KR20130055222A - Lbacklight unit - Google Patents

Lbacklight unit Download PDF

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Publication number
KR20130055222A
KR20130055222A KR1020110120868A KR20110120868A KR20130055222A KR 20130055222 A KR20130055222 A KR 20130055222A KR 1020110120868 A KR1020110120868 A KR 1020110120868A KR 20110120868 A KR20110120868 A KR 20110120868A KR 20130055222 A KR20130055222 A KR 20130055222A
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KR
South Korea
Prior art keywords
light emitting
emitting device
light
cavity
guide plate
Prior art date
Application number
KR1020110120868A
Other languages
Korean (ko)
Inventor
김정진
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020110120868A priority Critical patent/KR20130055222A/en
Publication of KR20130055222A publication Critical patent/KR20130055222A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

PURPOSE: A backlight unit is provided to reduce a viewing angle in a display device and to allow only the user to see a screen. CONSTITUTION: A light entry surface(21) is formed in one side of a light guide plate(20). A light emitting device package faces the light entry surface on a light source(10). The light emitting device package has an asymmetric structure. The vertical orientation angle of an upper and a lower surface(22,23) is larger than that of the horizontal orientation angle of the upper and the lower surface in the asymmetric structure.

Description

Backlight Unit {LBacklight Unit}

The present invention relates to a backlight unit.

In general, a product using a light emitting diode (LED) as a light source is mounted in various types of packages to form a module according to a purpose. Such a light emitting device package generally has a directivity angle of about 120 degrees.

Therefore, in a display device such as an LCD using a light emitting device package as a light source, the light emitting device package generally has a wide viewing angle due to the directivity angle characteristic of the light emitting device package, and it is easy to work with a wide viewing angle when it is necessary to view personal privacy work. There was a problem that did not.

Therefore, in the art, there is a need for a backlight unit capable of viewing personal privacy by narrowing the viewing angle of the LCD so that only the user can recognize the screen.

In a backlight unit according to an embodiment of the present invention,

A light guide plate having a light incident surface on one side thereof; And a light source in which a plurality of light emitting device packages are arranged to face the light incident surface, wherein the light emitting device package is perpendicular to the top and bottom surfaces of the light guide plate rather than the directivity angle in the horizontal direction parallel to the top and bottom surfaces of the light guide plate. The directing angle in the vertical direction may have a larger asymmetric structure.

The light emitting device package may include a light emitting device and a main body portion in which a cavity is formed to mount the light emitting device therein, and an inner surface of the cavity surrounding the light emitting device has a slope with respect to the mounting surface of the light emitting device. Asymmetry can be achieved according to the asymmetric structure of the orientation angle.

In addition, the inclination of the inner surfaces of the inner surface of the cavity disposed in the left and right directions of the light guide plate to face each other may have a structure larger than the inclination of the inner surfaces of the light guide plate which face each other.

In addition, the inclination of the inner surfaces of the inner surface of the cavity facing each other with respect to the light emitting device may be the same.

The light emitting device package may have an upper surface of the main body facing the light incident surface such that the light emitting device mounted in the cavity faces the light incident surface of the light guide plate.

In addition, the inner surface of the cavity may have a concave curved surface.

The apparatus may further include a reflective layer formed on the inner side surface of the cavity.

The light emitting device may further include a fluorescent layer covering the light emitting device in the cavity.

In addition, the fluorescent layer may be formed at a position lower than an upper surface of the body portion, which is an inlet of the cavity.

In addition, the light source may further include a circuit board on which the light emitting device package is mounted and electrically connected.

In addition, the light emitting device package may have a direction angle in the horizontal direction of 18 degrees to 22 degrees, and a direction angle in the vertical direction may range from 118 degrees to 122 degrees.

In the display device such as an LCD, a backlight unit having a narrowing angle characteristic may be provided so that only the user can recognize the screen by narrowing the viewing angle.

1 is a partial perspective view schematically illustrating a backlight unit according to an embodiment of the present invention.
2 is a cross-sectional view of Fig.
3 is a plan view schematically illustrating a light emitting device package that may be employed in a backlight unit according to an exemplary embodiment of the present invention.
4A is a cross-sectional view schematically illustrating a state in which the light emitting device package of FIG. 3 is cut along the line II ′.
4B is a cross-sectional view schematically illustrating a state in which the light emitting device package of FIG. 3 is cut along the II-II ′ axis.
5A and 5B schematically illustrate another structure of the cavity in the light emitting device package of FIG. 3.
6 is a schematic cross-sectional view of an embodiment in which a reflective layer is provided on an inner side surface of a cavity.
7 is a cross-sectional view schematically showing a modification of the inner surface of the cavity that can be employed in the light emitting device package according to an embodiment of the present invention.
8 is a view schematically illustrating a light irradiation area according to a change in a direction angle of an inner surface of a cavity in a light emitting device package according to an embodiment of the present invention.
FIG. 9A is a view schematically illustrating a state in which light emitted by the light emitting device package of FIG. 8 is incident in a left and right direction of the light guide plate at a narrow direction angle range.
FIG. 9B is a view schematically illustrating a state in which light emitted by the light emitting device package of FIG. 8 is incident in the vertical direction of the light guide plate at a wide angle range.

Details of the backlight unit according to an exemplary embodiment of the present invention will be described with reference to the drawings. However, embodiments of the present invention may be modified in many different forms and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

Therefore, the shape and size of the components shown in the drawings may be exaggerated for more clear description, components having substantially the same configuration and function in the drawings will use the same reference numerals.

A backlight unit according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 and 2. 1 is a partial perspective view schematically illustrating a backlight unit according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view of FIG. 1.

1 and 2, the backlight unit 1 according to an exemplary embodiment of the present invention may include a light source 10 and a light guide plate 20 for guiding light of the light source 10. .

The light guide plate 20 has a rectangular parallelepiped plate structure, and a light incident surface 21 on which the light source 10 is disposed so that the light L is incident may be provided at one side of the light guide plate 20.

The light guide plate 20 may be made of a transparent resin such as PMMA so that light of the light source 10 incident on the light incident surface 21 may be guided smoothly. In addition, a specific pattern (not shown) such as irregularities may be formed on the lower surface of the light guide plate 20 to reflect the light directed toward the bottom of the light guide plate 20 upward.

The light source 10 may be disposed on the light incident surface 21 side of the light guide plate 20. The light source 10 may include a light emitting device package 10 ′ composed of a light emitting device 100 and a main body 200 having a cavity 210 for mounting the light emitting device 100. The light emitting device package 10 ′ may further include a circuit board 30 mounted and electrically connected to the light emitting device package 10 ′.

A light emitting device package that may be employed in a backlight unit according to an exemplary embodiment of the present invention will be described with reference to FIGS. 3 to 8.

3 is a plan view schematically illustrating a light emitting device package that may be employed in a backlight unit according to an exemplary embodiment of the present invention, and FIG. 4A schematically illustrates a state in which the light emitting device package of FIG. 3 is cut along the line II ′. 4B is a cross-sectional view schematically illustrating a state in which the light emitting device package of FIG. 3 is cut along the II-II 'axis, and FIGS. 5A and 5B schematically illustrate another structure of the cavity in the light emitting device package of FIG. 3. It is a figure which shows. 6 is a cross-sectional view schematically illustrating an embodiment in which a reflective layer is provided on an inner side surface of a cavity, and FIG. 7 schematically illustrates a modification of an inner side surface of a cavity that may be employed in a light emitting device package according to an exemplary embodiment of the present invention. 8 is a cross-sectional view illustrating a light irradiation area according to a change in a directivity angle of an inner surface of a cavity in a light emitting device package according to an exemplary embodiment of the present invention.

The light emitting device 100 is a kind of semiconductor device that generates light having a predetermined wavelength by an electric signal applied from an external device, that is, a power source, and may include a light emitting diode (LED). The light emitting device 100 may generate blue light, red light, or green light according to a material contained therein, and may generate white light. In the drawing, the light emitting device 100 is illustrated as being provided as a single unit, but the present invention is not limited thereto, and a plurality of light emitting devices 100 may be provided. In this case, the light emitting device 100 may be of the same kind to generate light of the same wavelength, or may be composed of different kinds of light of different wavelengths. The fluorescent layer 110 may be provided on the light emitting device 100.

The main body 200 may include a cavity 210 formed at a predetermined size on one surface thereof, and the light emitting device 100 may be mounted on a mounting surface 220 provided on a bottom surface of the cavity 210. . The light emitting device 100 may be fixed on the mounting surface 220 through an adhesive or the like.

The main body 200 is manufactured of an LTCC, HTCC, or the like composed of an insulating member such as aluminum oxide (Al 2 O 3 ) or aluminum nitride (AlN) to minimize the influence of heat generated from the light emitting device 100. It may be a ceramic package structure obtained by the method.

