CN207489679U - A kind of radiator for capacitor case - Google Patents
A kind of radiator for capacitor case Download PDFInfo
- Publication number
- CN207489679U CN207489679U CN201721697123.0U CN201721697123U CN207489679U CN 207489679 U CN207489679 U CN 207489679U CN 201721697123 U CN201721697123 U CN 201721697123U CN 207489679 U CN207489679 U CN 207489679U
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- heat
- shell
- radiator
- dissipating layer
- capacitor case
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Abstract
The utility model discloses a kind of radiators for capacitor case, including shell, cover and radiator, the cover is connected to the cover top portion, the radiator is set to inside the shell wall of the shell, the radiator includes heat-sink shell and heat dissipating layer, the heat-sink shell is set to the inside of the heat dissipating layer, the heat-sink shell is formed by heat absorbing sheet and with heat insulation foam, the heat absorbing sheet is set to the top of the heat insulation foam, several filling mouths are offered in the heat insulation foam, semiconductor refrigeration chip is provided in the filling mouth, the heat dissipating layer is made of radiating piece and axial flow blower, the radiating piece is set to the right side of the axial flow blower.Advantageous effect：The heat that directly can be effectively absorbed by the radiator on the shell of heat of the utility model, and occupy little space and it is safe to use, heat dissipation effect is apparent so that job stability, processing safety and the service life of electronic product.
Description
Technical field
The utility model is related to capacitor area, it particularly relates to a kind of radiator for capacitor case
Background technology
In social fast-developing so that various electric equipment products are all towards miniaturization, lightweight, densification and efficient
Change direction to develop, so grown rapidly with high-power electronic product, and resulting a large amount of heat does not dissipate
Job stability, processing safety and the service life that hair space will directly affect electronic product, the conventional type of cooling is
Through the cooling requirements of high power electronic product cannot be met, so just having to improve the rate of heat dissipation of electronic product.
For the problems in the relevant technologies, currently no effective solution has been proposed.
Utility model content
For the problems in the relevant technologies, the utility model proposes a kind of radiator for capacitor case, with gram
Take the above-mentioned technical problem present in existing the relevant technologies.
What the technical solution of the utility model was realized in：
A kind of radiator for capacitor case, including shell, cover and radiator, the cover are connected to institute
Cover top portion is stated, the radiator is set to inside the shell wall of the shell, and the radiator includes heat-sink shell and heat dissipation
Layer, the heat-sink shell are set to the inside of the heat dissipating layer.
The heat-sink shell is formed by heat absorbing sheet and with heat insulation foam, and the heat absorbing sheet is set to the top of the heat insulation foam, institute
It states and several filling mouths is offered in heat insulation foam, be provided with semiconductor refrigeration chip in the filling mouth, the heat dissipating layer is by radiating
Part and axial flow blower composition, the radiating piece are set to the inside of the axial flow blower, are offered on the outside of the axial flow blower
Ventilation duct, the both ends of the ventilation duct connect the ventilation opening for being opened in the shell both ends respectively.
Further, it is enclosed with absorber plate outside the heat absorbing sheet.
Further, venthole is offered between two adjacent filling mouths.
Further, counnter attack heat sink is equipped between the heat-sink shell and the heat dissipating layer.
Further, it is fixedly connected with dust excluding plate on the ventilation opening.
The beneficial effects of the utility model：Heat turn is carried out by the heat-sink shell and using the semiconductor refrigeration chip
It moves, is conducive to concentrate heat absorption, accelerated heat transmits the cooling rate for substantially increasing the shell, then adopts through the absorber plate
Increasing radiator heat exchange area, significantly more efficient heat transfer, then pass through the radiating piece in the heat dissipating layer
Heat is further absorbed, then heat is dispersed by the axial flow blower, heat is discharged by institute by the ventilation duct
It states in shell, adequately achievees the purpose that heat dissipation, add the counnter attack heat sink so that heat will not reversely flow into the shell
In, it is significantly more efficient to radiate, the dust excluding plate is added at the ventilation opening so that external dust is not easily accessible outside described
Inside shell, it can effectively increase the service life of the utility model, the utility model can be filled directly by the heat dissipation
Be set effective absorption heat the shell on heat, and occupy little space and it is safe to use, heat dissipation effect is apparent so that electricity
Job stability, processing safety and the service life of sub- product.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only the utility model
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other attached drawings.
Fig. 1 is the internal cross section structural representation according to the radiator for capacitor case of the utility model embodiment
Figure；
Fig. 2 is the external structure schematic diagram according to the radiator for capacitor case of the utility model embodiment.
In figure：
1st, shell；2nd, cover；3rd, thermal；4th, heat-sink shell；5th, heat dissipating layer；6th, heat absorbing sheet；7th, heat insulation foam；8th, mouth is clogged；
9th, semiconductor refrigeration chip；10th, radiating piece；11st, axial flow blower；12nd, ventilation duct；13rd, ventilation opening；14th, absorber plate；15th, it ventilates
Hole；16th, counnter attack heat sink；17th, dust excluding plate.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art's all other embodiments obtained all belong to
In the range of the utility model protection.
Embodiment according to the present utility model provides a kind of radiator for capacitor case.
As shown in Figs. 1-2, according to the utility model embodiment, including shell 1, cover 2 and radiator 3, the lid
Body 2 is connected to 1 top of shell, and the radiator 3 is set to inside the shell wall of the shell 1, and the radiator 3 wraps
Heat-sink shell 4 and heat dissipating layer 5 are included, the heat-sink shell 4 is set to the inside of the heat dissipating layer 5.
The heat-sink shell 4 is formed by heat absorbing sheet 6 and with heat insulation foam 7, and the heat absorbing sheet 6 is set to the upper of the heat insulation foam 7
Portion offers several filling mouths 8 in the heat insulation foam 7, semiconductor refrigeration chip 9, the heat dissipation is provided in the filling mouth 8
Layer 5 is made of radiating piece 10 and axial flow blower 11, and the radiating piece 10 is set to the inside of the axial flow blower 11, the axis stream
The outside of wind turbine 11 offers ventilation duct 12, and the both ends of the ventilation duct 12 connect respectively is opened in the logical of 1 both ends of shell
Air port 13.
In one embodiment, for above-mentioned heat absorbing sheet 6, absorber plate 14 is enclosed with outside the heat absorbing sheet 6.
In one embodiment, it for above-mentioned filling mouth 8, is offered between two adjacent filling mouths 8 logical
Stomata 15.
In one embodiment, for above-mentioned heat-sink shell 4 and above-mentioned heat dissipating layer 5, the heat-sink shell 4 and the heat dissipation
Counnter attack heat sink 16 is equipped between layer 5.
In one embodiment, for above-mentioned ventilation opening 13, dust excluding plate 17 is fixedly connected on the ventilation opening 13.
In conclusion by means of the above-mentioned technical proposal of the utility model, partly led by the heat-sink shell 4 and using described
Body refrigerating chip 9 carries out heat transfer, is conducive to concentrate heat absorption, accelerated heat transmits the cooling for substantially increasing the shell 1
Speed, then the heat exchange area of the increasing radiator by the absorber plate 14, significantly more efficient heat transfer are adopted, then pass through
The radiating piece 10 in the heat dissipating layer 5 further absorbs heat, then disperses heat by the axial flow blower 11
Amount, heat is discharged in the shell 1, adequately achieve the purpose that heat dissipation, add the anti-reflection by the ventilation duct 12
Hot plate 16 causes heat reversely not flow into the shell 1, significantly more efficient to radiate, and is added at the ventilation opening 13
For the dust excluding plate 17 so that external dust is not easily accessible the enclosure, can effectively increase the utility model uses the longevity
Life, the heat that directly can be effectively absorbed by the radiator 3 on the shell 1 of heat of the utility model, and
Occupy little space and it is safe to use, heat dissipation effect is apparent so that job stability, processing safety and the use of electronic product
Service life.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model
Protection domain within.
Claims (5)
1. a kind of radiator for capacitor case, which is characterized in that including shell (1), cover (2) and radiator
(3), the cover (2) is connected at the top of the shell (1), and the radiator (3) is set in the shell wall of the shell (1)
Portion, the radiator (3) include heat-sink shell (4) and heat dissipating layer (5), and the heat-sink shell (4) is set to the heat dissipating layer (5)
Inside；
The heat-sink shell (4) is made of heat absorbing sheet (6) and heat insulation foam (7), and the heat absorbing sheet (6) is set to the heat insulation foam (7)
Top, several filling mouths (8) are offered in the heat insulation foam (7), semiconductor refrigeration chip is provided in the filling mouth (8)
(9), the heat dissipating layer (5) is made of radiating piece (10) and axial flow blower (11), and the radiating piece (10) is set to the axis stream
The inside of wind turbine (11) offers ventilation duct (12), the both ends point of the ventilation duct (12) on the outside of the axial flow blower (11)
The ventilation opening (13) at the shell (1) both ends Lian Jie be opened in.
2. the radiator according to claim 1 for capacitor case, which is characterized in that the heat absorbing sheet (6) is outside
Portion is enclosed with absorber plate (14).
3. the radiator according to claim 1 for capacitor case, which is characterized in that two adjacent described to fill out
Venthole (15) is offered between mouth (8).
4. the radiator according to claim 1 for capacitor case, which is characterized in that the heat-sink shell (4) and
Counnter attack heat sink (16) is equipped between the heat dissipating layer (5).
5. the radiator according to claim 1 for capacitor case, which is characterized in that on the ventilation opening (13)
It is fixedly connected with dust excluding plate (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721697123.0U CN207489679U (en) | 2017-12-08 | 2017-12-08 | A kind of radiator for capacitor case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721697123.0U CN207489679U (en) | 2017-12-08 | 2017-12-08 | A kind of radiator for capacitor case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207489679U true CN207489679U (en) | 2018-06-12 |
Family
ID=62457744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721697123.0U Active CN207489679U (en) | 2017-12-08 | 2017-12-08 | A kind of radiator for capacitor case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207489679U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108039278A (en) * | 2017-12-08 | 2018-05-15 | 安徽广宇电子材料有限公司 | A kind of radiator for capacitor case |
-
2017
- 2017-12-08 CN CN201721697123.0U patent/CN207489679U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108039278A (en) * | 2017-12-08 | 2018-05-15 | 安徽广宇电子材料有限公司 | A kind of radiator for capacitor case |
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