CN207818607U - A kind of infra-red radiation LED light-emitting component - Google Patents
A kind of infra-red radiation LED light-emitting component Download PDFInfo
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- CN207818607U CN207818607U CN201721553252.2U CN201721553252U CN207818607U CN 207818607 U CN207818607 U CN 207818607U CN 201721553252 U CN201721553252 U CN 201721553252U CN 207818607 U CN207818607 U CN 207818607U
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- 239000010703 silicon Substances 0.000 description 1
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Abstract
A kind of infra-red radiation LED light-emitting component, including：Supporting structure；Baffle arrangement is connected with the periphery of supporting structure；Infra-red radiation LED chip, is set on supporting structure；Packaging plastic is covered in the periphery of infra-red radiation LED chip；Lens are formed on packaging plastic；The lens have the first surface towards packaging plastic and the second surface far from packaging plastic, the first surface includes the first sublist face, the second sublist face positioned at the first sublist face both sides, and positioned at the third sublist face of the second sub- surface periphery, wherein the first sublist face longitudinal section shape in curved surface, the trapezoidal shape in second sublist face longitudinal section or approximate trapezoid shape, third sublist face are planar in longitudinal section.
Description
Technical field
The utility model is related to a kind of light-emitting components, more particularly, to a kind of infra-red radiation LED light-emitting component.
Background technology
Infra-red radiation LED light-emitting component gradually applies iris recognition in Mobile Communications Market, security protection market, night vision
The characteristics of light filling etc., which applies, requires LED light-emitting component to have smaller light emitting angle, small volume and relatively low
Cost.
Small light emitting angle is made at present（θ1/2≤ ± 25 °, θ1/2It refer to the direction that luminous intensity values are axial strength value half
With the angle of luminous axis/normal）LED and the production program for having drift angle light source assembly mostly use the methods of additional lens of LED,
But this method assembly volume is very big, can not be applied in compact apparatus, and lens materials are more, cost is higher.Existing one
Kind of method is：LED package is implanted into high-precision light gathering reflector chamber, the structure of lens is in addition configured, although can also realize small
Angle and relatively small, but it reflects cavity mould costliness, and the packaging technology of LED light-emitting component is complicated, and cost of manufacture is caused to occupy
It is high not under, and limit by the structure of reflection cavity, if the light emitting angle of diminution LED light-emitting component is thought, in same efficiency and chip
Under the premise of size, the height for improving reflection cavity is needed, is become larger so as to cause the height of LED light-emitting component, application is limited.Mesh
Before, there are the infra-red radiation LED that American-European manufacturer is made using this similar structures, size to reach 3.5 × 3.5 × 2.4mm（Long ×
It is wide × high）, light emitting angle θ1/2≤±10°。
Invention content
In order to solve the above-mentioned technical problem, the utility model provides a kind of infra-red radiation LED light-emitting component.
It is according to the present utility model in a first aspect, a kind of infra-red radiation LED light-emitting component, including：Supporting structure；Baffle knot
Structure is connected with the periphery of supporting structure；Infra-red radiation LED chip, is set on supporting structure；Packaging plastic is covered in red
The periphery of external radiation LED chip；Lens are formed on packaging plastic；The lens have towards packaging plastic first surface with
And the second surface far from packaging plastic, the first surface include the first sublist face, the second son positioned at the first sublist face both sides
Surface, and positioned at the third sublist face of the second sub- surface periphery, wherein the first sublist face longitudinal section shape in curved surface, the second sublist
The trapezoidal shape in face longitudinal section or approximate trapezoid shape, third sublist face longitudinal section is in planar.
Further, it defines：Upper surface the widest part positioned at second sublist face longitudinal section and the baffle arrangement
Spacing between the inside edge of upper surface is A, then 0<A≤0.3mm.
Further, it defines：The horizontal size of the LED chip is L, is located at the upper table of second sublist face longitudinal section
Spacing between face the widest part and the centre normal of the second surface is B, then 3.3L≤B≤4.3L.
Further, it defines：Spacing between the upper surface of the LED chip and the upper surface peak of the packaging plastic
For C, then 0.1≤C≤0.5mm.
Further, it defines：The lower surface minimum point in first sublist face and the upper surface peak of the packaging plastic
Between spacing be D, then D>0.
Further, it defines：The horizontal size of the LED chip is L, the upper surface of the LED chip and the baffle
Spacing between the upper surface of structure is E, then E >=0.7L.
Further, first sublist face include first plane of incidence, second sublist face include second plane of incidence with
And reflecting surface, the second surface include exit facet.
Further, the second surface longitudinal section is stepped shape or planar.
Further, the upper surface of the packaging plastic is convex or planar.
Further, the refractive index of the LED chip is between 1.6 ~ 3.5.
Further, the refractive index of the packaging plastic is between 1.3 ~ 1.6.
Further, the refractive index of the lens is between 1.3 ~ 1.7.
Further, the supporting structure and the baffle arrangement are integrally formed or non-integral molding.
Second aspect according to the present utility model, a kind of infra-red radiation LED light-emitting component, including：Supporting structure；Baffle knot
Structure is connected with the periphery of supporting structure；Infra-red radiation LED chip, is set on supporting structure；Packaging plastic is covered in red
The periphery of external radiation LED chip；Lens are formed on packaging plastic；The inner and outer surfaces of the baffle arrangement include absorbing surface or
The inner and outer surfaces of non-reflecting surface or baffle arrangement reflecting layer around light absorbing layer or not.
Further, the light absorption face or light absorbing layer have the extinction efficiency more than 70%.
Further, the non-reflecting surface or not reflecting layer have no more than 15% reflection efficiency.
Further, the material color in the light absorption face or light absorbing layer or non-reflecting surface or not reflecting layer is predominantly black
Color.
Further, the light absorption face or light absorbing layer or non-reflecting surface or not reflecting layer be black EMC or black PPA
Or black PCT or black SMC.
Further, the surface roughness Sa1 that the baffle arrangement is contacted with the lens is more than the baffle arrangement
The roughness Sa2 of inner and outer surfaces.
Further, the value range of the roughness Sa1：3μm≤Sa1≤15μm.
Further, the value range of the roughness Sa2：1μm≤Sa2≤10μm.
Further, the lens have the first surface towards packaging plastic and the second surface far from packaging plastic, institute
It includes the first sublist face, the second sublist face positioned at the first sublist face both sides to state first surface, and outside the second sublist face
The third sublist face enclosed, wherein the first sublist face longitudinal section shape in curved surface, the trapezoidal shape in the second sublist face longitudinal section or approximate ladder
Shape, third sublist face longitudinal section is in planar.
Further, the second surface longitudinal section is stepped shape or planar.
Further, the upper surface of the packaging plastic is convex or planar.
Further, the supporting structure and the baffle arrangement are integrally formed or non-integral molding.
Compared with prior art, the utility model can obtain being apparently higher than shining for existing structure under micro volume
Efficiency, and realize smaller light emitting anger（θ1/2≤±25°）, including following advantage：
（1）In forming packaging plastic, and the formation lens above packaging plastic in infra-red radiation LED chip, lens have optically focused
And the effect of deviation light extraction optical axis；
（2）The plane of incidence that lens are located at infra-red radiation LED chip oblique upper makes the light of the wide-angle projected via packaging plastic
Into, to wide-angle deviation, reducing the fore-and-aft distance of light-emitting component, the step structure of lens upper surface can when lens interior
So that deviation occurs for emergent light, the light distribution property for having drift angle is obtained；
（3）The surface roughness that enhancing baffle arrangement is contacted with lens is conducive to eliminate and weaken stray light, avoid at this
The light of adjacent other elements is interfered during light-emitting component use, is conducive to the stability of lens seals technique, it is close in lens
It during envelope, is not easy to skid so that the fixation of its lens position is relatively accurate, and is conducive to improve production operation efficiency.
Other features and advantages of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood by implementing the utility model.The purpose of this utility model and other advantages can pass through
Specifically noted structure is realized and is obtained in specification, claims and attached drawing.
Description of the drawings
The utility model is further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is infra-red radiation LED light-emitting component schematic cross-sectional view described in embodiment 1.
Fig. 2 is the critical piece dimensional parameters schematic diagram of Fig. 1.
Fig. 3 is infra-red radiation LED light-emitting component light path schematic diagram described in embodiment 1.
Fig. 4 is the infra-red radiation LED light-emitting component schematic cross-sectional view described in embodiment 2.
Fig. 5 is infra-red radiation LED light-emitting component schematic cross-sectional view described in embodiment 3.
Component symbol description in figure：10：Supporting structure；20：Baffle arrangement；201：Inner surface；202：Outer surface；30：It is red
External radiation LED chip；40：Packaging plastic；50：Lens；51：First surface；52：Second surface；511：First sublist face；512：The
Two sublist faces；513：Third sublist face；S1、S2：The plane of incidence；S3：Reflecting surface；S4：Exit facet；A：It indulges and cuts positioned at the second sublist face
Spacing between the upper surface the widest part in face and the upper surface inside edge of baffle arrangement；B：Positioned at the second sublist face longitudinal section
Spacing between upper surface the widest part and the centre normal of second surface；C：The upper surface of LED chip and the upper surface of packaging plastic
Spacing between peak；D：Spacing between the upper surface of LED chip and the upper surface of baffle arrangement；E：LED chip it is upper
Spacing between surface and the upper surface of baffle arrangement；L：The horizontal size of LED chip.
Specific implementation mode
The utility model is described in detail with reference to specific embodiment.
Embodiment 1
As illustrated in fig. 1 and 2, the present embodiment provides a kind of infra-red radiation LED light-emitting components, including：Supporting structure 10；Baffle
Structure 20 is connected with the periphery of supporting structure 11；Infra-red radiation LED chip 30 is set on supporting structure 11；Gold thread,
For connecting the circuit in infra-red radiation LED chip 30 and supporting structure 11（It is not shown in figure）；Packaging plastic 40 is covered in infrared
Radiate the periphery of LED chip；Lens 50 are formed on packaging plastic 40, to form independent infra-red radiation working cell, this
The light radiation output of low-angle, controllable deflection angle can be realized without other additional optical devices for working cell.
Further, supporting structure 10 can select homogenous material, such as metal, ceramics, plastics, glass, can also select
It is made of a variety of composite materials；The present embodiment supporting structure preferably comprises ceramic material, especially has high capacity of heat transmission
Material, so as to light-emitting component at work be sufficiently cool transmitting radiation infra-red radiation LED chip.
Further, baffle arrangement 20 can select homogenous material, such as metal, ceramics, plastics, glass, can also select
It is made of a variety of composite materials；The preferred inner surface 201 of the present embodiment baffle arrangement, outer surface 202 include absorbing surface or do not reflect
The inner surface 201 of face or baffle arrangement, outer surface 202 reflecting layer around light absorbing layer or not（It is not shown in figure）.Light is inhaled
Receipts face or light absorbing layer or non-reflecting surface or the material color in reflecting layer is not mainly black, can be black EMC or black PPA
Or black PCT or black SMC.Light absorption face or light absorbing layer preferably have greater than 70% extinction efficiency, non-reflecting surface or not anti-
Penetrating layer preferably has the reflection efficiency for being no more than 15%, is conducive to eliminate stray light, it is right during the light-emitting component use to avoid
The light of adjacent devices interferes；For example often arrange in pairs or groups the camera system used, distance measurement system etc. with this light-emitting component, it improves
Ease for use, reduces the volume and overall noise of system.
In addition, the material composition of baffle arrangement 20 can be as supporting structure 10, it can not also be the same；Supporting structure with
Baffle arrangement can be integrally formed, and can also be separated molding, i.e., non-integral molding.
Further, infra-red radiation LED chip 30 is assemblied on supporting structure 10, and chip upper surface is coated with such as silicon
The packaging plastic 40 that glue or epoxy resin are constituted, the side wall of baffle arrangement 20 are higher than the upper surface of packaging plastic 40, and upper opening.Envelope
The upper surface for filling glue can be convex, can also be planar or other shapes.
Further, lens 50 have the first surface 51 towards packaging plastic and the second surface 52 far from packaging plastic,
First surface may include the first sublist face 511, the second sublist face 512 positioned at the first sublist face both sides, and be located at second
The third sublist face 513 of sub- surface periphery, wherein the first sublist face longitudinal section shape in curved surface, the second sublist face longitudinal section are trapezoidal
Shape or approximate trapezoid shape, third sublist face longitudinal section is in planar；52 longitudinal section of second surface can be stepped shape or plane
Shape, the present embodiment are preferably planar.
As shown in Fig. 2, definition：The horizontal size of LED chip is L, and the upper surface for being located at the second sublist face longitudinal section is most wide
Spacing between place and the upper surface inside edge of baffle arrangement is A, is located at upper surface the widest part of the second sublist face longitudinal section
Spacing between the centre normal of second surface is B, between the upper surface of LED chip and the upper surface peak of packaging plastic
Spacing is C, and the spacing between the lower surface minimum point in the first sublist face and the upper surface peak of packaging plastic is D, LED chip
Spacing between upper surface and the upper surface of baffle arrangement is E, then preferably 0<A≤0.3mm can so be utilized to greatest extent
LED chip package interior volume, and lens can be helped to position, improve the utilization rate of light；It is preferred that 3.3L≤B≤4.3L, is based on
The balance of light extraction efficiency and appearance and size, within this range, lens efficiency may be implemented 85% or more；It is preferred that 0.1≤C≤
0.5mm, balances improving the realization between chip light-emitting efficiency and lens de-magnification LED light-emitting angles, that is, improves LED chip encapsulation
External quantum efficiency, and lens de-magnification angle will not be influenced too much；It is preferred that D>0, it is stayed for the production technology of the light-emitting component
Manufacture convenience is improved in certain space, and is conducive to improve the incident light efficiency of lens；It is preferred that E >=0.7L, to increase by first
The gross area of the reflecting surface on surface is conducive to the light-emitting angle for reducing the light-emitting component.
As shown in figure 3, supporting structure is used to support and controls the optical distance between lens and infra-red radiation LED chip, thoroughly
Mirror is covered in baffle arrangement upper open mouth region, and is connected with supporting structure by bonding mode；Lens include first incident
Face S1 and the second plane of incidence S2, reflecting surface S3 and exit facet S4, wherein the first plane of incidence S1 and the second plane of incidence S2, difference position
In the surface part of LED infra-red radiation chips and oblique upper part two parts；Reflecting surface S3 is located on packaging plastic；Exit facet
S4 is located on the second surface of lens.
Further, plane of incidence S1 is in class ball crown type convex, and surface is spherical surface or quadratic surface R 0.5 ~ 3mm of value, master
Converge the light that infra-red radiation LED chip sends out the low-angle being located near optical axis projected via packaging plastic；Plane of incidence S2 by
Surface plane of incidence edge bends downwards composition, is mainly used for deflecting infra-red radiation LED chip and sends out and projected via packaging plastic
Wide-angle light；Reflecting surface S3 is made of one or more quadratic surfaces, forms up big and down small " bowl-type " structure, master
The light reflection of infra-red radiation LED chip oblique upper plane of incidence bending is projected along approximate optical axis direction；Exit facet S4, can be with
Be stepped shape or planar, and the present embodiment is preferably planar.
The refractive index of lens 50 is preferably between 1.3 ~ 1.7, and the refractive index of packaging plastic is preferably between 1.3 ~ 1.6,
It is generally acknowledged that the refractive index of air is equal to 1.0, the refractive index of infrared LED chip is preferably between 1.6 ~ 3.5, by luminous member
Part from bottom to up be respectively LED chip, packaging plastic, air, lens refractive index respectively be in it is high, medium and low, in refringence close
System is conducive to improve LED chip external quantum efficiency, and can reduce the light-emitting angle of the light-emitting component through this structure.
Compared with existing structure, infra-red radiation LED light-emitting component provided in this embodiment, using the infrared of identical size
LED chip is radiated, realizes minimum light-emitting angle（θ1/2≤±10°）Under the premise of, volume can reduce 30% or more, luminous efficiency
15% or more is improved, the application of Mobile Communications Market has more been adapted to, iris recognition, the night vision benefit being also beneficial in security protection market
The popularization and application of light.
Embodiment 2
As shown in figure 4, as different from Example 1, the present embodiment is by second surface 52 of the lens 50 far from packaging plastic
Planar to be changed to stairstepping, the stairstepping on preferably 2 or 2 or more inclined-planes obtains the light distribution property for having drift angle.
Embodiment 3
As shown in figure 5, as different from Example 1,512 longitudinal section of the second sublist face of the present embodiment is in approximate trapezoid
Shape forms a notch, to reduce the lateral dimension of light-emitting component in the second sublist face and third sublist face intersection.This
Outside, the surface roughness Sa1 that the preferred baffle arrangement of the present embodiment is contacted with lens is more than the inner surface 201 of baffle arrangement, appearance
The roughness Sa2 in face 202, the value range of wherein roughness Sa1 are preferred：3 μm≤Sa1≤15 μm, the value model of roughness Sa2
It encloses preferably：1 μm≤Sa2≤10 μm, be so conducive to eliminate and weaken stray light, it is right during the light-emitting component use to avoid
The light of adjacent other elements interferes；For example often arrange in pairs or groups the camera system used, distance measurement system etc. with this element, it improves
Ease for use, reduces the volume and overall noise of system；The surface roughening that baffle arrangement is contacted with lens, is conducive to lens
The stability of sealing technology is not easy to skid during lens seals so that its lens position is fixed relatively accurate and advantageous
In raising production operation efficiency.
Although the exemplary embodiment of the utility model has been described, it should be understood that, the utility model not office
It is limited to these exemplary embodiments, but includes that those skilled in the art can be in the sheet as required by claim above
Variations and modifications are carried out in the spirit and scope of utility model.
Claims (11)
1. a kind of infra-red radiation LED light-emitting component, including：Supporting structure；Baffle arrangement is connected with the periphery of supporting structure；
Infra-red radiation LED chip, is set on supporting structure；Packaging plastic is covered in the periphery of infra-red radiation LED chip；Lens, shape
At on packaging plastic；The lens have the first surface towards packaging plastic and the second surface far from packaging plastic, described
First surface includes the first sublist face, the second sublist face positioned at the first sublist face both sides, and is located at the second sub- surface periphery
Third sublist face, wherein the first sublist face longitudinal section shape in curved surface, the trapezoidal shape in the second sublist face longitudinal section or approximate trapezoid
Shape, third sublist face longitudinal section is in planar；The surface roughness Sa1 that the baffle arrangement is contacted with the lens is more than described
The roughness Sa2 of the inner and outer surfaces of baffle arrangement.
2. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：Definition：Positioned at described second
Spacing between upper surface the widest part of sublist face longitudinal section and the upper surface inside edge of the baffle arrangement is A, then 0<A≤
0.3mm。
3. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：Definition：The LED chip
Horizontal size be L, be located at second sublist face longitudinal section upper surface the widest part and the second surface centre normal
Between spacing be B, then 3.3L≤B≤4.3L.
4. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：Definition：The LED chip
Upper surface and the upper surface peak of the packaging plastic between spacing be C, then 0.1≤C≤0.5mm.
5. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：Definition：First sublist
Spacing between the lower surface minimum point in face and the upper surface peak of the packaging plastic is D, then D>0.
6. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：Definition：The LED chip
Horizontal size be L, spacing between the upper surface of the LED chip and the upper surface of the baffle arrangement is E, then E >=
0.7L。
7. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：The first sublist bread
First plane of incidence is included, second sublist face includes second plane of incidence and reflecting surface, and the second surface includes exit facet.
8. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：The second surface is vertical to be cut
Face is stepped shape or planar.
9. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：The refraction of the LED chip
Rate is between 1.6 ~ 3.5.
10. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：The refraction of the packaging plastic
Rate is between 1.3 ~ 1.6.
11. a kind of infra-red radiation LED light-emitting component according to claim 1, it is characterised in that：The refractive index of the lens
Between 1.3 ~ 1.7.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721553252.2U CN207818607U (en) | 2017-11-20 | 2017-11-20 | A kind of infra-red radiation LED light-emitting component |
| TW107201664U TWM564827U (en) | 2017-11-20 | 2018-02-02 | LED illumination device |
| KR2020180003647U KR20190000442U (en) | 2017-08-08 | 2018-08-07 | Light emitting diode (led) device |
| JP2018003048U JP3219833U (en) | 2017-08-08 | 2018-08-07 | LED light emitting device |
| US16/147,784 US10833232B2 (en) | 2017-08-08 | 2018-09-30 | LED device |
| JP2018004644U JP3220095U (en) | 2017-08-08 | 2018-11-30 | LED light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721553252.2U CN207818607U (en) | 2017-11-20 | 2017-11-20 | A kind of infra-red radiation LED light-emitting component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207818607U true CN207818607U (en) | 2018-09-04 |
Family
ID=63333831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721553252.2U Active CN207818607U (en) | 2017-08-08 | 2017-11-20 | A kind of infra-red radiation LED light-emitting component |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207818607U (en) |
| TW (1) | TWM564827U (en) |
-
2017
- 2017-11-20 CN CN201721553252.2U patent/CN207818607U/en active Active
-
2018
- 2018-02-02 TW TW107201664U patent/TWM564827U/en unknown
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| Publication number | Publication date |
|---|---|
| TWM564827U (en) | 2018-08-01 |
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Effective date of registration: 20231020 Address after: Yuanqian village, Shijing Town, Nan'an City, Quanzhou City, Fujian Province Patentee after: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 361009 no.1721-1725, Luling Road, Siming District, Xiamen City, Fujian Province Patentee before: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |