CN207381401U - A kind of encapsulating structure of image sensing chip - Google Patents

Abstract

The utility model discloses a kind of encapsulating structure of image sensing chip, which includes：Image sensing chip, the image sensing chip include opposite first surface and second surface, and the first surface is used to gather the pixel of image information and multiple the first weld pads being connected with the pixel with multiple；The substrate of the first surface of the image sensing chip is covered, the substrate has wiring route and the contact jaw being connected with the wiring route；The wiring route is used to be electrically connected with external circuit；The periphery of the image sensing chip is fixed by anisotropy conductiving glue and the substrate bonding, first weld pad is electrically connected by the anisotropy conductiving glue with the contact jaw, on the direction of the substrate, the anisotropy conductiving glue surrounds all pixels, is not overlapped with the pixel.Technical solutions of the utility model are simple for process when being packaged to image sensing chip, reduce cost of manufacture.

Description

A kind of encapsulating structure of image sensing chip

Technical field

The utility model is related to image collecting device technical field, more specifically, being related to a kind of image sensing chip Encapsulation knot.

Background technology

Image sensing chip is a kind of electronic device that can be experienced extraneous light and convert thereof into electric signal.Image passes Sense chip generally use semiconductor fabrication process carries out chip manufacturing.After the completion of image sensing chip manufacturing, then by shadow As sensing chip carries out a series of packaging technologies so as to form packaged encapsulating structure, for such as digital camera, number The various electronic equipments of video camera etc..

In the prior art, when image sensing chip is packaged, to be by the weld pad of image sensing chip surface and one The weld pad of substrate is welded to each other, and passes through viscose and image sensing chip and the substrate surrounding are sealed fixation.

By foregoing description, when the prior art is packaged image sensing chip, it is necessary to again by glutinous after welding Gluing knot is fixed, complex process, of high cost.

Utility model content

To solve the above-mentioned problems, the utility model provides a kind of encapsulating structure of image sensing chip, to image It is simple for process when sensing chip is packaged, and reduce cost of manufacture.

To achieve these goals, the utility model provides following technical solution：

A kind of encapsulating structure of image sensing chip, the encapsulating structure include：

Image sensing chip, the image sensing chip include opposite first surface and second surface, described first Surface is used to gather the pixel of image information and multiple the first weld pads being connected with the pixel with multiple；

Cover the substrate of the first surface of the image sensing chip, be provided on the substrate wiring route and with institute State the contact jaw of wiring route connection；The wiring route is used to be electrically connected with external circuit；

The periphery of the image sensing chip is fixed by anisotropy conductiving glue and the substrate bonding, and described first Weld pad is electrically connected by the anisotropy conductiving glue with the contact jaw, described each on the direction of the substrate Anisotropy conducting resinl surrounds all pixels, and is not overlapped with the pixel.

Preferably, in above-mentioned encapsulating structure, the substrate includes first area and surrounds the of the first area Two regions；The first area is transmission region；

The first surface of the image sensing chip includes：Pickup area and the non-acquired area for surrounding the pickup area Domain；The pickup area is oppositely arranged with the first area；First weld pad is located at the non-acquired region；

Wherein, the anisotropy conductiving glue is between the non-acquired region and the second area.

Preferably, in above-mentioned encapsulating structure, the substrate is transparent material.

Preferably, in above-mentioned encapsulating structure, the wiring route is located at the second area towards the image sensing The surface of chip, and there is light shield layer between the wiring route and the substrate.

Preferably, in above-mentioned encapsulating structure, the substrate is non-transparent material；The first area is provided through institute The window of substrate is stated, the window is used to expose all pixels.

Preferably, in above-mentioned encapsulating structure, fixed transparent cover plate on the substrate, the transparent cover plate are further included Cover the window.

Preferably, in above-mentioned encapsulating structure, a side surface of the substrate towards the image sensing chip is also set up There is the external terminal being electrically connected with the wiring route, the external terminal is used to be electrically connected with the external circuit.

Preferably, in above-mentioned encapsulating structure, the external circuit has jack；

The external terminal is the grafting pin to match with the jack, and the wiring route passes through the grafting pin It realizes with the jack grafting and is electrically connected with the external circuit.

Preferably, in above-mentioned encapsulating structure, further include：

It is arranged on the light source compensator that the substrate deviates from the image sensing chip-side surface.

Preferably, in above-mentioned encapsulating structure, first weld pad is evenly distributed in the week of the image sensing chip Edge.

Preferably, in above-mentioned encapsulating structure, the first surface of the image sensing chip is additionally provided with multiple auxiliary mats Piece, the shape of the auxiliary spacer is identical with the shape of first weld pad, and the auxiliary spacer and first weld pad are uniform The periphery for being distributed in the image sensing chip.

Preferably, in above-mentioned encapsulating structure, the auxiliary spacer is located at the periphery of same rectangle with first weld pad, Multiple first weld pads are symmetrically distributed on two opposite sides of the rectangle；

Multiple auxiliary spacers are symmetrically distributed on the opposite two other side of the rectangle.

Preferably, in above-mentioned encapsulating structure, the auxiliary spacer is located at the periphery of same rectangle with first weld pad, On the periphery of the rectangle, first weld pad is arranged alternately setting with the auxiliary spacer.

By foregoing description, in the encapsulating structure for the image sensing chip that the utility model embodiment provides, image First weld pad of sensing chip is directly electrically connected by anisotropy conductiving glue with the contact jaw on the substrate, while passes through institute Being adhesively fixed for the substrate and the image sensing chip can be realized by stating anisotropy conductiving glue, compared with need to weld with And the prior art of viscose, technical solutions of the utility model are simple for process when being packaged to image sensing chip, and reduce Cost of manufacture.

Description of the drawings

It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is the embodiment of the utility model, for those of ordinary skill in the art, without creative efforts, also Other attached drawings can be obtained according to the attached drawing of offer.

Fig. 1 is a kind of schematic diagram of the encapsulating structure for image sensing chip that the utility model embodiment provides；

Fig. 2 is the top view in the reverse direction of the Z in a first direction of encapsulating structure shown in Fig. 1；

Fig. 3 is the top view on encapsulating structure described in Fig. 1 in a first direction Z；

Fig. 4 is the schematic diagram of the encapsulating structure for another image sensing chip that the utility model embodiment provides；

Fig. 5 is a kind of top view for image sensing chip that the utility model embodiment provides；

Fig. 6 is the top view for another image sensing chip that the utility model embodiment provides；

Fig. 7 is the top view for another image sensing chip that the utility model embodiment provides；

Fig. 8-Figure 11 is a kind of flow diagram for method for packing that the utility model embodiment provides；

Figure 12-Figure 15 is the flow diagram for another method for packing that the utility model embodiment provides.

Specific embodiment

The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work All other embodiments obtained shall fall within the protection scope of the present invention.

To enable the above-mentioned purpose of the utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings and have Body embodiment is described in further detail the utility model.

With reference to figure 1- Fig. 3, Fig. 1 is a kind of showing for the encapsulating structure for image sensing chip that the utility model embodiment provides It is intended to, Fig. 2 is the top view in the reverse direction of the Z in a first direction of encapsulating structure shown in Fig. 1, and Fig. 3 is encapsulating structure described in Fig. 1 Top view on Z in a first direction.

The encapsulating structure includes：Image sensing chip 11, the image sensing chip 11 include opposite first surface with And second surface, the first surface have multiple pixels 12 for being used to gather image information and the multiple and pixel First weld pad 13 of 12 connection of point；The substrate 14 of the first surface of the image sensing chip 11 is covered, is set on the substrate 14 It is equipped with wiring route and the contact jaw being connected with the wiring route；The wiring route is used to be electrically connected with external circuit. The wiring route includes the first interconnection circuit for being electrically connected the pixel 12 with external circuit.External circuit according to The image information that pixel 12 gathers carries out image procossing.

The periphery of the image sensing chip 11 is adhesively fixed by anisotropy conductiving glue 15 and the substrate 14, and institute It states the first weld pad 13 to be electrically connected with the contact jaw by the anisotropy conductiving glue 15, perpendicular to the side of the substrate 14 Upwards, the anisotropy conductiving glue 15 surrounds all pixels 12, and is not overlapped with the pixel 12.In Fig. 1 Fig. 3 The wiring route and the contact jaw is not shown.

In the utility model embodiment, define perpendicular to the direction of the substrate 14 be first direction Z, first direction Z by The image sensing chip 11 is directed toward the substrate 14.Second direction X and third direction Y is defined to hang down with first direction Z respectively Directly, and second direction X is vertical with third direction Y.Second direction X is parallel with the substrate 14 with third direction Y.

The substrate 14 includes first area A and surrounds the second area B of the first area A；The first area A For transmission region；The first surface of the image sensing chip 11 includes：The pickup area C's and encirclement pickup area C Non-acquired region D；The pickup area C is oppositely arranged with the first area A；First weld pad 13 is located at described non-acquired Region D.Wherein, the anisotropy conductiving glue 15 is between the non-acquired region D and the second area B.

On the first direction Z, the first area A is completely exposed the pickup area C.Optionally, can set The first area A is identical with the pickup area C.

In Fig. 1-Fig. 3 illustrated embodiments, substrate 14 is transparent material.Therefore, light can directly pass through the firstth area Domain A incidental images are as the pickup area C of sensing chip 11.When substrate 14 is transparent material, the substrate 14 can be glass base Plate or transparent plastic substrate.

The wiring route is located at the second area B towards the surface of the image sensing chip 11, and the wiring There is light shield layer between circuit and the substrate 14.

The contact jaw be located at the light shield layer away from a side surface of substrate 14.Light shield layer is arranged on 14 court of substrate To the one side of image sensing chip 11, friction damage light shield layer is avoided.Wiring route and the contact are blocked by light shield layer End, ensures that the appearance of encapsulating structure does not show wiring route and the contact jaw.The light shield layer not shown in Fig. 1-Fig. 3. Optionally, the light shield layer is black ink layer.

One side surface of the substrate 14 towards the image sensing chip 11 is additionally provided with to be electrically connected with the wiring route The external terminal 16 connect, the external terminal 16 with the external circuit for being electrically connected, so that external circuit is passed with image Pixel 12 in sense chip 11 is electrically connected.On the first direction Z, the external terminal 16 is located at substrate 14 and corresponds to institute The position of second area B is stated, and is not overlapped with the image sensing chip 11.

In the embodiment shown in fig. 1, the external terminal 16 is tin ball.In other embodiment, external terminal 16 is also It can be pad.When external terminal is tin ball or pad, external terminal 16 can be welded with the weld pad in external circuit, with So that external circuit is electrically connected with wiring route.

In other embodiment, the external circuit has jack, and the external terminal 16 can also be and the jack The grafting pin to match, at this point, the wiring route by the grafting of the grafting pin and the jack realize with it is described The electrical connection of external circuit.

In order to ensure image quality of the encapsulating structure under the weaker environment of light, envelope described in the utility model embodiment In assembling structure, further include：It is arranged on the light source compensator that the substrate 14 deviates from 11 1 side surface of image sensing chip 17.On the first direction Z, the light source compensator 17 is located at the position that substrate 14 corresponds to the second area B.It can Choosing, the light source compensator 17 is LED component.The work of light source compensator can be controlled by external circuit.It is described Wiring route further includes the second interconnection circuit for the light source compensator to be electrically connected with the external circuit.Described Two interconnection circuits insulate with first interconnection circuit.

Light source compensator 17 can be by running through the via of substrate 14 and substrate 14 towards 11 surface of image sensing chip Contact jaw connection, and then be connected with external circuit or light source compensator 17 by FPC with being located at 14 opposite side of substrate Contact jaw connection.

In the above-described embodiment, substrate 14 is transparent material, and therefore, first area A light transmissions, substrate 14 is in realization pair Image sensing chip 11 encapsulates, and while electrical connection with external circuit, can also be multiplexed the cover board of image sensing chip 11.

Encapsulating structure described in the utility model embodiment can be using as shown in figure 4, Fig. 4 be provided as the utility model embodiment Another image sensing chip encapsulating structure schematic diagram, in encapsulating structure shown in Fig. 4, substrate 14 is non-transparent material. At this point, the first area A is provided through the window K, the window K of the substrate 14 for exposing all pixels Point 12.Since substrate 14 at this time is non-transparent material, so when light shield layer need not be set.

When the substrate 14 is non-transparent material, the substrate 14 can be PCB substrate or opaque plastics base Plate or semiconductor substrate.At this point, the encapsulating structure further includes：The transparent cover plate 18 being fixed on the substrate 14, it is described Bright cover board 18 covers the window K.The transparent cover plate 18 can be tempered glass.The substrate 14 can be individual layer or more Layer stacked structure, corresponding first interconnection line and/or the second interconnection line or single-layer or multi-layer stacked structure.

When the substrate 14 is PCB substrate or opaque plastics substrate, first interconnection line and the second interconnection When circuit is multilayer lamination structure, first interconnection line and/or the second interconnection line can include multiple layer metal line layer With the metal plug or mistake hole connection structure for interconnecting the metallic circuit layer of adjacent layer.

When the substrate 14 is semiconductor substrate, first interconnection line and/or the second interconnection line can include In through-hole interconnection structure through semiconductor substrate and the first surface and/or second surface positioned at semiconductor substrate with it is logical The wiring metal line layer again of hole interconnection structure electrical connection.

The quantity of first interconnection line is multiple (>=2), and the quantity of second interconnection line is multiple (>=2 It is a), it is mutually isolated between different the first interconnection line and/or the second interconnection line, and mutually insulated.As needed The electronic component being connected with external circuit sets the quantity and cabling mode of first interconnection line and the second interconnection line.

With reference to figure 5, Fig. 5 is a kind of top view for image sensing chip that the utility model embodiment provides, real shown in Fig. 5 It applies in mode, the first weld pad 13 of image sensing chip 11 is evenly distributed in the periphery of the image sensing chip 11.First Weld pad 13 is located at the non-acquired region D of image sensing chip 11.All first weld pads 13 surround pickup area C.The embodiment In, since the first weld pad 13 is evenly distributed in the peripheral position of image sensing chip 11, when using anisotropy conductiving glue 15 When substrate 14 is adhesively fixed with image sensing chip 11,11 surrounding of image sensing chip can be caused to anisotropy conductiving glue 15 Pressure it is more uniform, ensure that substrate 14 and image sensing chip 11 are adhesively fixed effect, avoid due to image sensing chip It is glued caused by local pressure caused by the pressure of 11 pairs of anisotropy conductiving glues 15 is uneven excessive excessive glue or insufficient pressure Close the problems such as effect is poor.

With reference to figure 6, Fig. 6 is the top view for another image sensing chip that the utility model embodiment provides, shown in Fig. 6 In embodiment, the first surface of the image sensing chip 11 is additionally provided with multiple auxiliary spacers 19, the auxiliary spacer 19 Shape it is identical with the shape of first weld pad 13, the auxiliary spacer 19 and first weld pad 13 are evenly distributed in institute State the periphery of image sensing chip.

The auxiliary spacer 19 is evenly distributed in the periphery of image sensing chip 11 with first weld pad 13.It is using When substrate 14 is adhesively fixed with image sensing chip 11 in anisotropy conductiving glue 15, the auxiliary spacer 19 is so that image sensing core 11 surrounding of piece is more uniform to the pressure of anisotropy conductiving glue 15, ensures that substrate 14 and image sensing chip 11 are adhesively fixed effect It is excessive to avoid the local pressure caused by image sensing chip 11 is uneven to the pressure of anisotropy conductiving glue 15 for fruit Excessive glue or insufficient pressure caused by bonding effect it is poor the problems such as.Between first weld pad 13 and the auxiliary spacer 19 Away from, first weld pad 13 and the spacing of first weld pad 13, the spacing of the auxiliary spacer 19 and the auxiliary spacer 19 All same.

In Fig. 6 illustrated embodiments, the auxiliary spacer 19 is located at the periphery of same rectangle with first weld pad 13, Multiple first weld pads 13 are symmetrically distributed on two opposite sides of the rectangle；Multiple auxiliary spacers 19 are symmetrical It is distributed on the opposite two other side of the rectangle.

With reference to figure 7, Fig. 7 is the top view for another image sensing chip that the utility model embodiment provides, shown in Fig. 7 In embodiment, the similary auxiliary spacer 19 is located at the periphery of same rectangle with first weld pad 13, and Fig. 7 is different from Fig. 6 It is, on the periphery of the rectangle, first weld pad 13 is arranged alternately setting with the auxiliary spacer 19.First weld pad 13 with the spacing all same of the auxiliary spacer 19.

When the prior art is packaged chip, in order to obtain lower thickness chip-packaging structure, it is necessary to chip into Row reduction processing, specifically, reduction processing can be carried out to chip by modes such as mechanical lapping or chemical etchings.But The mechanical strength of chip after reduction processing is weaker.

In encapsulating structure described in the utility model embodiment, image sensing chip 11 passes through away from a side surface of substrate 14 Reduction processing, and after reduction processing, image sensing chip 11 is provided with enhancement layer away from a side surface of substrate 14.The reinforcement The mechanical strength of layer is more than the mechanical strength of the image sensing chip 11.It in this way, can be in the prior art to the image Sensing chip 11 carries out reduction processing by a larger margin, and increases mechanical strength by enhancement layer, and the shadow is being greatly lowered Ensure that chip-packaging structure has preferable mechanical strength while as 11 thickness of sensing chip.That is, the utility model Encapsulating structure described in embodiment, compared with encapsulating structure of the prior art, can further increase reduction processing reduces image 11 thickness of sensing chip so that the thickness of image sensing chip 11 is thinner, is compensated and is thinned by the better enhancement layer of mechanical strength Mechanical strength that treated can realize the lightening of chip-packaging structure.Optionally, the enhancement layer can be plastic packaging material Material.

In the encapsulating structure provided by foregoing description, the utility model embodiment, image sensing chip 11 and base When being packaged between plate 14, without welding procedure, image sensing chip is directly adhesively fixed by anisotropy conductiving glue 15 11 with substrate 14, the first weld pad 13 and the cloth on substrate 14 are caused while image sensing chip 11 and substrate 14 are being adhesively fixed Line circuit is electrically connected, simple for process, low manufacture cost.And the distribution of the first weld pad 13 can also be laid out or increase auxiliary spacer 19 so that 11 surrounding of image sensing chip is more uniform to the pressure of anisotropy conductiving glue 15, ensures that substrate 14 is passed with image Sense chip 11 is adhesively fixed effect, the problems such as avoiding excessive glue or poor bonding effect.

Based on above-mentioned encapsulating structure embodiment, another embodiment of the utility model additionally provides a kind of method for packing, is used for Image sensing chip is packaged, to form the encapsulating structure in above-described embodiment.The method for packing as shown in figures s-11, Fig. 8-Figure 11 is a kind of flow diagram for method for packing that the utility model embodiment provides.The method for packing includes：

Step S11：As shown in Figure 8 and Figure 9, a plate 21 is provided, institute's plate 21 includes the encapsulation region of multiple array arrangements 22, there is between adjacent package area 22 cutting raceway groove 20.

Fig. 8 is the top view of plate 21, and Fig. 9 is sectional drawings of the Fig. 8 in PP ' directions.The encapsulation region 22 includes the firstth area The domain A and second area B for surrounding the first area A；The first area AA is transmission region.In subsequent step, cutting Afterwards, the plate 21 is divided into multiple substrates 14.

The encapsulation region 22 is provided with wiring route and the contact jaw being electrically connected with the wiring route；The wiring line Road is used to be electrically connected with external circuit.The wiring route and contact jaw not shown in Fig. 8.

In Fig. 8-Figure 11 illustrated embodiments, illustrated so that plate 21 is transparent material as an example.When the plate 21 is During transparent material, one plate of the offer includes：The light shield layer of predetermined pattern structure is formed on 21 surface of plate, it is described pre- It is open correspondingly with the first area A if the light shield layer of patterning has, it is described to be open to expose corresponding institute State first area A；In the light shield layer of the predetermined pattern structure wiring route is formed away from a side surface of the plate And the contact jaw.

When forming the light shield layer of the predetermined pattern structure, the mask plate of predetermined pattern structure may be employed, pass through vapor deposition Technique forms the light shield layer of the predetermined pattern structure；Or, the light shield layer of the predetermined pattern structure is formed by photoetching process； Or, the light shield layer of the predetermined pattern structure is formed by silk-screen printing technique.When forming the wiring route, silk can be passed through Net typography forms the wiring route.

Step S12：As shown in Figure 10, by anisotropy conductiving glue 17, one is adhesively fixed in the encapsulation region 22 Image sensing chip 11.

The image sensing chip 11 includes opposite first surface and second surface, and the first surface has multiple For gathering the pixel 12 of image information and multiple the first weld pads 13 being connected with the pixel 12.

The first surface of the image sensing chip 11 includes：Acquisition zone and the non-acquired area for surrounding the pickup area Domain；The pickup area is oppositely arranged with the first area A；First weld pad 13 is located at the non-acquired region.It is described Image sensing chip 11 may be referred to above-mentioned encapsulating structure embodiment, and details are not described herein.

Specifically, include in the method that image sensing chip 11 is adhesively fixed in the encapsulation region 22：In each envelope The periphery coating anisotropy conductiving glue 15 in area 22 is filled, and an image is bonded on the anisotropy conductiving glue 15 Sensing chip 11 carries out hot-press solidifying so that the image sensing chip 11 is by described to the anisotropy conductiving glue 15 Anisotropy conductiving glue 15 is fixed with the substrate 14, and is electrically connected with first weld pad 13.Wherein, the anisotropy is led Electric glue 15 is between the non-inductive region and the second area B.Anisotropy conductiving glue 15 is perpendicular to substrate 14 It is conductive on direction, parallel on the direction of substrate 14 have electrical insulating property.

Step S13：Cutting separation is carried out to the plate 21 along the cutting raceway groove 20, multiple images is formed and passes The encapsulating structure of sense chip.

As shown in figure 11, before being cut, further include：It is formed and the wiring line on each encapsulation region 22 The external terminal 16 of road electrical connection, the external terminal 16 are used to be electrically connected with the external circuit.Wherein, the external terminal 16 are located at the same side of the plate 21 with the image sensing chip 11.After 22 stabilized image sensing chip 11 of encapsulation region, Before being cut, further include：Light Source Compensation is set away from a side surface of image sensing chip 11 in each encapsulation region 22 Device 17, light source compensator 17 are located at second area B.

After an image sensing chip 11 is adhesively fixed in the encapsulation region 22, before being cut, further include：To shadow As the side surface progress reduction processing of 11 back side plate 21 of sensing chip, and after reduction processing, in image sensing chip 11 One side surface of back side plate 21 forms enhancement layer.

After cutting, the plate 21 is divided into multiple substrates 14, each described substrate 14 includes an encapsulation region 22.Wherein, the periphery of the image sensing chip 11 is bonded solid by the anisotropy conductiving glue 15 and the encapsulation region 22 It is fixed, and first weld pad 13 is electrically connected by the anisotropy conductiving glue 15 with the contact jaw 13；For each institute Encapsulation region 22 is stated, on the direction of the encapsulation region, the anisotropy conductiving glue 15 surrounds all pixels 12, and do not overlapped with the pixel 12.After cutting, encapsulating structure is as shown in Figure 1.

In method for packing shown in Fig. 8-Figure 11, by plate 21 to be illustrated exemplified by transparent material, i.e., substrate 14 is dog Material is ordered, after cutting, each substrate 14 corresponds to the position light transmission of 11 pickup area of image sensing chip.

When plate 21 is non-transparent material, i.e., when substrate 14 is non-transparent material, need to correspond to respectively in plate 21 at this time The pickup area position of a image sensing chip 11 forms window, and image sensing chip 11 is subsequently adhesively fixed on encapsulation region 22 Afterwards, it is necessary to fix transparent cover plate on window.

When substrate 14 is non-transparent material, method for packing can be as shown in Figure 12-Figure 15, and Figure 12-Figure 15 is this practicality The flow diagram for another method for packing that new embodiment provides, the method for packing include：

Step S21：As shown in figure 12, provide with plate 12, plate 12 is non-transparent material at this time.

Plate 21 equally includes multiple encapsulation regions 22, has cutting raceway groove 20 between encapsulation region 22, and encapsulation region 22 has the One region A and second area B.

The first area A in each encapsulation region 22 is needed to be formed on Z in a first direction through the encapsulation region at this time 22 window K, the window K is used for all pixels for exposing image sensing chip.

Step S22：As shown in figure 13, by anisotropy conductiving glue, a shadow is adhesively fixed in the encapsulation region 22 As sensing chip 11.

Step S23：As shown in figure 14, transparent cover plate 18 is fixed on each window K.

Step S24：As shown in figure 15, on each encapsulation region 22 formed be electrically connected with the wiring route it is external Terminal 16 sets light source compensator 17 in each encapsulation region 22 away from a side surface of image sensing chip 11.

Step S25：Cutting separation is carried out to the plate 21 along the cutting raceway groove 20, multiple images is formed and passes The encapsulating structure of sense chip.After cutting, encapsulating structure is as shown in Figure 4.

It in method for packing described in the utility model embodiment, can be used for being packaged image sensing chip 11, be formed Above-mentioned encapsulating structure, when image sensing chip 11 and plate 21 are packaged, without welding procedure, manufacture craft is simple, into This is low.

It should be noted that each embodiment is described by the way of progressive in this specification, each embodiment emphasis is said Bright is all difference from other examples, and just to refer each other for identical similar portion between each embodiment.For reality For applying method for packing disclosed in example, due to its with embodiment disclosed in encapsulating structure it is corresponding, so description is fairly simple, Related part illustrates referring to encapsulating structure corresponding portion.

The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or new using this practicality Type.A variety of modifications of these embodiments will be apparent for those skilled in the art, determine herein The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein The most wide scope consistent with features of novelty.

Claims (13)

1. a kind of encapsulating structure of image sensing chip, which is characterized in that including：

Image sensing chip, the image sensing chip include opposite first surface and second surface, the first surface It is used to gather the pixel of image information and multiple the first weld pads being connected with the pixel with multiple；

Cover the substrate of the first surface of the image sensing chip, be provided on the substrate wiring route and with the cloth The contact jaw of line connection；The wiring route is used to be electrically connected with external circuit；

The periphery of the image sensing chip is fixed by anisotropy conductiving glue and the substrate bonding, and first weld pad It is electrically connected by the anisotropy conductiving glue with the contact jaw, it is described respectively to different on the direction of the substrate Property conducting resinl surround all pixels, and do not overlapped with the pixel.

2. encapsulating structure according to claim 1, which is characterized in that the substrate is included described in first area and encirclement The second area of first area；The first area is transmission region；

The first surface of the image sensing chip includes：Pickup area and the non-acquired region for surrounding the pickup area； The pickup area is oppositely arranged with the first area；First weld pad is located at the non-acquired region；

Wherein, the anisotropy conductiving glue is between the non-acquired region and the second area.

3. encapsulating structure according to claim 2, which is characterized in that the substrate is transparent material.

4. encapsulating structure according to claim 3, which is characterized in that the wiring route is located at the second area direction The surface of the image sensing chip, and there is light shield layer between the wiring route and the substrate.

5. encapsulating structure according to claim 2, which is characterized in that the substrate is non-transparent material；Firstth area Domain is provided through the window of the substrate, and the window is used to expose all pixels.

6. encapsulating structure according to claim 5, which is characterized in that further include fixed transparency cover on the substrate Plate, the transparent cover plate cover the window.

7. encapsulating structure according to claim 1, which is characterized in that the substrate is towards the one of the image sensing chip Side surface is additionally provided with the external terminal being electrically connected with the wiring route, and the external terminal is used for and external circuit electricity Connection.

8. encapsulating structure according to claim 7, which is characterized in that the external circuit has jack；

The external terminal is the grafting pin to match with the jack, and the wiring route passes through the grafting pin and institute It states jack grafting and realizes and be electrically connected with the external circuit.

9. encapsulating structure according to claim 1, which is characterized in that further include：

It is arranged on the light source compensator that the substrate deviates from the image sensing chip-side surface.

10. encapsulating structure according to claim 1, which is characterized in that first weld pad is evenly distributed in the shadow As the periphery of sensing chip.

11. encapsulating structure according to claim 1, which is characterized in that the first surface of the image sensing chip is also set Multiple auxiliary spacers are equipped with, the shape of the auxiliary spacer is identical with the shape of first weld pad, the auxiliary spacer and institute State the periphery that the first weld pad is evenly distributed in the image sensing chip.

12. encapsulating structure according to claim 11, which is characterized in that the auxiliary spacer is located at first weld pad The periphery of same rectangle, multiple first weld pads are symmetrically distributed on two opposite sides of the rectangle；

Multiple auxiliary spacers are symmetrically distributed on the opposite two other side of the rectangle.

13. encapsulating structure according to claim 11, which is characterized in that the auxiliary spacer is located at first weld pad The periphery of same rectangle, on the periphery of the rectangle, first weld pad is arranged alternately setting with the auxiliary spacer.