CN207398131U - A kind of device radiation structure based on heat pipe water conservancy diversion - Google Patents
A kind of device radiation structure based on heat pipe water conservancy diversion Download PDFInfo
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- CN207398131U CN207398131U CN201721467580.0U CN201721467580U CN207398131U CN 207398131 U CN207398131 U CN 207398131U CN 201721467580 U CN201721467580 U CN 201721467580U CN 207398131 U CN207398131 U CN 207398131U
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- heat pipe
- heat
- copper
- water conservancy
- conservancy diversion
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Abstract
The utility model discloses a kind of device radiation structure based on heat pipe water conservancy diversion, including copper-based seat, heat pipe, cooling fin and heat conductive pad, wherein, heat conductive pad is used to be covered in the cpu chip that need to be radiated, and copper-based seat is pressed on heat conductive pad；Heat pipe one end is inlaid into copper base interior, and the heat pipe other end is inlaid into inside cooling fin；Inside heat pipe is hollow, fills heat-conducting work medium.CPU heats are led device radiation piece by such structure by heat pipe diversion mode, and perfect heat-dissipating, radiating efficiency is high, are used when using high-performance, caloric value big CPU, be ensure that device Wen Sheng in claimed range.
Description
Technical field
The utility model belongs to grid automation technical field, secondary device device radiation in more particularly to a kind of substation
Structure.
Background technology
With the development of intelligent substation communication technology and the introducing of Substation Process layer network, network message records and analyzes
The equipment such as device, wave recording device need gatherer process layer network message, and the quantities of messages flood tide that need to be handled increases, and with application
The continuous development of business needs on device the calculating realized and logic function more and more, therefore, when designing such device needs to adopt
With the higher CPU of performance (central processing unit).But the higher CPU of performance is usually associated with cpu power and caloric value more
Greatly, for the conventionally employed modes such as cooling fin that directly mounted on CPU come the method to radiate, heat dissipation effect is poor, cannot expire
The radiating requirements of the high-power CPU of such device of foot.And by the way of rotary fan heat dissipation, in the commercial Applications such as substation field
Under scape, due to rotary fan high failure rate, short life, being distinctly claimed does not allow to use.
Therefore, it is necessary to develop a kind of new radiator structure, perfect heat-dissipating, radiating efficiency is high, using high-performance, fever
It is used when measuring big CPU, to ensure device Wen Sheng in claimed range, thus this case generates.
Utility model content
The purpose of this utility model, is to provide a kind of device radiation structure based on heat pipe water conservancy diversion, and the structure is by CPU heat
Amount leads device radiation piece by heat pipe diversion mode, and perfect heat-dissipating, radiating efficiency is high, big using high-performance, caloric value
CPU when use, ensure that device Wen Sheng in claimed range.
In order to achieve the above objectives, the solution of the utility model is：
A kind of device radiation structure based on heat pipe water conservancy diversion, including copper-based seat, heat pipe, cooling fin and heat conductive pad, wherein, it leads
Heat pad is used to be covered in the cpu chip that need to be radiated, and copper-based seat is pressed on heat conductive pad；Heat pipe one end is inlaid into copper base interior,
The heat pipe other end is inlaid into inside cooling fin；Inside heat pipe is hollow, fills heat-conducting work medium.
Above-mentioned copper-based seat, heat pipe and cooling fin use integral structure, and heat pipe one end is inlaid into copper-based using welding procedure
Seat is internal, and the heat pipe other end is inlaid into using welding procedure inside cooling fin.
The heat-conducting work medium of above-mentioned inside heat pipe filling uses volatile working medium.
Above-mentioned cooling fin uses vertical fin.
Hole is offered on above-mentioned copper-based seat, when the radiator structure is installed on device, heat conductive pad is covered in cpu chip, copper
Pedestal is pressed on heat conductive pad, and nut is fixed on device bottom plate, and bolt is connected after being penetrated from the hole on copper-based seat with nut.
Above-mentioned bolt is fixed on using spring structure on the hole of copper-based seat.
Above-mentioned heat pipe is equipped with 4.
When above-mentioned radiator structure is installed on device, cooling fin is simultaneously as device box side wall.
After using the above program, the utility model is led CPU heats on the cooling fin of device by heat pipe diversion mode,
It is scattered to again from cooling fin by air convection in air, perfect heat-dissipating, radiating efficiency is high, using high-performance, hair
It is used during the big CPU of heat, ensure that device Wen Sheng in claimed range.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the embodiment schematic diagram that the utility model is installed on device；
Copper-based seat and cpu chip installation instructions schematic diagram in Fig. 3 the utility model.
Device label declaration in figure：
The copper-based seats of 1-, 2- heat pipes, 3- cooling fins, 4- heat conductive pads, 5- bolts, 6- device chassis backplanes, 7- nuts, 8- circuits
Printed board, 9-CPU chips.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, with reference to embodiments, to this
Utility model is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain this practicality
It is new, it is not used to limit the utility model.
The application principle of the utility model is explained in detail below in conjunction with the accompanying drawings.
As shown in Figure 1, the utility model provides a kind of device radiation structure based on heat pipe water conservancy diversion, including copper-based seat 1, heat
Pipe 2, cooling fin 3 and heat conductive pad 4, wherein, heat conductive pad is for being covered in cpu chip, and copper-based seat is pressed on heat conductive pad during use；
Copper-based seat, heat pipe, cooling fin are produced and installed using integral structure, and heat pipe one end is inlaid into using welding procedure in copper-based seat
Portion, a part of agent structure and the other end of heat pipe are inlaid into using welding procedure inside cooling fin, it is ensured that copper-based seat and heat pipe,
It is in close contact between heat pipe and cooling fin, to ensure the heat conduction efficiency between copper-based seat, heat pipe, cooling fin, beneficial to heat
Pass through from copper-based seat in conduction to cooling fin；Inside heat pipe is hollow, fills heat-conducting work medium, generally using volatile working medium, passes through
The flowing of working medium and the conversion of working medium vapour-liquid state realize that heat is conducted from copper-based seat to cooling fin.
The utility model radiator structure is installed on the embodiment schematic diagram of device as shown in Fig. 2, wherein, cooling fin is made simultaneously
For device box side wall, there is sufficiently large heat dissipation area and holding strength, and can be directly by convection type by heat
It is scattered on the outside of device；And the cooling fin uses vertical fin, convenient for convection current above and below air；When mounted, the device cpu chip
Heat conductive pad is first padded in top, then installs copper-based seat, to ensure to combine closely between copper-based seat, heat conductive pad, cpu chip, using spiral shell
Mother is fixed on device bottom plate, and bolt is connected after being penetrated from the hole on copper-based seat with nut, then fastening bolt, it can be ensured that copper-based seat
Heat conductive pad and cpu chip are compressed, convenient for heat derives；In the present embodiment, bolt is fixed on copper-based seat using spring structure
Kong Shang, it is ensured that bolt is not easy the loss that drops.4 heat pipes are used in the present embodiment, it is ensured that the structure entirety capacity of heat transmission, convenient for heat
Amount export.
Further, copper-based seat and cpu chip mounting means in the utility model radiator structure are illustrated, as shown in figure 3, spiral shell
Mother is fixed on device chassis backplane, and cpu chip is welded on circuit printing plate, and heat conductive pad is covered on cpu chip, is had good
The good capacity of heat transmission, while ensure that cpu chip will not be damaged due to pressure；Copper-based seat is pressed on heat conductive pad, bolt and lower section spiral shell
Mother's connection, after fastening bolt connection, it is ensured that copper-based seat compresses heat conductive pad and cpu chip；Heat pipe one end is embedded in copper-based seat；
Finally, the heat that cpu chip is sent is passed to copper-based seat by heat conductive pad, then exports to device side wall cooling fin by heat pipe
On, it is scattered to by convection type in air.
The advantages of basic structure, main feature and the utility model of the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Simply illustrate the structure of the utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
Various changes and modifications are had, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed scope is defined by the appending claims and its equivalent thereof.
Claims (8)
1. a kind of device radiation structure based on heat pipe water conservancy diversion, it is characterised in that：Including copper-based seat, heat pipe, cooling fin and heat conduction
Pad, wherein, heat conductive pad is used to be covered in the cpu chip that need to be radiated, and copper-based seat is pressed on heat conductive pad；Heat pipe one end is inlaid into copper
Base interior, the heat pipe other end are inlaid into inside cooling fin；Inside heat pipe is hollow, fills heat-conducting work medium.
2. a kind of device radiation structure based on heat pipe water conservancy diversion as described in claim 1, it is characterised in that：The copper-based seat,
Heat pipe and cooling fin are using integral structure, and heat pipe one end is inlaid into copper base interior using welding procedure, and the heat pipe other end is adopted
It is inlaid into welding procedure inside cooling fin.
3. a kind of device radiation structure based on heat pipe water conservancy diversion as described in claim 1, it is characterised in that：The inside heat pipe
The heat-conducting work medium of filling uses volatile working medium.
4. a kind of device radiation structure based on heat pipe water conservancy diversion as described in claim 1, it is characterised in that：The cooling fin is adopted
With vertical fin.
5. a kind of device radiation structure based on heat pipe water conservancy diversion as described in claim 1, it is characterised in that：On the copper-based seat
Hole is offered, when the radiator structure is installed on device, heat conductive pad is covered in cpu chip, and copper-based seat is pressed on heat conductive pad, nut
Device bottom plate is fixed on, bolt is connected after being penetrated from the hole on copper-based seat with nut.
6. a kind of device radiation structure based on heat pipe water conservancy diversion as claimed in claim 5, it is characterised in that：The bolt uses
Spring structure is fixed on the hole of copper-based seat.
7. a kind of device radiation structure based on heat pipe water conservancy diversion as described in claim 1, it is characterised in that：The heat pipe is equipped with
4.
8. a kind of device radiation structure based on heat pipe water conservancy diversion as described in claim 1, it is characterised in that：The radiator structure
When being installed on device, cooling fin is simultaneously as device box side wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721467580.0U CN207398131U (en) | 2017-11-07 | 2017-11-07 | A kind of device radiation structure based on heat pipe water conservancy diversion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721467580.0U CN207398131U (en) | 2017-11-07 | 2017-11-07 | A kind of device radiation structure based on heat pipe water conservancy diversion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207398131U true CN207398131U (en) | 2018-05-22 |
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ID=62324913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721467580.0U Active CN207398131U (en) | 2017-11-07 | 2017-11-07 | A kind of device radiation structure based on heat pipe water conservancy diversion |
Country Status (1)
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|---|---|
| CN (1) | CN207398131U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741646A (en) * | 2020-05-26 | 2020-10-02 | 吴德坚 | Novel integrated phase-change superconducting heat transfer super-efficient heat dissipation structure and product shell |
-
2017
- 2017-11-07 CN CN201721467580.0U patent/CN207398131U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741646A (en) * | 2020-05-26 | 2020-10-02 | 吴德坚 | Novel integrated phase-change superconducting heat transfer super-efficient heat dissipation structure and product shell |
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