CN207752998U - Closed loop liquid cooling apparatus and its electronic equipment of application - Google Patents

Closed loop liquid cooling apparatus and its electronic equipment of application Download PDF

Info

Publication number
CN207752998U
CN207752998U CN201721918138.5U CN201721918138U CN207752998U CN 207752998 U CN207752998 U CN 207752998U CN 201721918138 U CN201721918138 U CN 201721918138U CN 207752998 U CN207752998 U CN 207752998U
Authority
CN
China
Prior art keywords
liquid
connecting line
closed loop
cooling apparatus
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201721918138.5U
Other languages
Chinese (zh)
Inventor
曲中江
范垚银
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celestica Technology Consultancy Shanghai Co Ltd
Original Assignee
Celestica Technology Consultancy Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celestica Technology Consultancy Shanghai Co Ltd filed Critical Celestica Technology Consultancy Shanghai Co Ltd
Priority to CN201721918138.5U priority Critical patent/CN207752998U/en
Application granted granted Critical
Publication of CN207752998U publication Critical patent/CN207752998U/en
Priority to US16/234,886 priority patent/US11145570B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides a kind of closed loop liquid cooling apparatus closed loop liquid cooling apparatus and its electronic equipment of application, the closed loop liquid cooling apparatus include:First liquid cooled module and the second liquid cooled module;The coolant liquid input terminal for cooling back flow liquid and being output to second liquid cooled module of the first liquid cooled module output end;The coolant liquid input terminal for cooling back flow liquid and being output to first liquid cooled module of the second liquid cooled module output end.The piping connection scheme that the utility model closed loop liquid cooling apparatus is proposed effectively overcomes the hot cascading between multiple chips in liquid cooling design, and ensure that system radiating Redundancy Design, overcomes liquid cooling system Single Point of Faliure(Single pump failure)And the thermal design problem brought, it has been obviously improved system integral heat sink ability and heat dissipation reliability, there is higher economy and practicability.