In addition, the body portion 200 may be made of a white molding compound having a high opacity or high light reflectance. This reflects the light generated from the light emitting device 100 has the effect of increasing the amount of light emitted to the top. Such white molded composite may include a high heat resistance thermosetting resin series or silicone resin series. In addition, a white pigment and a filler, a curing agent, a releasing agent, an antioxidant, an adhesion improving agent, etc. may be added to the thermoplastic resin series.

The cavity 210 forms a space for accommodating the light emitting device 100, and has an inner side surface 230 such that an upper side area forms an inverted conical structure wider than a lower area on which the light emitting device 100 is mounted. The upper surface 201 of the main body 200 may have a tapered cup structure inclined toward the lower surface 202. The cavity 210 may be formed in a circular or elliptical shape as shown in FIGS. 3 and 5A, and may also be formed in a quadrangle corresponding to the shape of the light emitting device 100 as shown in FIG. 5B, but is not shown in the drawings, but reflects light. It may also be formed from other polygons in consideration of characteristics.

As shown in FIG. 6, the cavity 210 may include a reflective layer 300 on the surface of the inner surface 230 in a structure surrounding the light emitting device 100. The reflective layer 300 may be formed of a metal material having a high reflectance, and may be attached in a thin film form or may be formed by a coating or deposition method. Therefore, the light extraction efficiency may be increased, and the surface of the cavity 210 may be prevented from being deformed by the high temperature heat generated by the light emitting device 100.

On the other hand, the inner surface 230 of the cavity 210 has a slope (θ1, θ2) with respect to the mounting surface 220 of the light emitting device 100 is partially asymmetric along the circumference of the light emitting device 100 It may be formed into a structure. In addition, the inclinations of the inner surfaces of the inner surface 230 of the cavity 210 that face each other with respect to the light emitting device 100 may be formed to have the same inclination. For example, the inclinations θ1 of the pair of inner surfaces 231 and 233 which are located in the horizontal direction (x-axis direction) across the center of the light emitting device 100 and face each other are equal to each other, and are in the horizontal direction. The inclinations θ2 of the pair of inner surfaces 232 and 234 disposed in different horizontal directions (y-axis directions) perpendicular to each other and facing each other may be the same. However, the inclinations θ1 of the inner surfaces 231 and 233 in the horizontal direction and the inclinations θ2 of the inner surfaces 232 and 234 in the other horizontal directions are not equal to each other, so the inner surface 230 is the light emitting device 100. It may have a structure that is partially asymmetric along the circumference.

As shown in FIGS. 3, 4A, and 4B, the inner surface 230 of the cavity 210 having an asymmetric structure is specifically positioned in the horizontal direction (x-axis direction) with respect to the light emitting device 100. Is smaller than the inclination θ1 of the inner surfaces 231 and 233 facing each other, and the inclination θ2 of the inner surfaces 232 and 234 facing each other in the horizontal direction (y-axis direction) is smaller than that of the light emitting device 100. May have That is, the inner surfaces 231 and 233 located in the horizontal direction (x-axis direction) may be formed at a slope closer to the right angle, and the inner surfaces 232 and 234 located in the other horizontal direction (y-axis direction) are more gentle. It can be formed to be obliquely inclined. Therefore, as shown in FIGS. 4 and 8, the orientation angles α of the inner surfaces 231 and 233 positioned in the horizontal direction (x-axis direction) are relatively narrower, and the other horizontal direction (y-axis direction) is smaller. The orientation angles β of the inner surfaces 232 and 234 positioned at may have a relatively wider asymmetry orientation angle characteristic. For example, the direction angle direction α in the left and right directions may have a range of 18 degrees to 22 degrees within about 20 degrees, and the direction angle β in the up and down directions may range from 118 degrees to 122 degrees. .

In the conventional general package structure, since the inclination of the inner surface of the cavity is uniformly formed along the circumference of the light emitting device, the package has a characteristic in which the orientation angle is constant in all directions. Accordingly, the light emitted from the package has an irradiation area corresponding to an angle range of about 120 degrees in all directions. On the other hand, in the package structure in which the inclination of the inner surface of the cavity has an asymmetrical structure as in the embodiment of the present invention, it is possible to adjust the irradiation area according to the change of the orientation angle. In other words, when a narrower irradiation area is required, the direction angle can be narrowed, and when a wider irradiation area is required, the direction angle can be increased.

