CN207672144U - Adding pressure type disperses electroplanting device under a kind of high-intensity magnetic field - Google Patents
Adding pressure type disperses electroplanting device under a kind of high-intensity magnetic field Download PDFInfo
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- CN207672144U CN207672144U CN201721343850.7U CN201721343850U CN207672144U CN 207672144 U CN207672144 U CN 207672144U CN 201721343850 U CN201721343850 U CN 201721343850U CN 207672144 U CN207672144 U CN 207672144U
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- magnetic field
- electroplating bath
- heatproof
- gas
- electroplate liquid
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Abstract
The utility model discloses adding pressure types under a kind of high-intensity magnetic field to disperse electroplanting device, it includes magnetic field generator, electroplating bath, cathode, anode, power supply, gas-guide tube, intake valve, vent valve, gas cylinder, ultrasonic unit composition.The utility model gas-guide tube, pressure reducing valve and pressurized gas bottle connect, gas-guide tube is connected with vent valve, intake valve, adjusting electroplating bath intensity can be reached by adjusting the size of pressure reducing valve, simultaneously, by the way of ultrasonic wave dispersion, it can disperse electroplate liquid, the effect of mass transmitting of plating solution can be significantly improved during especially composite plating is electroplated, make evengranular in plating solution be suspended in electroplate liquid.So as to improve the quality of coating of acquisition, high performance product is prepared.
Description
Technical field
The utility model is related to electroplating technology, adding pressure type disperses electroplanting device under specially a kind of high-intensity magnetic field.
Background technology
Since the 1970s, electroplating technology obtains fast development, be widely used in aerospace, automobile making,
The fields such as incrustation and functional material preparation.And since the 1990s, it is electroplated under magnetic field under especially high-intensity magnetic field
Plating obtains fast development, since with electric current reciprocation can occur for the application in magnetic field, generates MHD effect
(MHD effects), plating solution property can be significantly improved, meanwhile, the effect of the additional energy and magnetizing force that are provided by magnetic field may be used also
Significantly to refine the effect of coating crystal grain, preferred orientation, the quality and performance of coating are improved.But still there are problems that,
For example electroplated layer is easy to detach with matrix, it still needs further improvement for performance.
Utility model content
The purpose of this utility model is to provide adding pressure types under a kind of high-intensity magnetic field to disperse electroplanting device, using under high-intensity magnetic field
It is electroplated, during plating, applies certain pressure to electroplating bath, while shaking using the ultrasound that ultrasonic unit generates
It swings and plating solution in electroplating bath is disperseed, realize the effect of mass transmitting to electroplate liquid, realize the good combination of coating and matrix, can grasp
Make simply, dispersion effect is good, with overcome the deficiencies in the prior art.
To achieve the above object, the utility model provides the following technical solutions:
Adding pressure type disperses electroplanting device, including heatproof electroplating bath under a kind of high-intensity magnetic field, which wraps up heatproof plating
The surrounding of slot, magnetic field generator wrap up heating device, and temperature controller is connected to realization with heating device and controls heating device, the magnetic
The magnetic direction that field generator generates is straight up, electroplate liquid to be injected in heatproof electroplating bath, at the top of heatproof electroplating bath
Sealing of the plating capping realization to heatproof electroplating bath is set, and the outlet side of gas-guide tube passes through plating capping to connect with heatproof electroplating bath
Logical, the inlet end of the gas-guide tube is connected to the gas cylinder equipped with compressed gas, and cathode and anode are inserted in that electroplate liquid is interior and the cathode
Plating capping is each passed through with the connecting line of anode to be connected to the electroplating power supply outside heatproof electroplating bath so that plating electricity
Source, cathode, anode and electroplate liquid form control loop, and Vltrasonic device, Vltrasonic device production is arranged in the bottom of heatproof electroplating bath
Raw ultrasonic field disperses electroplate liquid.
Under a kind of high-intensity magnetic field above-mentioned in adding pressure type dispersion electroplanting device, from interior between magnetic field generator and heating device
Insulation material layer and water cooling plant are set gradually outward, and water cooling plant wraps up insulation material layer, and magnetic field generator includes water cooling dress
It sets.
