CN207353058U - Integrated power supply unit - Google Patents

Integrated power supply unit Download PDF

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Publication number
CN207353058U
CN207353058U CN201721249474.5U CN201721249474U CN207353058U CN 207353058 U CN207353058 U CN 207353058U CN 201721249474 U CN201721249474 U CN 201721249474U CN 207353058 U CN207353058 U CN 207353058U
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CN
China
Prior art keywords
pcb
power supply
supply unit
heat conduction
magnetic core
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Active
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CN201721249474.5U
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Chinese (zh)
Inventor
谢卫其
陈曲
黄�俊
王永山
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United Automotive Electronic Systems Co Ltd
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United Automotive Electronic Systems Co Ltd
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Priority to CN201721249474.5U priority Critical patent/CN207353058U/en
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Abstract

The utility model discloses a kind of integrated power supply unit for vehicle load, including:Heat conduction transition part is installed on cooling end, first magnetic core is installed on heat conduction transition part, PCB components are installed on above the first magnetic core, second magnetic core is contacted through the through hole on PCB components and with the first magnetic core from top to bottom, encapsulation part is located above the second magnetic core, and encapsulation part and cooling end are fixed together, and winding is arranged in the PCB internal layers around each layer PCB through hole of PCB components, winding is in parallel by via between same PCB different layers, and the winding between different PCB is welded by weldment and turned on;A part of windings of each PCB of PCB components and first, second magnetic core are collectively forming inductance;Each PCB remainders winding of PCB components and first, second magnetic core are collectively forming transformer.The utility model will wind and be arranged in the internal layer of each layer PCB, and inductance and transformer are integrated, the high voltage direct current of new-energy automobile on-board high-voltage battery can be converted into low-voltage direct needed for vehicle load, be conducive to the miniaturization of power supply unit.

Description

Integrated power supply unit
Technical field
Automotive field is the utility model is related to, Denso is supplied for the integrated of new-energy automobile load more particularly to a kind of Put.
Background technology
With the development of auto industry, exhaust emissions becomes the problem of environmental pollution of getting worse.Therefore, new-energy automobile Industry progressively becomes main trend.New-energy automobile on-board high-voltage battery to motor in addition to providing power, it is also necessary to automobile Load provides input.And the input of vehicle load is typically all low-tension supply, in order to realize the high voltage direct current of on-board high-voltage battery To the conversion of the low-voltage direct needed for vehicle load, it is necessary to utilize DC-DC converter.Transformer is high and low pressure voltage conversion Primary Component is widely used in high voltage direct current into the conversion of low-voltage direct.In order to avoid voltage waveform is to vehicle load shadow Ring, it is also necessary to which inductance realizes that rectification could obtain the low-voltage dc power supply needed for vehicle load.
It is equal that the existing high voltage direct current by on-board high-voltage battery is converted into the transformer of low-voltage direct, inductance needed for vehicle load It is unfavorable for device miniaturization greatly for independent component occupied space, installation is relatively complicated, and manufacturing cost is high.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of high straightening by new-energy automobile on-board high-voltage battery Circulation turns to the integrated power supply unit of low-voltage direct needed for vehicle load.
In order to solve the above technical problems, the utility model provides the integrated power supply unit for vehicle load, including:Cooling Portion, heat conduction transition part, the first magnetic core, the second magnetic core, PCB components and encapsulation part;
Heat conduction transition part is installed on cooling end, and the first magnetic core is installed on heat conduction transition part, and PCB components are installed on first Above magnetic core, the second magnetic core is contacted through the through hole on PCB components and with the first magnetic core from top to bottom, and encapsulation part is located at the second magnetic Above core, encapsulation part and cooling end are fixed together, and winding is arranged in the PCB internal layers around each layer PCB through hole of PCB components In, the winding between same PCB different layers is connected by via, and the winding between different PCB is welded by weldment and turned on;
A part of windings of each PCB of PCB components and first, second magnetic core are collectively forming inductance;Its remaining part of each PCB of PCB components Sub-winding and first, second magnetic core are collectively forming transformer.
Further improve, the first magnetic core is I type magnetic cores, and the second magnetic core is E-type magnetic core.
Wherein, the PCB components are made of at least two layers PCB welded together.
Further improve, first kind Heat Conduction Material, first kind heat conduction material are additionally provided between heat conduction transition part and the first magnetic core Expect to be more than 2.0, such as heat conductive silica gel for insulating heat-conduction material, first kind Heat Conduction Material thermal conductivity factor.
Further improve, cooling end is the concave structure with side wall.
Wherein, cooling end is cooled plate.
Further improve, further include fastener, encapsulation part is fixed together by the side wall of fastener and cooling end.
Wherein, fastener is bolt.
Further improve, elastic cord breaker is additionally provided between encapsulation part and the second magnetic core.Elastic buffer be subject to encapsulation part to Under pressure produce deformation, the second magnetic core will be pressed to after pressure buffer.Wherein, elastic cord breaker is silica gel foam.
Further improve, integrated power supply unit is realized into the region of inductive function and realizes the region of transformer low voltage function Low-pressure area is defined as, the region that integrated power supply unit realizes transformer high-voltage function is defined as higher-pressure region, high and low pressure area is led to Groove is crossed to be isolated;
Heat conduction transition part position corresponding with high and low pressure area vertical direction is respectively defined as high and low pressure radiating area, high pressure Radiating area is isolated area, is isolated by groove with low pressure radiating area.
Further improve, higher-pressure region is equipped with first kind Heat Conduction Material, and low-pressure area is equipped with the second class Heat Conduction Material, and the first kind is led Hot material is insulating heat-conduction material, and first kind Heat Conduction Material and the second class Heat Conduction Material thermal conductivity factor are all higher than 2.0.
Wherein, first kind Heat Conduction Material is thermal conductive silicon rubber cushion, the second class Heat Conduction Material thermal grease conduction.
Since higher-pressure region has high pressure to climb electric requirement, so insulating heat-conduction material can only be used.Due to existing inside thermal grease conduction Air, and it is difficult to ensure that thickness is uniform during smearing, the thickness of thermal grease conduction is directly related to pressure-resistant insulation performance, so Thermal conductive silicon rubber cushion is used in higher-pressure region.
Further improve, thermal conductive silicon rubber cushion has location structure, and thermal conductive silicon rubber cushion is fixed on higher-pressure region by location structure.
Further improve, multiple first kind vias are set in the same position of each layer PCB white spaces of PCB components, first Class via break-through PCB components;
White space refers to that PCB is without electrical equipment and without wiring at this.
Wherein, first kind via inner wall laying thermal conductive metallic material, such as:Copper.
Further improve, the same position setting of PCB components other each layer PCB white spaces in addition to top layer PC plate is multiple Second class via, sets multiple conductive structures, conductive structure is formed with top layer PCB through the second class via and connect in heat conduction transition part Touch;White space refers to that PCB is without electrical equipment and without wiring at this.
Wherein, the second class via inner wall laying thermal conductive metallic material, such as:Copper.
Further improve, the second class Heat Conduction Material, such as thermal grease conduction are laid with conductive structure.
Further improve, conductive structure is the heat conduction boss being arranged in the excessive portion of heat conduction.
Further improve, thermal conductive metallic material is laid in the side wall of other each layer PCB in addition to top layer PCB.
The utility model at least has following technique effect compared with prior art:
1st, the utility model independently arranged inductance and transformer will integrate in the prior art, be conducive to supply Denso The miniaturization put, improves integrated level, is conducive to the optimization in space in automobile engine using new energy resources storehouse.
2nd, the utility model will wind and be arranged in the internal layer of each layer PCB, further saves space, passes through the different numbers of plies PCB forms PCB component energy flexible configuration and obtains required voltage.
3rd, inductance and transformer are integrated in PCB components, device heat dissipation is huge difficult problem, the utility model for for The high and low pressure area of division and high and low pressure radiating area of property.Different zones are carried out according to current characteristics using different Heat Conduction Materials Heat dissipation, substantially increases heat dissipation effect.
4th, to solve the objective circumstances of PCB assembly radiating hardly possiblies, this is provided with two class vias, heat conduction boss, PCB side walls and applies copper Etc. technological means, the heat dissipation of integrated power supply unit is realized, ensure integrated power supply unit energy stable operation.
5th, the utility model realizes inductance, the technological means of transformer is to set winding using PCB internal layers, eliminates winding The scheme being electrically connected by screw, avoids since screw loosens the security risk for bringing contact resistance to rise, and ensures integrated Power supply unit energy stable operation.
Brief description of the drawings
The utility model is described in further detail with embodiment below in conjunction with the accompanying drawings:
Fig. 1 is the side structure schematic view of the utility model embodiment.
Fig. 2 is the overlooking the structure diagram of the utility model embodiment.
Fig. 3 is the inner side present invention looks up structural representation of the utility model embodiment.
Fig. 4 is inductive function area bottom PCB winding schematic diagrames.
Fig. 5 is inductive function area middle level PCB winding schematic diagrames.
Fig. 6 is inductive function area top layer PCB winding schematic diagrames.
Fig. 7 is transformer functional areas bottom PCB transformer primary sides winding schematic diagram.
Fig. 8 is transformer functional areas middle level PCB transformer primary sides winding schematic diagram.
Fig. 9 is transformer functional areas top layer PCB transformer primary sides winding schematic diagram.
Figure 10 is transformer functional areas transformer secondary winding schematic diagram.
Description of reference numerals
A is inductive function area
A1 is the connecting pin of inductive function area bottom PCB winding connection middle level PCB windings
A2 is that inductive function area middle level PCB winds the connecting pin that input current is wound to bottom PCB
A3 is the connecting pin that middle level PCB winding output currents in inductive function area are wound to top layer PCB
A4 is the connecting pin that top layer PCB winding output currents in inductive function area are wound to middle level PCB, that is, come in and go out filtering connection End
B is transformer functional areas
B1 is the first connecting pin that transformer functional areas bottom PCB winds a connecting pin, i.e. transformer primary side winding
B2 is transformer functional areas bottom PCB winding connection middle level PCB windings connecting pin
B3 is transformer functional areas middle level PCB winding connection top layer PCB windings connecting pin
B4 is the second connection end that transformer functional areas top layer PCB winds a connecting pin, i.e. transformer primary side winding
B5 is transformer
C1, C2, C3 represent the through hole of PCB components
H higher-pressure regions
H1 high pressure radiating areas
L low-pressure areas
L1 low pressure radiating areas
1 is cooling end
2 be heat conduction transition part
3 be first kind Heat Conduction Material
4 be the first magnetic core
5 be the second magnetic core
6 be PCB components
6.1 be bottom PCB
6.2 be middle level PCB
6.3 be top layer PCB
7 be elastic cord breaker
8 be fastener
9 be encapsulation part
10 be conductive structure
Via between 11 same PCB different layers windings
Embodiment
As shown in Figure 1 with Figure 2, the utility model provides one embodiment of integrated power supply unit for vehicle load, bag Include:Cooling end 1, heat conduction transition part 2, the first magnetic core 4, the second magnetic core 5, PCB components 6, elastic cord breaker 7, fastener 8 and encapsulation Portion 9.
In the present embodiment, cooling end 1 is cooled plate, and heat conduction rebound 2 is the rebound for having the capacity of heat transmission, the first magnetic core 4 be I type magnetic cores, and the second magnetic core 5 is E-type magnetic core, and PCB components 6 are by bottom PCB6.1, middle level PCB6.2 and top layer PCB6.3 totally 3 The composition that layer PCB welds together, elastic cord breaker 7 is silica gel foam, and fastener 8 is bolt, and encapsulation part 9 is head cover.
Rebound 2 is installed in cooled plate 1, and I types magnetic core 4 is installed on rebound 2, rebound 2 and I type magnetic core 4 it Between be equipped with first kind Heat Conduction Material, heat conduction transition part and the first magnetic core, PCB components 6 are installed on the top of I types magnetic core 4, E-type magnetic core 5 The through hole on PCB components is passed through from top to bottom and is contacted with I types magnetic core 4, and head cover 9 is located at the top of E-type magnetic core 5, head cover 9 and E types Silica gel foam 7 is equipped between magnetic core 5, cooled plate 1 is the concave structure for having side wall, and head cover 9 passes through bolt 8 and cooled plate 1 Side wall is fixed together, and winding is arranged in the PCB internal layers around each layer PCB through hole of PCB components, same PCB different layers Between winding connected by via, the winding between different PCB pass through weldment (pad) welding conducting;
Winding is used as inductive function area around a certain through hole C1 of each PCB of PCB components, and inductance is wound by 3 circles, E-type magnetic core Formed with I types magnetic core, winding is in parallel by via inside same PCB, and winding is led after passing through pad solder between different PCB Logical, explanation winding deployment scenarios are as follows exemplified by bottom, middle level, top layer PCB respectively set 1 circle winding:
As shown in figure 4, bottom PCB6.1 inductive functions area winds schematic diagram, winding is arranged in the bottom around through hole C1 The internal layer of PCB6.1, A1 are the connecting pins that bottom PCB winding output currents are wound to middle level PCB, and A2 is that middle level PCB is wound the bottom of to The connecting pin (the first connecting pin of the inductance) of layer PCB winding input currents.
As shown in figure 5, middle level PCB6.2 inductive functions area winds schematic diagram, winding is arranged in the middle level around through hole C1 The internal layer of PCB6.2, A3 are the connecting pins that PCB winding output currents in middle level are wound to top layer PCB, and A1 is bottom PCB winding inputs The connecting pin that electric current is wound to middle level PCB.
As shown in fig. 6, top layer PCB6.3 inductive functions area winds schematic diagram, winding is arranged in the top layer around through hole C1 The internal layer of PCB6.3, A3 are the connecting pins that PCB winding input currents in middle level are wound to top layer PCB, and A4 is top layer PCB winding outputs The connecting pin that electric current is wound to middle level PCB, that is, come in and go out filtering connecting pin (second connection end of the inductance).
Winding is used as transformer functional areas around PCB components other through holes of each PCB C2, C3, with winding and E around through hole C2 Type magnetic core forms the primary side of transformer, and transformer primary side side bottom, middle level, top layer PCB respectively set 6 circles to wind, in every piece of PCB The circle winding of portion 6 is in parallel by via;To wind the secondary that transformer is formed with E-type magnetic core, transformer secondary one around through hole C3 Side bottom, middle level, top layer PCB respectively set 4 circle windings, and every piece of 4 circle winding of PCB inside is in parallel by via.
As shown in fig. 7, bottom PCB6.1 transformer primary sides winding (higher-pressure region), B1 be transformer functional areas bottom PCB around The first connecting pin of a connecting pin, i.e. transformer primary side winding is hindered, B2 is transformer functional areas bottom PCB winding connections middle level PCB winds connecting pin.
As shown in figure 8, middle level PCB6.2 transformer primary sides winding (higher-pressure region), B2 be transformer functional areas bottom PCB around Resistance connection middle level PCB windings connecting pin, B3 are transformer functional areas middle level PCB winding connection top layer PCB windings connecting pins.
As shown in figure 9, top layer PCB6.3 transformer primary sides winding (higher-pressure region), B3 be transformer functional areas middle level PCB around Resistance connection top layer PCB winding connecting pin, B4 are that transformer functional areas top layer PCB winds a connecting pin, i.e., the transformer primary side around The second connection end of resistance.
As shown in Figure 10, each layer PCB windings of transformer secondary connect layer PCB windings catenation principle phase each with transformer primary side Together, repeat no more.B5 is that transformer secondary winds the first connecting pin, and B6 is transformer secondary winding second connection end.
With reference to shown in figure 2, Fig. 3, integrated power supply unit is realized into the region of inductive function and realizes transformer low voltage function Region be defined as low-pressure area L, integrated power supply unit is realized that the region of transformer high-voltage function is defined as higher-pressure region H, by it is high, Low-pressure area is isolated by groove;
The position corresponding with high and low pressure area vertical direction of rebound 2 is respectively defined as high pressure radiating area H1, low pressure heat dissipation Area L1, high pressure radiating area are isolated area H1, isolate L1 with low pressure radiating area by groove.
Higher-pressure region is equipped with first kind Heat Conduction Material, and low-pressure area is equipped with the second class Heat Conduction Material, and first kind Heat Conduction Material is exhausted Edge Heat Conduction Material, first kind Heat Conduction Material and the second class Heat Conduction Material thermal conductivity factor are all higher than 2.0.The present embodiment mesohigh area First kind Heat Conduction Material uses thermal conductive silicon rubber cushion;Second class Heat Conduction Material of low-pressure area uses thermal grease conduction;
Wherein, thermal conductive silicon rubber cushion has location structure, and thermal conductive silicon rubber cushion is fixed on higher-pressure region by location structure.For example, Convex portion is manufactured on thermal conductive silicon rubber cushion, convex portion is positioned in the groove of PCB;Or convex portion is manufactured on PCB, stayed on thermal conductive silicon rubber cushion Hole, the convex portion of PCB pass through hole of thermal conductive silicon rubber cushion etc..
In the same position of each layer PCB white spaces of PCB components, multiple first kind vias, first kind via break-through are set PCB components;
White space refers to that PCB is without electrical equipment and without wiring at this.
First kind via and the second class via inner wall laying thermal conductive metallic material, such as:Copper.
The same position of PCB components other each layer PCB white spaces in addition to top layer PC plate sets multiple second class vias, Multiple conductive structures 10 are set in rebound 2, the present embodiment is heat conduction boss, and heat conduction boss 10 passes through the second class via and top layer PCB forms contact
Second class via inner wall lays thermal conductive metallic material, such as:Copper.
The second class Heat Conduction Material, such as thermal grease conduction are laid with conductive structure.
Thermal conductive metallic material is laid in the side wall of other each layer PCB in addition to top layer PCB.
The utility model is described in detail above by embodiment and embodiment, but these are not structure The limitation of paired the utility model.In the case where not departing from the utility model principle, those skilled in the art can also make Many modification and improvement, these also should be regarded as the scope of protection of the utility model.

Claims (21)

  1. A kind of 1. integrated power supply unit for vehicle load, it is characterised in that including:Cooling end, heat conduction transition part, the first magnetic Core, the second magnetic core, PCB components and encapsulation part;
    Heat conduction transition part is installed on cooling end, and the first magnetic core is installed on heat conduction transition part, and PCB components are installed on the first magnetic core Top, the second magnetic core are contacted through the through hole on PCB components and with the first magnetic core from top to bottom, and encapsulation part is located on the second magnetic core Side, encapsulation part and cooling end are fixed together, and winding is arranged in the PCB internal layers around each layer PCB through hole of PCB components, Winding between same PCB different layers is in parallel by via, and the winding between different PCB is welded by weldment to be turned on;
    A part of windings of each PCB of PCB components and first, second magnetic core are collectively forming inductance;Each PCB remainders of PCB components around Group and first, second magnetic core are collectively forming transformer.
  2. 2. integrated power supply unit as claimed in claim 1, it is characterised in that:First magnetic core is I type magnetic cores, and the second magnetic core is E Type magnetic core.
  3. 3. integrated power supply unit as claimed in claim 1, it is characterised in that:The PCB components are welded on one by least two layers The PCB compositions risen.
  4. 4. integrated power supply unit as claimed in claim 1, it is characterised in that:It is additionally provided between heat conduction transition part and the first magnetic core First kind Heat Conduction Material, first kind Heat Conduction Material are insulating heat-conduction material, and first kind Heat Conduction Material thermal conductivity factor is more than 2.0.
  5. 5. integrated power supply unit as claimed in claim 1, it is characterised in that:Cooling end is the concave structure with side wall.
  6. 6. integrated power supply unit as claimed in claim 1, it is characterised in that:Cooling end is cooled plate.
  7. 7. integrated power supply unit as claimed in claim 5, it is characterised in that:Fastener is further included, encapsulation part passes through fastener It is fixed together with the side wall of cooling end.
  8. 8. integrated power supply unit as claimed in claim 7, it is characterised in that:Fastener is bolt.
  9. 9. integrated power supply unit as claimed in claim 1, it is characterised in that:Elasticity is additionally provided between encapsulation part and the second magnetic core Cushion.
  10. 10. integrated power supply unit as claimed in claim 9, it is characterised in that:Elastic cord breaker is silica gel foam.
  11. 11. integrated power supply unit as claimed in claim 1, it is characterised in that:Integrated power supply unit is realized into inductive function Region is defined as low-pressure area with the region for realizing transformer low voltage function, and integrated power supply unit is realized transformer high-voltage function Region is defined as higher-pressure region, and high and low pressure area is isolated by groove;
    Heat conduction transition part position corresponding with high and low pressure area vertical direction is respectively defined as high and low pressure radiating area, high pressure heat dissipation Area is isolated area, is isolated by groove with low pressure radiating area.
  12. 12. power supply unit is integrated as claimed in claim 11, it is characterised in that:Higher-pressure region is equipped with first kind Heat Conduction Material, low Pressure area is equipped with the second class Heat Conduction Material, and first kind Heat Conduction Material is insulating heat-conduction material, and first kind Heat Conduction Material and the second class are led Hot material thermal conductivity factor is all higher than 2.0.
  13. 13. integrated power supply unit as claimed in claim 12, it is characterised in that:First kind Heat Conduction Material is thermal conductive silicon rubber cushion, Second class Heat Conduction Material thermal grease conduction.
  14. 14. integrated power supply unit as claimed in claim 13, it is characterised in that:Thermal conductive silicon rubber cushion has location structure, heat conduction Silicagel pad is fixed on higher-pressure region by location structure.
  15. 15. the integrated power supply unit as described in claim 1-14 any one, it is characterised in that:It is empty in each layer PCB of PCB components The same position of white region sets multiple first kind vias, first kind via break-through PCB components;
    White space refers to that PCB is without electrical equipment and without wiring at this.
  16. 16. integrated power supply unit as claimed in claim 15, it is characterised in that:First kind via inner wall lays heat-conducting metal material Material.
  17. 17. the integrated power supply unit as described in claim 1-14 any one, it is characterised in that:PCB components except top layer PCB it The same position of other outer each layer PCB white spaces sets multiple second class vias, and multiple heat conduction knots are set in heat conduction transition part Structure, conductive structure are formed with top layer PCB through the second class via and contacted;White space refer at this PCB without electrical equipment and Without wiring.
  18. 18. integrated power supply unit as claimed in claim 17, it is characterised in that:Second class via inner wall lays heat-conducting metal material Material.
  19. 19. integrated power supply unit as claimed in claim 17, it is characterised in that:The second class heat conduction material is laid with conductive structure Material.
  20. 20. integrated power supply unit as claimed in claim 17, it is characterised in that:Conductive structure is to be arranged in the excessive portion of heat conduction Heat conduction boss.
  21. 21. the integrated power supply unit as described in claim 1-14 any one, it is characterised in that:In addition to top layer PCB its The side wall laying thermal conductive metallic material of his each layer PCB.
CN201721249474.5U 2017-09-27 2017-09-27 Integrated power supply unit Active CN207353058U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721249474.5U CN207353058U (en) 2017-09-27 2017-09-27 Integrated power supply unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721249474.5U CN207353058U (en) 2017-09-27 2017-09-27 Integrated power supply unit

Publications (1)

Publication Number Publication Date
CN207353058U true CN207353058U (en) 2018-05-11

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Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN207353058U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107610903A (en) * 2017-09-27 2018-01-19 联合汽车电子有限公司 Integrated electric supply installation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107610903A (en) * 2017-09-27 2018-01-19 联合汽车电子有限公司 Integrated electric supply installation

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