The inner surface 230 of the cavity 210 may be formed to have a concave curved surface as shown in FIG. 7 as well as a flat structure. As described above, since the inner surface 230 has a smooth curved structure, it is possible to obtain an effect of more concentrating a region to which light is irradiated. The inner surface of the cavity 230 is not limited to having a single curved surface as shown in the figure, it is also possible to have a multi-sided structure to form a concave shape.

Meanwhile, the fluorescent layer 110 covering the light emitting device 100 may be formed in the cavity 210 on the light emitting device 100 mounted in the cavity 210. The fluorescent layer 110 may convert the wavelength of light generated from the light emitting device 100 into a wavelength of a desired color. For example, monochromatic light such as red light or blue light can be converted into white light. To this end, the fluorescent layer 110 may contain at least one fluorescent material. In addition, the light emitting device 100 may contain an ultraviolet absorber for absorbing the ultraviolet light generated.

The fluorescent layer 110 is preferably selected from a resin having a high transparency that can pass the light generated by the light emitting device 100 with a minimum loss, for example, an elastic resin may be used. The elastic resin is a gel-type resin such as silicone and has excellent optical properties because the change of the short wavelength such as yellowing is very small and the refractive index is also high.

As shown in the drawing, the fluorescent layer 110 may be formed in a structure surrounding the light emitting device 100 on the mounting surface 220. In addition, the fluorescent layer 110 may be formed at a position lower than the top surface 201 of the main body 200 which is an inlet of the cavity 210 without filling the cavity 210. In this case, the cavity 210 may be filled with air as a whole.

In the conventional package structure, the cavity is generally filled with a molding resin, and in this case, light irradiated to the outside is refracted at the interface between the molding resin and the air to change the irradiation area regardless of the orientation angle characteristic of the cavity. There was a drawback of being out of the setting range. On the contrary, when the fluorescent layer 110 is formed at a position lower than the upper surface 201 of the main body 200 in the cavity 210, as in the embodiment of the present invention, the irradiation from the cavity 210 to the outside is performed. The light may be irradiated while maintaining the direction angle characteristic according to the inclination of the inner surface 230 of the cavity 210 without being affected by the fluorescent layer 110.

2A and 2B, the light source 10 is disposed on the light incident surface 21 side of the light guide plate 20, and light emitted from the light source 10 is incident on the light incident surface 21. The incident light into the light guide plate 20 may be emitted to an upper portion of the light guide plate 20. In detail, the light emitting device package 10 ′ has an upper surface 201 of the main body 200 facing the light incident surface 21 so that the light emitting device 100 mounted in the cavity 210 faces the light incident surface 21. It may be disposed to face the light surface 21. The circuit board 30 on which the light emitting device package 10 'is mounted is disposed in parallel with the light guide plate 20 or according to a structure in which the light emitting device package 10' is mounted on an upper surface thereof. It may be arranged in a structure facing the light incident surface 21 of the (). That is, when the light emitting device package 10 ′ is bonded to the circuit board 30 through the bottom surface 202 of the main body 200, the circuit board 30 faces the light incident surface 21. It can be arranged as. In addition, when bonded to the circuit board 30 through one side 203 of the main body 200, the circuit board 30 may be disposed in parallel with the light guide plate 20. As such, the circuit board 30 may change its arrangement position according to the mounting structure of the light emitting device package 10 ′ such that the light emitting device 100 faces the light incident surface 21.

The light source 10 may form a line light source by arranging the light emitting device packages 10 ′ on the circuit board 30 at predetermined intervals. The interval at which the light emitting device packages 10 'are arranged is determined according to the light emission characteristics to be realized through the light guide plate 20 in consideration of the size of the light guide plate 20 and the orientation angle of the light emitting device package 10'. Various adjustments can be made.

As such, the upper surface 201 of the main body 200 is disposed such that the light emitting device 100 mounted in the cavity 210 of the main body 200 faces the light incident surface 21 of the light guide plate 20. When disposed to face the light incident surface 21, it is positioned in a direction (left and right directions) parallel to the upper surface 22 and the lower surface 23 of the light guide plate 20 of the inner surface 230 of the cavity 210. The inclination θ1 of the pair of inner surfaces 231 and 233 facing each other is positioned in a direction perpendicular to the upper surface 22 and the lower surface 23 of the light guide plate 20 to face each other. It may have a larger inclination value than the inclination θ2 of the inner surfaces 232 and 234. That is, the inner surfaces 231 and 233 positioned in the horizontal direction and the left and right directions may be formed at an angle closer to the right angle, and the inner surfaces 232 and 234 positioned in the vertical direction and the vertical direction may be formed at an inclined slope that is more gentle. Can be. Accordingly, the direction angle α of the inner surfaces 231 and 233 located in the horizontal direction is relatively narrower, and the direction angle β of the inner surfaces 232 and 234 located in the vertical direction is relatively wider asymmetric. Can have each characteristic.

Therefore, as shown in FIGS. 9A and 9B, the light incident from the light emitting device package 10 ′ in the left and right directions of the light guide plate 20 is in a range close to the straight line with the narrow irradiation angle α of the irradiation area. The light incident on the light guide plate 20 in the up and down direction may be irradiated with a wide range of radiation by a wide direction angle β, and the LCD may have a small viewing angle due to the light emitting structure of the backlight unit 1. May have Therefore, only the user can recognize the screen, so that personal privacy can be viewed.

1 ... backlight unit 10 ... light source
10 '... light emitting device package 20 ... light guide plate
30 ... circuit board 100 ... light emitting element
200 ... Main body 210 ... Cavity
220 ... mounting surface 230 ... inner surface
300 ... reflective layer

Claims (11)

A light guide plate having a light incident surface on one side thereof; And
A light source in which a plurality of light emitting device packages are arranged to face the light incident surface;
/ RTI >
And the light emitting device package has an asymmetrical structure in which a directivity angle in a vertical direction perpendicular to the top and bottom surfaces of the light guide plate is larger than a directivity angle in the horizontal direction parallel to the top and bottom surfaces of the light guide plate.
The method of claim 1,
The light emitting device package includes a light emitting device and a main body portion in which a cavity is formed to mount the light emitting device therein,
The inner side surface of the cavity surrounding the light emitting element is asymmetrical with respect to the mounting surface of the light emitting element asymmetrical according to the asymmetric structure of the directivity angle.
The method of claim 2,
The inclination of the inner surfaces of the inner side of the cavity facing each other in the left and right direction of the light guide plate has a larger structure than the inclination of the inner surfaces facing each other in the vertical direction of the light guide plate.
The method according to claim 2 or 3,
The inclination of the inner surface of the inner surface of the cavity facing each other with respect to the light emitting element is the same, characterized in that the same.
The method of claim 2,
The light emitting device package is a backlight unit, characterized in that the upper surface of the body portion is disposed facing the light incident surface so that the light emitting device mounted in the cavity facing the light incident surface of the light guide plate.
The method of claim 2,
The inner surface of the cavity has a concave shape curved surface unit.
The method of claim 2,
And a reflective layer formed on the inner side surface of the cavity.
The method of claim 2,
And a fluorescent layer covering the light emitting element in the cavity.
9. The method of claim 8,
And the fluorescent layer is formed at a position lower than an upper surface of the body portion, which is an inlet of the cavity.
The method of claim 1,
The light source further comprises a circuit board on which the light emitting device package is mounted and electrically connected.
The method of claim 1,
The light emitting device package has a backlight angle of 18 degrees to 22 degrees in the left and right direction, the vertical angle of the backlight unit has a range of 118 degrees to 122 degrees.
KR1020110120868A 2011-11-18 2011-11-18 Lbacklight unit KR20130055222A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110120868A KR20130055222A (en) 2011-11-18 2011-11-18 Lbacklight unit

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Application Number Priority Date Filing Date Title
KR1020110120868A KR20130055222A (en) 2011-11-18 2011-11-18 Lbacklight unit

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Publication Number Publication Date
KR20130055222A true KR20130055222A (en) 2013-05-28

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170138978A (en) * 2015-12-02 2017-12-18 (주)포인트엔지니어링 Chip substrate
US9927570B2 (en) 2015-02-24 2018-03-27 Samsung Display Co., Ltd. Liquid crystal display apparatus having a light guide plate with optical patterns to prevent light leakage
US10014446B2 (en) 2015-12-02 2018-07-03 Point Engineering Co., Ltd. Chip substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9927570B2 (en) 2015-02-24 2018-03-27 Samsung Display Co., Ltd. Liquid crystal display apparatus having a light guide plate with optical patterns to prevent light leakage
KR20170138978A (en) * 2015-12-02 2017-12-18 (주)포인트엔지니어링 Chip substrate
US10014446B2 (en) 2015-12-02 2018-07-03 Point Engineering Co., Ltd. Chip substrate

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N231 Notification of change of applicant
WITN Withdrawal due to no request for examination