CN107953038A - Transparent fragile material process equipment - Google Patents

Transparent fragile material process equipment Download PDF

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Publication number
CN107953038A
CN107953038A CN201711448374.XA CN201711448374A CN107953038A CN 107953038 A CN107953038 A CN 107953038A CN 201711448374 A CN201711448374 A CN 201711448374A CN 107953038 A CN107953038 A CN 107953038A
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CN
China
Prior art keywords
laser
fragile material
process equipment
module
transparent fragile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711448374.XA
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Chinese (zh)
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CN107953038B (en
Inventor
周云申
沈丹鸿
周蕊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Micro Nano Laser Application Technology Research Institute Co Ltd
INNO MACHINING Co Ltd
Original Assignee
Jiangsu Micro Nano Laser Application Technology Research Institute Co Ltd
INNO MACHINING Co Ltd
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Application filed by Jiangsu Micro Nano Laser Application Technology Research Institute Co Ltd, INNO MACHINING Co Ltd filed Critical Jiangsu Micro Nano Laser Application Technology Research Institute Co Ltd
Priority to CN201711448374.XA priority Critical patent/CN107953038B/en
Publication of CN107953038A publication Critical patent/CN107953038A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The present invention provides a kind of transparent fragile material process equipment, including control module, laser cutting module, focus ultrasonic module and processing platform, laser cutting module includes laser generator, and laser shaping unit, laser alignment transmission unit, laser scan unit, the laser focusing unit set gradually along laser optical path direction, sample processing platform is arranged at the lower section of laser focusing unit, the setting coaxial with laser focusing unit of focus ultrasonic module, processing platform can multiaxis free movement, control module is used to control the collaborative work of each component.The beneficial effects of the present invention are：Provide a kind of process equipment of transparent fragile material, the process equipment is processed transparent fragile material using laser beam is focused on, focusing ultrasonic wave is produced using ultrasonic focusing system at the same time to separate the material fragment that Laser Processing produces with material body, burst apart mouth using the material cutting smooth nothing of wall of equipment processing, zero draft, substantially increases the success rate of transparent fragile material processing.

