CN108039278A - A kind of radiator for capacitor case - Google Patents
A kind of radiator for capacitor case Download PDFInfo
- Publication number
- CN108039278A CN108039278A CN201711292649.5A CN201711292649A CN108039278A CN 108039278 A CN108039278 A CN 108039278A CN 201711292649 A CN201711292649 A CN 201711292649A CN 108039278 A CN108039278 A CN 108039278A
- Authority
- CN
- China
- Prior art keywords
- heat
- shell
- radiator
- dissipating layer
- sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 15
- 239000002937 thermal insulation foam Substances 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000009423 ventilation Methods 0.000 claims description 9
- 239000000428 dust Substances 0.000 claims description 7
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000005057 refrigeration Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of radiator for capacitor case, including shell, lid and radiator, the lid is connected to the cover top portion, the radiator is arranged inside the shell wall of the shell, the radiator includes heat-sink shell and heat dissipating layer, the heat-sink shell is arranged at the inner side of the heat dissipating layer, the heat-sink shell is formed by heat absorbing sheet and with heat insulation foam, the heat absorbing sheet is arranged at the top of the heat insulation foam, some filling mouths are offered in the heat insulation foam, semiconductor refrigeration chip is provided with the filling mouth, the heat dissipating layer is made of radiating piece and axial flow blower, the radiating piece is arranged at the right side of the axial flow blower.Beneficial effect：The present invention the heat that directly can be effectively absorbed by the radiator on the shell of heat, and occupy little space and it is safe to use, heat dissipation effect is obvious so that job stability, processing safety and the service life of electronic product.
Description
Technical field
The present invention relates to capacitor area, it particularly relates to a kind of radiator for capacitor case
Background technology
In social fast-developing so that various electric equipment products are all towards miniaturization, lightweight, densification and efficient
Change direction to develop, so grown rapidly with high-power electronic product, and resulting substantial amounts of heat does not dissipate
Hair space will directly affect job stability, processing safety and the service life of electronic product, and the conventional type of cooling is
Through that cannot meet the cooling requirements of high power electronic product, so just having to improve the rate of heat dissipation of electronic product.
The problem of in correlation technique, not yet propose effective solution at present.
The content of the invention
The problem of in correlation technique, the present invention propose a kind of radiator for capacitor case, existing to overcome
There is the above-mentioned technical problem present in correlation technique.
The technical proposal of the invention is realized in this way：
A kind of radiator for capacitor case, including shell, lid and radiator, the lid are connected to institute
Cover top portion is stated, the radiator is arranged inside the shell wall of the shell, and the radiator includes heat-sink shell and heat dissipation
Layer, the heat-sink shell are arranged at the inner side of the heat dissipating layer.
The heat-sink shell is formed by heat absorbing sheet and with heat insulation foam, and the heat absorbing sheet is arranged at the top of the heat insulation foam, institute
State and some filling mouths are offered in heat insulation foam, be provided with semiconductor refrigeration chip in the filling mouth, the heat dissipating layer is by radiating
Part and axial flow blower composition, the radiating piece are arranged at the inner side of the axial flow blower, are offered on the outside of the axial flow blower
Ventilation duct, the both ends of the ventilation duct connect the ventilating opening for being opened in the shell both ends respectively.
Further, it is enclosed with absorber plate outside the heat absorbing sheet.
Further, venthole is offered between two adjacent filling mouths.
Further, counnter attack heat sink is equipped between the heat-sink shell and the heat dissipating layer.
Further, it is fixedly connected with dust excluding plate on the ventilating opening.
Beneficial effects of the present invention：Heat transfer is carried out by the heat-sink shell and using the semiconductor refrigeration chip,
Be conducive to concentrate heat absorption, accelerated heat transmission substantially increases the cooling rate of the shell, then adopts by the absorber plate
The heat exchange area of radiator, significantly more efficient heat transfer are increased, then passes through the radiating piece pair in the heat dissipating layer
Heat is further absorbed, then disperses heat by the axial flow blower, heat discharged by the ventilation duct described in
In shell, sufficiently achieve the purpose that heat dissipation, add the counnter attack heat sink so that heat will not be flowed into reversely in the shell,
It is significantly more efficient to radiate, the dust excluding plate is added at the ventilating opening so that external dust is not easily accessible in the shell
Portion, can effectively increase the service life of the present invention, of the invention directly can effectively be absorbed by the radiator
Heat on the shell of heat, and occupy little space and it is safe to use, heat dissipation effect is obvious so that the work of electronic product
Stability, processing safety and service life.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the internal cross section structure diagram of the radiator for capacitor case according to embodiments of the present invention；
Fig. 2 is the external structure schematic diagram of the radiator for capacitor case according to embodiments of the present invention.
In figure：
1st, shell；2nd, lid；3rd, thermal；4th, heat-sink shell；5th, heat dissipating layer；6th, heat absorbing sheet；7th, heat insulation foam；8th, mouth is clogged；
9th, semiconductor refrigeration chip；10th, radiating piece；11st, axial flow blower；12nd, ventilation duct；13rd, ventilating opening；14th, absorber plate；15th, ventilate
Hole；16th, counnter attack heat sink；17th, dust excluding plate.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art's all other embodiments obtained, belong to what the present invention protected
Scope.
According to an embodiment of the invention, there is provided a kind of radiator for capacitor case.
As shown in Figs. 1-2, it is according to embodiments of the present invention, including shell 1, lid 2 and radiator 3, the lid 2 connect
The top of shell 1 is connected to, the radiator 3 is arranged inside the shell wall of the shell 1, and the radiator 3 includes inhaling
Thermosphere 4 and heat dissipating layer 5, the heat-sink shell 4 are arranged at the inner side of the heat dissipating layer 5.
The heat-sink shell 4 is formed by heat absorbing sheet 6 and with heat insulation foam 7, and the heat absorbing sheet 6 is arranged at the upper of the heat insulation foam 7
Portion, some filling mouths 8 are offered in the heat insulation foam 7, semiconductor refrigeration chip 9, the heat dissipation are provided with the filling mouth 8
Layer 5 is made of radiating piece 10 and axial flow blower 11, and the radiating piece 10 is arranged at the inner side of the axial flow blower 11, the axis stream
The outside of wind turbine 11 offers ventilation duct 12, and the both ends of the ventilation duct 12 connect respectively is opened in the logical of 1 both ends of shell
Air port 13.
In one embodiment, for above-mentioned heat absorbing sheet 6, absorber plate 14 is enclosed with outside the heat absorbing sheet 6.
In one embodiment, for above-mentioned filling mouth 8, offered between two adjacent filling mouths 8 logical
Stomata 15.
In one embodiment, for above-mentioned heat-sink shell 4 and above-mentioned heat dissipating layer 5, the heat-sink shell 4 and the heat dissipation
Counnter attack heat sink 16 is equipped between layer 5.
In one embodiment, for above-mentioned ventilating opening 13, dust excluding plate 17 is fixedly connected with the ventilating opening 13.
In conclusion by means of the above-mentioned technical proposal of the present invention, by the heat-sink shell 4 and the semiconductor system is utilized
Cold core piece 9 carries out heat transfer, is conducive to concentrate heat absorption, and accelerated heat transmission substantially increases the cooling rate of the shell 1,
The heat exchange area of the increasing radiator by the absorber plate 14, significantly more efficient heat transfer, then by described are adopted again
The radiating piece 10 in heat dissipating layer 5 further absorbs heat, then disperses heat by the axial flow blower 11, leads to
Cross the ventilation duct 12 to discharge heat in the shell 1, sufficiently achieve the purpose that heat dissipation, add the counnter attack heat sink 16
So that heat will not be flowed into reversely in the shell 1, and it is significantly more efficient to radiate, added at the ventilating opening 13 described anti-
Dirt plate 17 causes external dust to be not easily accessible the enclosure, can effectively increase the service life of the present invention, the present invention
The heat that directly can be effectively absorbed by the radiator 3 on the shell 1 of heat, and occupy little space and make
It is obvious with safety, heat dissipation effect so that job stability, processing safety and the service life of electronic product.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on, should all be included in the protection scope of the present invention god.
Claims (5)
- A kind of 1. radiator for capacitor case, it is characterised in that including shell (1), lid (2) and radiator (3), the lid (2) is connected at the top of the shell (1), and the radiator (3) is arranged in the shell wall of the shell (1) Portion, the radiator (3) include heat-sink shell (4) and heat dissipating layer (5), and the heat-sink shell (4) is arranged at the heat dissipating layer (5) Inner side；The heat-sink shell (4) forms by heat absorbing sheet (6) and with heat insulation foam (7), and the heat absorbing sheet (6) is arranged at the heat insulation foam (7) top, the heat insulation foam (7) is interior to offer some filling mouths (8), and semiconductor refrigerating is provided with the filling mouth (8) Chip (9), the heat dissipating layer (5) are made of radiating piece (10) and axial flow blower (11), and the radiating piece (10) is arranged at described The inner side of axial flow blower (11), offers ventilation duct (12) on the outside of the axial flow blower (11), and the two of the ventilation duct (12) End connects the ventilating opening (13) for being opened in the shell (1) both ends respectively.
- 2. the radiator according to claim 1 for capacitor case, it is characterised in that the heat absorbing sheet (6) is outside Portion is enclosed with absorber plate (14).
- 3. the radiator according to claim 1 for capacitor case, it is characterised in that two adjacent described to fill out Venthole (15) is offered between mouth (8).
- 4. the radiator according to claim 1 for capacitor case, it is characterised in that the heat-sink shell (4) and Counnter attack heat sink (16) is equipped between the heat dissipating layer (5).
- 5. the radiator according to claim 1 for capacitor case, it is characterised in that on the ventilating opening (13) It is fixedly connected with dust excluding plate (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711292649.5A CN108039278A (en) | 2017-12-08 | 2017-12-08 | A kind of radiator for capacitor case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711292649.5A CN108039278A (en) | 2017-12-08 | 2017-12-08 | A kind of radiator for capacitor case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108039278A true CN108039278A (en) | 2018-05-15 |
Family
ID=62101562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711292649.5A Pending CN108039278A (en) | 2017-12-08 | 2017-12-08 | A kind of radiator for capacitor case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108039278A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109270737A (en) * | 2018-10-26 | 2019-01-25 | 蚌埠国显科技有限公司 | A kind of novel liquid crystal display module containing radiating block |
| CN109283743A (en) * | 2018-10-26 | 2019-01-29 | 蚌埠国显科技有限公司 | A kind of liquid crystal display die set |
| CN109307953A (en) * | 2018-10-26 | 2019-02-05 | 蚌埠国显科技有限公司 | A kind of liquid crystal display die set containing reflective mirror |
| CN109343270A (en) * | 2018-10-26 | 2019-02-15 | 蚌埠国显科技有限公司 | A kind of novel liquid crystal display module that heat dissipation effect is excellent |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102780052A (en) * | 2012-06-28 | 2012-11-14 | 陆宁 | Temperature controllable type lithium ion battery module for vehicles |
| CN203288718U (en) * | 2013-06-29 | 2013-11-13 | 福建高力金煌能源科技有限公司 | Self-heating self-cooling constant-temperature alkaline battery pack |
| CN103761358A (en) * | 2013-12-23 | 2014-04-30 | 柳州职业技术学院 | Establishing and unsteady state performance analysis methods for semiconductor refrigeration system |
| CN103779796A (en) * | 2014-03-01 | 2014-05-07 | 无锡佳谊林电气有限公司 | Dehumidifier |
| CN205028983U (en) * | 2015-09-24 | 2016-02-10 | 北汽福田汽车股份有限公司 | Power battery and car that has it |
| CN205692937U (en) * | 2016-06-20 | 2016-11-16 | 江西超维新能源科技股份有限公司 | A kind of high security lithium ion battery-efficient heat-dissipating casing |
| CN106410315A (en) * | 2016-06-23 | 2017-02-15 | 广东工业大学 | Two-way flow battery heat management system and battery heat adjustment method |
| CN207489679U (en) * | 2017-12-08 | 2018-06-12 | 安徽广宇电子材料有限公司 | A kind of radiator for capacitor case |
-
2017
- 2017-12-08 CN CN201711292649.5A patent/CN108039278A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102780052A (en) * | 2012-06-28 | 2012-11-14 | 陆宁 | Temperature controllable type lithium ion battery module for vehicles |
| CN203288718U (en) * | 2013-06-29 | 2013-11-13 | 福建高力金煌能源科技有限公司 | Self-heating self-cooling constant-temperature alkaline battery pack |
| CN103761358A (en) * | 2013-12-23 | 2014-04-30 | 柳州职业技术学院 | Establishing and unsteady state performance analysis methods for semiconductor refrigeration system |
| CN103779796A (en) * | 2014-03-01 | 2014-05-07 | 无锡佳谊林电气有限公司 | Dehumidifier |
| CN205028983U (en) * | 2015-09-24 | 2016-02-10 | 北汽福田汽车股份有限公司 | Power battery and car that has it |
| CN205692937U (en) * | 2016-06-20 | 2016-11-16 | 江西超维新能源科技股份有限公司 | A kind of high security lithium ion battery-efficient heat-dissipating casing |
| CN106410315A (en) * | 2016-06-23 | 2017-02-15 | 广东工业大学 | Two-way flow battery heat management system and battery heat adjustment method |
| CN207489679U (en) * | 2017-12-08 | 2018-06-12 | 安徽广宇电子材料有限公司 | A kind of radiator for capacitor case |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109270737A (en) * | 2018-10-26 | 2019-01-25 | 蚌埠国显科技有限公司 | A kind of novel liquid crystal display module containing radiating block |
| CN109283743A (en) * | 2018-10-26 | 2019-01-29 | 蚌埠国显科技有限公司 | A kind of liquid crystal display die set |
| CN109307953A (en) * | 2018-10-26 | 2019-02-05 | 蚌埠国显科技有限公司 | A kind of liquid crystal display die set containing reflective mirror |
| CN109343270A (en) * | 2018-10-26 | 2019-02-15 | 蚌埠国显科技有限公司 | A kind of novel liquid crystal display module that heat dissipation effect is excellent |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |