CN207676899U - Shift the preparation system of probe and two-dimensional hetero-junction - Google Patents
Shift the preparation system of probe and two-dimensional hetero-junction Download PDFInfo
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- CN207676899U CN207676899U CN201721443001.9U CN201721443001U CN207676899U CN 207676899 U CN207676899 U CN 207676899U CN 201721443001 U CN201721443001 U CN 201721443001U CN 207676899 U CN207676899 U CN 207676899U
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Abstract
The utility model is related to a kind of preparation systems of transfer probe and two-dimensional hetero-junction.The transfer probe includes glass substrate and stacks gradually transparent elastic cord breaker, extract layer and transfer layer on a glass substrate, the one kind of extract layer in poly (propylene carbonate) layer and polymethyl methacrylate layers, transfer layer is boron nitride layer, and the flatness of transfer layer is Ethylmercurichlorendimide grade.Above-mentioned transfer probe can effectively ensure that the planarization of two-dimensional hetero-junction, and then improve the quality of two-dimensional hetero-junction device.
Description
Technical field
The utility model is related to a kind of preparation systems of transfer probe and two-dimensional hetero-junction.
Background technology
With the rise of two-dimensional semiconductor material, two-dimensional hetero-junction breaks through the limitation of traditional devices material, becomes preparation electricity
The ideal material system of sub- device.But current two-dimensional material is easy bending, and two-dimensional hetero-junction appearance is easy to cause in transfer process
Wrinkle seriously affect the planarization of two-dimensional hetero-junction.
Utility model content
Based on this, it is necessary to provide a kind of transfer probe that more smooth two-dimensional hetero-junction can be prepared.
In addition, also providing a kind of preparation system of two-dimensional hetero-junction.
A kind of transfer probe, including glass substrate, transparent elastic cord breaker, extract layer and transfer layer, elastic cord breaker
On a glass substrate, extract layer is layered on elastic cord breaker, and transfer layer is layered on extract layer for stacking, and extract layer is selected from poly- carbon
One kind in sour Asia propyl ester layer and polymethyl methacrylate layers, transfer layer is boron nitride layer.
The elastic cord breaker of above-mentioned transfer probe can play the role of buffering, anti-rotation stop in two-dimensional material stacking process
Move the planarization that probe contacted and destroyed firmly two-dimensional hetero-junction with two-dimensional material.Extract layer has the characteristic of heating visbreaking, can
Viscosity is lost after the heating and directly obtains two-dimensional hetero-junction, it is not necessary to be shifted two-dimensional hetero-junction using other mechanical systems, be protected
Demonstrate,prove the planarization of two-dimensional hetero-junction.Therefore, above-mentioned transfer probe can effectively ensure that the planarization of two-dimensional hetero-junction, and then improve
The quality of two-dimensional hetero-junction device.
The thickness of elastic cord breaker is 0.5mm~5mm in one of the embodiments,.
Elastic cord breaker is silastic-layer in one of the embodiments,.
The thickness of transfer layer is 1nm~20nm in one of the embodiments,.
Further include adhesive tape in one of the embodiments, adhesive tape be layered in elastic cord breaker and extract layer it
Between.
A kind of preparation system of two-dimensional hetero-junction, including transfer platform, objective table, above-mentioned transfer probe and microscope at
As component, transfer platform and objective table can move in the horizontal direction, and transfer platform and objective table can be vertical
It stretches on direction, objective table can carry sample, and transfer probe can be fixed on transfer platform, and microscope imaging component can
Sample on objective table is imaged, wherein at least one of transfer platform and objective table are flexible and make transfer probe
Side of the transfer layer far from extract layer can be contacted with two-dimensional material.
Microscope imaging component includes microscope in one of the embodiments, and microscope is long-focus microscope.
Further include damped platform in one of the embodiments, transfer platform, objective table and microscope imaging component are pacified
On damped platform.
Further include warm table in one of the embodiments, warm table is located on objective table, and warm table can carry sample
Product.
Further include glove box, objective table, transfer platform, transfer probe and microscope imaging in one of the embodiments,
Component is contained in glove box.
Description of the drawings
Fig. 1 is the sectional view of the preparation system of the two-dimensional hetero-junction of an embodiment；
Fig. 2 be two-dimensional hetero-junction shown in FIG. 1 preparation system in shift probe structural schematic diagram；
Fig. 3 is the flow chart of the preparation method of the two-dimensional hetero-junction of an embodiment；
Fig. 4 is the flow chart of the preparation method of the transfer probe in the preparation method of two-dimensional hetero-junction shown in Fig. 3；
Fig. 5 is atomic force microscope (AFM) figure on the surface for the two-dimensional hetero-junction that embodiment 1 obtains；
Fig. 6 is atomic force microscope (AFM) figure on the surface for the two-dimensional hetero-junction that embodiment 4 obtains.
Specific implementation mode
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiment described herein.Make to the utility model on the contrary, purpose of providing these embodiments is
The understanding of disclosure is more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model
The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
Referring to Fig. 1, the two-dimensional hetero-junction preparation system 10 of an embodiment, can be used in preparing two-dimensional hetero-junction.Its
In, two-dimensional hetero-junction preparation system 10 includes damped platform 100, objective table 200, warm table 300, transfer platform 400, transfer spy
Needle 500, micro imaging system 600 and glove box 700.
