model provides a kind of transparent fragile material process equipment, including control module, laser cutting module, focus ultrasonic module and processing platform, laser cutting module includes laser generator, and laser shaping unit, laser alignment transmission unit, laser scan unit, the laser focusing unit set gradually along laser optical path direction, sample processing platform is set to the lower section of laser focusing unit, the setting coaxial with laser focusing unit of focus ultrasonic module, processing platform can multiaxis free movement, control module is used to control the collaborative work of each component.The beneficial effects of the utility model are：Provide a kind of process equipment of transparent fragile material, the process equipment is processed transparent fragile material using laser beam is focused, focusing ultrasonic wave is generated using ultrasonic focusing system simultaneously to detach the material fragment that laser processing generates with material body, it is burst apart mouth using the material cutting smooth nothing of wall of equipment processing, zero draft substantially increases the success rate of transparent fragile material processing.
Description
Technical field
The utility model is related to cutting technique technical fields, refer in particular to a kind of transparent fragile material process equipment.
Background technology
With the development of industry, in present industrial production, especially some electronic components and photovoltaic
Core component process in, it usually needs to some transparent materials, such as glass, lithium triborate crystal (LBO), phosphoric acid
Potassium dihydrogen (KDP) crystal etc. such as is cut, is punched, being polished at a series of operation.It is mainly the following processing method at present：
1, tradition machinery processing method, using hard metal wheel or diamond, machinery fractures after material surface scribing line, however,
Due to the characteristic of fragile material itself, easily there is the case where surface chipping or even material fragmentation, it cannot be guaranteed that yields.And with
Increasing to the product consumption of such transparent fragile material, traditional processing method is also faced with new challenge；
2, laser processing mode, the high density energy generated using laser beam make material melt even gas in a short time
Change, then with auxiliary gas blasting slag, forms joint-cutting with the movement of laser beam, however this method generates the problem that
It is also easy to produce in the notch end face of fragile material and coagulates layer and micro-crack again, surface roughness is made to increase, and notch chipping and splash
It can contaminated materials；
3, laser thermal stress patterning method generates thermal stress by laser scanning material, induces and control the side of crack propagation
Method realizes that fragile material detaches, and laser thermal stress patterning method does not need high power laser light irradiation, material will not soften and melt；
Powder or slag are not cut, cut surface is smooth, and material does not lose, but rapidoprint in this way, such as blue precious
Stone needs to be immersed in the strong corrosives solution such as hydrofluoric acid up to a few hours, is unfavorable for environmental protection, and time-consuming.
Therefore, it is necessary to be reformed to the prior art.
Utility model content
Technical problem to be solved in the utility model is：There is provided a kind of process simple and environmentally-friendly reliable transparent fragile material
Process equipment.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is：A kind of transparent fragile material processing
Equipment, including control module, laser cutting module, focus ultrasonic module and processing platform, the laser cutting module include swashing
Optical generator, and the laser shaping unit, laser alignment transmission unit, the laser scan unit that are set gradually along laser optical path direction
And laser focusing unit, the processing platform are set to the lower section of laser focusing unit, the focus ultrasonic module swashs with described
The coaxial setting of light focusing unit, the processing platform can multiaxis free movement, the control module for control laser cutting mould
The displacement of block and focus ultrasonic module working condition and processing platform.
Further, the focus ultrasonic module is overlapped with the focus of the laser focusing unit.
Further, the upper surface of described processing platform is equipped with processing groove, and material fixed mechanism is equipped in the processing groove.
Further, liquid is inoculated in the processing groove, the liquid is water or oil.
Further, further include adaptive platform, the laser focusing unit of the laser cutting module and the ultrasound are poly-
Burnt module may be contained within the adaptive platform, and the adaptive platform can be transported vertically by control module control
It is dynamic.
Further, the optical maser wavelength that the laser generator generates is 0.2-11.4 μm.
Further, the pulse width for the laser that the laser generator generates is picosecond or femtosecond.
Further, the focus ultrasonic module is high intensity focused ultrasound system, the high intensity focused ultrasound system
The ultrasonic frequency of generation is 18KHz-10MHz.
Further, the resonance frequency of the ultrasonic frequency that the high intensity focused ultrasound system generates and transparent fragile material
Rate is adapted to.
The beneficial effects of the utility model are：Provide a kind of process equipment of transparent fragile material, the process equipment
Transparent fragile material is processed using laser beam is focused, while being generated using ultrasonic focusing system and focusing ultrasonic wave by laser
The material fragment that processing generates is detached with material body, and cutting the smooth nothing of wall using the material of equipment processing bursts apart mouth, no cone
Degree substantially increases the success rate of transparent fragile material processing.
Description of the drawings
The concrete structure of the utility model is described in detail below in conjunction with the accompanying drawings：
Fig. 1 is the modular structure schematic diagram of the fragile material process equipment of the utility model.
Specific implementation mode
For the technology contents of the utility model, construction feature, the objects and the effects are described in detail, below in conjunction with implementation
Mode simultaneously coordinates attached drawing to be explained in detail.
Embodiment 1
Referring to Fig. 1, a kind of fragile material process equipment, including control module, laser cutting module, focus ultrasonic module
And processing platform, the laser cutting module include laser generator, and the laser shaping set gradually along laser optical path direction
Unit, laser alignment transmission unit, laser scan unit and laser focusing unit, the processing platform are set to laser and focus list
Member lower section, the focus ultrasonic module setting coaxial with the laser focusing unit, the processing platform can multiaxis freely transport
Dynamic, the control module is used to control the displacement of laser cutting module and focus ultrasonic module working condition and processing platform.
In the present embodiment, control module laser generator generates laser, wherein laser generator is for optical fiber laser or admittedly
Body laser, the wavelength of the laser of generation are 0.2-11.4 μm, and pulsewidth is picosecond or the pulse laser of femtosecond, laser pass through laser
Shaping unit carries out the adjustment such as spot size, shape, the optical density distribution to laser, by laser alignment transmission unit and swashs
Light scanning unit is transmitted to laser focusing unit and is focused processing, and transparent fragile material is consolidated by material fixed mechanism
Due on processing platform, control module adjusts the focus of laser by laser focusing unit, makes laser action in the cutting of material
On point, then by controlling the movement of processing platform horizontal direction X-axis and Y-axis, to adjust the cutting path of process equipment.
Emit laser simultaneously, the focus ultrasonic module of confocal setting coaxial with laser focus module is started to work, and is focused and is swashed
Light beam makes material generate controllable crack due to thermal stress, is overlapped with laser spot due to focusing ultrasonic wave, strong concussion can make
The material that crack due to thermal stress is generated after laser irradiation prolongs the direction of cutting and splits, in order to make the fragment of material focus ultrasonic wave
It is more easy to be detached from material under effect, the processing groove of processing platform is injected into liquid, which can be water or oil, and the choosing of liquid
It selects and is adapted with optical maser wavelength, avoid liquid absorption laser energy and influence processing effect, impregnate transparent brittleness in a liquid
Material can accelerate the separation process with fragment under the tension of liquid.Wherein, the working frequency of ultrasonic wave and shaking for liquid are focused
Dynamic frequency is adapted to.
Laser focus module carries out various ways focusing to laser, such as Multi-point focusing light beam, Bezier focus on light beam, laser
At mercerising beam etc..
Fragile material includes glass, sapphire, quartz, corundum etc..
Laser processing includes the techniques such as cutting, holes drilled through, drilling blind hole.
Herein, up, down, left, right, before and after only represents its relative position and does not indicate that its absolute position.
As can be seen from the above description, the beneficial effects of the utility model are：Provide a kind of processing of transparent fragile material
Equipment, which is processed transparent fragile material using laser beam is focused, while being generated using ultrasonic focusing system
It focuses ultrasonic wave to detach the material fragment that laser processing generates with material body, wall light is cut using the material of equipment processing
Slide the success rate that transparent fragile material processing is substantially increased without the mouth that bursts apart, zero draft.