Description

Closed loop liquid cooling apparatus and its electronic equipment of application
Technical field
The utility model is related to electronic equipments, more particularly to a kind of closed loop liquid cooling apparatus and its electronic equipment of application.
Background technology
Closed loop liquid cooling apparatus is used to solve the heat dissipation problem of big power consuming devices in electronic equipment.The closed loop liquid in being commonly designed In device for cooling, a kind of design is that liquid flows sequentially through multiple heating devices, since the hot cascading between heating device makes The temperature difference between each two device is obtained at 5 degree or so, number of devices is more, and hot cascading is more serious, hot cascading The serious radiating efficiency for reducing system.
In being commonly designed, also another design is that two independent liquid-cooling circulating systems solve dissipating for respective chip Heat, when the wherein failure of pump of liquid cooling system, which fails because liquid interrupts the due to of recycling, then corresponding chip will be because Temperature is excessively high and is stopped, it will causes serious influence to system business.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of closed loop liquid cooling apparatus and Its electronic equipment applied, for solving the hot cascading of liquid cooling apparatus in the prior art seriously or being susceptible in cycle Disconnected problem.
In order to achieve the above objects and other related objects, the utility model provides a kind of closed loop liquid cooling apparatus, the closed loop Liquid cooling apparatus includes:First liquid cooled module and the second liquid cooled module;The first liquid cooled module output end to cool back flow liquid defeated Go out the coolant liquid input terminal to second liquid cooled module;The flow liquid that cools back of the second liquid cooled module output end is output to institute State the coolant liquid input terminal of the first liquid cooled module.
In an embodiment of the utility model, first liquid cooled module includes First Heat Exchanger, first pump housing, and first Cold plate and the first pipe-line cell;Second liquid cooled module includes the second heat exchanger, second pump housing, the second cold plate and second Pipe-line cell.
In an embodiment of the utility model, first pipe-line cell includes:First connecting line and the second connection Pipeline;Second pipe-line cell includes:Third connecting line and the 4th connecting line.
In an embodiment of the utility model, first pump housing and first cold plate are integrated, form first Integrate structure;First connecting line is connected to the First Heat Exchanger and described first and integrates between structure; Second connecting line is connected to described first and integrates between structure and second heat exchanger.
In an embodiment of the utility model, described first integrates first pump housing described in structure and described first Connecting line connects, and first cold plate is connect with second connecting line;Or described first integrate institute in structure It states the first cold plate to connect with first connecting line, first pump housing is connect with second connecting line.
In an embodiment of the utility model, first connecting line is connected to the First Heat Exchanger and described the Between one cold plate;Second connecting line is connected between first cold plate and second heat exchanger;First pump Body is connected on first connecting line or is connected on second connecting line.
In an embodiment of the utility model, second pump housing and second cold plate are integrated, form second Integrate structure;The third connecting line is connected to second heat exchanger and described second and integrates between structure; 4th connecting line is connected to described second and integrates between structure and the First Heat Exchanger.
In an embodiment of the utility model, described second integrates second pump housing described in structure and the third Connecting line connects, and second cold plate is connect with the 4th connecting line;Or described second integrate institute in structure It states the second cold plate to connect with the third connecting line, second pump housing is connect with the 4th connecting line.
In an embodiment of the utility model, the third connecting line is connected to second heat exchanger and described the Between two cold plates;4th connecting line is connected between second cold plate and the First Heat Exchanger;Second pump Body is connected on the third connecting line or is connected on the 4th connecting line.
In an embodiment of the utility model, first liquid cooled module further includes being installed at the First Heat Exchanger The first fan unit, second liquid cooled module further includes the second fan unit being installed at second heat exchanger.
The embodiments of the present invention also provide a kind of electronic equipment, including closed loop liquid cooling apparatus as described above.
As described above, the piping connection scheme that the utility model closed loop liquid cooling apparatus is proposed effectively overcomes liquid cooling design In hot cascading between multiple chips, and ensure that system radiating Redundancy Design, overcome liquid cooling system Single Point of Faliure (single pump failure) and the thermal design problem brought, have been obviously improved system integral heat sink ability and heat dissipation reliability, have had higher Economy and practicability.
Description of the drawings
Fig. 1 is shown as the whole theory structure schematic diagram of the closed loop liquid cooling apparatus of the utility model.
Fig. 2 is shown as the concrete structure schematic diagram of the closed loop liquid cooling apparatus of the utility model.
Component label instructions
100 closed loop liquid cooling apparatus
110 first liquid cooled modules
111 First Heat Exchangers
112 first pump housings
113 first cold plates
114 first connecting lines
115 second connecting lines
116 first fan units
120 second liquid cooled modules
121 second heat exchangers
122 second pump housings
123 second cold plates
124 third connecting lines
125 the 4th connecting lines
126 second fan units
Specific implementation mode
Illustrate that the embodiment of the utility model, those skilled in the art can be by this theorys below by way of specific specific example Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition Different specific implementation modes are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer With carrying out various modifications or alterations under the spirit without departing from the utility model.It should be noted that the case where not conflicting Under, the feature in following embodiment and embodiment can be combined with each other.
It should be noted that the diagram provided in following embodiment only illustrates the basic of the utility model in a schematic way Conception, component count, shape when only display is with related component in the utility model rather than according to actual implementation in illustrating then And size is drawn, when actual implementation kenel, quantity and the ratio of each component can be a kind of random change, and its assembly layout Kenel may also be increasingly complex.
The purpose of the present embodiment is that a kind of closed loop liquid cooling apparatus and its electronic equipment of application are provided, it is existing for solving The problem of hot cascading of liquid cooling apparatus in technology is serious or is susceptible to cycle interruption.Described in detail below implementation A kind of closed loop liquid cooling apparatus of example and its electronic equipment principle and embodiment of application, make those skilled in the art that need not create The property made labour is appreciated that a kind of closed loop liquid cooling apparatus of the present embodiment and its electronic equipment of application.
It please refers to Fig.1 to Fig. 2, is shown as the knot of the closed loop liquid cooling apparatus 100 of the utility model in one embodiment Structure schematic diagram.
As shown in Figure 1, the closed loop liquid cooling apparatus 100 includes:First liquid cooled module 110 and the second liquid cooled module 120, In, the coolant liquid input for cooling back flow liquid and being output to second liquid cooled module 120 of 110 output end of the first liquid cooled module End;The coolant liquid input for cooling back flow liquid and being output to first liquid cooled module 110 of second liquid cooled module, 120 output end End.
Specifically, as shown in Fig. 2, in an embodiment, first liquid cooled module 110 includes First Heat Exchanger 111, the One pump housing 112, the first cold plate 113 and the first pipe-line cell, second liquid cooled module 120 include the second heat exchanger 121, the Two pump housings 122, the second cold plate 123 and the second pipe-line cell.
The concrete structure of first liquid cooled module 110 and second liquid cooled module 120 is described in detail below.
In an embodiment, first pipe-line cell includes:First connecting line 114 and the second connecting line 115.
Wherein described first pump housing 112 can be integrated with first cold plate 113, can also detach connection.Wherein, Component (such as chip) to be cooled, which is placed on first cold plate 113, to be cooled down.
Specifically, in an embodiment, first pump housing 112 and first cold plate 113 are integrated, form first Integrate structure.
It is integrated in first pump housing 112 and first cold plate 113, when formation first integrates structure, institute It states the first connecting line 114 and is connected to the First Heat Exchanger 111 and described first and integrate between structure;Described second connects It takes over road 115 and is connected to described first and integrate between structure and second heat exchanger 121.
Cooling liquid is flowed out from the First Heat Exchanger 111, and the described 1st is flowed into through first connecting line 114 Body integrated morphology cools down component to be cooled, and withdrawing fluid after cooling is flowed back into through second connecting line 115 In second heat exchanger 121.
Wherein, in an embodiment, described first to integrate in structure can be first pump housing 112 and described the One connecting line 114 connects, and first cold plate 113 is connect with second connecting line 115;Or can also be described The first cold plate 113 is connect with first connecting line 114 described in one integrated integrated morphology, first pump housing 112 and institute State the connection of the second connecting line 115.
In another embodiment, first pump housing 112 detaches connection with first cold plate 113.
Specifically, first connecting line 114 be connected to the First Heat Exchanger 111 and first cold plate 113 it Between;Second connecting line 115 is connected between first cold plate 113 and second heat exchanger 121;First pump Body 112 is connected on first connecting line 114 or is connected on second connecting line 115.
Cooling liquid is flowed out from the First Heat Exchanger 111, through first connecting line 114, first connecting tube First pump housing 112 on road 114 is flowed into first cold plate 113, is cooled down to component to be cooled, after cooling Withdrawing fluid flowed back into second heat exchanger 121 through second connecting line 115;Or cooling liquid is from described the One heat exchanger 111 flow out, be flowed into first cold plate 113 through first connecting line 114, to component to be cooled into Row cooling, withdrawing fluid after cooling is through described first on second connecting line 115, second connecting line 115 The pump housing 112 flows back into second heat exchanger 121.
In an embodiment, first liquid cooled module 110 further includes first be installed at the First Heat Exchanger 111 Fan unit 116.As shown in Fig. 2, first fan unit 116 includes several fans.
The First Heat Exchanger 111 is installed in the air side of the fan so that the air-flow of the fan blowout passes through institute It states First Heat Exchanger 111 and is mixed with the cold air of the First Heat Exchanger 111;Or the First Heat Exchanger 111 is installed in institute State the opposite back side in the air side of fan so that cold air is successively by described in the First Heat Exchanger 111 and the fan and warp Fan blows to component to be cooled.
In an embodiment, second pipe-line cell includes:Third connecting line 124 and the 4th connecting line 125.
Wherein described second pump housing 122 can be integrated with second cold plate 123, can also detach connection.Wherein, Component (such as chip) to be cooled, which is placed on second cold plate 123, to be cooled down.
In an embodiment, second pump housing 122 and second cold plate 123 are integrated, form the second one collection At structure.
It is integrated in second pump housing 122 and second cold plate 123, when formation second integrates structure, institute It states third connecting line 124 and is connected to second heat exchanger 121 and described second and integrate between structure;Described 4th connects It takes over road 125 and is connected to described second and integrate between structure and the First Heat Exchanger 111.
The coolant liquid flowed out from first cold plate 113 enters second heat exchanger 121, through second heat exchanger After 121 coolings, cooling liquid is flowed out from second heat exchanger 121, and described second is flowed into through the third connecting line 124 Structure is integrated, component to be cooled is cooled down, withdrawing fluid after cooling flows back through the 4th connecting line 125 Into the First Heat Exchanger 111.
Wherein, in an embodiment, described second to integrate in structure can be second pump housing 122 and described the Three connecting lines 124 connect, and second cold plate 123 is connect with the 4th connecting line 125;Or can also be described Two integrate the second cold plate 123 described in structure connect with the third connecting line 124, second pump housing 122 and institute State the connection of the 4th connecting line 125.
In another embodiment, second pump housing 122 detaches connection with second cold plate 123.
Specifically, in another embodiment, the third connecting line 124 is connected to second heat exchanger 121 and institute It states between the second cold plate 123;4th connecting line 125 is connected to second cold plate 123 and the First Heat Exchanger 111 Between;Second pump housing 122 is connected on the third connecting line 124 or is connected to the 4th connecting line 125 On.
Cooling liquid is flowed out from second heat exchanger 121, through the third connecting line 124, the third connecting tube Second pump housing 122 on road 124 is flowed into second cold plate 123, is cooled down to component to be cooled, after cooling Withdrawing fluid flowed back into the First Heat Exchanger 111 through the 4th connecting line 125;Or cooling liquid is from described the One heat exchanger 111 flow out, be flowed into second cold plate 123 through the third connecting line 124, to component to be cooled into Row cooling, withdrawing fluid after cooling is through described second on the 4th connecting line 125, the 4th connecting line 125 The pump housing 122 flows back into the First Heat Exchanger 111.
In an embodiment, second liquid cooled module 120 further includes second be installed at second heat exchanger 121 Fan unit 126.As shown in Fig. 2, second fan unit 126 includes several fans.
Second heat exchanger 121 is installed in the air side of the fan so that the air-flow of the fan blowout passes through institute It states the second heat exchanger 121 and is mixed with the cold air of second heat exchanger 121;Or second heat exchanger 121 is installed in institute State the opposite back side in the air side of fan so that cold air is successively by described in second heat exchanger 121 and the fan and warp Fan blows to component to be cooled.
The course of work of closed loop liquid cooling apparatus 100 in the present embodiment is as follows:
The heat of first cold plate, 113 taken away chip 1 is transported to the second heat exchange by pipeline by liquid by first pump housing 112 Device 121, fluid temperature is higher at this time, and the second heat exchanger 121 cools down high-temp liquid, then will be cold by second pump housing 122 But the cryogenic liquid after is transported to the second cold plate 123, freezes to chip 2, after the second cold plate 123 absorbs the heat of chip 2 First Heat Exchanger 111 is transported to by second pump housing 122 by pipeline, First Heat Exchanger 111 cools down high-temp liquid, cooling Liquid afterwards is transported to the first cold plate 113 by pipeline by first pump housing 112, cools down to chip 1, recycles successively.Due to Chip 1 and 2 has cryogenic liquid to be cooled down, therefore there is no thermal levels to join, and temperature is relatively low.
If one of failure of pump in first pump housing 112 and second pump housing 122, then another, which is pumped, will continue to keep liquid Body normal circulation ensures that heat dissipation is reliable.
In addition, the embodiments of the present invention also provide a kind of electronic equipment, including closed loop liquid cooling apparatus as described above 100.Above-mentioned that closed loop liquid cooling apparatus 100 is described in detail, details are not described herein.Wherein, the electronic equipment is excellent It is selected as interchanger, or the electronic equipments such as server.
In conclusion the piping connection scheme that the utility model closed loop liquid cooling apparatus is proposed effectively overcomes liquid cooling design In hot cascading between multiple chips, and ensure that system radiating Redundancy Design, overcome liquid cooling system Single Point of Faliure (single pump failure) and the thermal design problem brought, have been obviously improved system integral heat sink ability and heat dissipation reliability, have had higher Economy and practicability.So the utility model effectively overcomes various shortcoming in the prior art and has high industrial profit With value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model Modifications and changes.Therefore, technical field includes usual skill without departing from the revealed essence of the utility model such as All equivalent modifications completed under refreshing and technological thought or change, should be covered by the claim of the utility model.

Claims (11)

1. a kind of closed loop liquid cooling apparatus, which is characterized in that the closed loop liquid cooling apparatus includes:First liquid cooled module and the second liquid cooling Module;
The coolant liquid input terminal for cooling back flow liquid and being output to second liquid cooled module of the first liquid cooled module output end;
The coolant liquid input terminal for cooling back flow liquid and being output to first liquid cooled module of the second liquid cooled module output end.
2. closed loop liquid cooling apparatus according to claim 1, which is characterized in that first liquid cooled module includes the first heat exchange Device, first pump housing, the first cold plate and the first pipe-line cell;Second liquid cooled module include the second heat exchanger, second pump housing, Second cold plate and the second pipe-line cell.
3. closed loop liquid cooling apparatus according to claim 2, which is characterized in that first pipe-line cell includes:First connects Take over road and the second connecting line;Second pipe-line cell includes:Third connecting line and the 4th connecting line.
4. closed loop liquid cooling apparatus according to claim 3, which is characterized in that first pump housing and the first cold plate collection Integrally, it forms first and integrates structure;
First connecting line is connected to the First Heat Exchanger and described first and integrates between structure;Described second connects It takes over road and is connected to described first and integrate between structure and second heat exchanger.
5. closed loop liquid cooling apparatus according to claim 4, which is characterized in that described first integrates described in structure One pump housing is connect with first connecting line, and first cold plate is connect with second connecting line;Or described first It integrates the first cold plate described in structure to connect with first connecting line, first pump housing and second connecting tube Road connects.
6. closed loop liquid cooling apparatus according to claim 3, which is characterized in that first connecting line is connected to described Between one heat exchanger and first cold plate;Second connecting line is connected to first cold plate and second heat exchanger Between;First pump housing is connected on first connecting line or is connected on second connecting line.
7. closed loop liquid cooling apparatus according to claim 3, which is characterized in that second pump housing and the second cold plate collection Integrally, it forms second and integrates structure;
The third connecting line is connected to second heat exchanger and described second and integrates between structure;Described 4th connects It takes over road and is connected to described second and integrate between structure and the First Heat Exchanger.
8. closed loop liquid cooling apparatus according to claim 7, which is characterized in that described second integrates described in structure Two pump housings are connect with the third connecting line, and second cold plate is connect with the 4th connecting line;Or described second It integrates the second cold plate described in structure to connect with the third connecting line, second pump housing and the 4th connecting tube Road connects.
9. closed loop liquid cooling apparatus according to claim 3, which is characterized in that the third connecting line is connected to described Between two heat exchangers and second cold plate;4th connecting line is connected to second cold plate and the First Heat Exchanger Between;Second pump housing is connected on the third connecting line or is connected on the 4th connecting line.
10. closed loop liquid cooling apparatus according to claim 2, which is characterized in that first liquid cooled module further includes installing The first fan unit at the First Heat Exchanger, second liquid cooled module further include being installed at second heat exchanger The second fan unit.
11. a kind of electronic equipment, which is characterized in that include as described in claim 1 to claim 10 any claim Closed loop liquid cooling apparatus.
CN201721918138.5U 2017-12-29 2017-12-29 Closed loop liquid cooling apparatus and its electronic equipment of application Active CN207752998U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201721918138.5U CN207752998U (en) 2017-12-29 2017-12-29 Closed loop liquid cooling apparatus and its electronic equipment of application
US16/234,886 US11145570B2 (en) 2017-12-29 2018-12-28 Closed loop liquid cooler and electronic device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721918138.5U CN207752998U (en) 2017-12-29 2017-12-29 Closed loop liquid cooling apparatus and its electronic equipment of application

Publications (1)

Publication Number Publication Date
CN207752998U true CN207752998U (en) 2018-08-21

Family

ID=63151933

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721918138.5U Active CN207752998U (en) 2017-12-29 2017-12-29 Closed loop liquid cooling apparatus and its electronic equipment of application

Country Status (1)

Country Link
CN (1) CN207752998U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108133919A (en) * 2017-12-29 2018-06-08 加弘科技咨询(上海)有限公司 Closed loop liquid cooling apparatus and its electronic equipment of application

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108133919A (en) * 2017-12-29 2018-06-08 加弘科技咨询(上海)有限公司 Closed loop liquid cooling apparatus and its electronic equipment of application
CN108133919B (en) * 2017-12-29 2024-05-28 加弘科技咨询(上海)有限公司 Closed loop liquid cooling device and electronic equipment using same

Similar Documents

Publication Publication Date Title
US10401077B2 (en) Chilled water cooling system
Iyengar et al. Server liquid cooling with chiller-less data center design to enable significant energy savings
Han et al. Development of an integrated air conditioner with thermosyphon and the application in mobile phone base station
US9282678B2 (en) Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
CN104735959B (en) The cooling system of rack
CN205878451U (en) Data center's refrigerating system and computer lab
US11291136B2 (en) Liquid-cooled cold plate device
CN104054407A (en) Cooling system for a server
CN103168509A (en) Liquid cooling system for a server
US20090272144A1 (en) Computer cooling apparatus
WO2018145366A1 (en) Liquid-cooling heat pipe radiator system for cabinet server and control method therefor
CN108235655B (en) Easy-to-plug server cabinet adopting liquid cooling heat dissipation
CN104729162A (en) Cooling system and air conditioner with same
US8842434B2 (en) Heat dissipation system
CN207752998U (en) Closed loop liquid cooling apparatus and its electronic equipment of application
CN214901821U (en) Combined type cooling system
TWI487473B (en) Cooling system for date center
CN205946479U (en) A cooling system and server room for server
TWI655895B (en) Cabinet cooling system
CN115629658A (en) Water-cooling type chip radiator
CN108133919A (en) Closed loop liquid cooling apparatus and its electronic equipment of application
CN106647983B (en) Cooling system
US11145570B2 (en) Closed loop liquid cooler and electronic device using the same
CN104133538A (en) Zone bit liquid cooling quick mounting modular server system
CN210399569U (en) Heat pump system

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant