CN207820325U - The manufacturing device and film formation device of circuit module - Google Patents
The manufacturing device and film formation device of circuit module Download PDFInfo
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- CN207820325U CN207820325U CN201721336710.7U CN201721336710U CN207820325U CN 207820325 U CN207820325 U CN 207820325U CN 201721336710 U CN201721336710 U CN 201721336710U CN 207820325 U CN207820325 U CN 207820325U
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- circuit module
- holder
- protrusion
- metal film
- manufacturing device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Physical Vapour Deposition (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides the manufacturing device and film formation device of circuit module.The manufacturing device of circuit module is formed into the metal film (18) of shielding part in the circuit module (10) with mounting surface (10a), top surface (10b) and side (10c).Including：Holding unit, it uses the holder (20) of holding circuit module, circuit module will be set in the state of so that the interarea (20a) of circuit module, mounting surface (10a) and holder (20) is abutted and in the region different in the region that same mounting surface (10a) is abutted with interarea (20a) from interarea (20a) protrusion outstanding (25), around outside in the state of, holding circuit module；Metal film forms unit, in top surface and side, formation metal film (18) by being formed a film from circuit module, top surface, direction；And separative element, make holder (20) and circuit module, detach.
Description
Technical field
The utility model is related to be formed into circuit module the manufacturing device of the circuit module of the metal film of shielding part with
And film formation device.
Background technology
In the past, there is known the multiple electronic units for having substrate, the interarea for being equipped on substrate and to cover multiple electronics
The mode of component is set to the circuit module in the resin seal portion of the interarea of substrate.Circuit module is rectangular-shape, has installation
Face, top surface and side are formed with the metal film as shielding part in top surface and side.
As the example for forming metal film on the surface of equipment, patent document 1 is disclosed to be pasted on by semiconductor equipment
After holder (supporting mass), the method by sputtering at semiconductor equipment formation metal film.
Patent document 1：Japanese Unexamined Patent Publication 2014-41923 bulletins.
However, as shown in Patent Document 1 like that, the method that is sputtered for semiconductor equipment is pasted on holder and
Speech, be difficult to sometimes semiconductor equipment high-precision surface form metal film.The problem is not limited to semiconductor equipment, in electricity
The surface of road module can similarly occur in the case of forming metal film (screened film).
Utility model content
Therefore, the utility model is completed in view of this problem, and its purpose is to provide high-precision in circuit module
Degree it is formed into the manufacturing device etc. of the circuit module of the metal film of shielding part.
To achieve the goals above, the manufacturing device of the circuit module of a mode of the utility model is with installation
The circuit module in face, top surface and side is formed into the manufacturing device of the circuit module of the metal film of shielding part comprising：It protects
Unit is held, using the holder for keeping foregoing circuit module, in the above-mentioned mounting surface for making foregoing circuit module and above-mentioned holder
And it will be from above-mentioned master in the above-mentioned mounting surface region different from the region that above-mentioned interarea abuts in the state that interarea abuts
Face protrusion outstanding is set under at least part of state around the outside of foregoing circuit module, keeps foregoing circuit
Module；Metal film forms unit, is formed a film by the direction of the above-mentioned top surface from foregoing circuit module, on above-mentioned top
Face and above-mentioned side form above-mentioned metal film；And separative element, so that above-mentioned holder is detached with foregoing circuit module.
Electricity is kept in the state of in this way, being provided with protrusion by least part around the outside of circuit module
Road module forms a film, and the metal film of shielding part can be accurately formed into circuit module.
Alternatively, it is also possible to which in above-mentioned holding unit, above-mentioned protrusion is set to the complete cycle in the outside of foregoing circuit module.
Hereby it is possible to which the complete cycle in the side of circuit module is accurately formed into the metal film of shielding part.
Alternatively, it is also possible to which in above-mentioned holding unit, gap is separated with the above-mentioned side relative to foregoing circuit module
Above-mentioned protrusion is arranged in mode.
Hereby it is possible to inhibit the entirety of the metal film for the side for being formed in circuit module more than necessary degree thinning.
In addition, above-mentioned gap can also be more than forms the above-mentioned metal that unit is formed in above-mentioned side by above-mentioned metal film
The thickness of film.
Accordingly, in the side of circuit module, the metal film of necessary thickness can be formed.
In addition, the height of above-mentioned protrusion can also be less than the height of foregoing circuit module.
Accordingly, in the side of the circuit module of the position higher than protrusion, the metal film of necessary thickness can be formed.
Alternatively, it is also possible to which in above-mentioned holding unit, multiple foregoing circuit modules, above-mentioned protrusion are maintained in above-mentioned holder
Portion is set between multiple foregoing circuit modules and the outside of the outer most edge in the region configured with multiple foregoing circuit modules.
Hereby it is possible to accurately be formed into the metal film of shielding part respectively in the side of multiple circuit modules.
In addition, in the case of the above-mentioned holder from above-mentioned main surface side, above-mentioned protrusion is clathrate.
Hereby it is possible to which the complete cycle in the side of circuit module is accurately formed into the metal film of shielding part.
Have alternatively, it is also possible to above-mentioned holder：Metallic plate, the adhesive part and clathrate being arranged on above-mentioned metallic plate
Framework, by the holding unit action before configuring the framework in the adhesive part by formed the protrusion or
Person configures the framework in the adhesive part using the holding unit and forms the protrusion.
By configuring framework in adhesive part like this, can accurately be formed in the shape and holder of protrusion
The position of protrusion, and then the metal film of shielding part can be accurately formed into circuit module.
