TWI746237B

TWI746237B - Manufacturing method of non-opaque display module

Info

Publication number: TWI746237B
Application number: TW109137838A
Authority: TW
Inventors: 李晉棠
Original assignee: 啟耀光電股份有限公司
Priority date: 2020-10-30
Filing date: 2020-10-30
Publication date: 2021-11-11
Also published as: TW202218210A

Abstract

The invention discloses a manufacturing method of non-opaque display module, which includes: preparing a non-opaque substrate; printing a first conductive layer on the first surface of the non-opaque substrate; printing a first insulating layer on the first conductive layer; printing a second conductive layer on the first insulating layer; printing a second insulating layer on the second conductive layer; and disposing a plurality of photoelectric elements on the first surface of the non-opaque substrate, wherein, part of the electrodes of each photoelectric element are electrically connected to the second pad structures of the second conductive layer, and part of the electrodes of each photoelectric element are electrically connected to the plurality of second lines of the second conductive layer through the plurality of second openings defined on the plurality of third insulation lines of the second insulating layer.

Description

透光顯示模組的製造方法 Method for manufacturing light-transmitting display module

本發明關於一種有別於傳統製程的透光顯示模組的製造方法。 The invention relates to a manufacturing method of a transparent display module which is different from the traditional manufacturing process.

傳統的光電裝置都是利用半導體製程製作，其中，半導體製程包括有黃光、蝕刻等等製程，製作過程相當複雜，費用也相當高，而且還有環境污染等的問題。 Traditional optoelectronic devices are manufactured using semiconductor manufacturing processes. Among them, semiconductor manufacturing processes include yellow light, etching and other manufacturing processes. The manufacturing process is quite complicated, the cost is also quite high, and there are problems such as environmental pollution.

本發明的目的為提供一種透光顯示模組的製造方法。有別於傳統光電裝置的製造過程，本發明的製造方法具有製程簡單、成本較低，而且也比較環保的優點。 The purpose of the present invention is to provide a method for manufacturing a light-transmitting display module. Different from the manufacturing process of traditional optoelectronic devices, the manufacturing method of the present invention has the advantages of simple manufacturing process, low cost, and environmental protection.

為達上述目的，依據本發明之一種透光顯示模組，至少包括以下步驟：置備一透光基板，其中透光基板定義有相對之一第一面與一第二面；印刷一第一導電圖層於透光基板之第一面上，其中第一導電圖層包括沿一第一方向佈設的多個第一線路、多個第一墊片結構、以及由該些第一線路延伸的多個引線；其中至少部分的該些第一墊片結構是由該些第一線路延伸；印刷一第一絕緣圖層於第一導電圖層上，其中第一絕緣圖層包括沿第一方向佈設的多個第一絕緣線、沿一第二方向佈設的多個第二絕緣線、以及曝露出該些引線的多個第一窗口，第二方向與第一方向垂直且構成一平面，該些第一絕緣線重疊該些第一線路；印刷一第二導電圖層於第一絕緣圖層上，其中第二導電圖層包括沿第二方向佈設的多個第二線路及多個第二墊片結構，該些第二線路重疊該些第二絕緣線，且通過該些第一窗口電連接至該些引線，該些第二墊片結構電連接該些第一墊片結構；印刷一第二絕緣圖層於第二導電圖層上，其中第二絕緣圖層包括沿第二方向佈設的多個第三絕緣線、及於該些第三絕緣線上定義的多個第二窗口，該些第三絕緣線重疊該些第二線路；以及設置多個光電元件於透光基板之第一面上，其中各光電元件具有多個電極，部分的該些電極電連接至該些第二墊片結構，部分的該些電極通過該些第二窗口電連接至該些第二線路。 To achieve the above objective, a light-transmitting display module according to the present invention includes at least the following steps: preparing a light-transmitting substrate, wherein the light-transmitting substrate defines a first surface and a second surface opposite to each other; and printing a first conductive surface The layer is on the first surface of the transparent substrate, wherein the first conductive layer includes a plurality of first circuits arranged along a first direction, a plurality of first pad structures, and a plurality of leads extending from the first circuits Wherein at least part of the first pad structures are extended by the first lines; a first insulating layer is printed on the first conductive layer, wherein the first insulating layer includes a plurality of first layers arranged along a first direction Insulated wires, a plurality of second insulated wires arranged along a second direction, and a plurality of first windows exposing the leads, the second direction is perpendicular to the first direction and forms a plane, and the first insulated wires overlap The first circuits; a second conductive layer is printed on the first insulating layer, wherein the second conductive layer includes a plurality of second circuits and a plurality of second pad structures arranged along a second direction, the second circuits Overlap the second insulating wires and electrically connect to the leads through the first windows, the second spacer structures are electrically connected to the first spacer structures; and a second insulating layer is printed on the second conductive layer In the above, the second insulation layer includes a plurality of third insulation wires arranged along the second direction, and a plurality of first insulation wires defined on the third insulation wires Two windows, the third insulated wires overlap the second circuits; and a plurality of optoelectronic elements are arranged on the first surface of the light-transmitting substrate, wherein each optoelectronic element has a plurality of electrodes, and some of the electrodes are electrically connected to the In some second gasket structures, part of the electrodes are electrically connected to the second circuits through the second windows.

在一些實施例中，於印刷第一導電圖層的步驟中，部分的該些第一墊片結構獨立於該些第一線路。 In some embodiments, in the step of printing the first conductive layer, part of the first pad structures are independent of the first lines.

在一些實施例中，於設置該些光電元件的步驟之前或之後，更包括：於透光基板之第一面或/與第二面形成對應於該些光電元件之多個保護單元。 In some embodiments, before or after the step of disposing the optoelectronic elements, it further includes: forming a plurality of protection units corresponding to the optoelectronic elements on the first surface or/and the second surface of the transparent substrate.

在一些實施例中，於印刷第一絕緣圖層或/與第二絕緣圖層的步驟中，同時形成該些保護單元。 In some embodiments, in the step of printing the first insulation layer or/and the second insulation layer, the protection units are formed at the same time.

在一些實施例中，於印刷第二導電圖層的步驟中，部分的該些第二墊片結構獨立於該些第二線路。 In some embodiments, in the step of printing the second conductive layer, part of the second pad structures are independent of the second lines.

在一些實施例中，於印刷第二導電圖層的步驟中，部分第二墊片結構重疊於獨立或不獨立於該些第二線路的部分第一墊片結構。 In some embodiments, in the step of printing the second conductive layer, part of the second gasket structure overlaps with the part of the first gasket structure independent or not independent of the second circuits.

在一些實施例中，於印刷第二導電圖層的步驟中，第一導電圖層的導電性優於第二導電圖層的導電性。 In some embodiments, in the step of printing the second conductive layer, the conductivity of the first conductive layer is better than that of the second conductive layer.

在一些實施例中，於印刷第二絕緣圖層的步驟之前，更包括：印刷一第三導電圖層於第二導電圖層上，其中第三導電圖層包括多個第三墊片結構，部分的該些第三墊片結構重疊並電連接至該些第二線路，部分的該些第三墊片結構疊加並電連接至該些第二墊片結構。 In some embodiments, before the step of printing the second insulating layer, it further comprises: printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third spacer structures, and some of the The third shim structure overlaps and is electrically connected to the second lines, and a part of the third shim structure is overlapped and electrically connected to the second shim structure.

在一些實施例中，於印刷第二絕緣圖層的步驟之後，更包括：印刷一第三導電圖層於第二導電圖層上，其中第三導電圖層包括多個第三墊片結構，部分的該些第三墊片結構對應於該些第二窗口，且電連接至該些第二線路，部分的該些第三墊片結構疊加並電連接至該些第二墊片結構。 In some embodiments, after the step of printing the second insulating layer, it further includes: printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third spacer structures, and some of the The third gasket structure corresponds to the second windows and is electrically connected to the second circuits, and a part of the third gasket structures are superimposed and electrically connected to the second gasket structures.

在一些實施例中，於印刷第二絕緣圖層的步驟之前或之後，更包括：印刷一第三導電圖層於第二導電圖層上，其中第三導電圖層包括多個第三墊片結構，該些第三墊片結構疊加並電連接至該些第二墊片結構。 In some embodiments, before or after the step of printing the second insulating layer, the method further includes: printing a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third spacer structures, and The third gasket structure is superimposed and electrically connected to the second gasket structures.

在一些實施例中，於設置該些光電元件的步驟中，更包括：佈設多個導電件於該些電極上，其中該些光電元件之該些電極透過該些導電件電連接至該些第二墊片結構與該些第二線路。 In some embodiments, the step of arranging the optoelectronic elements further includes: arranging a plurality of conductive elements on the electrodes, wherein the electrodes of the optoelectronic elements are electrically connected to the first through the conductive elements Two shim structures and the second circuits.

在一些實施例中，透光基板為一玻璃基板。 In some embodiments, the light-transmitting substrate is a glass substrate.

在一些實施例中，於製備透光基板的步驟中，透光基板為承載於一剛性基板上之一柔性基板；且於設置該些光電元件的步驟之後，更包括：移除剛性基板。 In some embodiments, in the step of preparing the light-transmitting substrate, the light-transmitting substrate is a flexible substrate carried on a rigid substrate; and after the step of disposing the optoelectronic elements, it further includes: removing the rigid substrate.

在一些實施例中，於移除剛性基板的步驟之前，更包括：貼附一光學膜於透光基板之第一面。 In some embodiments, before the step of removing the rigid substrate, the method further includes: attaching an optical film to the first surface of the transparent substrate.

在一些實施例中，於設置該些光電元件的步驟之前或之後，更包括：於透光基板之第一面或第二面鋪設一保護層。 In some embodiments, before or after the step of arranging the optoelectronic elements, the method further includes: laying a protective layer on the first surface or the second surface of the light-transmitting substrate.

在一些實施例中，保護層沿透光基板之第一面或第二面全面性鋪設。 In some embodiments, the protective layer is laid on the entire surface along the first surface or the second surface of the light-transmitting substrate.

在一些實施例中，保護層沿透光基板之第二面鋪設，且至少對應於第一導電圖層、第一絕緣圖層、第二導電圖層、或第二絕緣圖層、或其組合。 In some embodiments, the protective layer is laid along the second surface of the transparent substrate, and at least corresponds to the first conductive layer, the first insulating layer, the second conductive layer, or the second insulating layer, or a combination thereof.

在一些實施例中，於設置該些光電元件的步驟之前或之後，更包括：實施一抗反射或/與抗眩光處理，以形成一抗反射或/與抗眩光層。 In some embodiments, before or after the step of arranging the optoelectronic elements, it further includes: performing an anti-reflection or/and anti-glare treatment to form an anti-reflection or/and anti-glare layer.

在一些實施例中，抗反射或/與抗眩光層形成於透光基板之第一面或/與第二面。 In some embodiments, the anti-reflection or/and anti-glare layer is formed on the first surface or/and the second surface of the transparent substrate.

在一些實施例中，該些光電元件為毫米級或微米級的光電晶片或光電封裝件。 In some embodiments, the optoelectronic elements are millimeter or micrometer optoelectronic chips or optoelectronic packages.

承上所述，在本發明之透光顯示模組的製造方法中，是利用印刷製程依序在透光基板上形成第一導電圖層、第一絕緣圖層、第二導電圖層和第二絕緣圖層後，再設置多個光電元件於透光基板上，使各光電元件的部分電極電連接至第二導電圖層的第二墊片結構(以及第一導電圖層)，同時部分的電極通過第二絕緣圖層所定義的第二窗口電連接至第二導電圖層的第二線路。因此，本發明的透光顯示模組的製造方法是一種有別於傳統利用黃光、蝕刻等製程製作的方法，可具有製程簡單、成本較低，而且也比較環保的優點。 As mentioned above, in the manufacturing method of the transparent display module of the present invention, the first conductive layer, the first insulating layer, the second conductive layer, and the second insulating layer are sequentially formed on the transparent substrate by a printing process Then, a plurality of optoelectronic elements are arranged on the light-transmitting substrate, so that part of the electrodes of each optoelectronic element are electrically connected to the second pad structure of the second conductive layer (and the first conductive layer), and part of the electrodes are passed through the second insulating layer. The second window defined by the layer is electrically connected to the second circuit of the second conductive layer. Therefore, the manufacturing method of the light-transmitting display module of the present invention is different from traditional manufacturing methods using yellow light, etching, etc., and can have the advantages of simple manufacturing process, low cost, and environmental protection.

1:透光顯示模組 1: Translucent display module

11:透光基板 11: Transparent substrate

12:第一導電圖層 12: The first conductive layer

121:第一線路 121: First Route

122:第一墊片結構 122: The first gasket structure

123:引線 123: Lead

13:第一絕緣圖層 13: The first insulation layer

131:第一絕緣線 131: The first insulated wire

132:第二絕緣線 132: second insulated wire

14:第二導電圖層 14: The second conductive layer

141:第二線路 141: The second line

142:第二墊片結構 142: Second gasket structure

15:第二絕緣圖層 15: The second insulation layer

151:第三絕緣線 151: third insulated wire

16:光電元件 16: Optoelectronics

17:第三導電圖層 17: The third conductive layer

171:第三墊片結構 171: The third gasket structure

18:保護單元 18: Protection unit

5B-5B,5C-5C,8B-8B,8C-8C:割面線 5B-5B, 5C-5C, 8B-8B, 8C-8C: cutting line

C:導電件 C: conductive parts

D1:第一方向 D1: First direction

D2:第二方向 D2: second direction

E:電極 E: Electrode

S1:第一面 S1: First side

S2:第二面 S2: Second side

S01,S02,S03,S04,S05,S06:步驟 S01, S02, S03, S04, S05, S06: steps

w1:第一窗口 w1: the first window

w2:第二窗口 w2: second window

圖1為本發明一實施例之透光顯示模組製造方法的流程步驟示意圖。 FIG. 1 is a schematic diagram of the process steps of a method for manufacturing a light-transmitting display module according to an embodiment of the present invention.

圖2至圖8C分別為本發明一實施例之透光顯示模組的製造過程示意圖。 2 to 8C are schematic diagrams of the manufacturing process of the transparent display module according to an embodiment of the present invention.

以下將參照相關圖式，說明依本發明一些實施例之透光顯示模組的製造方法，其中相同的元件將以相同的參照符號加以說明。 Hereinafter, the manufacturing method of the light-transmitting display module according to some embodiments of the present invention will be described with reference to related drawings, in which the same components will be described with the same reference signs.

本文所述的「透光」係僅排除「不透明」而可包括「透明」或「半透明」等至少部分透明的狀態，例如經設置電路層後的畫素基板所呈現非百分百之透光率(或開口率)、或畫素基板因為本身材料所形成的霧度等。 The "transparent" mentioned herein only excludes "opaque" and can include at least partially transparent states such as "transparent" or "translucent". For example, the pixel substrate after the circuit layer is set is not 100% transparent. The light rate (or aperture ratio), or the haze of the pixel substrate due to its own material, etc.

圖1為本發明一實施例之透光顯示模組製造方法的流程步驟示意圖。如圖1所示，本發明提出的透光顯示模組製造方法，至少可包括以下步驟：置備一透光基板，其中該透光基板定義有相對之一第一面與一第二面(步驟S01)；印刷一第一導電圖層於該透光基板之該第一面上，其中該第一導電圖層包括沿一第一方向佈設的多個第一線路、多個第一墊片結構、以及由該些第一線路延伸的多個引線；其中至少部分的該些第一墊片結構是由該些第一線路延伸(步驟S02)；印刷一第一絕緣圖層於該第一導電圖層上，其中該第一絕緣圖層包括沿該第一方向佈設的多個第一絕緣線、沿一第二方向佈設的多個第二絕緣線、以及曝露出該些引線的多個第一窗口，該第二方向與該第一方向垂直且構成一平面，該些第一絕緣線重疊該些第一線路(步驟S03)；印刷一第二導電圖層於該第一絕緣圖層上，其中該第二導電圖層包括沿該第二方向佈設的多個第二線路及多個第二墊片結構，該些第二線路重疊該些第二絕緣線，且通過該些第一窗口電連接至該些引線，該些第二墊片結構電連接該些第一墊片結構(步驟S04)；印刷一第二絕緣圖層於該第二導電圖層上，其中該第二絕緣圖層包括沿該第二方向佈設的多個第三絕緣線、及於該些第三絕緣線上定義的多個第二窗口，該些第三絕緣線重疊該些第二線路(步驟S05)；以及設置多個光電元件於該透光基板之該第一面上，其中各該光電元件具有多個電極，部分的該些電極電連接至該些第二墊片結構，部分的該些電極通過該些第二窗口電連接至該些第二線路(步驟S06)。 FIG. 1 is a schematic diagram of the process steps of a method for manufacturing a light-transmitting display module according to an embodiment of the present invention. As shown in FIG. 1, the method for manufacturing a light-transmitting display module provided by the present invention may at least include the following steps: preparing a light-transmitting substrate, wherein the light-transmitting substrate defines a first surface and a second surface opposite to each other (step S01); Print a first conductive layer on the first surface of the light-transmitting substrate, wherein the first conductive layer includes a plurality of first lines arranged along a first direction, a plurality of first pad structures, and A plurality of leads extending from the first lines; wherein at least part of the first pad structures are extended from the first lines (step S02); printing a first insulating layer on the first conductive layer, The first insulation layer includes a plurality of first insulation wires arranged along the first direction, a plurality of second insulation wires arranged along a second direction, and a plurality of first windows exposing the leads. The two directions are perpendicular to the first direction and form a plane, the first insulated wires overlap the first circuits (step S03); a second conductive layer is printed on the first insulated layer, wherein the second conductive layer Comprising a plurality of second circuits and a plurality of second pad structures arranged along the second direction, the second circuits overlap the second insulated wires, and are electrically connected to the leads through the first windows, the The second pad structures are electrically connected to the first pad structures (step S04); a second insulating layer is printed on the second conductive layer, wherein the second insulating layer includes a plurality of layers arranged along the second direction The third insulated wires, and a plurality of second windows defined on the third insulated wires, the third insulated wires overlap the second circuits (step S05); and a plurality of photoelectric elements are arranged on the transparent substrate On the first surface, each of the optoelectronic elements has a plurality of electrodes, and some of the electrical The electrodes are electrically connected to the second pad structures, and part of the electrodes are electrically connected to the second circuits through the second windows (step S06).

以下，請參照圖2至圖8C以詳細說明上述透光顯示模組的製造過程。其中，圖2至圖8C分別為本發明一實施例之透光顯示模組的製造過程示意圖。 Hereinafter, please refer to FIGS. 2 to 8C to describe in detail the manufacturing process of the above-mentioned transparent display module. 2 to 8C are schematic diagrams of the manufacturing process of the transparent display module according to an embodiment of the present invention.

首先，如圖2所示，先置備透光基板11，其中，透光基板11定義有相對的第一面S1與第二面S2(步驟S01)。於此，第一面S1為透光基板11的上表面，而第二面S2為透光基板11的下表面。另外，本實施例的透光基板11還定義有沿圖2的垂直向(上下側延伸)的第一方向D1與水平向(左右側延伸)的第二方向D2，第一方向D1與第二方向D2垂直且構成一平面(該平面同時平行第一面S1、與第二面S2)。 First, as shown in FIG. 2, a light-transmitting substrate 11 is first prepared, wherein the light-transmitting substrate 11 defines a first surface S1 and a second surface S2 opposite to each other (step S01). Here, the first surface S1 is the upper surface of the light-transmitting substrate 11, and the second surface S2 is the lower surface of the light-transmitting substrate 11. In addition, the light-transmitting substrate 11 of this embodiment also defines a first direction D1 in the vertical direction (extending on the up and down sides) and a second direction D2 in the horizontal direction (extending on the left and right sides) in FIG. The direction D2 is vertical and forms a plane (the plane is parallel to the first surface S1 and the second surface S2 at the same time).

在一些實施例中，透光基板11可為剛性基板或柔性基板(可撓性基板)。透光基板11的材質可為玻璃、樹脂、金屬或陶瓷、或是複合材質。在一些實施例中，透光基板11可例如為玻璃基板或聚醯亞胺(PI)基板。在一些實施例中，透光基板11可為透明基板或半透明基板(例如霧面基板，部分透光)。其中，透明基板的影像清晰度可比半透明基板好，視設計者的需求而決定其材料。 In some embodiments, the light-transmitting substrate 11 may be a rigid substrate or a flexible substrate (flexible substrate). The material of the transparent substrate 11 can be glass, resin, metal or ceramic, or a composite material. In some embodiments, the light-transmitting substrate 11 may be, for example, a glass substrate or a polyimide (PI) substrate. In some embodiments, the light-transmitting substrate 11 may be a transparent substrate or a semi-transparent substrate (for example, a matte substrate, partially transparent). Among them, the image clarity of the transparent substrate can be better than that of the semi-transparent substrate, and the material is determined according to the needs of the designer.

在一些實施例中，如果透光基板11是柔性基板時，為了使之後的元件可通過後續製程順利地形成在柔性基板上，並方便對此柔性基板進行操作，可先將柔性基板承載於一剛性基板上後再進行後續步驟，並且，在後續設置光電元件的步驟S06之後，再移除該剛性基板。不過，為了使移除剛性基板後的柔性基板(透光基板11)具有足夠的強度，避免製作過程中被破壞，可在移除該剛性基板的步驟之前，先貼附一光學膜(未繪示)於透光基板11之第一面S1上，接著再移除剛性基板。其中，光學膜可例如但不限於為光學膠(OCA)。當然，如果透光基板11是剛性基板時，則不需要上述的過程。 In some embodiments, if the light-transmitting substrate 11 is a flexible substrate, in order to enable subsequent components to be smoothly formed on the flexible substrate through subsequent processes, and to facilitate the operation of the flexible substrate, the flexible substrate can be first carried on a flexible substrate. After the rigid substrate is mounted, the subsequent steps are performed, and the rigid substrate is removed after the subsequent step S06 of setting the photoelectric element. However, in order to make the flexible substrate (transmissive substrate 11) after the rigid substrate has sufficient strength and avoid damage during the manufacturing process, an optical film (not shown) can be attached before the step of removing the rigid substrate. (Shown) on the first surface S1 of the transparent substrate 11, and then remove the rigid substrate. Among them, the optical film may be, for example, but not limited to, an optical adhesive (OCA). Of course, if the light-transmitting substrate 11 is a rigid substrate, the above-mentioned process is not required.

接著，進行步驟S02：印刷第一導電圖層12於透光基板11之第一面S1上，其中第一導電圖層12包括沿第一方向D1佈設且實質上彼此平行的多個第一線路121、多個第一墊片結構122、以及由該些第一線路121延伸的多個引線123。至少部分的該些第一墊片結構122是由該些第一線路121延伸。本發明所稱的「墊片結構」可以是一種導電墊片、或進一步包括由導電線路延伸出來的一部分(且不受限原導電線路的方向性，例如，可由第一線路121朝第二方向D2延伸的一部分)。在本實施例中，該些第一墊片結構122都是由第一線路121往單側延伸所形成，而可作為導電之用。在一些實施例中，在印刷第一導電圖層12的步驟S02中，可以有部分第一墊片結構122不由第一線路121延伸，而是獨立於第一線路121的導電墊片；其中，印刷獨立於第一線路121的該些第一墊片結構122則可提供高度，有利於提高後續製程(印刷製程)的接續與順暢性。此外，本實施例的引線123是由第一線路121往至少一側(本實施例中大多數為兩側)延伸所形成，引線123有利於提高後續導電材印刷的接續性，以及增加接觸面積、降低阻抗。在一些實施例中，第一導電圖層12(及/或後續的第二導電圖層、及/或第三導電圖層)的材料可使用金屬(例如鋁、銅、銀、鉬、鈦)或其合金所構成的單層或多層結構。 Next, proceed to step S02: Print the first conductive layer 12 on the first surface S1 of the transparent substrate 11, where the first conductive layer 12 includes a plurality of first lines 121 arranged along the first direction D1 and substantially parallel to each other, A plurality of first pad structures 122 and a plurality of leads 123 extending from the first lines 121. At least part of the first gasket structures 122 are extended by the first lines 121. The so-called "pad" in the present invention The "sheet structure" may be a conductive pad, or further include a part extending from the conductive circuit (and the directionality of the original conductive circuit is not limited, for example, a part extending from the first circuit 121 in the second direction D2). In this embodiment, the first pad structures 122 are all formed by the first line 121 extending from one side, and can be used for conducting electricity. In some embodiments, in the step S02 of printing the first conductive layer 12, there may be a part of the first pad structure 122 that does not extend from the first circuit 121, but is independent of the conductive pads of the first circuit 121; The first pad structures 122 independent of the first circuit 121 can provide height, which is beneficial to improve the connection and smoothness of the subsequent process (printing process). In addition, the lead 123 of this embodiment is formed by extending the first circuit 121 to at least one side (mostly on both sides in this embodiment). The lead 123 is beneficial to improve the continuity of subsequent conductive material printing and increase the contact area. , Reduce impedance. In some embodiments, the material of the first conductive layer 12 (and/or the subsequent second conductive layer, and/or the third conductive layer) can use metals (such as aluminum, copper, silver, molybdenum, titanium) or alloys thereof The single-layer or multi-layer structure formed.

之後，如圖3A所示，進行步驟S03：印刷第一絕緣圖層13於第一導電圖層12上，其中，第一絕緣圖層13包括沿第一方向D1佈設且實質上彼此平行的多個第一絕緣線131、沿第二方向D2佈設且實質上彼此平行的多個第二絕緣線132、以及曝露出第一導電圖層12的該些引線123的多個第一窗口w1，該些第一絕緣線131分別重疊(或重合)於該些第一線路121。於此，第一絕緣圖層13可單純沿第一導電圖層12佈設，並包覆第一導電圖層12。第一絕緣圖層13(及/或後續的第二絕緣圖層)的材料可以是黑色、白色或透明。其中，黑色材料可遮蔽光線、提高透光顯示模組的對比及視覺效果，白色材料可提高透光顯示模組的光線反射率，而透明材料可作為保護功能、或搭配其他設計而擴展到第一導電圖層12以外的區域達到全面保護或更多的功能。於此，絕緣材料的選用可依設計者的需求而決定其顏色。 After that, as shown in FIG. 3A, proceed to step S03: print the first insulating layer 13 on the first conductive layer 12, wherein the first insulating layer 13 includes a plurality of first insulating layers arranged along the first direction D1 and substantially parallel to each other. The insulated wires 131, a plurality of second insulated wires 132 arranged along the second direction D2 and substantially parallel to each other, and a plurality of first windows w1 exposing the leads 123 of the first conductive layer 12, the first insulating wires The lines 131 overlap (or overlap) on the first lines 121 respectively. Here, the first insulating layer 13 may simply be laid along the first conductive layer 12 and cover the first conductive layer 12. The material of the first insulating layer 13 (and/or the subsequent second insulating layer) may be black, white or transparent. Among them, black materials can shield light, improve the contrast and visual effects of the light-transmitting display module, white materials can increase the light reflectivity of the light-transmitting display module, and transparent materials can be used as a protection function, or with other designs to extend to the first The area outside the conductive layer 12 achieves full protection or more functions. Here, the choice of insulating material can be determined according to the designer's needs.

具體來說，本實施例之第一絕緣圖層13中的第一絕緣線131和第二絕緣線132彼此在引線123之處交會呈不連續狀態以形成第一窗口w1，而可露出引線123。在一些實施例中，第二絕緣線132可部分重疊引線123的兩端，藉此可提高印刷的連接性或順暢度。值得提醒的是，本文中所謂的「重疊」和「重合」可以是完全重疊(重合)或部分重疊(重合)。完全重疊(重合)指的是上側的圖層完全覆蓋住下側的圖層(例如由第一面S1朝第二面S2的投影方向時看不見位於其下側的圖層)，而部分重疊(重合)指的是下側的圖層無法完全覆蓋住位於其下側的圖層(由第一面S1朝第二面S2的投影方向時可以看見一側或兩側的圖層)。 Specifically, the first insulated wire 131 and the second insulated wire 132 in the first insulating layer 13 of this embodiment intersect at the lead 123 in a discontinuous state to form a first window w1, and the lead 123 can be exposed. In some embodiments, the second insulated wire 132 may partially overlap the two ends of the lead 123, thereby improving the connectivity or smoothness of printing. It is worth reminding that the so-called "overlap" and "overlap" in this article can be completely overlapped (coincidence) or partially overlapped (coincident). Full overlap (coincidence) refers to the upper side The layer completely covers the lower layer (for example, when the projection direction from the first surface S1 to the second surface S2 is invisible), the partial overlap (overlap) means that the lower layer cannot be completely Cover the layer on the lower side (the layer on one or both sides can be seen when the projection direction from the first surface S1 to the second surface S2).

在本實施例中，在之後設置該些光電元件的步驟S06之前，可以先在透光基板11之第一面S1或/與第二面S2形成對應於該些光電元件之多個保護單元。如圖3B所示，本實施例是以在透光基板11之第一面S1上形成對應於該些光電元件的多個保護單元18為例，藉此保護後續設置的光電元件。其中，保護單元18可製作在第一絕緣圖層13或第二絕緣圖層上。本實施例的保護單元18是以製作且覆蓋在第一絕緣圖層13的部分第一絕緣線131中的一部分為例。在一些實施例中，保護單元18可為一絕緣圖層，其材料可與第一絕緣圖層13及/或第二絕緣圖層相同或不相同。當保護單元18與第一絕緣圖層13及/或第二絕緣圖層的材料相同時，可以在印刷第一絕緣圖層13(步驟S03)或/與第二絕緣圖層(步驟S05)的製程中，同時印刷該些保護單元18。此外，在一些實施例中，該些保護單元18也可以在設置光電元件的步驟S06之後再進行，本發明不限制。在一些實施例中，也可在透光基板11的第二面S2、或者在第一面S1及第二面S2同時形成對應於該些光電元件之多個保護單元18。當保護單元18形成於透光基板11的第二面S2時，其製作步驟則不限於設置該些光電元件的步驟S06之前或之後。此外，保護單元18可選用有色材料，作為遮蔽光電元件往透光基板11的第二面S2(下側)射出的光線之用，例如保護單元18選用黑色材料時可提高透光顯示模組的對比及視覺效果；或者保護單元18可選用白色材料則可提高光線反射率。值得一提的是，本發明中亦可不設置該些保護單元18，在此並不限制。 In this embodiment, before the subsequent step S06 of arranging the optoelectronic elements, a plurality of protection units corresponding to the optoelectronic elements may be formed on the first surface S1 or/and the second surface S2 of the transparent substrate 11. As shown in FIG. 3B, in this embodiment, a plurality of protection units 18 corresponding to the optoelectronic elements are formed on the first surface S1 of the light-transmitting substrate 11 as an example, so as to protect the optoelectronic elements to be subsequently disposed. Wherein, the protection unit 18 can be fabricated on the first insulating layer 13 or the second insulating layer. The protection unit 18 of this embodiment is an example of a part of the first insulated wire 131 made and covered on the first insulating layer 13. In some embodiments, the protection unit 18 may be an insulating layer, and its material may be the same as or different from the first insulating layer 13 and/or the second insulating layer. When the protective unit 18 is made of the same material as the first insulating layer 13 and/or the second insulating layer, the first insulating layer 13 (step S03) or/and the second insulating layer (step S05) can be printed at the same time. The protection units 18 are printed. In addition, in some embodiments, the protection units 18 may also be performed after the step S06 of setting the photoelectric element, which is not limited in the present invention. In some embodiments, a plurality of protection units 18 corresponding to the photoelectric elements may also be formed on the second surface S2 of the transparent substrate 11 or on the first surface S1 and the second surface S2 at the same time. When the protection unit 18 is formed on the second surface S2 of the light-transmitting substrate 11, the manufacturing steps are not limited to before or after the step S06 of arranging the photoelectric elements. In addition, the protection unit 18 can choose to use colored materials to shield the light emitted from the photoelectric element to the second surface S2 (lower side) of the light-transmitting substrate 11. Contrast and visual effects; or the protection unit 18 can choose white materials to increase the light reflectivity. It is worth mentioning that the protection units 18 may not be provided in the present invention, which is not limited here.

接著，如圖4所示，再進行步驟S04：印刷第二導電圖層14於第一絕緣圖層13上，其中，第二導電圖層14包括沿第二方向D2佈設且彼此實質上平行的多個第二線路141及多個第二墊片結構142，該些第二線路141分別重疊該些第二絕緣線132，且該些第二線路141分別通過該些第一窗口w1電連接至第一導電圖層12的該些引線123，亦即第二線路141的材料可填入第一窗口w1內而與引線123電連接。再者，第二導電圖層14的該些第二墊片結構142電連接第一導電圖層12的該些第一墊片結構122。在此，第二墊片結構142可完全重疊或部分重疊第一墊片結構122，本實施例是以完全重疊為例。如圖4所示，本實施例的各保護單元18的周緣分別對應有三個第二墊片結構142，各第二墊片結構142分別電連接對應的各第一墊片結構122(可同時參考圖3B)。 Next, as shown in FIG. 4, proceed to step S04: printing a second conductive layer 14 on the first insulating layer 13, wherein the second conductive layer 14 includes a plurality of first conductive layers arranged along the second direction D2 and substantially parallel to each other. Two lines 141 and a plurality of second pad structures 142. The second lines 141 overlap the second insulated wires 132, and the second lines 141 are electrically connected to the first conductive wires through the first windows w1. The lead wires 123 of the layer 12, that is, the material of the second circuit 141, can be filled into the first window w1 to be electrically connected to the lead wires 123. Furthermore, the second pad structures 142 of the second conductive layer 14 are electrically connected to the first conductive pattern The first gasket structures 122 of layer 12. Here, the second gasket structure 142 may completely overlap or partially overlap the first gasket structure 122, and this embodiment takes the complete overlap as an example. As shown in FIG. 4, there are three second gasket structures 142 corresponding to the periphery of each protection unit 18 in this embodiment, and each second gasket structure 142 is electrically connected to each corresponding first gasket structure 122 (see also Figure 3B).

可以理解的是，第一窗口w1中的該些引線123可通過重複印刷而增加厚度，第二線路141的材料在對應但未填入第一窗口w1的方式即可與引線123電連接。在一些實施例中，在印刷第二導電圖層14的步驟S04中，可以有部分第二墊片結構142不由第二線路141延伸，而是電性獨立於第二線路141；獨立印刷於第二線路141的該些第二墊片結構142可作為增加高度之用，利於提高後續製程(印刷製程)的接續與順暢性；且獨立的該些第二墊片結構142可以分別疊置於該些獨立的該些第一墊片結構122上。此外，第二導電圖層14的材料可選擇與第一導電圖層12相同或不同。可理解的是，在一些實施例中，由第二線路141延伸的部分第二墊片結構142可不疊置於該些第一墊片結構122(不論該些第一墊片結構122與該些第一線路121之間是否電性獨立)，或/與由第二線路141延伸的部分第二墊片結構142可疊置並電連接至該些獨立的第一墊片結構122。於此，在前述該些實施例中，當第一導電圖層12的導電性優於第二導電圖層14的導電性時，第二墊片結構142連同第一墊片結構122所構成的整體導電性(不論該些第一墊片結構122與該些第一線路121之間是否電性獨立)，優於僅由第二墊片結構142本身構成的導電性。 It is understandable that the thickness of the leads 123 in the first window w1 can be increased by repeated printing, and the material of the second circuit 141 can be electrically connected to the lead 123 in a manner corresponding to but not filled in the first window w1. In some embodiments, in the step S04 of printing the second conductive layer 14, part of the second pad structure 142 may not be extended by the second circuit 141, but electrically independent of the second circuit 141; printed independently of the second circuit 141; The second gasket structures 142 of the circuit 141 can be used to increase the height, which is beneficial to improve the continuity and smoothness of the subsequent process (printing process); and the independent second gasket structures 142 can be stacked on the respective On the independent first gasket structure 122. In addition, the material of the second conductive layer 14 may be the same as or different from that of the first conductive layer 12. It is understandable that, in some embodiments, a portion of the second gasket structure 142 extending from the second circuit 141 may not overlap the first gasket structure 122 (regardless of the first gasket structure 122 and the Whether the first lines 121 are electrically independent), or/and part of the second pad structure 142 extending from the second line 141 can be overlapped and electrically connected to the independent first pad structures 122. Herein, in the foregoing embodiments, when the conductivity of the first conductive layer 12 is better than that of the second conductive layer 14, the whole of the second pad structure 142 and the first pad structure 122 is electrically conductive. The electrical conductivity (regardless of whether the first pad structures 122 and the first circuits 121 are electrically independent) is better than the electrical conductivity formed by only the second pad structure 142 itself.

請參照圖5A至圖5C所示，其中，圖5B及圖5C分別為圖5A中，沿割面線5B-5B及5C-5C的剖視示意圖。在本實施例中，在印刷第二導電圖層14的步驟S04之後且在下一步驟S05，即印刷第二絕緣圖層之前，本發明的製作方法還可包括：印刷一第三導電圖層17於第二導電圖層14上，其中，第三導電圖層17包括多個第三墊片結構171，部分的該些第三墊片結構171重疊並電連接至該些第二線路141(圖5A、圖5B)，部分的該些第三墊片結構171疊加並電連接至該些第二墊片結構142(圖5A、圖5C)。在此，第三導電圖層17的該些第三墊片結構171位於保護單元18的周緣(外側)，可使後續設置光電元件的步驟S06中，對應於各光電元件的電極位置皆加厚，有利於光電元件的電連接。 Please refer to FIG. 5A to FIG. 5C, where FIG. 5B and FIG. 5C are respectively schematic cross-sectional views taken along the cutting plane lines 5B-5B and 5C-5C in FIG. 5A. In this embodiment, after step S04 of printing the second conductive layer 14 and in the next step S05, that is, before printing the second insulating layer, the manufacturing method of the present invention may further include: printing a third conductive layer 17 on the second On the conductive layer 14, the third conductive layer 17 includes a plurality of third pad structures 171, and some of the third pad structures 171 overlap and are electrically connected to the second lines 141 (FIG. 5A, FIG. 5B) , Part of the third gasket structures 171 are superimposed and electrically connected to the second gasket structures 142 (FIG. 5A, FIG. 5C). Here, the third spacer structures 171 of the third conductive layer 17 are located at the periphery (outside) of the protection unit 18, so that in the subsequent step S06 of arranging optoelectronic elements, the electrode positions corresponding to each optoelectronic element are thickened. Conducive to the electrical connection of optoelectronic components.

在完成第三導電圖層17之後，接著，如圖6所示，再進行步驟S05：印刷第二絕緣圖層15於第二導電圖層14上，其中，第二絕緣圖層15包括沿第二方向D2佈設且彼此實質上平行的多個第三絕緣線151、及於該些第三絕緣線151上定義的多個第二窗口w2，該些第三絕緣線151分別重疊該些第二線路141。在本實施例中，各第二窗口w2對應於第三墊片結構171的位置，以曝露出位於該些第二線路141上的第三墊片結構171。值得說明的是，在上述印刷第一絕緣圖層13或第二絕緣圖層15的製程中，分別印刷在第一線路121和第二線路141上的第一絕緣線131和第二絕緣線132可以包覆導電線路的兩側壁，可提高保護導電線路、或避免氧化等保護與絕緣效果。 After the third conductive layer 17 is completed, then, as shown in FIG. 6, step S05 is performed: a second insulating layer 15 is printed on the second conductive layer 14, wherein the second insulating layer 15 includes laying along the second direction D2 A plurality of third insulated wires 151 that are substantially parallel to each other and a plurality of second windows w2 defined on the third insulated wires 151, the third insulated wires 151 overlap the second wires 141, respectively. In this embodiment, each second window w2 corresponds to the position of the third gasket structure 171 to expose the third gasket structure 171 on the second circuits 141. It is worth noting that in the above-mentioned process of printing the first insulating layer 13 or the second insulating layer 15, the first insulated wire 131 and the second insulated wire 132 printed on the first circuit 121 and the second circuit 141, respectively, may be wrapped Covering the two side walls of the conductive circuit can improve the protection and insulation effect of protecting the conductive circuit or avoiding oxidation.

此外，在上述的實施例中，僅佈設沿第二方向D2印刷有第二絕緣圖層15(第三絕緣線151)，然並不以此為限。在一些實施例中，也可以在沿第一方向D1佈設的該些第一絕緣線131上印刷第二絕緣圖層15(例如未圖示的第四絕緣線)，除了具有保護或遮蔽第一絕緣線131的功用外，還可增加高度；而且，如果第二絕緣圖層15與第一絕緣圖層13的顏色不同的話，沿第一方向D1、第二方向D2佈設的第二絕緣圖層15還可保持透光顯示模組之絕緣圖層顏色的一致性。 In addition, in the above-mentioned embodiment, only the second insulating layer 15 (the third insulating wire 151) printed along the second direction D2 is arranged, but it is not limited to this. In some embodiments, the second insulating layer 15 (for example, the fourth insulated wire not shown) can also be printed on the first insulated wires 131 arranged along the first direction D1, in addition to protecting or shielding the first insulated wires. In addition to the function of the wire 131, the height can also be increased; and if the color of the second insulating layer 15 is different from that of the first insulating layer 13, the second insulating layer 15 arranged along the first direction D1 and the second direction D2 can also maintain The color consistency of the insulating layer of the transparent display module.

特別注意的是，上述印刷第三導電圖層17的製程也可在印刷第二絕緣圖層15的步驟S05之後再進行。換句話說，在印刷第二絕緣圖層15的步驟S05之後，再進行印刷第三導電圖層17的製程。在這種實施例中，由於先印刷第二絕緣圖層15，因此第二絕緣圖層15之該些第三絕緣線151上所定義的該些第二窗口w2將曝露出部分的該些第二線路141，而後續印刷的部分該些第三墊片結構171將對應於該些第二窗口w2，並電連接至該些第二線路141，且部分的該些第三墊片結構171會疊加並電連接至該些第二墊片結構142。 It is particularly noted that the above-mentioned process of printing the third conductive layer 17 can also be performed after the step S05 of printing the second insulating layer 15. In other words, after step S05 of printing the second insulating layer 15, the process of printing the third conductive layer 17 is performed. In this embodiment, since the second insulating layer 15 is printed first, the second windows w2 defined on the third insulated wires 151 of the second insulating layer 15 will expose part of the second lines 141, and a part of the third spacer structures 171 printed subsequently will correspond to the second windows w2 and electrically connected to the second lines 141, and a part of the third spacer structures 171 will overlap and It is electrically connected to the second gasket structures 142.

另外，在一些實施例中，印刷第三導電圖層17於第二導電圖層14的步驟可在印刷第二絕緣圖層的步驟S05之前或之後，而第三導電圖層17包括多個第三墊片結構171，該些第三墊片結構171疊加並電連接至該些第二墊片結構142。換句話說，只有在第二墊片結構142的位置上印刷第三墊片結構171，第二線路141上並不印刷對應於電極位置的第三墊片結構171。可以理解的是，第三導電圖層17中的第三墊片結構171可通過重複印刷而增加厚度，例如僅在第二墊片結構142的位置上印刷、或進一步在第二線路141上印刷、或者前述兩種方式交錯運用。 In addition, in some embodiments, the step of printing the third conductive layer 17 on the second conductive layer 14 may be before or after the step S05 of printing the second insulating layer, and the third conductive layer 17 includes a plurality of third pad structures 171. The third gasket structures 171 are superimposed and electrically connected to the second gasket structures 142. In other words, only the third pad structure 171 is printed on the position of the second pad structure 142, and the third pad structure 171 corresponding to the electrode position is not printed on the second circuit 141. Understandably, the third The thickness of the third pad structure 171 in the conductive layer 17 can be increased by repeated printing, for example, it is printed only on the position of the second pad structure 142, or further printed on the second circuit 141, or the aforementioned two methods are used in a staggered manner. .

最後，如圖7至圖8C，進行步驟S06：設置多個光電元件16於透光基板11之第一面S1上，其中，各光電元件16具有多個電極E(標示於圖8B、圖8C)，各光電元件16的部分該些電極E電連接至該些第二墊片結構142(圖8C)，各光電元件16的部分該些電極E則通過該些第二窗口w2電連接至該些第二線路141(圖8B)，藉此得到透光顯示模組1。在一些實施例中，可利用黏著層(例如黏著膠，未繪示)將該些光電元件16黏合在透光基板11之第一面S1上的該些保護單元18。 Finally, as shown in FIGS. 7 to 8C, proceed to step S06: arranging a plurality of photoelectric elements 16 on the first surface S1 of the light-transmitting substrate 11, wherein each photoelectric element 16 has a plurality of electrodes E (labeled in FIGS. 8B and 8C) ), part of the electrodes E of each photoelectric element 16 is electrically connected to the second pad structures 142 (FIG. 8C), and part of the electrodes E of each photoelectric element 16 is electrically connected to the second window w2 These second lines 141 (FIG. 8B ), thereby obtaining a transparent display module 1. In some embodiments, an adhesive layer (such as an adhesive, not shown) may be used to bond the optoelectronic elements 16 to the protection units 18 on the first surface S1 of the transparent substrate 11.

在本實施例中，為了使光電元件16的該些電極E可分別與第二墊片結構142(及第一墊片結構122)和第二線路141電性連接，更可佈設多個導電件C於該些電極E上，如圖8B所示，部分的該些電極E是透過該些導電件C及該些第三墊片結構171電連接至第二導電圖層14的該些第二線路141；如圖8C所示，部分的該些電極E是透過該些導電件C、該些第三墊片結構171及該些第二墊片結構142電連接至該些第一墊片結構122。在一些實施例中，導電件C可包括導電材料，例如為銅膠、銀膠、錫膏、或異方性導電膠(ACP)，其可設置於光電元件16面內的穿孔，或設置於光電元件16的側邊(例如本實施例)，以將光電元件16的電極E電連接至第二導電圖層14的第二線路141及第一墊片結構122(該些第一線路121)。在一些實施例中，光電元件16為標準的SMD元件，導電件C可以位於光電元件16的電極E可位於朝向透光基板11的一面，例如位於光電元件16的該些電極E與第二墊片結構142(及第一墊片結構122)和第二線路141之間。在此，導電件C可以是光電元件16面內穿孔的直接電連接(Direct Mount)，或是光電元件16為標準的SMD元件而可直接電連接(Direct Mount)，或是位於光電元件16側邊的跳線(Side Jumper)，或其他功效均等的電連接方式。 In this embodiment, in order to enable the electrodes E of the optoelectronic element 16 to be electrically connected to the second pad structure 142 (and the first pad structure 122) and the second circuit 141, a plurality of conductive elements may be arranged. C is on the electrodes E. As shown in FIG. 8B, some of the electrodes E are electrically connected to the second lines of the second conductive layer 14 through the conductive members C and the third pad structures 171 141; as shown in FIG. 8C, part of the electrodes E are electrically connected to the first pad structures 122 through the conductive members C, the third pad structures 171, and the second pad structures 142 . In some embodiments, the conductive member C may include a conductive material, such as copper glue, silver glue, solder paste, or anisotropic conductive glue (ACP), which may be provided in a perforation in the surface of the optoelectronic element 16 or The side of the optoelectronic element 16 (for example, in this embodiment) is to electrically connect the electrode E of the optoelectronic element 16 to the second circuit 141 of the second conductive layer 14 and the first pad structure 122 (the first circuits 121). In some embodiments, the optoelectronic element 16 is a standard SMD element, and the conductive member C may be located on the electrode E of the optoelectronic element 16 may be located on the side facing the light-transmitting substrate 11, such as the electrodes E and the second pad of the optoelectronic element 16 Between the sheet structure 142 (and the first gasket structure 122) and the second circuit 141. Here, the conductive member C can be a direct electrical connection (Direct Mount) perforated in the surface of the optoelectronic element 16, or the optoelectronic element 16 is a standard SMD element and can be directly electrically connected (Direct Mount), or is located on the side of the optoelectronic element 16 Side Jumper, or other electrical connection methods with equal functions.

在一些實施例中，該些光電元件16可為毫米級或微米級的光電晶片或光電封裝件。在一些實施例中，各光電元件16可例如但不限於包括至少一發光二極體晶片(LED chip)、次毫米發光二極體晶片(Mini LED chip)、微發光二極體晶片(Micro LED chip)或至少一封裝件，或不限尺寸毫米級、微米級或以下的光電晶片或光電封裝件。其中，毫米級的封裝件可包括有微米級的晶片。在一些實施例中，各光電元件16可包括一個光電晶片或封裝件，而以此將光電元件16理解為單一畫素；或者，在一些實施例中，各光電元件16可包括多個光電晶片或封裝件，可以理解為光電元件16包括多個畫素。在一些實施例中，光電元件16中可包括例如紅色、藍色或綠色等LED、Mini LED、或Micro LED晶片，或其他顏色的LED、Mini LED、或Micro LED晶片或封裝件。當光電元件16上的三個光電晶片或封裝件分別為紅色、藍色及綠色LED、Mini LED、或Micro LED晶片時，可構成全彩的LED、Mini LED、或Micro LED顯示器。前述的晶片可為水平式電極、或覆晶式電極、或垂直式電極的晶粒，並以打線接合(wire bonding)或覆晶接合(flip chip bonding)與電極E電連接。 In some embodiments, the optoelectronic elements 16 may be millimeter or micrometer optoelectronic chips or optoelectronic packages. In some embodiments, each optoelectronic element 16 may include, for example, but not limited to, at least one light-emitting diode chip (LED chip), sub-millimeter light-emitting diode chip (Mini LED chip), and Micro LED chip or at least one package, or a photoelectric chip or package with an unlimited size of millimeter, micrometer or less. Among them, the millimeter-level package may include micron-level wafers. In some embodiments, each optoelectronic element 16 may include one optoelectronic chip or package, and in this way, the optoelectronic element 16 is understood as a single pixel; or, in some embodiments, each optoelectronic element 16 may include multiple optoelectronic chips. Or a package, it can be understood that the optoelectronic element 16 includes a plurality of pixels. In some embodiments, the optoelectronic element 16 may include, for example, red, blue, or green LEDs, Mini LEDs, or Micro LED chips, or other colors of LEDs, Mini LEDs, or Micro LED chips or packages. When the three optoelectronic chips or packages on the optoelectronic element 16 are respectively red, blue, and green LED, Mini LED, or Micro LED chips, a full-color LED, Mini LED, or Micro LED display can be formed. The aforementioned chip may be a die of a horizontal electrode, a flip chip electrode, or a vertical electrode, and is electrically connected to the electrode E by wire bonding or flip chip bonding.

在一些實施例中，在設置該些光電元件16的步驟S06之前或之後，本發明的製造方法更可包括：在透光基板11之第一面S1鋪設一保護層(未繪示)，保護層可沿透光基板11之第一面S1全面性鋪設，以保護被其覆蓋的相關元件；或更進一步地使第一導電圖層12、第二導電圖層14等引電用結構所在位置相當於整體結構的應力中性層，以更保護前述的引電用結構。在一些實施例中，在設置該些光電元件16的步驟S06之前或之後，本發明的製造方法更可包括：在透光基板11之第二面S2鋪設一保護層(未繪示)，可進一步平衡透光基板11可能發生的翹曲(Warpage)。在一些實施例中，保護層可沿透光基板11之第二面S2全面性鋪設，藉此提高透光顯示模組的整體結構強度；於此，全面性鋪設的保護層為透明。在一些實施例中，保護層可至少對應於第一導電圖層12、第一絕緣圖層13、第二導電圖層14、或第二絕緣圖層15、或其組合而設置，以平衡第一導電圖層12、第一絕緣圖層13、第二導電圖層14、或第二絕緣圖層15、或更多的其他圖層、或其組合在透光基板11之第一面S1所形成的應力之用。保護層無論設在透光基板11之第一面S1或第二面S2、或採局部鋪設可斟酌選用有利於對比的黑色、有利於反射的白色、或採全面鋪設有利於不遮光的透明等。此外，保護層可於第一絕緣圖層13、第二絕緣圖層15、或其他保護用圖層一同實施，亦可獨立實施，並不限制。 In some embodiments, before or after the step S06 of arranging the optoelectronic elements 16, the manufacturing method of the present invention may further include: laying a protective layer (not shown) on the first surface S1 of the transparent substrate 11 to protect The layer can be laid across the first surface S1 of the light-transmitting substrate 11 to protect the related components covered by it; or more so that the position of the first conductive layer 12, the second conductive layer 14 and other structures for drawing electricity is equivalent to The stress-neutral layer of the overall structure protects the aforementioned structure for drawing electricity. In some embodiments, before or after the step S06 of arranging the optoelectronic elements 16, the manufacturing method of the present invention may further include: laying a protective layer (not shown) on the second surface S2 of the light-transmitting substrate 11. The possible warpage of the light-transmitting substrate 11 is further balanced. In some embodiments, the protective layer can be laid across the second surface S2 of the light-transmitting substrate 11 to improve the overall structural strength of the light-transmitting display module; here, the protective layer laid all-round is transparent. In some embodiments, the protective layer can be provided at least corresponding to the first conductive layer 12, the first insulating layer 13, the second conductive layer 14, or the second insulating layer 15, or a combination thereof, so as to balance the first conductive layer 12. , The first insulating layer 13, the second conductive layer 14, or the second insulating layer 15, or more other layers, or a combination thereof on the first surface S1 of the transparent substrate 11. Whether the protective layer is set on the first surface S1 or the second surface S2 of the light-transmitting substrate 11, or it is partially laid, it can be selected to be black for contrast, white for reflection, or full-faced to be transparent without shading, etc. . In addition, the protective layer can be implemented together with the first insulating layer 13, the second insulating layer 15, or other protective layers, or can be implemented independently without limitation.

在一些實施例中，在設置該些光電元件16的步驟S06之前或之後，本發明的製造方法更可包括：實施一抗反射或/與抗眩光處理，以形成一抗反射或/與抗眩光層(未繪示)。其中，抗反射或/與抗眩光層可形成於透光基板11之第一面S1或/與第二面S2。在一些實施例中，抗反射或/與抗眩光處理也可以在置備透光基板11的步驟S01時就進行，一樣可達到抗反射或/與抗眩光的功效。 In some embodiments, before or after the step S06 of arranging the optoelectronic elements 16, the manufacturing method of the present invention may further include: implementing an anti-reflection or/and anti-glare treatment to form an anti-reflection or/and anti-glare treatment. Layer (not shown). Wherein, the anti-reflection or/and anti-glare layer may be formed on the first surface S1 or/and the second surface S2 of the transparent substrate 11. In some embodiments, the anti-reflection or/and anti-glare treatment can also be performed during step S01 of preparing the light-transmitting substrate 11, and the anti-reflection or/and anti-glare effect can also be achieved.

綜上所述，在本發明之透光顯示模組的製造方法中，是利用印刷製程依序在透光基板上形成第一導電圖層、第一絕緣圖層、第二導電圖層和第二絕緣圖層後，再設置多個光電元件於透光基板上，使各光電元件的部分電極電連接至第二導電圖層的第二墊片結構(以及第一導電圖層)，同時部分的電極通過第二絕緣圖層所定義的第二窗口電連接至第二導電圖層的第二線路。因此，本發明的透光顯示模組的製造方法是一種有別於傳統利用黃光、蝕刻等製程製作的方法，可具有製程簡單、成本較低，而且也比較環保的優點。 In summary, in the manufacturing method of the transparent display module of the present invention, the first conductive layer, the first insulating layer, the second conductive layer, and the second insulating layer are sequentially formed on the transparent substrate by a printing process. Then, a plurality of optoelectronic elements are arranged on the light-transmitting substrate, so that part of the electrodes of each optoelectronic element are electrically connected to the second pad structure of the second conductive layer (and the first conductive layer), and part of the electrodes are passed through the second insulating layer. The second window defined by the layer is electrically connected to the second circuit of the second conductive layer. Therefore, the manufacturing method of the light-transmitting display module of the present invention is different from the traditional manufacturing method using yellow light, etching, etc., and can have the advantages of simple manufacturing process, low cost, and environmental protection.

以上所述僅為舉例性，而非為限制性者。任何未脫離本發明之精神與範疇，而對其進行之等效修改或變更，均應包含於後附之申請專利範圍中。 The above descriptions are merely illustrative and not restrictive. Any equivalent modifications or alterations that do not depart from the spirit and scope of the present invention should be included in the scope of the appended patent application.

S01,S02,S03,S04,S05,S06:步驟 S01, S02, S03, S04, S05, S06: steps

Claims

一種透光顯示模組的製造方法，至少包括以下步驟：置備一透光基板，其中該透光基板定義有相對之一第一面與一第二面；印刷一第一導電圖層於該透光基板之該第一面上，其中該第一導電圖層包括沿一第一方向佈設的多個第一線路、多個第一墊片結構、以及由該些第一線路延伸的多個引線；其中至少部分的該些第一墊片結構是由該些第一線路延伸；印刷一第一絕緣圖層於該第一導電圖層上，其中該第一絕緣圖層包括沿該第一方向佈設的多個第一絕緣線、沿一第二方向佈設的多個第二絕緣線、以及曝露出該些引線的多個第一窗口，該第二方向與該第一方向垂直且構成一平面，該些第一絕緣線重疊該些第一線路；印刷一第二導電圖層於該第一絕緣圖層上，其中該第二導電圖層包括沿該第二方向佈設的多個第二線路及多個第二墊片結構，該些第二線路重疊該些第二絕緣線，且通過該些第一窗口電連接至該些引線，該些第二墊片結構電連接該些第一墊片結構；印刷一第二絕緣圖層於該第二導電圖層上，其中該第二絕緣圖層包括沿該第二方向佈設的多個第三絕緣線、及於該些第三絕緣線上定義的多個第二窗口，該些第三絕緣線重疊該些第二線路；以及設置多個光電元件於該透光基板之該第一面上，其中各該光電元件具有多個電極，部分的該些電極電連接至該些第二墊片結構，部分的該些電極通過該些第二窗口電連接至該些第二線路。 A method for manufacturing a light-transmitting display module includes at least the following steps: Preparing a light-transmitting substrate, wherein the light-transmitting substrate defines a first surface and a second surface opposite to each other; A first conductive layer is printed on the first surface of the light-transmitting substrate, wherein the first conductive layer includes a plurality of first circuits arranged along a first direction, a plurality of first pad structures, and the A plurality of leads extending from the first line; wherein at least part of the first pad structures are extended by the first lines; Printing a first insulating layer on the first conductive layer, wherein the first insulating layer includes a plurality of first insulated wires arranged along the first direction, a plurality of second insulated wires arranged along a second direction, and A plurality of first windows exposing the leads, the second direction is perpendicular to the first direction and forms a plane, the first insulated wires overlap the first circuits; A second conductive layer is printed on the first insulating layer, wherein the second conductive layer includes a plurality of second circuits and a plurality of second pad structures arranged along the second direction, and the second circuits overlap the ones The second insulated wire is electrically connected to the leads through the first windows, and the second gasket structures are electrically connected to the first gasket structures; Print a second insulating layer on the second conductive layer, wherein the second insulating layer includes a plurality of third insulated wires arranged along the second direction, and a plurality of second windows defined on the third insulated wires , The third insulated wires overlap the second wires; and A plurality of optoelectronic elements are arranged on the first surface of the light-transmitting substrate, wherein each of the optoelectronic elements has a plurality of electrodes, some of the electrodes are electrically connected to the second pad structures, and some of the electrodes pass through the The second windows are electrically connected to the second lines.

如請求項1所述的製造方法，其中，於印刷該第一導電圖層的步驟中，部分的該些第一墊片結構獨立於該些第一線路。The manufacturing method according to claim 1, wherein, in the step of printing the first conductive layer, part of the first pad structures are independent of the first lines.

如請求項1所述的製造方法，其中，於設置該些光電元件的步驟之前或之後，更包括：於該透光基板之該第一面或/與該第二面形成對應於該些光電元件之多個保護單元。 The manufacturing method according to claim 1, wherein, before or after the step of arranging the optoelectronic elements, the method further comprises: A plurality of protection units corresponding to the photoelectric elements are formed on the first surface or/and the second surface of the transparent substrate.

如請求項3所述的製造方法，其中，於印刷該第一絕緣圖層或/與該第二絕緣圖層的步驟中，同時形成該些保護單元。The manufacturing method according to claim 3, wherein in the step of printing the first insulation layer or/and the second insulation layer, the protection units are formed at the same time.

如請求項1所述的製造方法，其中，於印刷該第二導電圖層的步驟中，部分的該些第二墊片結構獨立於該些第二線路。The manufacturing method according to claim 1, wherein, in the step of printing the second conductive layer, part of the second pad structures are independent of the second circuits.

如請求項2所述的製造方法，其中，於印刷該第二導電圖層的步驟中，部分的該些第二墊片結構重疊於獨立或不獨立於該些第二線路的部分的該些第一墊片結構。The manufacturing method according to claim 2, wherein, in the step of printing the second conductive layer, part of the second spacer structure overlaps the first part independent or not independent of the second circuit A gasket structure.

如請求項1所述的製造方法，其中，於印刷該第二導電圖層的步驟中，該第一導電圖層的導電性優於該第二導電圖層的導電性。The manufacturing method according to claim 1, wherein in the step of printing the second conductive layer, the conductivity of the first conductive layer is better than that of the second conductive layer.

如請求項1所述的製造方法，其中，於印刷該第二絕緣圖層的步驟之前，更包括：印刷一第三導電圖層於該第二導電圖層上，其中該第三導電圖層包括多個第三墊片結構，部分的該些第三墊片結構重疊並電連接至該些第二線路，部分的該些第三墊片結構疊加並電連接至該些第二墊片結構。 The manufacturing method according to claim 1, wherein, before the step of printing the second insulating layer, the method further includes: Print a third conductive layer on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, part of the third pad structures overlap and are electrically connected to the second lines, part The third gasket structures of are superimposed and electrically connected to the second gasket structures.

如請求項1所述的製造方法，其中，於印刷該第二絕緣圖層的步驟之後，更包括：印刷一第三導電圖層於該第二導電圖層上，其中該第三導電圖層包括多個第三墊片結構，部分的該些第三墊片結構對應於該些第二窗口，且電連接至該些第二線路，部分的該些第三墊片結構疊加並電連接至該些第二墊片結構。 The manufacturing method according to claim 1, wherein after the step of printing the second insulating layer, the method further includes: Print a third conductive layer on the second conductive layer, where the third conductive layer includes a plurality of third spacer structures, and some of the third spacer structures correspond to the second windows and are electrically connected to The second circuits and part of the third gasket structures are superimposed and electrically connected to the second gasket structures.

如請求項1所述的製造方法，其中，於印刷該第二絕緣圖層的步驟之前或之後，更包括：印刷一第三導電圖層於該第二導電圖層上，其中該第三導電圖層包括多個第三墊片結構，該些第三墊片結構疊加並電連接至該些第二墊片結構。 The manufacturing method according to claim 1, wherein, before or after the step of printing the second insulating layer, the method further comprises: A third conductive layer is printed on the second conductive layer, wherein the third conductive layer includes a plurality of third pad structures, and the third pad structures are superimposed and electrically connected to the second pad structures.

如請求項1所述的製造方法，其中，於設置該些光電元件的步驟中，更包括：佈設多個導電件於該些電極上，其中該些光電元件之該些電極透過該些導電件電連接至該些第二墊片結構與該些第二線路。 The manufacturing method according to claim 1, wherein, in the step of arranging the optoelectronic elements, the method further includes: A plurality of conductive elements are arranged on the electrodes, and the electrodes of the optoelectronic elements are electrically connected to the second pad structures and the second circuits through the conductive elements.

如請求項1所述的製造方法，其中該透光基板為一玻璃基板。The manufacturing method according to claim 1, wherein the transparent substrate is a glass substrate.

如請求項1所述的製造方法，其中，於製備該透光基板的步驟中，該透光基板為承載於一剛性基板上之一柔性基板；且於設置該些光電元件的步驟之後，更包括：移除該剛性基板。 The manufacturing method according to claim 1, wherein, in the step of preparing the light-transmitting substrate, the light-transmitting substrate is a flexible substrate carried on a rigid substrate; and after the step of arranging the optoelectronic elements, more include: Remove the rigid substrate.

如請求項13所述的製造方法，其中，於移除該剛性基板的步驟之前，更包括：貼附一光學膜於該透光基板之該第一面。 The manufacturing method according to claim 13, wherein, before the step of removing the rigid substrate, the method further includes: An optical film is attached to the first surface of the transparent substrate.

如請求項1所述的製造方法，其中，於設置該些光電元件的步驟之前或之後，更包括：於該透光基板之該第一面或第二面鋪設一保護層。 The manufacturing method according to claim 1, wherein, before or after the step of arranging the optoelectronic elements, the method further comprises: A protective layer is laid on the first surface or the second surface of the transparent substrate.

如請求項15所述的製造方法，其中該保護層沿該透光基板之該第一面或該第二面全面性鋪設。The manufacturing method according to claim 15, wherein the protective layer is laid on the entire surface along the first surface or the second surface of the light-transmitting substrate.

如請求項15所述的製造方法，其中該保護層沿該透光基板之該第二面鋪設，且至少對應於該第一導電圖層、該第一絕緣圖層、該第二導電圖層、或該第二絕緣圖層、或其組合。The manufacturing method according to claim 15, wherein the protective layer is laid along the second surface of the light-transmitting substrate, and at least corresponds to the first conductive layer, the first insulating layer, the second conductive layer, or the The second insulating layer, or a combination thereof.

如請求項1所述的製造方法，其中，於設置該些光電元件的步驟之前或之後，更包括：實施一抗反射或/與抗眩光處理，以形成一抗反射或/與抗眩光層。 The manufacturing method according to claim 1, wherein, before or after the step of arranging the optoelectronic elements, the method further comprises: Implement an anti-reflection or/and anti-glare treatment to form an anti-reflection or/and anti-glare layer.

如請求項18所述的製造方法，其中該抗反射或/與抗眩光層形成於該透光基板之該第一面或/與該第二面。The manufacturing method according to claim 18, wherein the anti-reflection or/and anti-glare layer is formed on the first surface or/and the second surface of the light-transmitting substrate.

如請求項1所述的製造方法，其中該些光電元件為毫米級或微米級的光電晶片或光電封裝件。The manufacturing method according to claim 1, wherein the optoelectronic elements are millimeter or micrometer optoelectronic wafers or optoelectronic packages.