CN206432264U - Display base plate and its display panel, crimping apparatus - Google Patents
Display base plate and its display panel, crimping apparatus Download PDFInfo
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- CN206432264U CN206432264U CN201621399994.XU CN201621399994U CN206432264U CN 206432264 U CN206432264 U CN 206432264U CN 201621399994 U CN201621399994 U CN 201621399994U CN 206432264 U CN206432264 U CN 206432264U
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Abstract
The utility model discloses a kind of display base plate and its display panel, crimping apparatus, the display base plate includes flexible substrate, the flexible substrate includes relative the first face and the second face, first face includes first area and second area, thin film transistor (TFT) and luminescent device are provided with the first area, the lead for circuit bonding is provided with the second area, curing material layer and cured layer are provided with second face, the cured layer is correspondingly arranged with the second area, the cured layer is configured as being formed by the curing process of the curing material layer.The technical scheme that the utility model is provided carries out regions curing to the corresponding curing materials layer segment of second area, so as to add hardness in the corresponding region of second area, so that presence of the flexible display substrates among follow-up crimping (carrying out bonding with circuit element) process because of the higher cured layer of hardness, the stability of second area is improved, the bad of circuit generation is slow down.
Description
Technical field
The utility model is related to display technology field, more particularly to a kind of display base plate and its display panel, crimping apparatus.
Background technology
Flexible display substrates can be used for forming wearable display product, increasingly be closed by display field technical staff
Note.At present, the preparation technology of flexible display substrates has large development, first fixes flexible base board on the glass substrate, then enter
Row backboard manufacture craft, above-mentioned technique and existing liquid crystal display are compatible.Flexible base board is prepared after completion, will be soft
Property substrate separated with glass substrate, then flexible base board the back side attach notacoria make it that flexible base board is planarized, carry out afterwards
The techniques such as bonding, cutting.Because the hardness of IC chip is high, the hardness of flexible base board and notacoria is low, especially notacoria
The upper glue material for being used to attach flexible base board, its thickness range is 10um to 30um, and hardness is very low.Therefore, in integrated voltage plate
Above-mentioned glue material can flow among crimping process so that flexible base board sink, and causes rupture of line.
Utility model content
To solve the above problems, the utility model provides a kind of display base plate and its display panel, crimping apparatus, collection is improved
The stability crimped among the crimping process of voltage plate.
Therefore, the utility model provides a kind of display base plate, including flexible substrate, the flexible substrate includes relative the
Simultaneously with the second face, first face includes being provided with thin film transistor (TFT) on first area and second area, the first area
And luminescent device, it is provided with the second area on the lead for circuit bonding, second face and is provided with curing materials
Layer and cured layer, the cured layer are correspondingly arranged with the second area, and the cured layer is configured as by the solidification material
The curing process of the bed of material is formed.
Optionally, the second area includes ic core panel region and flexible PCB region, and the cured layer exists
View field in the flexible substrate includes the ic core panel region and/or the flexible PCB region.
Optionally, in addition to notacoria substrate, the curing material layer and the cured layer be arranged on the flexible substrate with
Between the notacoria substrate.
Optionally, the curing material layer is notacoria glue material layer, and the notacoria glue material layer includes optical cement.
Optionally, the optical cement is uv-curing type optical cement or thermohardening type optical cement.
The utility model also provides a kind of display panel, including any described display base plate.
The utility model also provides a kind of crimping apparatus, for carrying out crimping processing, the display base plate to display base plate
Including flexible substrate, the flexible substrate includes relative the first face and the second face, and first face includes first area and the
It is provided with thin film transistor (TFT) and luminescent device, the second area and is provided with for circuit on two regions, the first area
Curing material layer is provided with the lead of bonding, second face；
The crimping apparatus includes solidified cell and crimping unit；
The solidified cell is used to carry out curing process to the part of the curing material layer correspondence second area, with
Form cured layer；
The crimping unit is used on the second area carry out bonding to circuit element.
Optionally, the solidified cell includes the first thermal head, and first thermal head is arranged on the display base plate
Top, first thermal head is used to heat the part of the curing material layer correspondence second area, or
Person
The solidified cell includes the second thermal head, and second thermal head is arranged on the lower section of the display base plate, institute
Stating the second thermal head is used to heat the part of the curing material layer correspondence second area.
Optionally, the solidified cell includes the first thermal head and the second thermal head, and first thermal head is arranged on institute
State the top of display base plate, second thermal head is arranged on the lower section of the display base plate, first thermal head and described
Second thermal head is used to heat the part of the curing material layer correspondence second area.
Optionally, the circuit element includes integrated circuit component or flexible PCB.
The utility model has following beneficial effects：
Among display base plate and its display panel, crimping apparatus that the utility model is provided, the display base plate includes soft
Property substrate, the flexible substrate include relative the first face and the second face, first face include first area and second area,
It is provided with the first area on thin film transistor (TFT) and luminescent device, the second area and is provided with drawing for circuit bonding
Curing material layer and cured layer are provided with line, second face, the cured layer is correspondingly arranged with the second area, described
Cured layer is configured as being formed by the curing process of the curing material layer.The technical scheme that the utility model is provided is to second
The corresponding curing materials layer segment progress in region is regions curing, so as to add hardness in the corresponding region of second area so that
Presence of the flexible display substrates among follow-up crimping (carrying out bonding with circuit element) process because of the higher cured layer of hardness,
The stability of second area is improved, the bad of circuit generation is slow down.
Brief description of the drawings
Fig. 1 is a kind of structural representation for display base plate that the utility model embodiment one is provided；
Fig. 2 is the second area that embodiment one is provided and a kind of structural representation of consolidation zone；
Fig. 3 is the second area that embodiment one is provided and another structural representation of consolidation zone；
Fig. 4 is a kind of a kind of structural representation for crimping apparatus that the utility model embodiment three is provided；
Fig. 5 is a kind of another structural representation for crimping apparatus that the utility model embodiment three is provided；
Fig. 6 is a kind of another structural representation for crimping apparatus that the utility model embodiment three is provided.
Embodiment
To make those skilled in the art more fully understand the technical solution of the utility model, below in conjunction with the accompanying drawings to this reality
It is described in detail with display base plate and its display panel, the crimping apparatus of new offer.
Embodiment one
Fig. 1 is a kind of structural representation for display base plate that the utility model embodiment one is provided.As shown in figure 1, described
Display base plate includes flexible substrate 101, and the flexible substrate 101 includes relative the first face and the second face, first bread
Include and light emitting device layer 102 is provided with first area and second area, the first area, the light emitting device layer 102 includes
The lead for circuit bonding is provided with thin film transistor (TFT) and luminescent device, the second area.Set on second face
There are curing material layer 201 and cured layer 202, the cured layer 202 is correspondingly arranged with the second area, the cured layer 202
Formed by the curing process of the curing material layer 201, the position in the present embodiment in curing material layer with second area
Place sets cured layer, so as to add hardness in the corresponding region of second area so that flexible display substrates follow-up crimping (with
Circuit element carries out bonding) among process because the presence of the higher cured layer of hardness, improve the stability of second area, slow down
It is bad that circuit occurs.
In the present embodiment, the curing material layer 201 and the cured layer 202 are arranged on flexible substrate 101 and notacoria base
Between bottom 203, encapsulation unit 103 is provided with the light emitting device layer 102.Optionally, the curing material layer 201 is notacoria
Glue material layer, such as OCA optical cements, specifically, can be uv-curing type optical cement or thermohardening type optical cement, due to straight
Connect and subregion in notacoria glue material layer is solidified to form cured layer, therefore flexible display substrates will not go out among crimping process
Existing glue material flowing, it is therefore prevented that flexible display substrates sink, slow down the bad of circuit generation.
In the present embodiment, the constituent material of the curing material layer 201 includes ULTRAVIOLET CURABLE MATERIAL, to the solidification material
The part of the correspondence of the bed of material 201 second area carries out ultraviolet curing processing.The present embodiment passes through ultraviolet curing mask plate
The part of the 204 pairs of correspondence of curing material layer 201 second areas carries out ultraviolet curing processing.Specifically, it is described
The part of the transmission region 205 of ultraviolet curing mask plate 204 second area corresponding with the curing material layer 201 is right
Should, the lightproof area of the ultraviolet curing mask plate 204 is corresponding with the other parts of the curing material layer 201.Utilize purple
Outside line is irradiated to the ultraviolet curing mask plate 204, the part of the correspondence of curing material layer 201 transmission region
Solidification, so as to add hardness in the corresponding region of second area so that flexible display substrates are subsequently being crimped (with circuit element
Carry out bonding) among process because the presence of the higher cured layer of hardness, improve the stability of second area, slow down circuit hair
Raw is bad.
In the present embodiment, the constituent material of the curing material layer 201 includes thermosetting material, to the curing material layer
The part of the 201 correspondence second areas carries out heat cure processing.The present embodiment is by thermal head to the curing material layer 201
The part of the correspondence second area carries out heat cure processing.The thermal head corresponding with the curing material layer 201 described
The part in two regions is correspondingly arranged, specifically, and the thermal head can be arranged on the top of the curing material layer 201,
The lower section of the curing material layer 201 can be arranged on.Optionally, the thermal head can also be arranged on the curing material layer
Above and below in the of 201.The present embodiment is added using thermal head to the part of the curing material layer 201 correspondence second area
Heat, so as to add hardness in the corresponding region of second area so that flexible display substrates (enter in follow-up crimping with circuit element
Row bonding) among process because the presence of the higher cured layer of hardness, improve the stability of second area, slow down circuit
It is bad.
Fig. 2 is the second area that embodiment one is provided and a kind of structural representation of consolidation zone.As shown in Fig. 2 described
Second area includes ic core panel region 301 and flexible PCB region 302, the He of ic core panel region 301
The flexible PCB region 302 is arranged on the side of first area 304.The cured layer 202 is in the flexible substrate 101
On view field include the ic core panel region 301.In the present embodiment, the view field is consolidation zone 303.
Fig. 3 is the second area that embodiment one is provided and another structural representation of consolidation zone.As shown in figure 3, institute
Stating second area includes ic core panel region 301 and flexible PCB region 302, the ic core panel region 301
The side of first area 304 is arranged on the flexible PCB region 302.The cured layer 202 is in the flexible substrate
View field on 101 includes the ic core panel region 301 and the flexible PCB region 302.In the present embodiment,
The view field is consolidation zone 303.
The display base plate that the present embodiment is provided includes flexible substrate, and the flexible substrate includes relative the first face and second
Face, first face includes being provided with thin film transistor (TFT) and luminescent device on first area and second area, the first area,
It is provided with the second area on the lead for circuit bonding, second face and is provided with curing material layer and cured layer,
The cured layer is correspondingly arranged with the second area, and the cured layer is configured as at the solidification by the curing material layer
Reason is formed.The present embodiment provide technical scheme in curing material layer with the position of second area set cured layer so that
Increase the zone hardness of second area so that flexible display substrates are among follow-up crimping (carrying out bonding with circuit element) process
Because the presence of the cured layer of hardness higher (for uncured curing material layer), the stabilization of second area is improved
Property, it slow down the bad of circuit generation.
Embodiment two
The present embodiment provides a kind of display panel, including the display base plate that embodiment one is provided, and particular content can refer to reality
The description of example one is applied, here is omitted.
Among the display panel that the present embodiment is provided, the display base plate includes flexible substrate, and the flexible substrate includes
Relative the first face and the second face, first face includes first area and second area, is provided with the first area thin
It is provided with the lead for circuit bonding, second face and is provided with film transistor and luminescent device, the second area
Curing material layer and cured layer, the cured layer are correspondingly arranged with the second area, and the cured layer is configured as by institute
The curing process for stating curing material layer is formed.Position of the technical scheme that the present embodiment is provided in curing material layer with second area
Put place and cured layer is set, so as to increase the zone hardness of second area so that flexible display substrates are subsequently being crimped (with circuit elements
Part carries out bonding) among process because the presence of the higher cured layer of hardness, improve the stability of second area, slow down circuit
What is occurred is bad.
Embodiment three
Fig. 4 is a kind of a kind of structural representation for crimping apparatus that the utility model embodiment three is provided.As shown in figure 4,
The crimping apparatus is used to carry out crimping processing to display base plate.The crimping apparatus includes solidified cell and crimping unit.Institute
Stating solidified cell is used to carry out curing process to the part of the curing material layer correspondence second area, to form solidification
Layer；Unit is crimped, for carrying out bonding to circuit element on the second area, the circuit element includes integrated circuit member
Part or flexible PCB.With setting cured layer at the position of second area in curing material layer, so as to increase second area
Zone hardness so that flexible display substrates are among follow-up crimping (carrying out bonding with circuit element) process because hardness is higher
Cured layer presence, improve second area stability, slow down circuit generation it is bad.
Referring to Fig. 4, the display base plate includes flexible substrate 101, and the flexible substrate 101 includes the first relative face
With the second face, first face includes being provided with light emitting device layer 102 on first area and second area, the first area,
The light emitting device layer 102 includes being provided with for circuit bonding on thin film transistor (TFT) and luminescent device, the second area
Lead.Curing material layer 201 and cured layer 202, the cured layer 202 and the second area are provided with second face
It is correspondingly arranged, the cured layer 202 is formed by the curing process of the curing material layer 201, so as to increase second area
Zone hardness.
The course of work of the present embodiment is described as follows：Notacoria attachment process carries out cutting technique, cutting technique after completing
The pre- alignment process of substrate is carried out after completion, the pre- alignment process of substrate is introduced into solidified cell after completing and solidified, then enters
Enter to crimp unit and crimped.Specifically, first carrying out anisotropic conductive adhesive paste (Anisotropic Conductive Film, ACF)
Attach, enter back into pre- bonding module and main bonding module carries out IC chip crimping, carry out flexible PCB again afterwards
Crimping.
In the present embodiment, the curing material layer 201 and the cured layer 202 are arranged on flexible substrate 101 and notacoria base
Between bottom 203, encapsulation unit 103 is provided with the light emitting device layer 102.The constituent material bag of the curing material layer 201
Thermosetting material is included, heat cure processing is carried out to the part of the curing material layer 201 correspondence second area.The present embodiment
Heat cure processing, the thermal head are carried out to the part of the curing material layer 201 correspondence second area by thermal head
The part of the second area corresponding with the curing material layer 201 is correspondingly arranged.
Fig. 5 is a kind of another structural representation for crimping apparatus that the utility model embodiment three is provided, and Fig. 6 is this reality
A kind of another structural representation of the crimping apparatus provided with new embodiment three.Set referring to Fig. 4-6, the first thermal heads 401
Put in the lower section of the curing material layer 201.Optionally, the second thermal head 402 is arranged on the upper of the curing material layer 201
Side.It is preferred that, the first thermal head 401 is arranged on the lower section of the curing material layer 201, while the second thermal head 402 is arranged on
The top of the curing material layer 201.The present embodiment is using thermal head to the curing material layer 201 correspondence second area
Part heating, so as to increase the zone hardness of second area so that flexible display substrates (enter in follow-up crimping with circuit element
Row bonding) among process because the presence of the higher cured layer of hardness, improve the stability of second area, slow down circuit
It is bad.
Among the crimping apparatus that the present embodiment is provided, the display base plate includes flexible substrate, and the flexible substrate includes
Relative the first face and the second face, first face includes first area and second area, is provided with the first area thin
It is provided with the lead for circuit bonding, second face and is provided with film transistor and luminescent device, the second area
Curing material layer and cured layer, the cured layer are correspondingly arranged with the second area, and the cured layer is configured as by institute
The curing process for stating curing material layer is formed.The technical scheme that the present embodiment is provided is regions curing to second area progress, so that
Increase the zone hardness of second area so that flexible display substrates are among follow-up crimping (carrying out bonding with circuit element) process
Because the presence of the higher cured layer of hardness, the stability of second area is improved, the bad of circuit generation is slow down.
It is understood that embodiment of above be merely to illustrate that principle of the present utility model and use it is exemplary
Embodiment, but the utility model is not limited thereto.For those skilled in the art, this is not being departed from
In the case of the spirit and essence of utility model, various changes and modifications can be made therein, and these variations and modifications are also considered as this reality
With new protection domain.
Claims (10)
1. a kind of display base plate, it is characterised in that including flexible substrate, the flexible substrate includes relative the first face and second
Face, first face includes being provided with thin film transistor (TFT) and luminescent device on first area and second area, the first area,
It is provided with the second area on the lead for circuit bonding, second face and is provided with curing material layer and cured layer,
The cured layer is correspondingly arranged with the second area, and the cured layer is configured as at the solidification by the curing material layer
Reason is formed.
2. display base plate according to claim 1, it is characterised in that the second area includes ic core panel region
And flexible PCB region, view field of the cured layer in the flexible substrate include the ic core panel region
And/or the flexible PCB region.
3. display base plate according to claim 1, it is characterised in that also including notacoria substrate, the curing material layer and
The cured layer is arranged between the flexible substrate and the notacoria substrate.
4. display base plate according to claim 1, it is characterised in that the curing material layer is notacoria glue material layer, described
Notacoria glue material layer includes optical cement.
5. display base plate according to claim 4, it is characterised in that the optical cement be uv-curing type optical cement or
Thermohardening type optical cement.
6. a kind of display panel, it is characterised in that including any described display base plate of claim 1 to 5.
7. a kind of crimping apparatus, for carrying out crimping processing to display base plate, it is characterised in that the display base plate includes flexibility
Substrate, the flexible substrate includes relative the first face and the second face, and first face includes first area and second area, institute
State and thin film transistor (TFT) and luminescent device are provided with first area, drawing for circuit bonding is provided with the second area
Curing material layer is provided with line, second face；
The crimping apparatus includes solidified cell and crimping unit；
The solidified cell is used to carry out curing process to the part of the curing material layer correspondence second area, to be formed
Cured layer；
The crimping unit is used on the second area carry out bonding to circuit element.
8. crimping apparatus according to claim 7, it is characterised in that the solidified cell includes the first thermal head, described
First thermal head is arranged on the top of the display base plate, and first thermal head is used for described to curing material layer correspondence
The part of second area is heated, or
The solidified cell includes the second thermal head, and second thermal head is arranged on the lower section of the display base plate, and described the
Two thermal heads are used to heat the part of the curing material layer correspondence second area.
9. crimping apparatus according to claim 7, it is characterised in that the solidified cell includes the first thermal head and second
Thermal head, first thermal head is arranged on the top of the display base plate, and second thermal head is arranged on the display base
The lower section of plate, first thermal head and second thermal head are used for the second area corresponding to the curing material layer
Heated part.
10. crimping apparatus according to claim 7, it is characterised in that the circuit element include integrated circuit component or
Person's flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621399994.XU CN206432264U (en) | 2016-12-19 | 2016-12-19 | Display base plate and its display panel, crimping apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621399994.XU CN206432264U (en) | 2016-12-19 | 2016-12-19 | Display base plate and its display panel, crimping apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206432264U true CN206432264U (en) | 2017-08-22 |
Family
ID=59586704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621399994.XU Active CN206432264U (en) | 2016-12-19 | 2016-12-19 | Display base plate and its display panel, crimping apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206432264U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783878A (en) * | 2016-12-19 | 2017-05-31 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display panel and crimping apparatus |
| WO2021136270A1 (en) * | 2020-01-03 | 2021-07-08 | 京东方科技集团股份有限公司 | Flexible display device and method for preparing same |
-
2016
- 2016-12-19 CN CN201621399994.XU patent/CN206432264U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783878A (en) * | 2016-12-19 | 2017-05-31 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display panel and crimping apparatus |
| WO2021136270A1 (en) * | 2020-01-03 | 2021-07-08 | 京东方科技集团股份有限公司 | Flexible display device and method for preparing same |
| US11991894B2 (en) | 2020-01-03 | 2024-05-21 | Boe Technology Group Co., Ltd. | Flexible display device and method for preparing the same |
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