Damped platform 100 is the brace foundation of two-dimensional hetero-junction preparation system 10, and system is prepared for reducing two-dimensional hetero-junction
The vibrations of system 10.In the illustrated embodiment, damped platform 100 includes the first tablet 110, the second tablet 120 and multiple bullets
Spring 130.Multiple springs 130 between the first tablet 110 and the second tablet 120, and with the first tablet 110 and the second tablet
120 elasticity abut.Multiple springs 130 can make two-dimensional hetero-junction preparation system by the flexible vibrations for reducing the first tablet 110
10 more stablize；Meanwhile the structure of damped platform 100 is simple, is easily assembled.
It is appreciated that damped platform 100 is not limited to above structure, also may be used between the first tablet 110 and the second tablet 120
The cushions such as sponge are arranged, as long as can play the role of reducing vibrations.
Objective table 200 is mounted on damped platform 100.Wherein, objective table 200 can move in the horizontal direction, and energy
It is enough to stretch in the vertical direction.Further, the movement of objective table 200 and flexible precision are other in the micron-scale.In the reality of diagram
It applies in example, the substantially rectangular parallelepiped structure of objective table 200, objective table 200 has opposite top and bottom, and top and bottom are
Plane.The bottom surface of objective table 200 is abutted against with the first tablet 110.
It is appreciated that objective table 200 is not limited to rectangular parallelepiped structure, or cylindrical structure and triangular prism structure
Deng as long as objective table 200 can be mounted on damped platform 100.Certainly, the top and bottom of objective table 200 are also unlimited
In for plane, or curved surface or irregular face, as long as on damped platform 200 and held stationary.
Warm table 300 is mounted on article carrying platform 200, and can be moved with objective table 200.Wherein, on warm table 300
Sample can be placed.Wherein, sample is the substrate for being adsorbed with two-dimensional material.In the illustrated embodiment, warm table 300 is mounted on
The top surface of objective table 200.
It is appreciated that warm table 300 is not limited to mounted on the top surface of objective table 200, objective table 200 can also be mounted on
Other positions, as long as substrate can be placed on warm table 300.
Actuator 410 is mounted on damped platform 100, and mobile platform 400 can move in the horizontal direction, and can be
It stretches on vertical direction.Further, the movement of mobile platform 400 and flexible precision are other in the micron-scale.
Wherein, mobile platform 400 includes actuator 410 and fixed frame 420, and actuator 410 is fixed with fixed frame 420 to be connected
It connects.Actuator 410 can move in the horizontal direction, and can stretch in the vertical direction, and fixed frame 420 can be with driving
Part 410 in the horizontal direction with moved on vertical direction.
In the illustrated embodiment, the substantially rectangular parallelepiped structure of actuator 410, actuator 410 have top and bottom, top
Face and bottom surface are plane, and the bottom surface of actuator 410 is abutted against with the first tablet 110.The substantially slab construction of fixed frame 420,
Fixed frame 420 has joint face 421, and the joint face 421 of fixed frame 420 and the top surface of actuator 410 abut against.
It is appreciated that actuator 410 is not limited to rectangular parallelepiped structure, or cylindrical structure and triangular prism structure
Deng as long as actuator 410 can be mounted on damped platform 100, and being fixedly connected with fixed frame 420.Certainly, actuator
410 top and bottom are also not necessarily limited to as plane, or curved surface or irregular face, as long as actuator 410 can be mounted on
On damped platform 200, and held stationary.
Transfer probe 500 can be fixedly connected with mobile platform 400, and can be moved with mobile platform 400.It is illustrating
Embodiment in, transfer probe 500 can be fixed on joint face 421, and shift probe 500 be located at fixed frame 420 far from drive
The side of moving part 410.Transfer probe 500 can be moved with fixed frame 420, and be fitted with the sample on warm table 300, i.e.,
Transfer probe 500 can fit with side of the substrate far from warm table 300, and the two-dimensional material on substrate is made to be adsorbed onto transfer
On probe 500, to prepare two-dimensional hetero-junction.Wherein, warm table 300 can heat transfer probe 500.
Also referring to Fig. 2, transfer probe 500 is transparent configuration.Wherein, transfer probe 500 include glass substrate 510 and
Stack gradually transparent elastic cord breaker 520, adhesive tape 530, extract layer 540 and transfer layer 550 on a glass substrate.
Glass substrate 510 is fixedly connected with fixed frame 420.In the illustrated embodiment, glass substrate 510 and joint face
421 are fixedly connected, and glass substrate 510 is located at side of the fixed frame 420 far from actuator 410.Wherein, glass substrate 510 is
Bright glass.Further, the one kind of glass substrate 510 in glass slide and coverslip.Further, glass substrate 510
Thickness be 0.5mm~5mm.
Elastic cord breaker 520 is transparent configuration, is mainly worked as a buffer.Elastic cord breaker 520 is layered in glass substrate 510
Far from 420 side of fixed frame.Further, the thickness of elastic cord breaker 520 is 0.5mm~5mm.Specifically, elastic buffer
Layer 520 is silastic-layer, and silicon rubber soft texture, buffering effect is preferable, can effectively prevent the preparation in two-dimensional hetero-junction
Probe 500 is shifted in journey to contact firmly with two-dimensional material, is avoided two-dimensional material from being subject to crushing, is ensured the planarization of two-dimensional hetero-junction.
It is appreciated that elastic cord breaker 520 is not limited to silastic-layer, or transparent emulsion layer etc., as long as being
Transparent configuration simultaneously works as a buffer.
Adhesive tape 530 is covered on elastic cord breaker 520, and is pasted with 510 phase of glass substrate, pastes elasticity with fixed
Buffer layer 520 and glass substrate 510.
Extract layer 540 is layered on adhesive tape 530.Extract layer 540 has inviscid under high temperature, and viscosity is strong under low temperature
Feature.Wherein, warm table 300 can heat extract layer 540.Specifically, extract layer 540 is selected from poly (propylene carbonate) layer and gathers
One kind in methyl methacrylate layer.Further, the thickness of extract layer 540 is 0.3mm~1mm.
Transfer layer 550 is layered on extract layer 540.Wherein, transfer layer 550 is boron nitride layer.Further, transfer layer
550 include the nitride multilayer boron layer stacked gradually, and nitride multilayer boron layer has higher intensity, in transfer layer 550 and two-dimentional material
When material fitting, prevent two-dimensional hetero-junction from wrinkle occur.It is appreciated that transfer layer 550 or single-layer silicon nitride boron layer.
Wherein, the flatness of transfer layer 550 is Ethylmercurichlorendimide grade, and the planarization of two-dimensional hetero-junction is effectively ensured.Specifically, it shifts
The thickness of layer 550 is 1nm~20nm.
It should be noted that adhesive tape 530 is not limited to be covered on elastic cord breaker 520, elasticity can also be only covered
Elastic cord breaker 520 and glass substrate 510 are fixed and are pasted, at this point, extract layer 540 is directly layered in by the edge of buffer layer 520
On elastic cord breaker 520.Meanwhile it being also not necessarily limited to fix using adhesive tape 530 and pasting elastic cord breaker 520 and glass substrate
510, adhesive can also be used to fix and paste elastic cord breaker 520 and glass substrate 510, at this point, the also direct layer of extract layer 540
It is stacked on elastic cord breaker 520.
In addition, if the connection of elastic cord breaker 520 and glass substrate 510 is firm enough, then adhesive tape 530 can be with
It omits, at this point, extract layer 540 is directly layered on elastic cord breaker 520.
The elastic cord breaker 520 of above-mentioned transfer probe 500 can play the role of buffering in two-dimensional material stacking process,
It prevents transfer probe 500 from being contacted firmly with two-dimensional material, destroys the planarization of two-dimensional hetero-junction.Simultaneously as objective table 200 and turn
Platform 400 is moved it is difficult to ensure that fully horizontally, can cause transfer probe 500 that cannot be perfectly bonded with two-dimensional material, and elasticity is slow
This defect can be made up by rushing layer 520, be bonded with the perfection of two-dimensional material to ensure to shift probe 500.Extract layer 540 has
The characteristic for heating visbreaking, can lose viscosity after the heating and directly obtain two-dimensional hetero-junction, extract layer 540 is prevented to be attached to two dimension
Hetero-junctions surface, and two-dimensional hetero-junction is polluted；Two-dimensional hetero-junction need not be shifted using other mechanical systems simultaneously,
Ensure the planarization of two-dimensional hetero-junction.
In addition, transfer layer 550 includes nitride multilayer boron layer, there is higher intensity, and the flatness of transfer layer 550 is angstrom
Meter level will not cause two-dimensional material wrinkle occur when transfer layer 550 and two-dimensional material fit, and ensure the flat of two-dimensional hetero-junction
Whole property.Therefore, above-mentioned transfer probe 500 can effectively ensure that the planarization of two-dimensional hetero-junction, and then improve two-dimensional hetero-junction device
The quality of part.
Micro imaging system 600 is mounted on damped platform 100.Wherein, micro imaging system 600 includes 610 He of holder
Microscope 620, holder 610 are fixedly connected with microscope 620, and holder 610 is mounted on damped platform 100.
In the illustrated embodiment, holder 610 includes montant 611 and cross bar 612.One end of montant 611 and the first tablet
110 are fixedly connected.Montant 611 is perpendicular to the first tablet 110.Cross bar 612 is solid with the one end of montant 611 far from the first tablet 110
Fixed connection, and cross bar 612 is perpendicular to montant 611.
Microscope 620 is fixedly connected with the one end of cross bar 612 far from montant 611.Microscope 620 can be located at transfer probe
500 top.By adjusting objective table 200 and mobile platform 400, microscope 620 can be with transfer probe 500 and warm table
Substrate on 300 is corresponding, and can penetrate transfer probe 500 and be imaged to sample, so that transfer probe 500 and two-dimentional material
Material aligns and is bonded.Wherein, sample is the substrate for being adsorbed with two-dimensional material.Specifically, microscope 620 is that long-focus is micro-
Mirror can more clearly from be imaged the two-dimensional material on substrate.Wherein, the thickness and elastic buffer of glass substrate 510
The thickness of layer 520 can be adjusted according to the focal length of microscope 610.
What glove box 700 was used to ensure two-dimensional hetero-junction prepares environment.Wherein it is possible to by being passed through in glove box 700
Protective gas, so as to avoid aqueous vapor during preparing two-dimensional hetero-junction in air and oxygen to two-dimensional hetero-junction
Oxidation or pollution, ensure the quality of two-dimensional hetero-junction.Further, protective gas is nitrogen.Wherein, damped platform 100, loading
Platform 200, warm table 300, transfer platform 400, transfer probe 500 and micro imaging system 600 are contained in glove box 700.
It should be noted that damped platform 100 is used to improve the stability of the preparation system 10 of two-dimensional hetero-junction, if two
It is more stable during the work time to tie up Heterojunction System 10, then, damped platform 100 can be omitted.
It should be noted that if heated to transfer probe 500 using other equipment, warm table 300 can
To omit, at this point, sample is directly placed on objective table 200.
It should be noted that glove box 700 is used to improve the internal environment of two-dimensional hetero-junction preparation system 10, two dimension is avoided
Hetero-junctions is aoxidized and is polluted, if only needing to prepare more smooth two-dimensional hetero-junction, glove box 700 can save
Slightly.
The operation principle of above-mentioned two-dimensional hetero-junction preparation system 10：
Open glove box 700, sample is placed on warm table 300, by microscope 610 to the two-dimensional material on substrate into
Row imaging, the transfer layer 550 on probe 500 will be shifted with substrate far from warm table by adjusting objective table 200 and mobile platform 400
Side fit so that two-dimensional material is adsorbed onto on transfer layer 550, extract layer 540 is heated using warm table 300,
So that extract layer 540 is detached with transfer layer 550, obtains two-dimensional hetero-junction.
Above-mentioned two-dimensional hetero-junction preparation system 10 at least has the following advantages that：
(1) elastic cord breaker 520 can play the role of buffering in two-dimensional material stacking process, ensure two-dimensional hetero-junction
Planarization；Simultaneously in objective table 200 and transfer platform 400 it is difficult to ensure that fully horizontally in the case of, 520 energy of elastic cord breaker
It is enough to ensure that transfer probe 500 is bonded with the perfection of two-dimensional material.
(2) extract layer 540 of transfer probe 500 has the characteristic of heating visbreaking, can lose after the heating sticky direct
Two-dimensional hetero-junction is obtained, extract layer 540 is prevented to be attached to two-dimensional hetero-junction surface, and two-dimensional hetero-junction is polluted；Simultaneously
Two-dimensional hetero-junction need not be shifted using other mechanical systems, ensure the planarization of two-dimensional hetero-junction.
(3) transfer layer 550 of transfer probe 500 is nitride multilayer boron, has higher intensity, while transfer layer 550
Flatness is Ethylmercurichlorendimide grade, and two-dimensional material will not be caused wrinkle occur when transfer layer 550 and two-dimensional material fit, and ensures two dimension
The planarization of hetero-junctions, and then improve the quality of two-dimensional hetero-junction device.
(4) damped platform 100 can reduce the vibrations of two-dimensional hetero-junction preparation system 10, two-dimensional hetero-junction preparation system 10
More stablize；And the structure of damped platform 100 is simple, is easily assembled.
(5) glove box 700 can avoid aqueous vapor and oxygen oxidation and pollution to two-dimensional hetero-junction, ensure two-dimensional hetero-junction
Quality.
(6) microscope 620 is long-focus microscope, can be more clearly imaged to the two-dimensional material on substrate, and
Transfer probe 500 is set to be aligned with two-dimensional material.
(7) objective table 200 and mobile platform 400 can move in the horizontal direction, and can be in the vertical direction
It is flexible, while the movement of objective table 200 and mobile platform 400 and flexible precision are other in the micron-scale, are conducive to shift probe
500 are bonded with the two-dimensional material perfection on substrate.
Referring to Fig. 3, the preparation method of the two-dimensional hetero-junction of an embodiment, includes the following steps：
Step S810：Prepare transfer probe.
Also referring to Fig. 4, which is prepared via a method which to obtain：
Step S811：Transparent elastic cord breaker is prepared on a glass substrate.
Wherein, the step of preparing transparent elastic cord breaker on a glass substrate be specially：Buffering slurry is coated on glass
It is cured on glass substrate, obtain elastic cord breaker.
Wherein, buffering slurry includes fluid silicone rubber and curing agent.Fluid silicone rubber main component is polydimethylsiloxanes
Alkane prepolymer.Further, the weight ratio of fluid silicone rubber and curing agent is 10:1.Solidification temperature is 25 DEG C~150 DEG C.Specifically
Ground, buffering slurry are commercially available 184 silicon rubber of DOW CORNING SYLGARD.Since 184 silicon rubber of healthy and free from worry SYLGARD is by basic
The bi-component external member product of component and curing agent composition, and its basic component is mainly polydimethylsiloxane prepolymer object, is also contained
There is micro platinum catalyst.The ingredient of the curing agent of 184 silicon rubber of healthy and free from worry SYLGARD include the prepolymer with vinyl sidechain and
Crosslinking agent poly (dimethyl-methylhydrogenosiloxane).
It should be noted that buffering slurry is not limited to commercially available 184 silicon rubber of DOW CORNING SYLGARD, it can also be used
Its fluid silicone rubber is 10 by weight with curing agent:1 ratio is mixed with.
Wherein, the thickness of elastic cord breaker is 0.5mm~5mm.
Step S812：Extract layer is prepared on elastic cord breaker.
Wherein, the one kind of extract layer in poly (propylene carbonate) layer and methyl methacrylate layer.
Wherein, it is specially the step of preparing extract layer on elastic cord breaker：Extracting solution is coated on the elastic buffer
On layer, through drying, extract layer is obtained.Further, extracting solution is coated on elastic cord breaker by the way of spin coating, is made
Elastic cord breaker it is more uniform.Specifically, extracting solution is turned on elastic cord breaker with 2000r/min~5000r/min
Fast spin coating 30s or more obtains extract layer then in 80 DEG C~100 DEG C dry 5min~15min.It is appreciated that extracting solution is unlimited
It is dried in using aforesaid way, it can also naturally dry.Meanwhile it being also not necessarily limited to be coated with extracting solution by the way of spin coating
On elastic cord breaker, extracting solution can also be coated on elastic cord breaker by the way of roller coating, spraying.
Wherein, extracting solution is selected from the methyl phenyl ethers anisole solution containing poly (propylene carbonate) and the benzene first containing methyl methacrylate
One kind in ethereal solution；The thickness of extract layer is 0.3mm~1mm.Further, the matter of the methyl phenyl ethers anisole solution of poly (propylene carbonate)
It is 10%~20% to measure percentage composition.
Step S813：Transfer layer is prepared on extract layer.
Wherein, transfer layer is boron nitride layer, and the flatness of transfer layer is Ethylmercurichlorendimide grade.
Wherein, it is specially the step of preparing transfer layer on extract layer：Boron nitride is taken using adhesive tape is viscous；Adhesive tape is attached at
On substrate, pressing adhesive tape is so that substrate adsorption boron nitride, then removes adhesive tape；By side of the extract layer far from elastic cord breaker and base
Plate fits, and boron nitride is made to be adsorbed onto on extract layer, to form transfer layer.Wherein, due to the effect of the adsorption capacity of substrate, nitrogen
Changing boron can remain on substrate.Specifically, substrate is clean silicon substrate.
Further, nitride multilayer boron is found on substrate, by side of the extract layer far from elastic cord breaker and multilayer nitrogen
Change boron to fit, so that boron nitride is adsorbed onto on extract layer and obtain transfer layer.Wherein, substrate is carried out on substrate using microscope
Nitride multilayer boron is found in imaging.
It should be noted that if can not find nitride multilayer boron on substrate, it can also be by extract layer far from elastic buffer
The side of layer fits with single-layer silicon nitride boron, so that boron nitride is adsorbed onto on extract layer and obtains transfer layer.
Further include fixing to paste using adhesive tape it should be noted that after step S811 and before step S812
The step of elastic cord breaker and glass substrate.Specifically, adhesive tape is covered on elastic cord breaker, and with glass substrate phase
It pastes, is pasted so that elastic cord breaker is fixed with glass substrate, at this point, extract layer is directly prepared on adhesive tape.
It is appreciated that adhesive tape is not limited to be covered on elastic cord breaker, the side of elastic cord breaker can also be only covered
Elastic cord breaker and glass substrate are fixed and are pasted by edge.Meanwhile it being also not necessarily limited to fix using adhesive tape and pasting elastic cord breaker
With glass substrate, adhesive can also be used to fix and paste elastic cord breaker and glass substrate, at this point, extract layer is in elastic buffer
It is prepared on layer.
Step S820：The first substrate for being adsorbed with the first two-dimensional material is provided, the transfer layer of probe will be shifted far from extraction
The side of layer fits with first substrate, and the first two-dimensional material is made to be adsorbed onto on transfer layer, to form the first two-dimensional material layer.
Further, take the first two-dimensional material using adhesive tape is viscous, adhesive tape be attached on first substrate, pressing adhesive tape so that
First substrate adsorbs the first two-dimensional material, then removes adhesive tape, obtains the first substrate for being adsorbed with the first two-dimensional material.Wherein, by
In the effect of the adsorption capacity of first substrate, the first two-dimensional material can remain on the first substrate.Specifically, first substrate is clean
Silicon substrate.
Further, the first two-dimensional material on first substrate is imaged using microscope, then probe will be shifted
Side of the transfer layer far from extract layer aligns and is bonded with the first two-dimensional material on first substrate.Specifically, transfer is visited
Side of the transfer layer of needle far from extract layer aligns and is bonded with the first two-dimensional material of single layer on first substrate.It can manage
Solution, transfer layer are not limited to fit with the first two-dimensional material of single layer on first substrate, can also be according to the requirement of required device
Transfer layer and the first two-dimensional material of multilayer on first substrate are fitted.
The one kind of first two-dimensional material in graphene and molybdenum disulfide in one of the embodiments,.
Step S830：The second substrate for being adsorbed with the second two-dimensional material is provided, by the first two-dimensional material layer far from transfer layer
Side fit with second substrate, and the second two-dimensional material is made to be adsorbed onto on the first two-dimensional material layer, to form the second two dimension
Material layer.
Further, take the second two-dimensional material using adhesive tape is viscous, adhesive tape be attached on second substrate, pressing adhesive tape so that
Second substrate adsorbs the second two-dimensional material, then removes adhesive tape, obtains the second substrate for being adsorbed with the second two-dimensional material.Wherein, by
In the effect of the adsorption capacity of second substrate, the second two-dimensional material can remain on second substrate.Specifically, second substrate is clean
Silicon substrate.
Further, the second two-dimensional material on second substrate is imaged using microscope, then by the first two-dimentional material
Side of the bed of material far from transfer layer aligns and is bonded with the second two-dimensional material on second substrate.Specifically, by the first two dimension
Side of the material layer far from transfer layer aligns and is bonded with the second two-dimensional material of single layer on second substrate.It is appreciated that the
One two-dimensional material layer is not limited to fit with the second two-dimensional material of single layer on second substrate, can also be wanted according to required device
It asks and the first two-dimensional material layer and the second two-dimensional material of multilayer on second substrate fits.
The one kind of second two-dimensional material in graphene and molybdenum disulfide in one of the embodiments,.
Step S840：Visbreaking process is heated to extract layer, and makes transfer layer and extraction layer separation, obtains laminates.
I.e. laminates are the two-dimensional material three-decker of the two-dimensional material of boron nitride/first/second, wherein "/" indicates stacking
(similarly hereinafter).
Specifically, the temperature for visbreaking process being heated to extract layer is 70 DEG C or more, and makes transfer layer and extraction layer separation, is obtained
To the two-dimensional material three-decker of the two-dimensional material of boron nitride/first/second, boron nitride structure can prevent intermediate two-dimensional material quilt
Oxygen and steam oxidation in air and pollution.
It should be noted that step S810, step S820, step S830 and step S810 are under the atmosphere of protective gas
It carries out, aqueous vapor and oxygen proportion are less than 0.1ppm, and boron nitride and two-dimensional material can be effectively prevent by water in air and oxygen
The oxidation or pollution of gas, ensure the quality of two-dimensional hetero-junction.Wherein, protective gas is nitrogen.
Step S850：Laminates are soaked in acetone, remaining extract layer on the boron nitride layer to remove laminates.
Specifically, two-dimensional hetero-junction is soaked in the time in acetone as 1min~2min.
Step S860：Using the transfer layer on inductively coupled plasma dry etching removal laminates, it is different to obtain two dimension
Matter knot.
At this point, the structure of obtained two-dimensional hetero-junction is the two-dimensional material of the first two-dimensional material/second.
Specifically, it is passed through reaction gas, using photoresist as mask, dry method is carried out using inductively coupled plasma (ICP)
Etching.Wherein, reaction gas is selected from Cl2、BCl3And one kind in Ar；The flow of reaction gas is 5sccm~8sccm.Wherein,
RF grid bias power supply power is 100w, and the speed of etch nitride boron is 10nm/s.
It should be noted that step S860 can also be omitted, at this point, step S850 obtains eliminating remaining extract layer
Laminates be two-dimensional hetero-junction, at this point, the structure of two-dimensional hetero-junction is the two dimension of the two-dimensional material of boron nitride/first/second
Material.
The preparation method of above-mentioned two-dimensional hetero-junction is easy to operate, and it is 100% that the high yield rate of two-dimensional hetero-junction, which reaches,.
Two-dimensional hetero-junction made from preparation method using above-mentioned two-dimensional hetero-junction has planarization good, the spy of good quality
Point.
It is specific embodiment part below：
Embodiment 1
The preparation process of the two-dimensional hetero-junction of the present embodiment is specific as follows：
(1) transfer probe is prepared
It is 10 by weight by the basic component of 184 silicon rubber of DOW CORNING SYLGARD and curing agent:It is coated on after 1 mixing
On glass slide, at 100 DEG C, solidification obtains the elastic cord breaker that thickness is 3mm.Adhesive tape is covered on elastic cord breaker, and
It is mutually pasted with glass substrate.By mass percentage be 15% methyl methacrylate methyl phenyl ethers anisole solution in elastic cord breaker
On with the rotating speed spin coating 30s of 3000r/min, then in 90 DEG C of dry 10min, obtain the extract layer that thickness is 0.5mm.Use glue
Band is viscous to take boron nitride, and adhesive tape is attached on the first silicon substrate, and pressing adhesive tape is so that the first silicon substrate adsorbs boron nitride, then removes
Adhesive tape obtains the first silicon substrate for being adsorbed with boron nitride.Nitride multilayer boron is found on the first silicon substrate using microscope, will be carried
It takes side of the layer far from elastic cord breaker to fit with the nitride multilayer boron on the first silicon substrate, and boron nitride is made to be adsorbed onto extraction
On layer, to form flatness as the transfer layer of Ethylmercurichlorendimide grade.
(2) the first two-dimensional material layer is prepared
Graphene fragment is taken using adhesive tape is viscous, adhesive tape is attached on the second silicon substrate, pressing adhesive tape is so that the second silicon serves as a contrast
Graphene is adsorbed at bottom, then removes adhesive tape, obtains the second silicon substrate for being adsorbed with graphene.Using on the second silicon substrate of microscope pair
Graphene be imaged, then the mono-layer graphite on side of the transfer layer of probe far from extract layer and the second silicon substrate will be shifted
Alkene aligns and is bonded, and graphene is made to be adsorbed onto on transfer layer, to form graphene layer.
(3) the second two-dimensional material layer is prepared
Molybdenum disulfide fragment is taken using adhesive tape is viscous, adhesive tape is attached on third silicon substrate, pressing adhesive tape is so that third silicon
Substrate adsorbs molybdenum disulfide, then removes adhesive tape, obtains the third silicon substrate for being adsorbed with molybdenum disulfide.Using microscope to third silicon
Molybdenum disulfide on substrate is imaged, then by two sulphur of single layer on side of the graphene layer far from transfer layer and third silicon substrate
Change molybdenum to align and be bonded, and molybdenum disulfide is made to be adsorbed onto on graphene layer, to form layer of molybdenum-disulfide.
(4) two-dimensional hetero-junction is prepared
70 DEG C of progress visbreaking process are heated to extract layer, and make transfer layer and extraction layer separation, obtain boron nitride/graphite
Alkene/molybdenum disulfide three-decker.By boron nitride/graphene/molybdenum disulfide three-decker in acetone soak 1min, to remove residual
Extract layer.Then it uses in inductively coupled plasma dry etching removal boron nitride/graphene/molybdenum disulfide three-decker
Boron nitride, obtain two-dimensional hetero-junction, i.e. graphene/molybdenum disulfide structure.Wherein, the reaction gas being passed through is Cl2, reaction gas
The flow of body is 6sccm；Mask is photoresist；RF grid bias power supply power is 100w, and the speed of etch nitride boron is 10nm/s.
The surface of the two-dimensional hetero-junction obtained to the present embodiment using atomic force microscope is scanned, and test two dimension is heterogeneous
The flatness for tying surface, is as a result shown in Fig. 5 and table 1, wherein the displacement in the abscissa and ordinate in Fig. 5 indicates that atomic force is aobvious
Height of the micro mirror probe in the position on two-dimensional hetero-junction surface, ordinate indicates the height on different location two-dimensional hetero-junction surface
It is low.