Have alternatively, it is also possible to above-mentioned holder：Metallic plate, clathrate framework and be arranged in above-mentioned framework and on
The adhesive part on metallic plate is stated, after being configured with above-mentioned framework on above-mentioned metallic plate before the action of above-mentioned holding unit, with
Above-mentioned adhesive part is arranged on above-mentioned metallic plate and forms above-mentioned protrusion for the mode for covering above-mentioned framework.
By utilizing adhesive part to cover framework like this, metal film will not be formed in framework to which metal film forms unit.
Thus it is for example possible to be easy to recycle framework.
The adhesive part that there is metallic plate alternatively, it is also possible to above-mentioned holder and be arranged on above-mentioned metallic plate, by using upper
Stating holding unit makes the above-mentioned mounting surface of foregoing circuit module be abutted with above-mentioned adhesive part, and the indentation of foregoing circuit module is above-mentioned
Adhesive part and form above-mentioned protrusion.
Hereby it is possible to easily protrusion be formed in holder, so as to improve production efficiency.
Alternatively, it is also possible to foregoing circuit module above-mentioned side is maintained as by loading the mounting tool of foregoing circuit module
The capped state in face keeps the above-mentioned of foregoing circuit module by being transferred when foregoing circuit module is pressed into above-mentioned adhesive part
The outer shape of mounting tool and form above-mentioned protrusion.
Hereby it is possible to easily protrusion be formed in holder, so as to improve production efficiency.In addition, being capable of high-precision
Ground forms protrusion, so as to accurately form metal film in circuit module.
Expose in above-mentioned mounting surface alternatively, it is also possible to the external terminal of foregoing circuit module, the ground connection of foregoing circuit module
Electrode exposes in above-mentioned side, and above-mentioned metal film is not formed at above-mentioned mounting surface, and above-mentioned to be connect with what is exposed in above-mentioned side
The mode of ground electrode electrical connection is formed in above-mentioned top surface and above-mentioned side.
Hereby it is possible to improve the shield effectiveness of circuit module.
In addition, the film formation device of a mode of the utility model is a kind of with mounting surface, top surface and the electricity of side
Road module is formed into the film formation device of the metal film of shielding part, has：Chamber；Film forming metal material portion, is set to
It states in chamber；And holder, it is set in above-mentioned chamber, so that the above-mentioned top surface of foregoing circuit module and above-mentioned film forming gold
Belong to the opposed mode in material portion and keep foregoing circuit module, above-mentioned holder the above-mentioned mounting surface for making foregoing circuit module with it is above-mentioned
It will be from the state that the interarea of holder abuts and in the above-mentioned mounting surface region different from the region that above-mentioned interarea abuts
Above-mentioned interarea protrusion outstanding is set under at least part of state around the outside of foregoing circuit module, in holding
State circuit module.
By using the film formation device, metal film can be accurately formed in circuit module.
The utility model can accurately be formed into the metal film of shielding part in circuit module.
Description of the drawings
Fig. 1 is the sectional view schematically shown through the manufactured circuit module of the manufacturing device of embodiment 1.
Fig. 2 is the figure of the manufacturing device for the circuit module for indicating comparative example.
Fig. 3 (a) is the figure of an example of the project of the manufacturing device for the circuit module for indicating comparative example.
Fig. 3 (b) is the figure of other projects of the manufacturing device for the circuit module for indicating comparative example.
Fig. 4 is the flow chart of the manufacturing device for the circuit module for indicating embodiment 1.
Fig. 5 (a)~Fig. 5 (d) is the figure of the manufacturing device for the circuit module for indicating embodiment 1, and is to indicate each process
Circuit module and holder section figure.
Fig. 6 is the vertical view of holder shown in Fig. 5 (a).
Fig. 7 is the vertical view of circuit module and holder shown in Fig. 5 (b).
Fig. 8 is by the sectional view of the part amplification of Fig. 5 (b).
Fig. 9 is by the sectional view of the part amplification of Fig. 5 (c).
Figure 10 is the figure for schematically showing film formation device used in the metal film formation process of embodiment 1.
Figure 11 is the circuit module for the metal film formation process for indicating embodiment 1 and one example of others of holder
Sectional view.
Figure 12 (a)~Figure 12 (d) is the figure of the manufacturing device for the circuit module for indicating embodiment 2, and is to indicate each work
The circuit module of sequence and the figure in the section of holder.
Figure 13 (a)~Figure 13 (c) is the dress for indicating to be formed protrusion in the manufacturing device of the circuit module of embodiment 3
The figure set.
Figure 14 is the circuit module of the holding process of other modes and the vertical view of holder.
Figure 15 is the sectional view for the circuit module for schematically showing other modes.
The explanation of reference numeral
10,10A... circuit modules；10a... mounting surfaces；The top surfaces 10b...；The sides 10c...；The sides 10d... lower end；
11... substrate；The interarea of 11m, 11n... substrate；12... electronic unit；13a, 13b... external terminal；14... conductor figure
Case；15... grounding electrode；16... via conductors；17... sealing；18... metal film (screened film)；18T... tapered portion；
20... holder；The interarea of 20a... holders；21... metallic plate；22... adhesive part (double-faced pressure-sensitive adhesive sheet)；22a... first adheres
Portion；The second adhesive parts of 22b...；25... protrusion；26... framework；26a... is open；30... tool is loaded；31... side
Portion；32... bottom surface sections；50... film formation device；51... chamber；52... film forming metal material portion；53... electrode plate；
54... upport installation portion；55... power supply；The gap of c1, c2... circuit module and protrusion；H1... the height of circuit module；
H2... the height of protrusion；T1... the thickness of the metal film of the side of sealing.
Specific implementation mode
Embodiment 1
The structure of 1-1. circuit modules
First, the structure of the circuit module 10 made of the manufacturing device of embodiment 1 is illustrated.Fig. 1 is to show
Indicate to meaning property the sectional view of circuit module 10.