Description

Transparent fragile material process equipment
Technical field
The present invention relates to cutting technique technical field, refers in particular to a kind of transparent fragile material process equipment.
Background technology
With industrial expansion, in present industrial production, especially some electronic components and photovoltaic Core component process in, it usually needs to some transparent materials, such as glass, lithium triborate crystal (LBO), phosphoric acid Potassium dihydrogen (KDP) crystal etc. such as is cut, is punched, being polished at a series of operation.It is mainly the following processing method at present：
1st, tradition machinery processing method, using hard metal wheel or diamond, machinery fractures after material surface line, however, Due to the characteristic of fragile material in itself, easily there is surface the chipping even situation of material fragmentation, it is impossible to ensure yields.And with Increasing to the product consumption of such transparent fragile material, traditional processing method is also faced with new challenge；
2nd, laser processing mode, the high density energy produced using laser beam, makes material melt even gas in a short time Change, then with auxiliary gas blasting slag, joint-cutting is formed with the movement of laser beam, but this method generates the problem that It is also easy to produce in the notch end face of fragile material and coagulates layer and micro-crack again, increases surface roughness, and notch chipping and splash Can contaminated materials；
3rd, laser thermal stress patterning method, produces thermal stress by laser scanning material, induces and control the side of crack propagation Method realizes that fragile material separates, and high power laser light irradiation is not required in laser thermal stress patterning method, material will not soften and melt； Powder or slag are not cut, cut surface is smooth, and material does not lose, but rapidoprint in this way, such as blue precious Stone reaches a few hours, it is necessary to be immersed in the severe corrosive such as hydrofluoric acid solution, is unfavorable for environmental protection, and time-consuming.
Therefore, it is necessary to the prior art is reformed.
The content of the invention
The technical problems to be solved by the invention are：There is provided a kind of process simple and environmentally-friendly reliable transparent fragile material processing Equipment.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is：A kind of transparent fragile material process equipment, Including control module, laser cutting module, focus ultrasonic module and processing platform, the laser cutting module includes laser Device, and laser shaping unit, laser alignment transmission unit, laser scan unit and the laser set gradually along laser optical path direction Focusing unit, the processing platform are arranged at the lower section of laser focusing unit, and the focus ultrasonic module is focused on the laser The coaxial setting of unit, the processing platform can multiaxis free movement, the control module is used to controlling laser cutting module and super The displacement of sound focusing module working status and processing platform.
Further, the focus ultrasonic module is overlapped with the focus of the laser focusing unit.
Further, processing groove is equipped with above the processing platform, material fixed mechanism is equipped with the processing groove.
Further, liquid is inoculated with the processing groove, the liquid is water or oil.
Further, adaptive platform is further included, the laser focusing unit of the laser cutting module and the ultrasound are poly- Burnt module may be contained within the adaptive platform, and the adaptive platform can be transported vertically by control module control It is dynamic.
Further, the optical maser wavelength that the laser generator produces is 0.2-11.4 μm.
Further, the pulse width for the laser that the laser generator produces is picosecond or femtosecond.
Further, the focus ultrasonic module is high intensity focused ultrasound system, the high intensity focused ultrasound system The ultrasonic frequency of generation is 18KHz-10MHz.
Further, the ultrasonic frequency that the high intensity focused ultrasound system produces and the resonance frequency of transparent fragile material Rate is adapted to.
The beneficial effects of the present invention are：A kind of process equipment of transparent fragile material is provided, which uses Focus on laser beam to be processed transparent fragile material, while produce focusing ultrasonic wave using ultrasonic focusing system to laser machine The material fragment of generation is separated with material body, is burst apart mouth using the material cutting smooth nothing of wall of equipment processing, zero draft, greatly The success rate of transparent fragile material processing is improved greatly.
Brief description of the drawings
The concrete structure of the present invention is described in detail below in conjunction with the accompanying drawings：
Fig. 1 is the modular structure schematic diagram of the fragile material process equipment of the present invention.
Embodiment
In order to describe the technical content, the structural feature, the achieved object and the effect of this invention in detail, below in conjunction with embodiment And attached drawing is coordinated to be explained in detail.
Embodiment 1
Referring to Fig. 1, a kind of fragile material process equipment, including control module, laser cutting module, focus ultrasonic module And processing platform, the laser cutting module include laser generator, and the laser shaping set gradually along laser optical path direction Unit, laser alignment transmission unit, laser scan unit and laser focusing unit, the processing platform are arranged at laser and focus on list Member lower section, the focus ultrasonic module setting coaxial with the laser focusing unit, the processing platform can multiaxis freely transport Dynamic, the control module is used for the displacement for controlling laser cutting module and focus ultrasonic module working status and processing platform.
In the present embodiment, control module laser generator produces laser, wherein, laser generator is optical fiber laser or solid Body laser, the wavelength of the laser of generation are 0.2-11.4 μm, pulsewidth for picosecond or femtosecond pulse laser, laser passes through laser Shaping unit, carries out spot size, shape, optical density distribution to laser etc. and adjusts, by laser alignment transmission unit and swash Light scanning unit is transmitted to laser focusing unit and is focused processing, and transparent fragile material is consolidated by material fixed mechanism Due on processing platform, control module adjusts the focus of laser by laser focusing unit, makes cutting of the laser action in material On point, then by controlling the movement of processing platform horizontal direction X-axis and Y-axis, to adjust the cutting path of process equipment.
Launch laser at the same time, the focus ultrasonic module of confocal setting coaxial with laser focus module is started to work, and is focused on and is swashed Light beam makes material produce controllable crack due to thermal stress, is overlapped due to focusing on ultrasonic wave with laser spot, strong concussion can make The material that crack due to thermal stress is produced after laser irradiation prolongs the direction of cutting and splits, in order to make the fragment of material focus on ultrasonic wave It is more easy to depart from material under effect, the processing groove of processing platform is injected into liquid, which can be water or oil, and the choosing of liquid Select and be adapted with optical maser wavelength, avoid liquid absorption laser energy and influence processing effect, soak transparent brittleness in a liquid Material can accelerate the separation process with fragment under the tension force of liquid, wherein, focus on the working frequency of ultrasonic wave and shaking for liquid Dynamic frequency is adapted to.
Laser focus module carries out various ways focusing to laser, such as Multi-point focusing light beam, Bezier focus on light beam, laser Into mercerising beam etc..
Fragile material includes glass, sapphire, quartz, corundum etc..
Laser Processing includes the techniques such as cutting, holes drilled through, drilling blind hole.
Herein, up, down, left, right, before and after only represents its relative position and does not indicate that its absolute position.
As can be seen from the above description, the beneficial effects of the present invention are：A kind of process equipment of transparent fragile material is provided, The process equipment is processed transparent fragile material using laser beam is focused on, while super using ultrasonic focusing system generation focusing Sound wave separates the material fragment for laser machining generation with material body, is collapsed using the material cutting smooth nothing of wall of equipment processing Breach, zero draft, substantially increases the success rate that transparent fragile material is processed.
Embodiment 2
On the basis of embodiment 1, which further includes adaptive platform, and the laser of the laser cutting module is swept Retouch unit, laser focusing unit and the focus ultrasonic module and may be contained within the adaptive platform, the adaptive platform by The control module control is vertically movable.
In the present embodiment, when material is thicker, the focus that control module can control adaptive platform to adjust laser focusing exists The position of vertical direction, i.e. Z axis, allows focus to be moved to material internal, realizes the three-dimension process to material, substantially increase processing Efficiency.
X-axis, Y-axis and Z axis in the present invention are mutually perpendicular between any two, and wherein X-axis and Y-axis represent horizontal direction displacement, Z Axis represents vertical displacement.
Embodiment 3
On the basis of embodiment 2, the focus ultrasonic module is high intensity focused ultrasound system, described high-strength focused The ultrasonic frequency that ultrasonic system produces is 18KHz-10MHz.
In the present embodiment, high intensity focused ultrasound system is made of multiple ultrasonic wave generating sources, each ultrasonic wave generating source A ultrasonic beam can be produced, when multiple ultrasonic beams are focused on a bit, you can obtain focusing on ultrasonic wave, coordinate laser to cut Cutting module can be with accelerated material fragment process separated with material.
The ultrasonic frequency that the high intensity focused ultrasound system produces is adapted to the resonant frequency of transparent fragile material, is adopted Material is processed with the ultrasonic frequency being adapted to resonant frequency, processing efficiency can be improved.
When transparent fragile material, which is soaked in, to be processed in liquid, high intensity focused ultrasound system produce ultrasonic frequency with The resonant frequency adaptation of liquid.
The foregoing is merely the embodiment of the present invention, is not intended to limit the scope of the invention, every to utilize this hair The equivalent structure or equivalent flow shift that bright specification and accompanying drawing content are made, is directly or indirectly used in other relevant skills Art field, is included within the scope of the present invention.

Claims (9)

  1. A kind of 1. transparent fragile material process equipment, it is characterised in that：Including control module, laser cutting module, focus ultrasonic Module and processing platform, the laser cutting module include laser generator, and the laser set gradually along laser optical path direction Shaping unit, laser alignment transmission unit, laser scan unit and laser focusing unit, the processing platform are arranged at laser and gather The lower section of burnt unit, the focus ultrasonic module setting coaxial with the laser focusing unit, the processing platform can multiaxis from By moving, the control module is used to control laser cutting module and the position of focus ultrasonic module working status and processing platform Move.
  2. 2. transparent fragile material process equipment as claimed in claim 1, it is characterised in that：The focus ultrasonic module with it is described The focus of laser focusing unit overlaps.
  3. 3. transparent fragile material process equipment as claimed in claim 2, it is characterised in that：It is equipped with above the processing platform Processing groove, the processing groove is interior to be equipped with material fixed mechanism.
  4. 4. transparent fragile material process equipment as claimed in claim 3, it is characterised in that：Liquid is inoculated with the processing groove, The liquid is water or oil.
  5. 5. transparent fragile material process equipment as claimed in claim 4, it is characterised in that：Adaptive platform is further included, it is described The laser focusing unit of laser cutting module and the focus ultrasonic module may be contained within the adaptive platform, described adaptive Platform is controlled vertically movable by the control module.
  6. 6. transparent fragile material process equipment as claimed in claim 5, it is characterised in that：What the laser generator produced swashs A length of 0.2-11.4 μm of light wave.
  7. 7. transparent fragile material process equipment as claimed in claim 6, it is characterised in that：What the laser generator produced swashs The pulse width of light is picosecond or femtosecond.
  8. 8. transparent fragile material process equipment as claimed in claim 7, it is characterised in that：The focus ultrasonic module is high-strength Focused ultrasound system is spent, the ultrasonic frequency that the high intensity focused ultrasound system produces is 18KHz-10MHz.
  9. 9. transparent fragile material process equipment as claimed in claim 8, it is characterised in that：The high intensity focused ultrasound system The ultrasonic frequency of generation is adapted to the resonant frequency of transparent fragile material.
CN201711448374.XA 2017-12-27 2017-12-27 Transparent brittle material processing equipment Active CN107953038B (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109604837A (en) * 2018-12-12 2019-04-12 中国科学院西安光学精密机械研究所 A kind of zero draft laser processing and processing unit (plant)
CN109759722A (en) * 2019-02-27 2019-05-17 大族激光科技产业集团股份有限公司 A kind of the LED chip system of processing and method of double process combinations
CN111116033A (en) * 2020-01-09 2020-05-08 苏州德龙激光股份有限公司 Laser filamentation drilling and ultrasonic wave splitting device and method for ultrathin glass

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CN105682850A (en) * 2013-08-29 2016-06-15 康宁股份有限公司 Methods for forming vias in glass substrates
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CN106238918A (en) * 2016-09-27 2016-12-21 广东工业大学 The ceramic etching system of a kind of ultrasonic wave added laser and method
CN206014669U (en) * 2016-09-05 2017-03-15 合肥鑫晟光电科技有限公司 A kind of cutting equipment
CN207873412U (en) * 2017-12-27 2018-09-18 常州英诺激光科技有限公司 Transparent fragile material process equipment

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JPS6376786A (en) * 1986-09-19 1988-04-07 Hitachi Ltd Laser beam machining device
US20020006765A1 (en) * 2000-05-11 2002-01-17 Thomas Michel System for cutting brittle materials
US20040251290A1 (en) * 2001-07-25 2004-12-16 Kondratenko Vladimir Stepanovich Cutting method for brittle non-metallic materials (two variants)
JP2006114786A (en) * 2004-10-15 2006-04-27 Laser System:Kk Laser beam machining method
CN102123818A (en) * 2008-06-28 2011-07-13 通快机床两合公司 Method for eccentrically orienting a laser cutting beam in relation to a nozzle axis and for cutting at an angle, corresponding laser machining head and laser machining tool
CN102092931A (en) * 2010-11-26 2011-06-15 华中科技大学 Method and device for preparing microchannel in glass material
US20140312017A1 (en) * 2011-07-27 2014-10-23 Alexander Potemkin Method For Applying a Data Marking to the Surface of a Diamond or Brilliant and For Determining the Authenticity Thereof
JP2013128974A (en) * 2011-12-22 2013-07-04 Ihi Inspection & Instrumentation Co Ltd Method and apparatus for laser processing by addition of ultrasonic wave
JP2014054668A (en) * 2012-09-13 2014-03-27 Leo:Kk Laser processing method and laser processing apparatus
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CN105945429A (en) * 2016-06-30 2016-09-21 哈尔滨工业大学（威海） Ultrasonic auxiliary underwater laser cutting device and method
CN206014669U (en) * 2016-09-05 2017-03-15 合肥鑫晟光电科技有限公司 A kind of cutting equipment
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109604837A (en) * 2018-12-12 2019-04-12 中国科学院西安光学精密机械研究所 A kind of zero draft laser processing and processing unit (plant)
CN109759722A (en) * 2019-02-27 2019-05-17 大族激光科技产业集团股份有限公司 A kind of the LED chip system of processing and method of double process combinations
CN109759722B (en) * 2019-02-27 2021-08-31 大族激光科技产业集团股份有限公司 Double-process combined LED chip processing system and method
CN111116033A (en) * 2020-01-09 2020-05-08 苏州德龙激光股份有限公司 Laser filamentation drilling and ultrasonic wave splitting device and method for ultrathin glass

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