Embodiment 2
On the basis of embodiment 1, which further includes adaptive platform, and the laser of the laser cutting module is swept
Retouch unit, laser focusing unit and the focus ultrasonic module and may be contained within the adaptive platform, the adaptive platform by
The control module control is vertically movable.
In the present embodiment, when material is thicker, the focus that control module can control adaptive platform to adjust laser focusing exists
Vertical direction, the i.e. position of Z axis allow focus to be moved to material internal, realize to the three-dimension process of material, substantially increase processing
Efficiency.
X-axis, Y-axis and Z axis in the utility model are mutually perpendicular between any two, and wherein X-axis and Y-axis represent horizontal direction position
It moves, Z axis represents vertical displacement.
Embodiment 3
On the basis of embodiment 2, the focus ultrasonic module is high intensity focused ultrasound system, described high-strength focused
The ultrasonic frequency that ultrasonic system generates is 18KHz-10MHz.
In the present embodiment, high intensity focused ultrasound system is made of multiple ultrasonic wave generating sources, each ultrasonic wave generating source
A ultrasonic beam can be generated, when multiple ultrasonic beams are focused on a bit, you can obtain focusing ultrasonic wave, cooperation laser is cut
Cut the process that module can be detached with accelerated material fragment with material.
The ultrasonic frequency that the high intensity focused ultrasound system generates is adapted to the resonant frequency of transparent fragile material, is adopted
Material is processed with the ultrasonic frequency being adapted to resonant frequency, processing efficiency can be improved.
When transparent fragile material, which is soaked in, to be processed in liquid, high intensity focused ultrasound system generate ultrasonic frequency with
The resonant frequency of liquid is adapted to.
The above description is only the embodiments of the present invention, and it does not limit the scope of the patent of the present invention, every
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other related technical areas are equally included in the patent within the scope of the utility model.
Claims (9)
1. a kind of transparent fragile material process equipment, it is characterised in that：Including control module, laser cutting module, focus ultrasonic
Module and processing platform, the laser cutting module include laser generator, and the laser set gradually along laser optical path direction
Shaping unit, laser alignment transmission unit, laser scan unit and laser focusing unit, it is poly- that the processing platform is set to laser
The lower section of burnt unit, the focus ultrasonic module setting coaxial with the laser focusing unit, the processing platform can multiaxis from
By moving, the control module is used to control the position of laser cutting module and focus ultrasonic module working condition and processing platform
It moves.
2. transparent fragile material process equipment as described in claim 1, it is characterised in that：The focus ultrasonic module with it is described
The focus of laser focusing unit overlaps.
3. transparent fragile material process equipment as claimed in claim 2, it is characterised in that：The upper surface of described processing platform is equipped with
Processing groove, the processing groove is interior to be equipped with material fixed mechanism.
4. transparent fragile material process equipment as claimed in claim 3, it is characterised in that：It is inoculated with liquid in the processing groove,
The liquid is water or oil.
5. transparent fragile material process equipment as claimed in claim 4, it is characterised in that：Further include adaptive platform, it is described
The laser focusing unit of laser cutting module and the focus ultrasonic module may be contained within the adaptive platform, described adaptive
Platform is controlled vertically movable by the control module.
6. transparent fragile material process equipment as claimed in claim 5, it is characterised in that：What the laser generator generated swashs
A length of 0.2-11.4 μm of light wave.
7. transparent fragile material process equipment as claimed in claim 6, it is characterised in that：What the laser generator generated swashs
The pulse width of light is picosecond or femtosecond.
8. transparent fragile material process equipment as claimed in claim 7, it is characterised in that：The focus ultrasonic module is high-strength
Focused ultrasound system is spent, the ultrasonic frequency that the high intensity focused ultrasound system generates is 18KHz-10MHz.