Under a kind of high-intensity magnetic field above-mentioned in adding pressure type dispersion electroplanting device, thermocouple is set in electroplate liquid, the thermocouple
Connecting line pass through plating capping be connected to the input terminal of temperature controller.
Under a kind of high-intensity magnetic field above-mentioned in adding pressure type dispersion electroplanting device, set gradually along airintake direction on gas-guide tube
Pressure reducing valve, intake valve and vent valve.
The utility model principle:Electroplate liquid is added in electroplate liquid, then opens intake valve and is inflated, reaches certain pressure intensity
Afterwards, stop aerating, turn off intake valve, open Vltrasonic device, ultrasonic wave dispersion is carried out to electroplate liquid, control is dispersed with stirring intensity
Afterwards, it opens magnetic field generator and electroplating power supply be electroplated under high-intensity magnetic field, realize discharge ion in cathode under the influence of a magnetic field
Surface-discharge forming core, to be conducive to that the coating of qualification is made.
Compared with prior art, this practical information has obvious prominent substantive distinguishing features and marked improvement:
(1), due to the reciprocation of electric field and magnetic field, the MHD effects of generation can significantly improve electricity for electro-deposition under magnetic field
The effect of mass transmitting of plating solution;
(2)Due to during plating, carrying out adding pressure type electro-deposition, electroplating process intermediate ion electric discharge forming core can be promoted
Process, the effect of crystal grain thinning improve the binding force of coating and matrix;
(3)In adding pressure type electrodeposition process, it is applied with ultrasonic field, can further promote the effect of mass transmitting of electroplate liquid,
It can be more advantageous to and obtain good coating;
(4)Easy to operate, dispersion effect is good, improves its lumber recovery and quality.
Description of the drawings
Attached drawing 1 is the structural schematic diagram of the utility model.
Specific implementation mode
The utility model embodiment:Adding pressure type disperses electroplanting device under a kind of high-intensity magnetic field, as shown in the picture, including heatproof electricity
Coating bath 1, the heating device 2 wrap up the surrounding of heatproof electroplating bath 1, and magnetic field generator 3 wraps up heating device 2, temperature controller 18 with plus
The connection of thermal 2, which is realized, controls heating device 2, and 19 direction of magnetic field which generates is straight up, in heatproof
It is injected with electroplate liquid 4 in electroplating bath 1, is realized to the close of heatproof electroplating bath 1 in 1 top setting plating capping 14 of heatproof electroplating bath
Envelope, the outlet side of gas-guide tube 8 pass through plating capping 14 be connected to heatproof electroplating bath 1, and the inlet end of the gas-guide tube 8 is compressed with being equipped with
The gas cylinder 9 of gas is connected to, cathode 5 and anode 6 is inserted in electroplate liquid 4 and the connecting line of the cathode 5 and anode 6 is each passed through electricity
Plating capping 14 is connected to the electroplating power supply 7 outside heatproof electroplating bath 1 so that electroplating power supply 7, cathode 5, anode 6 and plating
Liquid 4 forms control loop, Vltrasonic device 12 is arranged in the bottom of heatproof electroplating bath 1, which generates ultrasonic field to electricity
Plating solution 4 is disperseed.
Set gradually insulation material layer 15 and water cooling dress from inside to outside wherein between magnetic field generator 3 and heating device 2
16 are set, water cooling plant 16 wraps up insulation material layer 15, and magnetic field generator 3 includes water cooling plant 16, and thermoelectricity is arranged in electroplate liquid 4
Even 17, the connecting line of the thermocouple 17 passes through plating capping 14 to be connected to the input terminal of temperature controller 18, on gas-guide tube 8 along into
Gas direction sets gradually pressure reducing valve 10, intake valve 11 and vent valve 13.
When specifically used
The present embodiment comprising magnetic field generator, electrode, power supply, gas cylinder, temperature controller etc. by forming, by the plating solution of particle size range
Particle is added in electroplate liquid, then the agitating mode of ultrasonic wave is used to be stirred electroplate liquid, after controlling stirring intensity, beaten
It opens magnetic field generator and electroplating power supply be electroplated under high-intensity magnetic field, realize particle in the certain journey of cathode surface under the influence of a magnetic field
Enrichment on degree, to be conducive to that the coating of qualification is made.