Circuit module 10 is, for example, the high-frequency model for being built in mobile communication terminal.Circuit module 10 has：Substrate 11 is taken
It is loaded in multiple electronic units 12 of the interarea 11m of substrate 11 and is set to substrate in a manner of covering multiple electronic units 12
The sealing 17 of 11 interarea 11m.In addition, circuit module 10 be, for example, rectangular-shape, and with mounting surface 10a, top surface 10b with
And side 10c.Metal film 18 is not formed in the mounting surface 10a of circuit module 10, and in top surface, 10b and side 10c are formed with into
For the metal film 18 of shielding part.
In addition, the mounting surface 10a of circuit module 10 is circuit module 10 is installed on printed wiring board via solder etc.
The face opposed with the interarea of printed wiring board when interarea.
As the substrate 11 of circuit module 10, ceramic substrate or glass epoxy substrate etc. can be used.Substrate 11 is by more
The multilager base plate that a substrate layer is formed, thickness is, for example, 1mm.The interarea 11m of substrate 11 or inside be formed with it is multiple
The conductive pattern 14 that electronic unit 12 is separately connected.As the material of conductive pattern 14, such as Cu can be used etc..As multiple electricity
The example of subassembly 12 can enumerate elastic wave device, IC elements, chip capacitor, chip inductor etc..Sealing 17 includes making
The heat-curing resins such as epoxy resin for host agent material and the filler being dispersed in the resin material.The thickness of sealing 17
For example, 1mm.
Metal film 18 is the screened film formed by sputtering etc., and thickness is, for example, 1 μm or more 20 μm or less.For gold
Belong to the thickness of film 18, the parts top surface 10b and the thickness of the side parts 10c can also be different, such as can also be formed as top surface 10b
Part is thicker than the side parts 10c.As the material of metal film 18, such as Cu, Ag, Ni can be used etc..It can also be more by being laminated
Metal film is planted to form metal film 18.
The mounting surface 10a of circuit module 10 is provided with external terminal 13a, 13b.External terminal 13a, 13b are that solder is convex
Block or electroconductive resin, thickness (height dimension) is, for example, 0.1mm.One external terminal 13a via via conductors 16 and
It is connect with the conductive pattern 14 of the interarea 11m of substrate 11.Another external terminal 13b is connected to ground connection via via conductors 16
Electrode 15.Grounding electrode 15 exposes in the side 10c of circuit module 10, is connected to metal film 18.By make metal film 18 via
Grounding electrode 15 and be grounded, be capable of the Electromagnetic Interference of suppression circuit module 10 and external mechanical.In addition, external terminal 13a,
13b can also be electrode as LGA (Land Grid Array).
It is formed with the metal film 18 of taper in the side of the substrate 11 of the part for the side 10c for constituting circuit module 10.
The tapered portion 18T being made of the metal film 18 of taper is specifically formed in the grounding electrode 15 exposed in side 10c and side
Between 10c and the side lower end 10d of mounting surface 10a intersections.For tapered portion 18T, with the film of the metal film 18 of side 10c
The position that thickness changes greatly as starting point until side lower end 10d and film thickness becomes smaller gradually, in side lower end 10d, film thickness becomes 0
μm or close to 0 μm of value (be more than 0 μm and 1 μm or less).
The project of the manufacturing device of circuit module in 1-2. comparative examples
Next, being illustrated to the project of the manufacturing device of the circuit module in comparative example.Fig. 2 is indicated in comparative example
Circuit module 110 manufacturing device figure.
Circuit module 110 in comparative example has substrate 111, multiple electronic units 112 and sealing 117.In addition, electric
Road module 110 has mounting surface 110a, top surface 110b and side 110c.
In manufacturing device in a comparative example, first as shown in (a) of Fig. 2, the holder coated with adhesive 122 is used
121 carry out holding circuit module 110.Specifically, the mounting surface 110a of circuit module 110 is made to be connected to coated in holder 121
The adhesive 122 on surface, to make circuit module 110 adhere to.
Next, as shown in (b) of Fig. 2, metal film is formed in the top surface 110b and side 110c of circuit module 110
118.The metal film 118 passes through the formation such as sputtering.In addition, when forming metal film 118, in the configuring area of circuit module 110
It is also formed with metal film 118 on adhesive 122 in addition.
Next, as shown in (c) of Fig. 2, circuit module 110 is removed from the adhesive 122 of holder 121.Pass through these
Process is formed in the circuit module 110 for the metal film 118 that top surface 110b and side 110c is formed with as shielding part.
However, in the manufacturing device of the circuit module 110 of comparative example as described above, can generate it is as shown below as
The problem of.
For example, after foring metal film 118, as shown in Fig. 3 (a), if circuit module 110 is removed from holder 121
Apply lateral power, then metal film 118 disconnects in the outer part in the side 110c than circuit module 110 sometimes.As a result, sometimes in electricity
The metal film 118 of road module 110 forms burr 118a, becomes bad order.
In addition, when circuit module 110 is fixed on holder 121, as shown in Fig. 3 (b), the posture of circuit module 110 is inclined
Tiltedly, it is maintained as the state that the end of mounting surface 110a floats sometimes.If forming a film in this state, in mounting surface 110a
End be also formed with metal film 118, metal film 118 is contacted with the external terminal of the signal of circuit module 110 and is sent out sometimes
Raw short trouble.
In this way, in the forming apparatus of the metal film 118 of comparative example, burr 118a is formed in metal film 118 sometimes, is had
When can form metal film 118 in mounting surface 110a, to be difficult to accurately form metal film 118 in circuit module 110.
The manufacturing device of the circuit module of the utility model is by including process below, so as in circuit module height
Form to precision metal film (screened film).
The manufacturing device of 1-3. circuit modules
Hereinafter, being said in detail to the manufacturing device of the circuit module 10 of the embodiment of the utility model using attached drawing
It is bright.In addition, embodiment described below shows a preferred concrete example of the utility model.The following embodiments and the accompanying drawings
Shown in numerical value, shape, material, inscape, the allocation position of inscape and connection type, step, the sequence of step
Etc. being an example, the utility model is not limited.In addition, not being recorded in table in the inscape of the following embodiments and the accompanying drawings
The inscape for showing the independent claims of the upper concept of the utility model, as the arbitrary of the preferred mode of composition
Inscape and illustrate.
Fig. 4 is the flow chart of the manufacturing device of indication circuit module 10, shows to be formed into screen in circuit module 10 successively
The process of the metal film 18 of shield.
Fig. 5 (a)~Fig. 5 (d) is the circuit module 10 for each process for indicating Fig. 4 and the figure in the section of holder 20.In addition,
It is only shown section as section in figure, omits the record of the inscape positioned at paper depth side (Y-direction positive side).Separately
Outside, electronic unit 12, conductive pattern 14, grounding electrode 15, via conductors 16 and the outside of circuit module 10 are omitted in figure
The record of terminal 13a, 13b.
As shown in figure 4, the manufacturing device of the circuit module 10 of embodiment 1 includes：Protrusion 25 is formed in holder 20
Protrusion formation process S11, metal is formed using the holding process S12 of 20 holding circuit module 10 of holder, in circuit module 10
The metal film formation process S13 of the film 18 and separation process S14 for making holder 20 be detached with circuit module 10.
First, as shown in Fig. 5 (a), protrusion 25 (S11) is formed in the interarea 20a of holder 20.
Holder 20 is the fixture for holding circuit module 10, has the flat metal being made of stainless steel material etc.
Plate 21 and the adhesive part 22 being arranged on metallic plate 21.
Adhesive part 22 is double-faced pressure-sensitive adhesive sheet, by substrate sheets, a face for being formed in substrate sheets the first adhesive part 22a, with
And it is formed in the second adhesive part 22b compositions in another face.Adhesive part 22 is pasted on metallic plate via the second adhesive part 22b
Expose on the surface of 21, the first adhesive part 22a.The flat surface of the exposing of first adhesive part 22a becomes the interarea 20a of holder 20.
Adhesive part 22 is such as sheet material (the hot stripping film of adhesion strength reduction due to heating：Nitto Denko Corp
System).The respective adhesion strengths of first adhesive part 22a and the second adhesive part 22b reduce temperature of the temperature higher than metal film formation when,
The adhesion strength of first adhesive part 22a, which reduces adhesion strength of the temperature less than the second adhesive part 22b, reduces temperature.
It is configured with the framework 26 of clathrate in the interarea 20a of holder 20.Framework 26 is by such as stainless steel and other metal materials shape
At.In the present embodiment, which becomes from the interarea 20a of holder 20 to vertical direction protrusion 25 outstanding.
Fig. 6 is the vertical view of holder 20 shown in Fig. 5 (a).
As shown in fig. 6, framework 26 has the multiple opening 26a being arranged with ranks shape.The 26a that is open is rectangular-shaped, compares circuit
The shape of module 10 is big, penetrates through framework 26 in a thickness direction.In addition, as shown in Fig. 5 (a), for framework 26, grid
Section is trapezoidal shape, is abutted below with adhesive part 22, with towards top and end constriction.In addition, the section of grid
Shape is not limited to trapezoidal shape, can also be triangle, quadrilateral shape, multilateral shape, semi-circular shape or ladder-like.
In this way, by configuring framework 26 in adhesive part 22, protrusion 25 is formed in holder 20.Holder 20 has as a result,
Metallic plate 21, adhesive part 22 and protrusion 25.
Next, as shown in Fig. 5 (b), multiple circuit modules 10 (S12) are kept using holder 20.
Specifically, making mother substrate singualtion using cutter etc., rectangular-shaped multiple circuit modules 10 are formed.Moreover,
Circuit module 10 is configured on holder 20 using fitting machine etc., so that the master of the mounting surface 10a and holder 20 of circuit module 10
Face 20a is abutted.As a result, holder 20 in the state of so that the mounting surface 10a of circuit module 10 is abutted with the interarea 20a of holder 20 and
And in the state of so that top surface 10b and side 10c is exposed, holding circuit module 10.
Fig. 7 is the vertical view of circuit module 10 and holder 20 shown in Fig. 5 (b).Fig. 8 is to put a part of Fig. 5 (b)
Big sectional view.
As shown in Figure 7 and Figure 8, in configuration circuit module 10 on holder 20, circuit module 10 is configured to：Not with protrusion
Portion 25 is overlapped, and in the opening 26a of framework 26.By the configuration, holder 20 is provided between multiple circuit modules 10
The outside of outer most edge in the state of protrusion 25 and in the region configured with multiple circuit modules 10 is provided with protrusion 25
In the state of, holding circuit module 10.That is, holder 20 is supported in the mounting surface 10a of same circuit module 10 and the interarea 20a of holder 20
The different region in the region that connects, has from interarea 20a protrusions 25 outstanding, which is being set to each circuit module
In the state of around 10 outside, holding circuit module 10.
As shown in fig. 7, the complete cycle in each circuit module 10 is arranged in protrusion 25.But it is not limited to this, protrusion 25 can
To be set as being dispersed in around each circuit module 10, can also be set to as around rectangular circuit module 10
One side or both sides of a part.
In addition, as shown in figure 8, protrusion 25 is set near the side 10c of circuit module 10.That is, protrusion 25 with
The mode that side 10c relative to circuit module 10 separates gap c1 is arranged.Gap c1 is such as 1 μm or more 6 μm hereinafter, simultaneously quilt
It is set greater than the thickness t1 of the metal film 18 for the side for being formed in sealing 17.It is the feelings of trapezoidal shape in the section of protrusion 25
Under condition, the gap c2 of the top of protrusion 25 is bigger than following gap c1.In addition, the height h2 of protrusion 25 is less than circuit module
10 height h1, and the height (thickness) of the preferably shorter than substrate 11 of circuit module 10.
Next, as shown in Fig. 5 (c), metal film 18 is formed in the top surface 10b and side 10c of circuit module 10
(S13).Specifically, using the film formation devices such as sputter equipment 50, metal film 18 is respectively formed in multiple circuit modules 10.
Figure 10 is the schematic diagram for indicating film formation device 50.Film formation device 50 has：Chamber 51, be set in chamber 51 at
The holder 20 of film metal material portion 52 and holding circuit module 10.
It is vented by drawdown pump (not shown) in chamber 51, is maintained as such as 10-4The vacuum degree of Pa or so.In chamber
The inactive gas such as argon gas are imported in 51.
Film forming metal material portion 52 is the target for including the metal materials such as Cu, Ag or Ni.In film forming metal material portion
52 upside is provided with electrode plate 53.Film forming is installed on electrode plate 53 in a detachable manner with metal material portion 52.
It is configured with the holder 20 of holding circuit module 10 in the lower part of chamber 51.The downside of holder 20 is provided with holder peace
Dress portion 54.Holder 20 by make the top surface 10b of circuit module 10 and film forming with metal material portion 52 it is opposed in a manner of be held in branch
Frame mounting portion 54.Holder 20 can be dismounted relative to upport installation portion 54.
Power supply 55 is provided between holder 20 and electrode plate 53.Power supply 55 is so that electrode plate 53 and film forming metal material
The mode that 52 side of material portion becomes cathode connects.20 side of holder is anode, and is grounded.
By the applying high voltage between holder 20 and electrode plate 53, ion in plasma with as cathode side at
Film is collided with metal material portion (target) 52, pounds the film forming particle in film forming metal material portion 52.Pounded as a result, at
Peplomer is attached to the top surface 10b and side 10c of circuit module 10, forms metal film 18.As a result, metal film 18 in side
The grounding electrode 15 that 10c exposes connects.In addition, metal film 18 is also formed in the protrusion other than the region configured with circuit module 10
Portion 25 and adhesive part 22.
In the present embodiment, protrusion 25 is provided with around the outside of circuit module 10, therefore prominent in film forming
Playing portion 25 becomes barrier, to which above-mentioned film forming particle is difficult to lower part (the mounting surface 10a into the side 10c of circuit module 10
Side).Therefore, be formed in side lower end 10d that the metal film 18 of side 10c more intersects towards side 10c with mounting surface 10a more
Thin, in side, the lower part of 10c is formed with the tapered portion 18T being made of the metal film 18 of taper.In side lower end 10d, metal film
18 thickness becomes 0 μm or close to 0 μm of value, is disconnected to which metal film 18 is easy laterally lower end 10d.
After metal film formation process S13, as shown in Fig. 5 (d), multiple circuit modules 10 is made to be detached from holder 20
(S14)。
Specifically, multiple circuit modules 10 are removed from the adhesive part 22 as double-faced pressure-sensitive adhesive sheet.As adhesive part
22 and in the case of having used hot stripping film, by being heat-treated (such as 100 DEG C), make the adhesion strength of the first adhesive part 22a
It reduces.By the heat treatment, circuit module 10 is removed from adhesive part 22.In addition, further increasing temperature and being heat-treated
(for example, 120 DEG C) make adhesive part 22 be removed from metallic plate 21 to make the adhesion strength of the second adhesive part 22b reduce.Framework 26
It detaches, can be recycled as needed from adhesive part 22.
In the present embodiment, in the side lower end 10d of circuit module 10, the thickness of metal film 18 becomes 0 μm or connects
Nearly 0 μm of value and formed.It therefore, can be along side lower end 10d i.e. along shape when making circuit module 10 be detached from holder 20
At the side 10c in circuit module 10 metal film 18 and be formed in holder 20 metal film 18 boundary and keep metal film 18 disconnected
Open, so as to inhibit metal film 18 burr generation.Thereby, it is possible to accurately form metal film in circuit module 10
18。
1-4. effects etc.
The manufacturing device of the circuit module 10 of present embodiment is with mounting surface 10a, top surface 10b and side 10c
Circuit module 10 be formed into shielding part metal film 18 circuit module 10 manufacturing device comprising：Keep process
S12, in this process, using the holder 20 of holding circuit module 10, in the mounting surface 10a for making circuit module 10 and holder 20
And it will be from interarea in the regions different from the region that interarea 20a is abutted same mounting surface 10a in the state that interarea 20a is abutted
In the state that 20a protrusions 25 outstanding are set to around the outside of circuit module 10, holding circuit module 10；Metal film shape
At process S13, in this process, formed a film by the direction of the top surface 10b from circuit module 10, to top surface 10b with
And side 10c forms metal film 18；And separation process S14, so that holder 20 is detached with circuit module 10.
By the way that protrusion 25 is arranged like this around the outside of circuit module 10, in the side of circuit module 10
The lower part of 10c relatively thinly forms metal film 18.As a result, when making circuit module 10 be detached with holder 20, metal film 18 is along electricity
The side lower end 10d of road module 10 is disconnected, so as to inhibit the side 10c in circuit module 10 to form the hair of metal film 18
Thorn.
In addition, by the way that protrusion 25 is arranged around the outside of circuit module 10, to as shown in figure 11, even if installation
Face 10a is fixed in the state of floating relative to holder 20, and protrusion 25 becomes partition, to which the particle that forms a film is difficult to be attached to
Mounting surface 10a.Thereby, it is possible to inhibit the mounting surface 10a in circuit module 10 to form metal film 18.
In this way, according to the present embodiment, the metal film 18 of shielding part can be accurately formed into circuit module 10.
In addition, the film formation device 50 of present embodiment is in the circuit with mounting surface 10a, top surface 10b and side 10c
Module 10 is formed into the film formation device 50 of the metal film 18 of shielding part, has：Chamber 51；Film forming metal material portion 52,
It is set in chamber 51；And holder 20, it is set in chamber 51, so that the top surface 10b of circuit module 10 is used with film forming
The opposed mode holding circuit module 10 in metal material portion 52, holder 20 is in the mounting surface 10a for making circuit module 10 and holder 20
Interarea 20a abut in the state of and will be from interarea in the regions different from the region that interarea 20a is abutted same mounting surface 10a
In the state that 20a protrusions 25 outstanding are set to around the outside of circuit module 10, holding circuit module 10.
By using the film formation device 50, metal film 18 can be accurately formed in circuit module 10.
Embodiment 2
The manufacturing device of the circuit module 10 of embodiment 2 is formed on protrusion 25 this aspect making adhesive part 22 deform,
From configure framework 26 in adhesive part 22 and to form the embodiment 1 of protrusion 25 different.
The manufacturing device of the circuit module 10 of embodiment 2 includes：Protrusion formation process S11, process S12, gold are kept
Belong to film formation process S13 and separation process S14.
Figure 12 (a)~Figure 12 (d) is the figure of the manufacturing device for the circuit module 10 for indicating embodiment 2, is to indicate each work
The circuit module 10 of sequence and the figure in the section of holder 20.In addition, in Figure 12 (a)~Figure 12 (d), only using section as section
It shows, in addition, omitting electronic unit 12, conductive pattern 14, grounding electrode 15, via conductors 16 and external terminal 13a, 13b
Record.
First, as shown in Figure 12 (a), protrusion 25 (S11) is formed in the interarea 20a of holder 20.In addition, embodiment 2
Holder 20 interarea 20a refer to the first adhesive part 22a flat surface.
In embodiment 2, in order to form protrusion 25, first, the framework 26 of clathrate is configured on metallic plate 21, is connect
Get off, adhesive part 22 is set in a manner of covering framework 26 on metallic plate 21.Adhesive part 22 is double-faced pressure-sensitive adhesive sheet, imitates framework
26 shape and paste.In this way, make the covering framework 26 in adhesive part 22 part deform and make adhesive part 22 from interarea 20a to
Vertical direction protrudes, to form protrusion 25 in holder 20.
A part of structure of the protrusion 25 of embodiment 2 in the adhesive part 22 of a part and covering framework 26 by framework 26
At different from the protrusion 25 of embodiment 1 on this aspect, other modes are identical as embodiment 1.Holding process below
S12, metal film formation process S13 and separation process S14 as being respectively shown in Figure 12 (b)~Figure 12 (d) with embodiment 1
It is identical, to omit the description.
In embodiment 2, using the holder 20 of holding circuit module 10, the mounting surface 10a for making circuit module 10 with
It will in the state that the interarea 20a of holder 20 is abutted and in the regions different from the region that interarea 20a is abutted same mounting surface 10a
In the state that interarea 20a protrusions 25 outstanding are set to around the outside of circuit module 10, holding circuit module 10.And
And formed a film by the direction of the top surface 10b from circuit module 10, to form metal in top surface 10b and side 10c
After film 18, holder 20 is made to be detached with circuit module 10.Thereby, it is possible to accurately be formed into shielding part in circuit module 10
Metal film 18.
Embodiment 3
The manufacturing device of the circuit module 10 of embodiment 3 makes the deformation of adhesive part 22 prominent to be formed without using framework 26
It rises on this aspect of portion 25, and uses framework 26 and to form the embodiment 1 and 2 of protrusion 25 different.
Figure 13 (a)~Figure 13 (c) is to indicate to form protrusion 25 in the manufacturing device of the circuit module 10 of embodiment 3
Device figure.
The holder 20 of embodiment 3 is made up of metallic plate 21 and adhesive part 22.
First, as shown in Figure 13 (a), carry out holding circuit module using the mounting tool 30 for loading circuit module 10
10.The side 10c of circuit module 10 is covered by the side surface part 31 of mounting tool 30.
Next, as shown in Figure 13 (b), mounting tool 30 is made to move, circuit module 10 is pressed into the adhesive part of holder 20
22, so that circuit module 10 is fixed on holder 20.At this point, the outer shape by transferring mounting tool 30 in adhesive part 22, to
Adhesive part 22 is set to deform and form protrusion 25.Specifically, the side surface part 31 of mounting tool 30 and bottom surface sections 32 is made to be absorbed in
Adhesive part 22 makes a part for adhesive part 22 be swelled along side surface part 31.
Next, as shown in Figure 13 (c), the holding of the circuit module 10 carried out by mounting tool 30 is released, will be loaded
Tool 30 is withdrawn from holder 20.By these processes, protrusion 25 is formed in holder 20.
The protrusion 25 of embodiment 3 be only made of adhesive part 22 it is different from the protrusion 25 of embodiment 1 on this aspect,
Other modes are identical as embodiment 1.Metal film formation process S13 and separation process S14 below and 1 phase of embodiment
Together, to omit the description.
In embodiment 3, using the holder 20 of holding circuit module 10, the mounting surface 10a for making circuit module 10 with
It will in the state that the interarea 20a of holder 20 is abutted and in the regions different from the region that interarea 20a is abutted same mounting surface 10a
In the state that interarea 20a protrusions 25 outstanding are set to around the outside of circuit module 10, holding circuit module 10.And
And formed a film by the direction of the top surface 10b from circuit module 10, to form metal in top surface 10b and side 10c
After film 18, holder 20 is made to be detached with circuit module 10.Thereby, it is possible to accurately be formed into shielding part in circuit module 10
Metal film 18.
Other modes
More than, the manufacturing device etc. of the circuit module 10 of the utility model is illustrated based on Embodiments 1 to 3,
But the utility model is not limited to these Embodiments 1 to 3.Without departing from the purport of the utility model, to present embodiment
The various modifications or the side for building the inscape combination of different embodiments that those skilled in the art of implementation expect
Formula is also contained in the scope of the utility model.
For example, as shown in figure 14, can also circuit module 10 overlook be trapezoidal shape.Make mother substrate monolithic using laser
When change, the flat shape of circuit module 10 can be made to become trapezoidal etc. different shape.Circuit module 10 is set to become not similar shape
In the case of shape, make the shape matching terrain of the framework 26 of clathrate and each circuit module 10 at.
In the embodiment 1, after adhesive part 22 is configured with the framework 26 of clathrate, multiple circuit modules 10 are matched respectively
It is placed in the opening 26a of framework 26, but not limited to this.Such as sequence can also be made on the contrary, matching by multiple circuit modules 10
After being placed in adhesive part 22, by make grid between each circuit module 10 in a manner of configure framework 26.That is, keeping process S12
In, if holder 20 is in the state of so that the mounting surface 10a of circuit module 10 is abutted with the interarea 20a of holder 20 and by protrusion
In the state that portion 25 is set to around the outside of circuit module 10, holding circuit module 10, then via subsequent metal film shape
At process S13 and separation process S14, metal film can be accurately formed.
In embodiment 2, metallic plate 21 and the framework 26 of clathrate is made to be separately independently formed, but not limited to this.Example
Such as, the fixture of one thing can also be utilized to form metallic plate 21 and framework 26, adhesion is configured in the male and fomale(M＆F) of the fixture of one thing
Portion 22, to form the holder 20 with protrusion 25.
For example, adhesive part 22 is not limited to double-faced pressure-sensitive adhesive sheet, can also be formed by by 21 application of adhesive of metallic plate.
In the case where foring adhesive part 22 by adhesive, also as in the present embodiment, by the outside of circuit module 10
Around be arranged protrusion 25, so as to inhibit to lead to the problem of shown in comparative example.That is, can inhibit to make circuit module 10 from
Burr is formed in metal film 18 or form metal film 18 in mounting surface 10a in film forming when holder 20 detaches.In addition, the situation
Under, as adhesive, the material for making adhesion strength reduce by heat treatment or ultraviolet light are irradiated can also be used.
For example, adhesive part 22 can also be pasted on metallic plate in a manner of the whole of a plane of covered metal plate 21
21.Specifically, can also make as the double-faced pressure-sensitive adhesive sheet of adhesive part 22 area be more than metallic plate 21 a plane face
Product keeps the peripheral end of double-faced pressure-sensitive adhesive sheet protruding compared to the peripheral end of metallic plate 21.According to the structure, can inhibit
One plane of metallic plate 21 forms metal film, therefore can inhibit the deterioration of the metallic plate 21 caused by volume production use.
For example, film formation device 50 can be the sputter equipment of diode sputtering, magnetron sputtering, high-frequency sputtering, reactive sputtering etc.,
It can also be the evaporation coating device with the film forming metal material portion as evaporation source.
For example, as shown in figure 15, circuit module 10A can also have：Substrate 11, the interarea 11m for being equipped on substrate 11,
Multiple electronic units 12 of 11n and be respectively arranged in a manner of covering multiple electronic units 12 substrate 11 interarea 11m,
The sealing 17 of 11n.
In circuit module 10A, it is not formed with metal film 18 in mounting surface 10a (sealing 17 of the sides interarea 11n), but
In top surface, 10b and side 10c is formed into the metal film 18 of shielding part.Interarea 11m, 11n in substrate 11 or internal shape
At there is the conductive pattern being connect respectively with multiple electronic units 12 14.The mounting surface 10a of circuit module 10A is provided with outer end
Sub- 13a, 13b.One external terminal 13a is connected to the conductive pattern of interarea 11m, 11n of substrate 11 via via conductors 16
14.Another external terminal 13b is connected to grounding electrode 15 via via conductors 16.Grounding electrode 15 is in circuit module 10A
Side 10c expose, connect with metal film 18.In the side of the substrate 11 of the part for the side 10c for constituting circuit module 10
It is formed with the metal film 18 of taper.The tapered portion 18T being made of the metal film 18 of taper is formed in the ground connection exposed in side 10c
Between electrode 15, the side lower end 10d intersected with side 10c and mounting surface 10a.Tapered portion 18T is with the metal film 18 of side 10c
The big position of Thickness Variation as starting point until side lower end 10d and film thickness becomes smaller gradually, in side lower end 10d, film thickness 0
μm or close to 0 μm value (than it is 0 μm big and 1 μm or less).As manufacture in the case of circuit module 10A, can also it lead to
It crosses using above-mentioned manufacturing device, obtains effect identical with Embodiments 1 to 3.
Industrial utilization possibility
The manufacturing device of the circuit module of the utility model for example constitutes the communication module of mobile communication terminal in manufacture
It can be utilized when circuit module.In addition, the film formation device of the utility model can be used as is formed into shielding part in circuit module
Metal film film formation device and utilize.
Claims (13)
1. a kind of manufacturing device of circuit module, the manufacturing device is in the circuit with mounting surface, top surface and side
Module is formed into the metal film of shielding part, wherein including：
Holding unit, using the holder for keeping the circuit module, the mounting surface for making the circuit module with it is described
It will be from the state that the interarea of holder abuts and in the mounting surface region different from the region that the interarea abuts
The interarea protrusion outstanding is set under at least part of state around the outside of the circuit module, keeps institute
State circuit module；
Metal film forms unit, is formed a film by the direction of the top surface from the circuit module, on the top
Face and the side form the metal film；And
Separative element makes the holder be detached with the circuit module.
2. the manufacturing device of circuit module according to claim 1, wherein
In the holding unit, the protrusion is set to the complete cycle in the outside of the circuit module.
3. the manufacturing device of circuit module according to claim 1 or 2, wherein
In the holding unit, the protrusion is set in such a way that the side relative to the circuit module separates gap
It sets.
4. the manufacturing device of circuit module according to claim 3, wherein
The gap is more than forms the thickness that unit is formed in the metal film of the side using the metal film.
5. the manufacturing device of circuit module according to claim 1, wherein
The height of the protrusion is less than the height of the circuit module.
6. the manufacturing device of circuit module according to claim 1, wherein
In the holding unit, multiple circuit modules are maintained in the holder, the protrusion is set to multiple institutes
It states between circuit module and the outside of the outer most edge in the region configured with multiple circuit modules.
7. the manufacturing device of circuit module according to claim 1, wherein
In the case of the holder from the main surface side, the protrusion is clathrate.
8. the manufacturing device of circuit module according to claim 1, wherein
The holder has：The framework of metallic plate, the adhesive part being arranged on the metallic plate and clathrate,
The protrusion or profit are formed by configuring the framework in the adhesive part before holding unit action
The framework is configured in the adhesive part and form the protrusion with the holding unit.
9. the manufacturing device of circuit module according to claim 1, wherein
The holder has：Metallic plate, clathrate framework and be arranged in the framework and the metallic plate on adhesion
Portion,
Before holding unit action, after being configured with the framework on the metallic plate, to cover the framework
The adhesive part is arranged on the metallic plate and forms the protrusion for mode.
10. the manufacturing device of circuit module according to claim 1, wherein
The adhesive part that the holder has metallic plate and is arranged on the metallic plate,
The mounting surface of the circuit module is set to be abutted with the adhesive part by using the holding unit, and by the electricity
Road module is pressed into the adhesive part and forms the protrusion.
11. the manufacturing device of circuit module according to claim 10, wherein
The circuit module is maintained as the capped state in the side by loading the mounting tool of the circuit module,
Remain the mounting tool of the circuit module by being transferred when the circuit module is pressed into the adhesive part
Outer shape and form the protrusion.
12. the manufacturing device of circuit module according to claim 1, wherein
The external terminal of the circuit module exposes in the mounting surface, and the grounding electrode of the circuit module reveals in the side
Go out,
The metal film is not formed at the mounting surface, and the side to be electrically connected with the grounding electrode exposed in the side
Formula is formed in the top surface and the side.
13. a kind of film formation device, the film formation device is being formed into screen with mounting surface, top surface and the circuit module of side
The metal film of shield, wherein have：
Chamber；
Film forming metal material portion, is set in the chamber；And
Holder is set in the chamber, so that the top surface of the circuit module and the film forming metal material portion
Opposed mode keeps the circuit module,
The holder is in the state of so that the mounting surface of the circuit module is abutted with the interarea of the holder and same
It will be set to from interarea protrusion outstanding in the mounting surface region different from the region that the interarea abuts described
Under at least part of state around the outside of circuit module, the circuit module is kept.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-204463 | 2016-10-18 | ||
| JP2016204463A JP2018067597A (en) | 2016-10-18 | 2016-10-18 | Manufacturing method of circuit module and film deposition apparatus |
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| Publication Number | Publication Date |
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| CN207820325U true CN207820325U (en) | 2018-09-04 |
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| CN201721336710.7U Active CN207820325U (en) | 2016-10-18 | 2017-10-17 | The manufacturing device and film formation device of circuit module |
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| JP (1) | JP2018067597A (en) |
| KR (1) | KR102016980B1 (en) |
| CN (1) | CN207820325U (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112449477A (en) * | 2019-08-27 | 2021-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board manufacturing method and circuit board |
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| KR20210092122A (en) * | 2020-01-14 | 2021-07-23 | 파워테크 테크놀로지 인코포레이티드 | Batch-type semiconductor packaging structures with back-deposited shielding layer and manufacturing method thereof |
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| JP2014041923A (en) | 2012-08-22 | 2014-03-06 | Ps4 Luxco S A R L | Manufacturing method and manufacturing apparatus of semiconductor device |
| JP2015115557A (en) * | 2013-12-13 | 2015-06-22 | 株式会社東芝 | Semiconductor device manufacturing method |
| JP6313250B2 (en) * | 2015-03-11 | 2018-04-18 | 東芝メモリ株式会社 | Semiconductor manufacturing equipment |
| KR101662069B1 (en) * | 2015-09-18 | 2016-10-10 | (주) 씨앤아이테크놀로지 | Eletromagnetic interference shielding method of semiconductor packages |
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| CN112449477A (en) * | 2019-08-27 | 2021-03-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board manufacturing method and circuit board |
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| Publication number | Publication date |
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| KR20180042800A (en) | 2018-04-26 |
| KR102016980B1 (en) | 2019-09-02 |
| JP2018067597A (en) | 2018-04-26 |
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