Embodiment 2
The preparation process of the two-dimensional hetero-junction of the present embodiment is specific as follows：
(1) transfer probe is prepared
It is 10 by weight by the basic component of 184 silicon rubber of DOW CORNING SYLGARD and curing agent:It is coated on after 1 mixing
On coverslip, at 25 DEG C, solidification obtains the elastic cord breaker that thickness is 0.5mm.Adhesive tape is covered on elastic cord breaker,
And it is mutually pasted with glass substrate.By mass percentage be 10% poly (propylene carbonate) methyl phenyl ethers anisole solution in elastic cord breaker
On with the rotating speed spin coating 40s of 3000r/min, then in 80 DEG C of dry 5min, obtain the extract layer that thickness is 0.3mm.Use glue
Band is viscous to take boron nitride, and adhesive tape is attached on the first silicon substrate, and pressing adhesive tape is so that the first silicon substrate adsorbs boron nitride, then removes
Adhesive tape obtains the first silicon substrate for being adsorbed with boron nitride.Nitride multilayer boron is found on the first silicon substrate using microscope, will be carried
It takes side of the layer far from elastic cord breaker to fit with the nitride multilayer boron on the first silicon substrate, and boron nitride is made to be adsorbed onto extraction
On layer, to form flatness as the transfer layer of Ethylmercurichlorendimide grade.
(2) the first two-dimensional material layer is prepared
Graphene fragment is taken using adhesive tape is viscous, adhesive tape is attached on the second silicon substrate, pressing adhesive tape is so that the second silicon serves as a contrast
Graphene is adsorbed at bottom, then removes adhesive tape, obtains the second silicon substrate for being adsorbed with graphene.Using on the second silicon substrate of microscope pair
Graphene be imaged, then the mono-layer graphite on side of the transfer layer of probe far from extract layer and the second silicon substrate will be shifted
Alkene aligns and is bonded, and graphene is made to be adsorbed onto on transfer layer, to form graphene layer.
(3) the second two-dimensional material layer is prepared
Molybdenum disulfide fragment is taken using adhesive tape is viscous, adhesive tape is attached on third silicon substrate, pressing adhesive tape is so that third silicon
Substrate adsorbs molybdenum disulfide, then removes adhesive tape, obtains the third silicon substrate for being adsorbed with molybdenum disulfide.Using microscope to third silicon
Molybdenum disulfide on substrate is imaged, then by two sulphur of single layer on side of the graphene layer far from transfer layer and third silicon substrate
Change molybdenum to align and be bonded, and molybdenum disulfide is made to be adsorbed onto on graphene layer, to form layer of molybdenum-disulfide.
(4) two-dimensional hetero-junction is prepared
80 DEG C of progress visbreaking process are heated to extract layer, and make transfer layer and extraction layer separation, obtain boron nitride/graphite
Alkene/molybdenum disulfide three-decker.By boron nitride/graphene/molybdenum disulfide three-decker in acetone soak 2min, to remove residual
Extract layer, obtain two-dimensional hetero-junction, i.e. boron nitride/graphene/molybdenum disulfide three-decker.
The surface of the two-dimensional hetero-junction obtained to the present embodiment using atomic force microscope is scanned, and test two dimension is heterogeneous
The flatness for tying surface, the results are shown in Table 1.
Embodiment 3
The preparation process of the two-dimensional hetero-junction of the present embodiment is specific as follows：
(1) transfer probe is prepared
It is 10 by weight by the basic component of 184 silicon rubber of DOW CORNING SYLGARD and curing agent:It is coated on after 1 mixing
On coverslip, at 150 DEG C, solidification obtains the elastic cord breaker that thickness is 5mm.Adhesive tape is covered on elastic cord breaker, and
It is mutually pasted with glass substrate.By mass percentage be 20% poly (propylene carbonate) methyl phenyl ethers anisole solution on elastic cord breaker
With the rotating speed spin coating 35s of 5000r/min, then in 100 DEG C of dry 15min, the extract layer that thickness is 1mm is obtained.Use adhesive tape
It is viscous to take boron nitride, adhesive tape is attached on the first silicon substrate, pressing adhesive tape is so that the first silicon substrate adsorbs boron nitride, then removes and remove photoresist
Band obtains the first silicon substrate for being adsorbed with boron nitride.Nitride multilayer boron is found on the first silicon substrate using microscope, will be extracted
Side of the layer far from elastic cord breaker fits with the nitride multilayer boron on the first silicon substrate, and boron nitride is made to be adsorbed onto extract layer
On, to form flatness as the transfer layer of Ethylmercurichlorendimide grade.
(2) the first two-dimensional material layer is prepared
Molybdenum disulfide fragment is taken using adhesive tape is viscous, adhesive tape is attached on the second silicon substrate, pressing adhesive tape is so that the second silicon
Substrate adsorbs molybdenum disulfide, then removes adhesive tape, obtains the second silicon substrate for being adsorbed with molybdenum disulfide.Using the second silicon of microscope pair
Molybdenum disulfide on substrate is imaged, then will be shifted on side of the transfer layer of probe far from extract layer and the second silicon substrate
Single layer molybdenum disulfide aligns and is bonded, and molybdenum disulfide is made to be adsorbed onto on transfer layer, to form layer of molybdenum-disulfide.
(3) the second two-dimensional material layer is prepared
Graphene fragment is taken using adhesive tape is viscous, adhesive tape is attached on third silicon substrate, pressing adhesive tape is so that third silicon serves as a contrast
Graphene is adsorbed at bottom, then removes adhesive tape, obtains the third silicon substrate for being adsorbed with graphene.Using microscope on third silicon substrate
Graphene be imaged, then it is side of the layer of molybdenum-disulfide far from transfer layer is opposite with the single-layer graphene on third silicon substrate
It together and is bonded, and graphene is made to be adsorbed onto on layer of molybdenum-disulfide, to form graphene layer.
(4) two-dimensional hetero-junction is prepared
90 DEG C of progress visbreaking process are heated to extract layer, and make transfer layer and extraction layer separation, obtain two-dimensional hetero-junction,
That is boron nitride/molybdenum disulfide/graphene three-decker.
The surface of the two-dimensional hetero-junction obtained to the present embodiment using atomic force microscope is scanned, and test two dimension is heterogeneous
The flatness for tying surface, the results are shown in Table 1.
Embodiment 4
The preparation process of the two-dimensional hetero-junction of the present embodiment is specific as follows：
(1) the first two-dimensional material layer is prepared
Molybdenum disulfide fragment is taken using adhesive tape is viscous, adhesive tape is attached on the first polycarbonate film substrate, adhesive tape is pressed
So that the first polycarbonate film substrate adsorbs molybdenum disulfide, then adhesive tape is removed, obtains the first poly- carbon for being adsorbed with molybdenum disulfide
Acid esters film-substrate.It is positioned using the molybdenum disulfide on microscope pair the first polycarbonate film substrate.
(2) the second two-dimensional material layer is prepared
Graphene fragment is taken using adhesive tape is viscous, adhesive tape is attached on the second silicon substrate, pressing adhesive tape is so that the second silicon serves as a contrast
Graphene is adsorbed at bottom, then removes adhesive tape, obtains the second silicon substrate for being adsorbed with graphene.Using on the second silicon substrate of microscope pair
Graphene be imaged, then by the mono-layer graphite on side of the layer of molybdenum-disulfide far from polycarbonate film and the second silicon substrate
Alkene aligns and is bonded, and molybdenum disulfide is made to be adsorbed onto on graphene layer, has both obtained two-dimensional hetero-junction, i.e. molybdenum disulfide/graphite
Alkene double-layer structure.
The surface of the two-dimensional hetero-junction obtained to the present embodiment using atomic force microscope is scanned, and test two dimension is heterogeneous
The flatness for tying surface, is as a result shown in Fig. 6 and table 1 wherein, and the displacement in the abscissa and ordinate in Fig. 6 indicates atomic force microscopy
Height of the mirror probe in the position on two-dimensional hetero-junction surface, ordinate indicates the height on different location two-dimensional hetero-junction surface.
Table 1
| Flatness | |
| Embodiment 1 | Surface height fluctuations are less than 1nm |
| Embodiment 2 | Surface height fluctuations are less than 1nm |
| Embodiment 3 | Surface height fluctuations are less than 1nm |
| Embodiment 4 | Surface height fluctuations are in 5nm~7nm |
As it can be seen from table 1 the flatness on the two-dimensional hetero-junction surface that Examples 1 to 3 obtains is less than 1nm, reach Ethylmercurichlorendimide
Grade, illustrates that the two-dimensional hetero-junction surface that Examples 1 to 3 obtains is smooth, and it is low bump probability occur, good quality.
And the surface smoothness for the two-dimensional hetero-junction that embodiment 4 obtains is 5nm~7nm, only reaches nanoscale, illustrates to implement
There is protrusion probability height in the two-dimensional hetero-junction surface that example 4 obtains, and surface is second-rate there are many PC film residues.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of transfer probe, which is characterized in that including glass substrate, transparent elastic cord breaker, extract layer and transfer layer, institute
It states elastic cord breaker to be layered in the glass substrate, the extract layer is layered on the elastic cord breaker, the transfer layer
It is layered on the extract layer, the one kind of the extract layer in poly (propylene carbonate) layer and polymethyl methacrylate layers,
The transfer layer is boron nitride layer.
2. transfer probe according to claim 1, which is characterized in that the thickness of the elastic cord breaker be 0.5mm~
5mm。
3. transfer probe according to claim 1, which is characterized in that the elastic cord breaker is silastic-layer.
4. transfer probe according to claim 1, which is characterized in that the thickness of the transfer layer is 1nm~20nm.
5. transfer probe according to claim 1, which is characterized in that further include adhesive tape, the adhesive tape stacking
Between the elastic cord breaker and the extract layer.
6. a kind of preparation system of two-dimensional hetero-junction, which is characterized in that appoint including transfer platform, objective table, Claims 1 to 5
Transfer probe described in meaning one and microscope imaging component, the transfer platform and the objective table can be in the horizontal direction
Upper movement, and the transfer platform and the objective table can stretch in the vertical direction, the objective table can carry sample
Product, the transfer probe can be fixed on the transfer platform, and the microscope imaging component can be on the objective table
The sample be imaged, wherein at least one of the transfer platform and the objective table are flexible and make the transfer
Side of the transfer layer of probe far from the extract layer can be contacted with the sample.
7. the preparation system of two-dimensional hetero-junction according to claim 6, which is characterized in that the microscope imaging component packet
Microscope is included, the microscope is long-focus microscope.
8. the preparation system of two-dimensional hetero-junction according to claim 6, which is characterized in that further include damped platform, it is described
Transfer platform, the objective table and the microscope imaging component are installed on the damped platform.
9. the preparation system of two-dimensional hetero-junction according to claim 6, which is characterized in that further include warm table, it is described to add
Thermal station is located on the objective table, and the warm table can carry the sample.
10. the preparation system of two-dimensional hetero-junction according to claim 6, which is characterized in that further include glove box, the load
Object platform, the transfer platform, the transfer probe and the microscope imaging component are contained in the glove box.
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| CN111912683A (en) * | 2020-07-31 | 2020-11-10 | 南京大学 | PDMS-based block transfer fixing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111912683A (en) * | 2020-07-31 | 2020-11-10 | 南京大学 | PDMS-based block transfer fixing method |
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