CN207604112U - A kind of radiator for the single tube that generates heat - Google Patents
A kind of radiator for the single tube that generates heat Download PDFInfo
- Publication number
- CN207604112U CN207604112U CN201721514206.1U CN201721514206U CN207604112U CN 207604112 U CN207604112 U CN 207604112U CN 201721514206 U CN201721514206 U CN 201721514206U CN 207604112 U CN207604112 U CN 207604112U
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- single tube
- conducting medium
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 206010037660 Pyrexia Diseases 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is related to a kind of radiators for the single tube that generates heat, and including fever single tube, heat-conducting medium and radiator, the heat-conducting medium is folded between fever single tube and radiator, card slot is offered on the radiator, the heat-conducting medium is fastened in card slot.By offering card slot on a heat sink, heat-conducting medium is fastened in card slot, and such heat-conducting medium is positioned, it is impossible to be slided, so as to greatly improve installation effectiveness and quality.
Description
Technical field
The utility model is related to photovoltaic DC-to-AC converter technical field, particularly a kind of radiator for the single tube that generates heat.
Background technology
The radiator of traditional single tube mainly includes fever single tube and radiator, during installation, between the surface of radiator
Heat-conducting medium is placed, then single tube is mounted on heat-conducting medium again, heat-conducting medium is placed directly in radiator without fixed form
On.When single tube is generated heat in installation, heat-conducting medium easily slides this mounting means, so as to which the fraction defective of quality can be caused very high,
Efficiency of assembling is low.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of radiator for the single tube that generates heat, it is intended to solve existing
There is heat-conducting medium without fixed form, easily slide, cause the problem of quality fraction defective is high, and efficiency of assembling is low.
Technical solution is used by the utility model solves its technical problem：A kind of heat dissipation dress for the single tube that generates heat is provided
It puts, including fever single tube, heat-conducting medium and radiator, the heat-conducting medium is folded between fever single tube and radiator, institute
It states and card slot is offered on radiator, the heat-conducting medium is fastened in card slot.
Further, baffle is provided in the card slot, card slot is separated into the groove body that can place multiple heat-conducting mediums.
Further, the radiator of the fever single tube further includes circuit board, and the fever single tube is mounted on circuit board
On.
Further, the circuit board is detachably arranged on the radiator.
Further, the support column for being used to support circuit board is provided on the radiator, when circuit board is mounted on heat dissipation
When on device, the fever single tube is against heat-conducting medium.
Further, threaded hole is offered on the support column, offers on the circuit board and determines with what threaded hole coordinated
Position hole；Make circuit board be installed on a heat sink in a manner that screw is screwed into location hole and threaded hole.
Further, if being also equipped with dry condenser on the circuit board.
Further, the heat-conducting medium is ceramic substrate or silica gel piece.
Further, the heat-conducting medium is ceramic substrate, and the depth of the card slot is identical with the thickness of ceramic substrate.
Relative to the prior art, a kind of radiator for the single tube that generates heat provided by the utility model, by a heat sink
Card slot is offered, heat-conducting medium is fastened in card slot, and such heat-conducting medium is positioned, it is impossible to slide, so as to greatly improve installation
Efficiency and quality.
Description of the drawings
Below in conjunction with accompanying drawings and embodiments, the utility model is described in further detail, in attached drawing：
Fig. 1 is the structure diagram of the radiator of fever single tube provided by the utility model；
Fig. 2 is the structure diagram of heater and heat-conducting medium in Fig. 1；
Fig. 3 is the assembling schematic diagram of Fig. 1.
Specific embodiment
In conjunction with attached drawing, elaborate to the preferred embodiment of the utility model.
As illustrated in fig. 1 and 2, the utility model provides a kind of radiator for the single tube that generates heat, including fever single tube 10, heat conduction
Medium 20 and radiator 30.Heat-conducting medium 20 is folded between fever single tube 10 and radiator 30, is offered on radiator 30
Card slot 31, heat-conducting medium 20 are fastened in card slot 31.By offering card slot 31 on radiator 30, heat-conducting medium 20 is fastened on
In card slot 31, such heat-conducting medium 20 is positioned, it is impossible to be slided, so as to greatly improve installation effectiveness and quality.
In the present embodiment, card slot 31 has multiple, and each card slot 31 places a heat-conducting medium 30.
In other embodiments, card slot 31 has multiple, and baffle is provided in card slot 31, card slot 31 is separated into can place it is more
The groove body of a heat-conducting medium 20.It is convenient for the processing of card slot 31 in this way, only need to first process a big card slot and then baffle point is set
Multiple groove bodies are divided into, complete the positioning of multiple heat-conducting mediums 20.
Specifically, heat-conducting medium 20 is preferably ceramic substrate or silica gel piece.In the present embodiment, heat-conducting medium 20 is ceramics
Substrate, the depth of card slot 31 are identical with the thickness of ceramic substrate.Ceramic substrate is concordant with card slot 31 to be conducive to the single tube 10 that generates heat
Installation.
Further, the radiator of single tube of generating heat further includes circuit board 40, and fever single tube 10 is mounted on circuit board 40,
If dry condenser 50 is also equipped on circuit board 40.Circuit board 40 is detachably arranged on radiator 30.In the present embodiment,
The side that radiator 30 is connect with circuit board is provided with fixed plate 60, and the branch for being used to support circuit board 40 is provided in fixed plate 60
Dagger 33 makes to form the space for accommodating fever single tube 10 between radiator 30 and circuit board 40, when circuit board 40 is mounted on heat dissipation
When on device 30, fever single tube 10 is conducive to the conduction (as shown in Figure 3) of heat against heat-conducting medium 20.Wherein, fixed plate 60 is
Metallic plate strengthens fixed function.
In the present embodiment, threaded hole is offered on support column 33, offers on circuit board 40 and determines with what threaded hole coordinated
Position hole 41.Circuit board 40 is made to be mounted on radiator 30 in a manner that screw is screwed into location hole and threaded hole 41.
It should be understood that above example is only to illustrate the technical solution of the utility model, it is rather than its limitations, right
For those skilled in the art, it can modify to the technical solution recorded in above-described embodiment or to which part skill
Art feature carries out equivalent replacement；And all such modifications and replacement, it should all belong to the protection of the appended claims for the utility model
Range.
Claims (10)
1. a kind of radiator for the single tube that generates heat, including fever single tube, heat-conducting medium and radiator, the heat-conducting medium sandwiched
Between fever single tube and radiator, which is characterized in that card slot is offered on the radiator, the heat-conducting medium is fastened on card
In slot.
2. radiator according to claim 1, which is characterized in that be provided with baffle in the card slot, card slot is separated
Into the groove body that can place multiple heat-conducting mediums.
3. radiator according to claim 1 or 2, which is characterized in that the radiator of the fever single tube further includes
Circuit board, the fever single tube installation is on circuit boards.
4. radiator according to claim 3, which is characterized in that the circuit board is detachably arranged in the heat dissipation
On device.
5. radiator according to claim 4, which is characterized in that the side setting that the radiator is connect with circuit board
There is fixed plate, the support column for being used to support circuit board is provided in the fixed plate, when circuit board is mounted in fixed plate, institute
Fever single tube is stated against heat-conducting medium.
6. radiator according to claim 5, which is characterized in that threaded hole, the electricity are offered on the support column
The location hole coordinated with threaded hole is offered on the plate of road；Pacify circuit board in a manner that screw is screwed into location hole and threaded hole
Dress is on a heat sink.
7. radiator according to claim 6, which is characterized in that if being also equipped with dry condenser on the circuit board.
8. radiator according to claim 7, which is characterized in that the heat-conducting medium is ceramic substrate or silica gel piece.
9. radiator according to claim 8, which is characterized in that the heat-conducting medium be ceramic substrate, the card slot
Depth it is identical with the thickness of ceramic substrate.
10. radiator according to claim 9, which is characterized in that the fixed plate is metallic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721514206.1U CN207604112U (en) | 2017-11-14 | 2017-11-14 | A kind of radiator for the single tube that generates heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721514206.1U CN207604112U (en) | 2017-11-14 | 2017-11-14 | A kind of radiator for the single tube that generates heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207604112U true CN207604112U (en) | 2018-07-10 |
Family
ID=62759225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721514206.1U Active CN207604112U (en) | 2017-11-14 | 2017-11-14 | A kind of radiator for the single tube that generates heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207604112U (en) |
-
2017
- 2017-11-14 CN CN201721514206.1U patent/CN207604112U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong, Shenzhen, Baoan District, Baoan District City, the third floor of the community of 13A, Wutong Industrial Park, 4 layers and 5 stories. Patentee after: Shenzhen Shuorixin Energy Technology Co.,Ltd. Address before: 4-5F, Building 13A, Taihua wutong Industrial Park, Gushu Development Zone, Hangcheng Street, Bao'an District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN SHUORI NEW ENERGY TECHNOLOGY Co.,Ltd. |