CN205384564U - Device based on heat dissipation of computer electrical components - Google Patents
Device based on heat dissipation of computer electrical components Download PDFInfo
- Publication number
- CN205384564U CN205384564U CN201521040980.4U CN201521040980U CN205384564U CN 205384564 U CN205384564 U CN 205384564U CN 201521040980 U CN201521040980 U CN 201521040980U CN 205384564 U CN205384564 U CN 205384564U
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- China
- Prior art keywords
- fixed
- water
- plate
- fin
- water board
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a device based on heat dissipation of computer electrical components, including water board, water board mount, component plate, PMKD, whole device is installed PMKD is last, PMKD upper portion is fixed with the fin of some, the fin top is fixed in aluminum plate bottom position, be fixed with in the middle of the aluminum plate top component plate, component plate upper portion is provided with some electronic components, the aluminum plate both ends all are fixed with water board mount, the water board mount other end is fixed with the water board, the water intralamellar part evenly is provided with condenser tube, water board both ends are provided with water inlet and delivery port respectively, the water inlet with end connection is in at the bottom of the delivery port condenser tube is last. Beneficial effect lies in: adopting the fixed aluminum plate in component plate bottom, improving the electronic components radiating efficiency greatly, the fin all adopts high material heat dissipation aluminum alloy for the convective heat transfer effect is better.
Description
Technical field
This utility model belongs to computer research field, is specifically related to a kind of device based on the heat radiation of computer electric elements.
Background technology
nullIn recent years for the construction and development of supercomputing center,Have become as the Important Action carrying out " made in China 2025 " strategical planning spirit,Supercomputing center constantly expands the scale of computing cluster,Computer chip power consumption has reached 160w,Heat flow density is up to 100w/cm2,Visible development efficient cooling system,Obtaining electronic chip bigger cooling capacity problem extremely urgent. the Study on Cooling currently for high-speed computer and server core devices CPU is mainly air cooling、Quasiconductor cools down、The modes such as heat pipe cooling,Along with being continuously increased of computer center's speed of service and operating load,Circuit board heating power is also incrementally increasing,The cooling of current almost all of miniature power circuit board all adopts forced convertion radiating mode. but this radiating mode is for supercomputing center computing cluster,Basic not from the operating temperature substantially fully reducing circuit components,Ensure the properly functioning of supercomputing center.
Utility model content
The purpose of this utility model is that provides a kind of device based on the heat radiation of computer electric elements to solve the problems referred to above.
This utility model is achieved through the following technical solutions above-mentioned purpose:
A kind of device based on the heat radiation of computer electric elements, including water plate, water plate fixed mount, elements and parts board, fixing base plate, whole device is arranged on described fixing base plate, described fixing base plate top is fixed with a number of fin, described fin top is fixed on aluminium sheet bottom position, described aluminium sheet crown center is fixed with described elements and parts board, described elements and parts board top is provided with some electronic devices and components, described aluminium sheet two ends are respectively and fixedly provided with described water plate fixed mount, the described water plate fixed mount other end is fixed with described water plate, described water intralaminar part is evenly arranged with cooling water pipe, described water plate two ends are respectively arranged with water inlet and outlet, described water inlet and described outlet bottom are connected on described cooling water pipe.
In said structure, described aluminium sheet is fixed bottom described elements and parts board, it is greatly improved described cooling electronic component efficiency, described fin all adopts high material radiation aluminium alloy, making convection heat transfer' heat-transfer by convection effect more preferably, the described cooling water pipe in described water plate can be quickly cooled within the scope of reasonable temperature when temperature is too high.
In order to improve computer cooling electronic component efficiency further, described elements and parts board top is provided with some electronic devices and components, and described aluminium sheet two ends are respectively and fixedly provided with described water plate fixed mount.
In order to improve computer cooling electronic component efficiency further, the described water plate fixed mount other end is fixed with described water plate, and described water intralaminar part is evenly arranged with cooling water pipe.
In order to improve computer cooling electronic component efficiency further, described water plate two ends are respectively arranged with water inlet and outlet, described water inlet and described outlet bottom and are connected on described cooling water pipe.
Have the beneficial effects that: adopting and fix aluminium sheet bottom elements and parts board, be greatly improved cooling electronic component efficiency, fin all adopts high material radiation aluminium alloy so that convection heat transfer' heat-transfer by convection effect is more preferably.
Accompanying drawing explanation
Fig. 1 is the front sectional view of a kind of device based on the heat radiation of computer electric elements described in the utility model;
Fig. 2 is the left view sectional view of a kind of device based on the heat radiation of computer electric elements described in the utility model.
1, water inlet;2, cooling water pipe;3, water plate;4, water outlet is oral;5, water plate fixed mount;6, elements and parts board;7, aluminium sheet;8, radiator;9, fixing base plate;10, electronic devices and components;11, fin.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in further detail:
nullAs Figure 1-Figure 2,A kind of device based on the heat radiation of computer electric elements,Including water plate 3、Water plate fixed mount 5、Elements and parts board 6、Fixing base plate 9,Whole device is arranged on described fixing base plate 9,Described fixing base plate 9 top is fixed with a number of fin 11,Described fin 11 top is fixed on aluminium sheet 7 bottom position,Described aluminium sheet 7 crown center is fixed with described elements and parts board 6,Described elements and parts board 6 top is provided with some electronic devices and components 10,Described aluminium sheet 7 two ends are respectively and fixedly provided with described water plate fixed mount 5,Described water plate fixed mount 5 other end is fixed with described water plate 3,Described water plate 3 inner homogeneous is provided with cooling water pipe 2,Described water plate 3 two ends are respectively arranged with water inlet 1 and outlet 4,Described water inlet 1 and described outlet 4 bottom are connected on described cooling water pipe 2.
In said structure, described aluminium sheet 7 is fixed bottom described elements and parts board 6, it is greatly improved described electronic devices and components 10 radiating efficiency, described fin 11 all adopts high material radiation aluminium alloy, making convection heat transfer' heat-transfer by convection effect more preferably, the described cooling water pipe 2 in described water plate 3 can be quickly cooled within the scope of reasonable temperature when temperature is too high.
In order to improve computer cooling electronic component efficiency further, described elements and parts board 6 top is provided with some electronic devices and components 10, described aluminium sheet 7 two ends are respectively and fixedly provided with described water plate fixed mount 5, described water plate fixed mount 5 other end is fixed with described water plate 3, described water plate 3 inner homogeneous is provided with cooling water pipe 2, described water plate 3 two ends are respectively arranged with water inlet 1 and outlet 4, described water inlet 1 and described outlet 4 bottom and are connected on described cooling water pipe 2.
Of the present utility model ultimate principle, principal character and advantage have more than been shown and described.Skilled person will appreciate that of the industry; this utility model is not restricted to the described embodiments; described in above-described embodiment and description is that principle of the present utility model is described; under the premise without departing from this utility model spirit and scope; this utility model also has various changes and modifications, and these changes and improvements both fall within the scope of claimed this utility model.This utility model claims scope and is defined by appending claims and effect thing thereof.
Claims (1)
1. the device based on the heat radiation of computer electric elements, it is characterized in that: include water plate, water plate fixed mount, elements and parts board, fixing base plate, whole device is arranged on described fixing base plate, described fixing base plate top is fixed with a number of fin, described fin top is fixed on aluminium sheet bottom position, described aluminium sheet crown center is fixed with described elements and parts board, described elements and parts board top is provided with some electronic devices and components, described aluminium sheet two ends are respectively and fixedly provided with described water plate fixed mount, the described water plate fixed mount other end is fixed with described water plate, described water intralaminar part is evenly arranged with cooling water pipe, described water plate two ends are respectively arranged with water inlet and outlet, described water inlet and described outlet bottom are connected on described cooling water pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521040980.4U CN205384564U (en) | 2015-12-15 | 2015-12-15 | Device based on heat dissipation of computer electrical components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521040980.4U CN205384564U (en) | 2015-12-15 | 2015-12-15 | Device based on heat dissipation of computer electrical components |
Publications (1)
Publication Number | Publication Date |
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CN205384564U true CN205384564U (en) | 2016-07-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201521040980.4U Expired - Fee Related CN205384564U (en) | 2015-12-15 | 2015-12-15 | Device based on heat dissipation of computer electrical components |
Country Status (1)
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CN (1) | CN205384564U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106886266A (en) * | 2015-12-15 | 2017-06-23 | 重庆道米科技有限公司 | A kind of device based on the radiating of computer electric elements |
-
2015
- 2015-12-15 CN CN201521040980.4U patent/CN205384564U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106886266A (en) * | 2015-12-15 | 2017-06-23 | 重庆道米科技有限公司 | A kind of device based on the radiating of computer electric elements |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160713 Termination date: 20161215 |
|
CF01 | Termination of patent right due to non-payment of annual fee |