9. transparent fragile material process equipment as claimed in claim 8, it is characterised in that：The high intensity focused ultrasound system
The ultrasonic frequency of generation is adapted to the resonant frequency of transparent fragile material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721865705.5U CN207873412U (en) | 2017-12-27 | 2017-12-27 | Transparent fragile material process equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721865705.5U CN207873412U (en) | 2017-12-27 | 2017-12-27 | Transparent fragile material process equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207873412U true CN207873412U (en) | 2018-09-18 |
Family
ID=63503614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721865705.5U Active CN207873412U (en) | 2017-12-27 | 2017-12-27 | Transparent fragile material process equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207873412U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107953038A (en) * | 2017-12-27 | 2018-04-24 | 常州英诺激光科技有限公司 | Transparent fragile material process equipment |
| CN109759722A (en) * | 2019-02-27 | 2019-05-17 | 大族激光科技产业集团股份有限公司 | A kind of the LED chip system of processing and method of double process combinations |
| CN111168251A (en) * | 2018-11-09 | 2020-05-19 | 财团法人工业技术研究院 | Cutting method for forming lead angle |
-
2017
- 2017-12-27 CN CN201721865705.5U patent/CN207873412U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107953038A (en) * | 2017-12-27 | 2018-04-24 | 常州英诺激光科技有限公司 | Transparent fragile material process equipment |
| CN107953038B (en) * | 2017-12-27 | 2023-10-20 | 常州英诺激光科技有限公司 | Transparent brittle material processing equipment |
| CN111168251A (en) * | 2018-11-09 | 2020-05-19 | 财团法人工业技术研究院 | Cutting method for forming lead angle |
| CN111168251B (en) * | 2018-11-09 | 2022-03-15 | 财团法人工业技术研究院 | Cutting method for forming lead angle |
| US11338392B2 (en) | 2018-11-09 | 2022-05-24 | Industrial Technology Research Institute | Cutting method for forming chamfered corners |
| CN109759722A (en) * | 2019-02-27 | 2019-05-17 | 大族激光科技产业集团股份有限公司 | A kind of the LED chip system of processing and method of double process combinations |
| CN109759722B (en) * | 2019-02-27 | 2021-08-31 | 大族激光科技产业集团股份有限公司 | Double-process combined LED chip processing system and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100876502B1 (en) | A cutter for substrate using microwaves laser beam and method thereof | |
| US20200156986A1 (en) | Methods of cutting glass using a laser | |
| CN207873412U (en) | Transparent fragile material process equipment | |
| US10010971B1 (en) | Method and apparatus for performing laser curved filamentation within transparent materials | |
| TWI584906B (en) | Method and apparatus for non-abaltive, photoaccoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses | |
| CN101461039B (en) | Laser material processing method | |
| TWI498180B (en) | Processing method of processed object and laser processing apparatus | |
| CN102649199B (en) | Substrate processing device and substrate processing method | |
| JP5452247B2 (en) | Laser dicing equipment | |
| JP2017509569A (en) | Laser cut composite glass article and cutting method | |
| CN105081564A (en) | Processing method and device for inner hole of tempered glass | |
| CN106891096A (en) | A kind of laser cutting device and cutting method | |
| CN107953038A (en) | Transparent fragile material process equipment | |
| CN108161250A (en) | Multifocal DYNAMIC DISTRIBUTION laser machines the method and device of brittle transparent material | |
| CN103831527B (en) | A kind of laser quick separating optical crystal method and device | |
| CN104944756A (en) | Laser machining strengthened glass | |
| Lopez et al. | Glass cutting using ultrashort pulsed Bessel beams | |
| CN102319958A (en) | Pulse laser cutting method for fragile materials | |
| Liu et al. | Modulation of crack formation inside single-crystal sapphire using ultrafast laser Bessel beams | |
| US20190366484A1 (en) | A method of high-precision laser processing sapphire with submicron cutting surface | |
| CN103387335A (en) | Substrate cutting device and substrate cutting method | |
| CN202846021U (en) | Laser etching machining unit | |
| CN110039204A (en) | The laser processing of machined object | |
| CN115041815A (en) | Laser processing system and processing method for brittle material | |
| CN203725988U (en) | Laser quick separation device for optical crystals |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |