CN207611766U - Lead frame, array of lead frames and packaging body - Google Patents
Lead frame, array of lead frames and packaging body Download PDFInfo
- Publication number
- CN207611766U CN207611766U CN201721542177.XU CN201721542177U CN207611766U CN 207611766 U CN207611766 U CN 207611766U CN 201721542177 U CN201721542177 U CN 201721542177U CN 207611766 U CN207611766 U CN 207611766U
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- Prior art keywords
- pin
- type
- chip
- lead frame
- dao
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of lead frame, array of lead frames and packaging body, the lead frame includes a Ji Dao for placing an at least chip, at least one first kind pin being connect with Ji Dao and at least one Second Type pin that can be connect using metal lead wire with chip, the width of first kind pin is more than the width of Second Type pin, there is a long and narrow notch at the rib cutting of the one end of first kind pin far from the Ji Dao, first kind pin end part is segmented into two parts by long and narrow notch, after lead frame is encapsulated by plastic-sealed body, first kind pin is partially protrude through plastic-sealed body with long and narrow notch.The utility model advantage is, at the rib cutting of first kind pin, first kind pin is divided into two parts by the long and narrow notch, reduces stress of the first kind pin at rib cutting, it solves the problems, such as to be not easy Trim Molding, avoids the risk that the plastic-sealed body of packaging body is secretly split.
Description
Technical field
The utility model is related to a kind of field of semiconductor package more particularly to lead frame, array of lead frames and encapsulation
Body.
Background technology
Inexpensive ultrathin type heat dissipation type high patch encapsulation is always the developing way of semiconductor packages, with chip technology skill
The progress of art, chip area is smaller and smaller, therefore packaging body is also because the variation of chip area experienced big packaging body, large chip；
Big packaging body, small chip；Small package body, small chip these three developing stage, at the same also produce SOP, ESOP, DFN, QFN,
The encapsulated types such as SOT.
As country vigorously advocates environmental protection and energy saving, LED illumination industry, LED illumination is helped to welcome spring, LED drives skill
Art innovation is advanced by leaps and bounds, and LED chip area is smaller and smaller, and power is increasing, and the use environment increasingly limit, cooling requirements are got over
Come higher, market competition is increasingly fierce, and Cost Competition is especially prominent.The shortcomings that traditional patch encapsulated type is, some envelopes
The islands Zhuan Tiji area is small, but thermal diffusivity is bad；The thermal diffusivity of some packaging bodies is good, but base island area is big, and chip area is small, returns
Have security risk after fluid welding, cost performance is not high, therefore, traditional patch encapsulated type cannot be satisfied packaging body it is low at
Originally, ultrathin, high heat dispersion requirement.
Therefore, there is an urgent need for a kind of novel array of lead frames and packaging body come overcome existing product there are the shortcomings that.
Utility model content
Technical problem to be solved by the utility model is to provide a kind of lead frame, array of lead frames and packaging body,
It can reduce the stress of first kind pin Trim Molding, while can avoid the risk that plastic-sealed body is secretly split.
To solve the above-mentioned problems, the utility model provides a kind of lead frame, including one is used to place an at least core
The islands Pian Ji, at least one first kind pin being connect with the Ji Dao and it is at least one can with the chip use metal
The Second Type pin of lead connection, the width of the first kind pin is more than the width of the Second Type pin, described
There is a long and narrow notch, the long and narrow notch is by the first kind at the rib cutting of the one end of first kind pin far from the Ji Dao
The end of type pin is divided into two parts, and after the lead frame is encapsulated by plastic-sealed body, the first kind pin has institute
That states long and narrow notch is partially protrude through the plastic-sealed body.
In one embodiment, the Ji Dao includes for the blank except the chip region of chip placement and the chip region
Area is provided at least one mode locking hole in the clear area, and the mode locking hole is used to enhance the lead frame and plastic-sealed body
Binding force.
In one embodiment, the side being connect with the first kind pin in the clear area is arranged in the mode locking hole
And/or the side not connect with the first kind pin in the clear area is set.
In one embodiment, the first kind pin is separately positioned on the two of the Ji Dao with the Second Type pin
Side.
In one embodiment, with the first kind pin homonymy, also have a third type pins, the third class
Type pin is connect with the Ji Dao, and the third type pins are identical as the first kind pin function.
In one embodiment, with the first kind pin homonymy, or have a third type pins, the third
Type pins can be connect with the chip using metal lead wire, and the third type pins are with the Second Type pin
Functional leads.
In one embodiment, the width of the long and narrow notch is the 0.13~0.24 of the width of the first kind pin
Times.
The utility model also provides a kind of array of lead frames, including multiple above-mentioned lead frames, multiple lead frames
Between by frame connect muscle connection, the one end of the first kind pin far from the Ji Dao connects muscle with the frame and connect.
The utility model also provides a kind of packaging body, including lead frame described in a lead frame, at least a chip and plastic packaging
The plastic-sealed body of frame and the chip；The lead frame includes that Ji Dao, at least one first kind being connect with the Ji Dao are drawn
Foot and at least one Second Type pin that can be connect using metal lead wire with the chip；The width of the first kind pin
For degree more than the width of the Second Type pin, the first kind pin has a long and narrow notch, and the long and narrow notch is by institute
The end for stating first kind pin is divided into two parts；The chip is arranged on the Ji Dao, the Second Type pin with
The chip is connected by metal lead wire；The first kind pin has the part of the long and narrow notch and the Second Type
Pin protrudes from the plastic-sealed body.
In one embodiment, the chip region and the clear area except the chip region that the Ji Dao includes chip placement,
The clear area is provided at least one mode locking hole, and the plastic-sealed body fills the mode locking hole, and the mode locking hole is for enhancing institute
State the binding force of lead frame and the plastic-sealed body.
In one embodiment, the side being connect with the first kind pin in the clear area is arranged in the mode locking hole
And/or the side not connect with the first kind pin in the clear area is set.
In one embodiment, the first kind pin is separately positioned on the two of the Ji Dao with the Second Type pin
Side.
In one embodiment, with the first kind pin homonymy, or have a third type pins, the third
Type pins are connect with the Ji Dao, and the first kind pin is identical as the third type pins function.
In one embodiment, with the first kind pin homonymy, or have a third type pins, the third
Type pins can be connect with the chip using metal lead wire, and the Second Type pin is with the third type pins
Functional leads.
In one embodiment, the width of the long and narrow notch is the 0.13~0.24 of the width of the first kind pin
Times.
The utility model has the advantage of under the premise of ensureing first kind pin heat dissipation performance, draw in the first kind
Long and narrow notch is arranged in the junction that foot and frame connect muscle, and at the rib cutting of the first kind pin, the long and narrow notch is by the
One type pins are divided into two parts, reduce stress of the first kind pin at rib cutting, solve and be not easy Trim Molding
Problem, while avoiding the risk that plastic-sealed body is secretly split.
Description of the drawings
Fig. 1 is the planar structure schematic diagram of the utility model lead frame first embodiment；
Fig. 2 is the planar structure schematic diagram of the utility model lead frame second embodiment；
Fig. 3 is the planar structure schematic diagram of the utility model lead frame 3rd embodiment；
Fig. 4 is the planar structure schematic diagram of the utility model lead frame fourth embodiment；
Fig. 5 is the structural schematic diagram of the utility model array of lead frames；
Fig. 6 A are the overlooking structure diagrams of the first embodiment of the utility model packaging body；
Fig. 6 B are the side structure schematic views of the first embodiment of the utility model packaging body；
Fig. 6 C are another structural schematic diagrams of the first embodiment of the utility model packaging body；
Fig. 7 is the structural schematic diagram of the second embodiment of the utility model packaging body.
Specific implementation mode
Below in conjunction with the accompanying drawings to the specific implementation of lead frame provided by the utility model, array of lead frames and packaging body
Mode elaborates.
Fig. 1 is the planar structure schematic diagram of the utility model lead frame first embodiment.It is shown in Figure 1, this reality
An independent packaging body can be formed after (being shown in Fig. 6 C) plastic packaging with chip 20 with novel lead frame 10, wherein drawing
The packaging line 40 of wire frame 10 is gone out using dotted line frame schematic indication.The lead frame 10 includes a base island 11, at least one
First kind pin 12 and at least one Second Type pin 13.In the first embodiment, one first is schematically shown
Type pins 12 and three Second Type pins 13, the first kind pin 12 are respectively set with the Second Type pin 13
Both sides in the base island 11, in other embodiments, 13 not limited to of the first kind pin 12 and Second Type pin,
As long as meeting the purpose of this utility model.
At least one chip can be placed on the surface on the base island 11.For multi-chip package, the table on the base island 11
Face can place two chips, three chips, even four chips.The first kind pin 12 is connect with the base island 11,
It is electrically connected as the main heat dissipation pin and functional leads on the base island 11 with the external world.The Second Type pin 13 not with institute
The islands Shu Ji 11 are directly connected to, and can be connected using metal lead wire 21 (being shown in Fig. 6 C) with the chip being arranged on base island 11
It connects, multiple Second Type pins 13 can be respectively connected to the different chips on base island 11, the Second Type pin
13 as follow-up packaging body functional leads with the external world be electrically connected.In other embodiments, the first kind pin 12 with
The base island 11 or the chip being arranged on Ji Dao can also use metal lead wire 21 to connect.
Wherein, the width of the first kind pin 12 is more than the width of the Second Type pin 13, the advantage is that,
The width for increasing main heat dissipation pin, improves the performance that the packaging body after plastic packaging is radiated outward by pin.It is new in this practicality
In type, the width of the width of the first kind pin 12 and the Second Type pin 13 refers to after plastic packaging, Ge Geyin
Foot protrudes from the width of the part of plastic-sealed body.
There is a long and narrow notch 14 at the rib cutting of the one end of the first kind pin 12 far from the base island 11.It is described narrow
The end of the first kind pin 12 is divided into two parts by long nick 14, is encapsulated by plastic-sealed body in the lead frame 10
Afterwards, there is the first kind pin 12 plastic-sealed body 30 that is partially protrude through of the long and narrow notch 14 (to be shown in Fig. 6 A
In).It refers to cutting 12 position of first kind pin before packaging or after packaging at the rib cutting, as dotted line A is marked in Fig. 1
The position shown.Due to the wider width of the first kind pin 12, stress is larger, in cutting step, is not easy to cut
It is disconnected, the risk brought problem to Trim Molding, and there is plastic-sealed body secretly to split.In the present invention, the first kind pin 12
There is a long and narrow notch 14, the long and narrow notch 14 is by the first kind pin at the rib cutting of one end far from the base island 11
12 are divided into two so that the stress of the Trim Molding of the first kind pin 12 reduces, and solves the difficulty for being not easy Trim Molding
Topic, while also avoiding the risk that plastic-sealed body is secretly split.Preferably, the width of the long and narrow notch 14 is the first kind pin
0.13~0.24 times of 12 width, for example, 0.15 times, 0.17 times, 0.20 times, 0.22 times etc., it the advantage is that, ensureing to dissipate
It under the premise of hot property is basically unchanged, solves the problems, such as Trim Molding, while also avoiding the risk that plastic-sealed body is secretly split.
Further, in the present embodiment, with 12 homonymy of first kind pin, also have a third type pins
15.The third type pins 15 are directly connected to the base island 11, and the third type pins 15 are drawn with the first kind
12 function of foot is identical, is heat dissipation pin.In the present embodiment, the width of the third type pins 15 is less than the first kind
The stress of the width of type pin 12, the third type pins 15 does not interfere with Trim Molding, therefore in the third type pins
Long and narrow notch is not set on 15.In other embodiments, if the wider width of the third type pins 15, stress influence
Long and narrow notch then can be also arranged in Trim Molding in third type pins 15, and to solve, stress is excessive to be brought to Trim Molding
Problem.
Fig. 2 is the planar structure schematic diagram of the second embodiment of the utility model lead frame.It is shown in Figure 2, institute
Stating second embodiment, difference lies in the third type pins 15 do not connect with base island 11 directly with the first embodiment
It connects, the third type pins 15 can be connect with the chip being arranged on base island 11 using metal lead wire 21, the third class
Type pin 15 is identical as the effect of the Second Type pin 13, is electrically connected with the external world as the functional leads of follow-up packaging body
It connects.
Fig. 3 is the planar structure schematic diagram of the 3rd embodiment of the utility model lead frame.It is shown in Figure 3, institute
Stating 3rd embodiment, difference lies in the base island 11 includes the chip region 110 for chip placement with the first embodiment
And the clear area 111 except the chip region 110.In practical structures, due to the chip region 110 and the clear area 111
Apparent line of demarcation is had no, therefore schematically indicates the range of chip region 110 using dotted line frame in figure 3.In practical structures
In, the region that chip occupies is exactly chip region 110, and the region that chip does not occupy is exactly clear area 111.In the clear area
111 are provided at least one mode locking hole 16, and the mode locking hole 16 can run through the lead frame 10 along longitudinal direction, can also only edge
It is longitudinally concave and and not through the lead frame 10.The effect in the mode locking hole 16 is to enhance the lead frame 10 with after
The binding force of the plastic-sealed body 30 of continuous packaging technology.Existing product encapsulation volume is small, and encapsulating intensity is weaker, and product is easy layering,
And the design in the utility model mode locking hole 16, the binding force of lead frame 10 and plastic-sealed body 30 is increased, product is avoided to be layered, together
When again promoted product reliability.
In this third embodiment, the mode locking hole 16 is arranged in the clear area 111 and the first kind pin 12
The side of connection.To the shape in the mode locking hole 16 without limiting, shape can carry out the utility model according to installation position
Adjustment.In the utility model other embodiment, the mode locking hole 16 can be arranged in the clear area 111 not with described first
The side that type pins 12 connect.For the utility model to the quantity in the mode locking hole 16 also without limiting, quantity can root
According to being set, for example, can be according to the chip area being arranged on Ji Dao, the combination of lead frame 10 and plastic-sealed body 30
Power excellent degree is set.Preferably, shown in Figure 4 in the utility model fourth embodiment, in the blank
The side and the clear area 111 that area 111 is connect with the first kind pin 12 are not connect with the first kind pin 12
Side be both provided with the mode locking hole 16, this further improves the combinations of the lead frame 10 and plastic-sealed body 30.
The utility model also provides a kind of array of lead frames, and Fig. 5 is a reality of the utility model array of lead frames
The planar structure schematic diagram of example is applied, shown in Figure 5, the array of lead frames includes multiple lead frames 10, described to draw
The structure of wire frame 10 is identical as the structure of previously described lead frame, repeats no more, in the present embodiment, with the lead
Lead frame of the lead frame 10 of the first embodiment of frame array as the array of lead frames.The lead frame 10
Between muscle 1 connected by frame connect, the one end of the first kind pin 12 far from the base island 11 and the frame connect the company of muscle 1
It connects, then connects muscle 1 close to the frame at the rib cutting of the first kind pin 12.
The utility model also provides a kind of packaging body, and Fig. 6 A are the vertical view knots of the first embodiment of the utility model packaging body
Structure schematic diagram, Fig. 6 B are the side structure schematic views of the first embodiment of the utility model packaging body, and Fig. 6 C are the utility model
Another structural schematic diagram of the first embodiment of packaging body, wherein the structure of the utility model packaging body for a clear description,
In Fig. 6 C, the structure of the lead frame inside plastic-sealed body 30 is shown out.It refers to shown in Fig. 6 A, Fig. 6 B and Fig. 6 C, the envelope
It includes the plastic-sealed body 30 of lead frame 10 and the chip 20 described in a lead frame 10, at least a chip 20 and plastic packaging to fill body.
The structure of the lead frame 10 is identical as the structure of previously described lead frame, repeats no more, in the present embodiment, with institute
State lead frame of the first embodiment of lead frame as the packaging body.Wherein, the chip 20 is arranged in the Ji Dao
On 11, the Second Type pin 13 is connect by metal lead wire 21 with the chip 20, and the first kind pin 12 has
The part of the long and narrow notch 14 and the Second Type pin 13 protrude from the plastic-sealed body 30, and the plastic-sealed body 30 is along described
The packaging area of lead frame 10 encapsulates the lead frame 10 and the chip 20.Fig. 7 is the of the utility model packaging body
The structural schematic diagram of two embodiments, it is shown in Figure 7, in this embodiment, and the clear area on base island 11, the plastic-sealed body 30
The mode locking hole 16 is filled, the mode locking hole 16 is used to enhance the binding force of the lead frame 10 and the plastic-sealed body 30.
The utility model is under the premise of ensureing the first kind 12 heat dissipation performance of pin, in first kind pin 12 far from institute
Long and narrow notch 14 is set at the rib cutting of the one end on the islands Shu Ji 11, and the long and narrow notch 14 punishes the rib cutting of first kind pin 12
Two parts are segmented into, stress of the first kind pin 12 at rib cutting is reduced, solves the problems, such as to be not easy Trim Molding, keep away simultaneously
The risk that plastic-sealed body 30 is secretly split is exempted from.Further, it for the ease of identifying the starting pin (i.e. PIN1) of packaging body, can also rise
Mark is set on the corresponding plastic-sealed body of beginning pin.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the scope of protection of the utility model.
Claims (15)
1. a kind of lead frame, which is characterized in that including one for placing at least Ji Dao of a chip, at least one and base
The first kind pin of island connection and at least one Second Type pin that can be connect using metal lead wire with the chip, institute
The width for stating first kind pin is more than the width of the Second Type pin, and the first kind pin is far from the Ji Dao's
There is a long and narrow notch, the long and narrow notch end of the first kind pin is divided into two parts at the rib cutting of one end,
After the lead frame is encapsulated by plastic-sealed body, the first kind pin has being partially protrude through for the long and narrow notch described
Plastic-sealed body.
2. lead frame according to claim 1, which is characterized in that the Ji Dao includes the chip region for chip placement
And the clear area except the chip region, the clear area is provided at least one mode locking hole, the mode locking hole is for enhancing
The binding force of the lead frame and plastic-sealed body.
3. lead frame according to claim 2, which is characterized in that mode locking hole setting the clear area with it is described
The side and/or the side not connect with the first kind pin in the clear area is set that first kind pin connects.
4. lead frame according to claim 1, which is characterized in that the first kind pin draws with the Second Type
Foot is separately positioned on the both sides of the Ji Dao.
5. lead frame according to claim 4, which is characterized in that with the first kind pin homonymy, also have
One third type pins, the third type pins are connect with the Ji Dao, the third type pins and the first kind
Pin function is identical.
6. lead frame according to claim 4, which is characterized in that with the first kind pin homonymy, or tool
There are a third type pins, the third type pins that can be connect using metal lead wire with the chip, the third type
Pin and the Second Type pin are functional leads.
7. lead frame according to claim 1, which is characterized in that the width of the long and narrow notch is the first kind
0.13~0.24 times of the width of pin.
8. a kind of array of lead frames, which is characterized in that including multiple such as claim 1-7 any one of them lead frames,
Muscle connection, the one end of the first kind pin far from the Ji Dao and the frame are connected by frame between multiple lead frames
Even muscle connection.
9. a kind of packaging body, which is characterized in that including lead frame described in a lead frame, at least a chip and plastic packaging and described
The plastic-sealed body of chip；The lead frame includes Ji Dao, at least one first kind pin being connect with the Ji Dao and at least
One can use the Second Type pin that metal lead wire is connect with the chip；The width of the first kind pin is more than institute
State the width of Second Type pin, the first kind pin has a long and narrow notch, and the long and narrow notch is by the first kind
The end of type pin is divided into two parts；The chip is arranged on the Ji Dao, the Second Type pin and the chip
It is connected by metal lead wire；There is the first kind pin part of the long and narrow notch and the Second Type pin to protrude
In the plastic-sealed body.
10. packaging body according to claim 9, which is characterized in that the Ji Dao includes chip region and the institute of chip placement
The clear area except chip region is stated, the clear area is provided at least one mode locking hole, the plastic-sealed body fills the mode locking
Hole, the mode locking hole are used to enhance the binding force of the lead frame and the plastic-sealed body.
11. packaging body according to claim 10, which is characterized in that mode locking hole setting the clear area with it is described
The side and/or the side not connect with the first kind pin in the clear area is set that first kind pin connects.
12. packaging body according to claim 9, which is characterized in that the first kind pin draws with the Second Type
Foot is separately positioned on the both sides of the Ji Dao.
13. packaging body according to claim 12, which is characterized in that with the first kind pin homonymy, or tool
There are a third type pins, the third type pins to be connect with the Ji Dao, the first kind pin and the third class
Type pin function is identical.
14. packaging body according to claim 12, which is characterized in that with the first kind pin homonymy, or tool
There are a third type pins, the third type pins that can be connect using metal lead wire with the chip, the Second Type
Pin and the third type pins are functional leads.
15. packaging body according to claim 9, which is characterized in that the width of the long and narrow notch is the first kind
0.13~0.24 times of the width of pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721542177.XU CN207611766U (en) | 2017-11-17 | 2017-11-17 | Lead frame, array of lead frames and packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721542177.XU CN207611766U (en) | 2017-11-17 | 2017-11-17 | Lead frame, array of lead frames and packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207611766U true CN207611766U (en) | 2018-07-13 |
Family
ID=62794593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721542177.XU Active CN207611766U (en) | 2017-11-17 | 2017-11-17 | Lead frame, array of lead frames and packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207611766U (en) |
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2017
- 2017-11-17 CN CN201721542177.XU patent/CN207611766U/en active Active
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