Concrete operation step is as follows:
(a) electroplate liquid has been configured, and has added granule particles, has added mechanical agitation to carry out using ultrasonic wave under no magnetic field
Pre- stirring, makes particle is substantially uniform to be suspended in electroplate liquid, and electroplate liquid is added in electroplating bath.
(b) by magnetic field generator, electroplating bath, intake valve, abandon the equipment such as valve, gas cylinder, ultrasonic unit and assemble
It is good.
(c) intake valve is opened, closing abandons valve, is inflated to electroplating bath, after pouring certain pressure intensity, turns off intake valve
And pressure reducing valve.And open ultrasonic unit.Then, magnetic field generator is opened, magnetic field intensity is regulated.
(d) it opens power supply to be electroplated, adjusts suitable current density and be electroplated, prepare qualified coating.
(e) after being electroplated, vent valve is opened, cathode is taken out, cleans and analyzed after drying.
Above-mentioned application on the electrode can be with power supply constant amplitude DC power supply, can be that duty ratio and frequency can
The pulse power of tune, can also be duty ratio, frequency and period can be reversed DC power supply, provide difference for electromagnetic viscosimeter process
The electric current of characteristic.Magnetic field generator can be the magnetic field that electromagnet generates, or permanent magnet is obtained using magnetic Circuit Design
Magnetic field, can also be using Bitter magnets, can be superconducting magnet, can be that Bitter magnets and superconducting magnet mix magnetic
The magnetic field that body provides, the magnetic induction intensity provided are 0.0001-45T.
Composite plating iron tests are carried out in magnetic field using the device of the present embodiment
The ingredient of the present embodiment electroplate liquid is:0.90mol/L FeSO4,0.15mol/LFeCl2,0.43mol/LNH4C1,
Reduced iron powder 1g/L, wetting agent are 2 drops of saturation neopelex solution/L, dispersant cetyl trimethylammonium bromide
0.5g/L, then the H2SO4 of 0.9mol/L, adjusting pH value are 1.5, and the pure silicon granules of 50g/L are added.It is filling peak diameter
The electroplate liquid 4 of 200 nanometers of silicon particle is placed in the heatproof electroplating bath 1 that capacity is 5L.
It is the low silicon silicon strips of 2wt% as silicon strip cathode 5, pure that use thickness, which for 0.5mm, length and width be 20mm, silicon content,
Iron plate is anode 6, and thickness 1mm is immersed in electroplate liquid 4, by cathode 5 and DC power supply(That is electroplating power supply 7)Cathode connect
It connects, pure iron piece Anodic 6 is connected with the anode of DC power supply 7, using temperature controller 18 and heating device 2 and thermoelectricity
Electroplate liquid 4 is heated to 30 DEG C and kept the temperature by even 17, while adjusting pressure reducing valve 10, and argon gas is made to pass through gas-guide tube 8 by electroplate liquid 4 by passing
In power transmission coating bath 1, pressure is controlled, opens ultrasonic unit 12, power 480W is then turned on composite plating DC power supply
7, adjustment DC current density is 2A/dm2;The magnetic field of Stationary Magnetic Field Generator for Magnetic 3 is provided by electromagnet, and magnetic induction intensity remains
14T.The direction of the magnetic line of force 19 is horizontal direction, vertical with electroplating current direction.
After the completion of composite electrodeposition, the Composite Coatings iron layer of high silicon is obtained, is measured through EDS (energy spectrum analysis), the compound plating iron
Layer silicone content is 18.25wt%, and coating is well combined with matrix.
Comparative example 1.
Identical with embodiment electroplating parameter, difference lies in magnetic field is not added with, cladding silicon granule content is only 3.22wt%,
And coating is combined preferably with matrix.
Comparative example 2.
It is identical with embodiment electroplating parameter, difference lies in magnetic field is not added with, it is not added with ultrasonic wave, cladding silicon granule content is only
For 1.56wt%, and the uniformity that particle is distributed on coating is poor, and coating combined with matrix it is poor.
The description of said program is the utility model being intended to facilitate those of ordinary skill in the art to understand and use,
Person skilled in the art obviously easily can make various modifications to embodiment, and therefore, the utility model is unlimited
In above-mentioned real scheme, those skilled in the art's method according to the present utility model does not depart from what the utility model scope was made
It improves and modification should be all within the protection scope of the utility model.
Claims (4)
1. adding pressure type disperses electroplanting device, including heatproof electroplating bath (1) and heating device (2) under a kind of high-intensity magnetic field, feature exists
In:The surrounding of heating device (2) the package heatproof electroplating bath (1), magnetic field generator (3) wrap up heating device (2), temperature controller
(18) it is connected to realization with heating device (2) to control heating device (2), magnetic field (19) direction which generates
Straight up, electroplate liquid (4) to be injected in heatproof electroplating bath (1), the setting plating capping at the top of heatproof electroplating bath (1)
(14) realize that the sealing to heatproof electroplating bath (1), the outlet side of gas-guide tube (8) pass through plating capping (14) and heatproof electroplating bath
(1) it is connected to, the inlet end of the gas-guide tube (8) is connected to the gas cylinder (9) equipped with compressed gas, and cathode (5) and anode (6) are inserted in
In electroplate liquid (4) and the connecting line of the cathode (5) and anode (6) is each passed through plating capping (14) and is located at heatproof electroplating bath
(1) external electroplating power supply (7) connection so that electroplating power supply (7), cathode (5), anode (6) and electroplate liquid (4) formation control back
Road, in the bottom of heatproof electroplating bath (1) setting Vltrasonic device (12), which generates ultrasonic field to electroplate liquid (4)
Disperseed.
2. adding pressure type disperses electroplanting device under a kind of high-intensity magnetic field according to claim 1, it is characterised in that:Occur in magnetic field
Insulation material layer (15) and water cooling plant (16), water cooling plant are set gradually between device (3) and heating device (2) from inside to outside
(16) package insulation material layer (15), magnetic field generator (3) includes water cooling plant (16).
3. adding pressure type disperses electroplanting device under a kind of high-intensity magnetic field according to claim 1, it is characterised in that:In electroplate liquid
(4) setting thermocouple (17) in, the connecting line of the thermocouple (17) pass through the input terminal of plating capping (14) and temperature controller (18)
Connection.
4. adding pressure type disperses electroplanting device under a kind of high-intensity magnetic field according to claim 1, it is characterised in that:In gas-guide tube
(8) pressure reducing valve (10), intake valve (11) and vent valve (13) are set gradually along airintake direction on.
Priority Applications (1)
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CN201721343850.7U CN207672144U (en) | 2017-10-18 | 2017-10-18 | Adding pressure type disperses electroplanting device under a kind of high-intensity magnetic field |
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CN201721343850.7U CN207672144U (en) | 2017-10-18 | 2017-10-18 | Adding pressure type disperses electroplanting device under a kind of high-intensity magnetic field |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110904486A (en) * | 2019-12-10 | 2020-03-24 | 戴鹏 | High-efficient aluminium alloy oxidation tank |
CN112301393A (en) * | 2020-10-30 | 2021-02-02 | 中冶赛迪技术研究中心有限公司 | Equipment and process for nano composite electroplating of inner surface of metal pipe fitting |
CN115305559A (en) * | 2022-09-01 | 2022-11-08 | 温州泰钰新材料科技有限公司 | Plating solution dispersing method |
-
2017
- 2017-10-18 CN CN201721343850.7U patent/CN207672144U/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110904486A (en) * | 2019-12-10 | 2020-03-24 | 戴鹏 | High-efficient aluminium alloy oxidation tank |
CN112301393A (en) * | 2020-10-30 | 2021-02-02 | 中冶赛迪技术研究中心有限公司 | Equipment and process for nano composite electroplating of inner surface of metal pipe fitting |
CN112301393B (en) * | 2020-10-30 | 2021-12-07 | 中冶赛迪技术研究中心有限公司 | Equipment and process for nano composite electroplating of inner surface of metal pipe fitting |
CN115305559A (en) * | 2022-09-01 | 2022-11-08 | 温州泰钰新材料科技有限公司 | Plating solution dispersing method |
CN115305559B (en) * | 2022-09-01 | 2023-10-13 | 温州泰钰新材料科技有限公司 | Plating solution dispersion method |
WO2024046426A1 (en) * | 2022-09-01 | 2024-03-07 | 温州泰钰新材料科技有限公司 | Plating solution dispersion method |
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