CN207244036U - One kind plating liquid pool and electroplating device - Google Patents
One kind plating liquid pool and electroplating device Download PDFInfo
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- CN207244036U CN207244036U CN201721208961.7U CN201721208961U CN207244036U CN 207244036 U CN207244036 U CN 207244036U CN 201721208961 U CN201721208961 U CN 201721208961U CN 207244036 U CN207244036 U CN 207244036U
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- electroplating
- liquid pool
- plating liquid
- plating
- pond body
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Abstract
The utility model provides a kind of plating liquid pool and electroplating device, including：The pond body of electroplate liquid, the waste-solution line and infusion pipeline being arranged on the outside of the pond body are accommodated, the infusion pipeline is connected to the infusion port of the pond body, and the waste-solution line includes the first drain pipe and the second drain pipe for being connected to the leakage fluid dram of the pond body；Wherein, the liquid level of first drain pipe is less than the liquid level of the infusion port, and the liquid level of second drain pipe is higher than the liquid level of the infusion port；Above-mentioned plating liquid pool, electroplating technology chamber and annealing process chamber form electroplating device.The plating liquid pool and electroplating device of the utility model utilize law of connected vessels, two-way drain pipe is provided with the pond body of plating liquid pool, liquid level wherein all the way is higher than the liquid level of infusion port, bubble is avoided to enter woven hose with this, and then avoid the air blister defect in electroplating process, ensure electrodeposited coating planarization and conductive energy property, improve electroplating quality.
Description
Technical field
Field of semiconductor manufacture is the utility model is related to, more particularly to one kind plating liquid pool and electroplating device.
Background technology
It is exactly to plate the other gold of a thin layer on some workpiece surfaces using electrolysis principle to electroplate (Electroplating)
The process of category or alloy, is the technique of the surface attachment layer of metal film of workpiece is prevented metal so as to play using electrolysis
Aoxidize (such as corrosion), improve the effect such as wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.
In field of semiconductor manufacture, usually metal line is realized using electroplating technology.As shown in Figure 1, there is provided pending crystalline substance
Circle, including bottom metal layer 11, the dielectric layer 12 that is formed on bottom metal layer 11, etch to be formed in pending crystal column surface
Wiring groove 13, barrier layer 14 is formed in pending crystal column surface and 13 inner wall of wiring groove, and Seed Layer is formed in 14 surface of barrier layer
15；As shown in Fig. 2, then by being plated on filling metal in wiring groove 13, and form metal foil in the surface of pending wafer
Layer 16；As shown in figure 3, removing the Seed Layer 15 and thin metal layer 16 of pending crystal column surface, reservation is filled in wiring groove 13
Metal, metal line 17 is formed with this.
Existing electroplating machine mainly includes plating liquid pool, electroplating technology chamber and annealing process chamber, wherein, plating liquid pool with
Electroplating technology chamber connects, and electroplate liquid is provided for electroplating technology chamber by pipeline.As shown in figure 4, plating liquid pool 2 includes pond body 21,
The sewer pipe 22 of 21 bottom of pond body is arranged at, and is arranged at the woven hose 23 of 21 side wall of pond body；Electroplate liquid passes through
The woven hose 23 provides reaction solution for electroplating technology chamber, and electroplate liquid is recovered to described from the woven hose 23 after reaction
In pond body 21.As shown in figure 5, when needing replacing electroplate liquid, electroplate liquid is discharged from the sewer pipe 22, when the pond body 21
During the port that the liquid level of middle electroplate liquid is connected with the pond body 21 less than the woven hose 23, air by the woven hose 23 into
Enter the electroplating technology chamber, hence into newly added electroplate liquid.Galvanizer is carried out using newly added electroplate liquid as reaction solution
During skill, the bubble in electroplate liquid will influence the planarization of electroplated metal layer, influence the electric conductivity of metal line.
In the prior art in order to solve this problem, it is proposed that following several improvement projects：1st, liquid level sensor is added, with
This liquid level to the electroplate liquid in pond body 21 is detected.2nd, standard operating procedure (Standard Operation are changed
Procedure, SOP), Site Detection is carried out to the electroplate liquid capacity in plating liquid pool.3rd, suctioned out using suction pipe in electroplate liquid
Bubble.4th, statistical Process Control (Statistical Process Control, SPC) table of electroplate liquid capacity is increased, to plating
The capacity of liquid carries out management and control.It is poor that above-mentioned several method can effectively alleviate electroplating quality caused by bubble, but is required to higher
Man power and material input, be unsuitable for use of large-scale production.
Therefore, bubble how is solved on the basis of input human and material resources are few, and to enter electroplating quality caused by electroplate liquid poor
The problem of, it has also become one of those skilled in the art's urgent problem to be solved.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide one kind plating liquid pool and plating
Equipment, for solving the problems, such as plating defects caused by bubble in the prior art.
In order to achieve the above objects and other related objects, the utility model provides a kind of plating liquid pool, the plating liquid pool
Include at least：
Accommodate the pond body of electroplate liquid, the waste-solution line and infusion pipeline being arranged on the outside of the pond body, the infusion pipeline
It is connected to the infusion port of the pond body, the waste-solution line includes the first drain pipe for being connected to the leakage fluid dram of the pond body and the
Two drain pipes；Wherein, the liquid level of first drain pipe is less than the liquid level of the infusion port, and the liquid level of second drain pipe is high
In the liquid level of the infusion port.
Preferably, the gauge table of statistics plating flow quantity is provided with the infusion pipeline.
Preferably, the pump for extracting electroplate liquid is provided with the infusion pipeline.
Preferably, the leakage fluid dram is arranged at the bottom of the pond body.
Preferably, first drain pipe and second drain pipe are connected by triple valve with the leakage fluid dram.
Preferably, the plating liquid pool further includes a lid, and the lid is covered on the upper side opening of the pond body.
In order to achieve the above objects and other related objects, the utility model provides a kind of electroplating device, the electroplating device
Include at least：
Above-mentioned plating liquid pool, electroplating technology chamber and annealing process chamber；
The plating liquid pool accommodates electroplate liquid, and electroplate liquid is provided or from the electroplating technology chamber for the electroplating technology chamber
Recycle electroplate liquid；
The electroplating technology chamber is connected with the infusion pipeline of the plating liquid pool, and electroplate liquid is obtained from the plating liquid pool,
And complete plating to workpiece to be handled；
The annealing process chamber is disposed adjacent with the electroplating technology chamber, and the pending workpiece after plating is carried out at annealing
Reason.
Preferably, the plating liquid pool is disposed adjacent with the electroplating technology chamber.
Preferably, the liquid level of the plating liquid pool is less than the liquid level of the electroplating technology chamber.
Preferably, anneal gas pipeline is connected with the annealing process chamber, is provided and moved back by the anneal gas pipeline
The gas needed during fire.
Preferably, the electroplating device further includes mechanical arm, and the mechanical arm is arranged on the electroplating device, right
The pending workpiece is shifted.
Preferably, the electroplating technology chamber includes electroplating bath and the plate being arranged in the electroplating bath.
It is highly preferred that the electroplating technology chamber is connected with power supply, wherein, the anode of the power supply is connected in the electroplating bath
Plate, the cathode of the power supply is connected in the pending workpiece in the electroplating bath.
As described above, the plating liquid pool and electroplating device of the utility model, have the advantages that：
The plating liquid pool and electroplating device of the utility model utilize law of connected vessels, are provided with the pond body of plating liquid pool
Two-way drain pipe, wherein liquid level all the way is higher than the liquid level of infusion port, avoids bubble from entering woven hose, and then avoid electroplating with this
During air blister defect, it is ensured that electrodeposited coating planarization and it is conductive can property, improve electroplating quality.
Brief description of the drawings
Fig. 1 is shown as the knot of the prior art that wiring groove, barrier layer and Seed Layer are formed in pending crystal column surface
Structure schematic diagram.
Fig. 2 is shown as of the prior art and metal is filled in wiring groove by plating, is formed in pending crystal column surface
The structure diagram of thin metal layer.
Fig. 3 is shown as the structure diagram of formation metal line of the prior art.
Fig. 4 is shown as the principle schematic of plating liquid pool infusion of the prior art.
Fig. 5 is shown as the principle schematic of plating liquid pool discharge opeing of the prior art.
Fig. 6 is shown as the structure diagram of the plating liquid pool of the utility model.
Fig. 7 is shown as the principle schematic of the plating liquid pool infusion of the utility model.
Fig. 8 is shown as the principle schematic of the plating complete discharge opeing of liquid pool of the utility model.
Fig. 9 is shown as the principle schematic of the plating incomplete discharge opeing of liquid pool of the utility model.
Figure 10 is shown as the structure diagram of the electroplating device of the utility model.
Component label instructions
11 bottom metal layers
12 dielectric layers
13 wiring grooves
14 barrier layers
15 Seed Layers
16 thin metal layers
17 metal lines
2 plating liquid pools
21 pond bodies
22 sewer pipes
23 woven hoses
3 plating liquid pools
31 pond bodies
311 leakage fluid drams
312 infusion ports
32 waste-solution lines
321 first drain pipes
322 second drain pipes
323 triple valves
33 infusion pipelines
34 gauge tables
35 pumps
4 electroplating technology chambers
5 annealing process chambers
Embodiment
Illustrate the embodiment of the utility model below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints with answering
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Refer to Fig. 6~Figure 10.It should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, the then only display component related with the utility model rather than during according to actual implementation in schema
Component count, shape and size are drawn, and kenel, quantity and the ratio of each component can be a kind of random change during its actual implementation
Become, and its assembly layout kenel may also be increasingly complex.
Embodiment one
As shown in fig. 6, the utility model provides a kind of plating liquid pool 3, the plating liquid pool 3 includes at least：
Pond body 31, waste-solution line 32, infusion pipeline 33, gauge table 34 and pump 35.
As shown in fig. 6, the pond body 31 is used to hold electroplate liquid.
Specifically, in the present embodiment, the pond body 31 is cube structure, thereon end opening.In actual use, appoint
The pond body structure of meaning shape is suitable for the utility model, not to be limited cited by the present embodiment.The bottom of the pond body 31 is set
It is equipped with leakage fluid dram 311, is provided with infusion port 312 on side wall.
As shown in fig. 6, the waste-solution line 32 is arranged at the outside of the pond body 31, and the leakage fluid dram 311 is connected to,
For the electroplate liquid in the pond body 31 to be discharged.
Specifically, the waste-solution line 32 includes the first drain pipe 321, the second drain pipe 322 and triple valve 323, described
First drain pipe 321 and second drain pipe 322 are connected by triple valve 323 with the leakage fluid dram 311, in blowdown period,
Only described first drain pipe 321 of same time or second drain pipe 322 are connected with the leakage fluid dram 311.Wherein, described
The liquid level of one drain pipe 321 is less than the liquid level of the infusion port 312, and the liquid level of second drain pipe 322 is higher than the infusion
The liquid level of mouth 312.In the present embodiment, first drain pipe 321 is straight tube, is horizontally disposed with；Second drain pipe 322 is
Broken pipe, including two sections, first segment is vertically arranged to be connected with the triple valve 323, and second segment is horizontally disposed with to be connected with first segment.
As shown in fig. 6, the infusion pipeline 33 is arranged at the outside of the pond body 31, and the infusion port 312 is connected to,
For the electroplate liquid in the pond body 31 to be supplied to electroplating reaction device, (in the present embodiment, the electroplating reaction device is
Electroplating technology chamber) or recycle electroplate liquid from the electroplating reaction device.
Specifically, in the present embodiment, the infusion pipeline 33 is broken pipe, including three sections, first segment is horizontally disposed with and institute
State infusion port 312 to connect, second segment is vertically arranged to be connected with first segment, and the 3rd section horizontally disposed to be connected to second segment and the electricity
Between plating reaction unit.
As shown in fig. 6, the gauge table 34 is arranged on the infusion pipeline 33, for flowing through the infusion pipeline 33
Electroplate liquid carry out traffic statistics.
As shown in fig. 6, the pump 35 is arranged on the infusion pipeline 33, for extracting the plating in the pond body 31
Liquid.
The plating liquid pool 3 further includes a lid (not shown), and the lid is covered in the upside of the pond body 31
In opening.
The operation principle of the plating liquid pool 3 is as follows：
As shown in fig. 7, in feed flow, the pump 35 starts, and the electroplate liquid in the pond body 31 is drawn into the infusion
In pipeline 33, and it is output in the electroplating reaction device；After terminating electroplating technology in the middle, the electricity in the electroplating reaction device
Plating solution is recovered in the pond body 31 by the infusion pipeline 32.
As shown in figure 8, when changing liquid, the electroplate liquid in the pond body 31 is if desired emptied, then passes through the triple valve 323
First drain pipe 321 is connected with the pond body 31, the electroplate liquid in the pond body 31 passes through first drain pipe 321
It is fully drained.
As shown in figure 9, when changing liquid, if the electroplate liquid in the pond body 31 need not be emptied, pass through the triple valve
323 connect second drain pipe 322 with the pond body 31, and the electroplate liquid in the pond body 31 passes through second drain pipe
The 322 discharge pond bodies 31, since the liquid level of second drain pipe 322 is higher than the liquid level of the infusion port 312, institute
The liquid level for stating the electroplate liquid in pond body 31 is not less than the infusion port 312, enters the infusion pipeline 33 without gas, also
Air blister defect will not be produced to electroplating process.
The plating liquid pool utilizes law of connected vessels, two-way drain pipe is provided with the pond body of plating liquid pool, wherein one
The liquid level on road is higher than the liquid level of infusion port, avoids bubble from entering woven hose with this, and then avoids the air blister defect in electroplating process,
Ensure electrodeposited coating planarization and conductive energy property, improve electroplating quality.
Embodiment two
The utility model provides a kind of electroplating device, and the electroplating device includes：
Plating liquid pool 3, electroplating technology chamber 4 and the annealing process chamber 5.
As shown in Figure 10, the plating liquid pool 3 accommodates electroplate liquid, is the electroplating technology chamber 4 offer electroplate liquid or from institute
State in electroplating technology chamber 4 and recycle electroplate liquid.
Specifically, in the present embodiment, the plating liquid pool 3 is disposed adjacent in the electroplating technology chamber 4, and by described
The infusion pipeline 33 of plating liquid pool 3 connects.The concrete structure of the plating liquid pool 3 is shown in embodiment one, herein not one by one
Repeat.
As shown in Figure 10, the electroplating technology chamber 4 is connected with the infusion pipeline of the plating liquid pool 3, from the electroplate liquid
Pond 3 obtains electroplate liquid, and completes plating to workpiece to be handled.
Specifically, in the present embodiment, the liquid level of the electroplating technology chamber 4 works as electricity higher than the liquid level of the plating liquid pool 3
Electroplate liquid can be directly output to after plating in the plating liquid pool 3.The electroplating technology chamber 4 includes electroplating bath and is arranged at
Plate in the electroplating bath, the pending workpiece is as cathode.The electroplating technology chamber is connected with power supply, the electricity
The anode in source connects the plate in the electroplating bath, and the cathode of the power supply, which is connected in the electroplating bath, to be waited to locate
Science and engineering part, forms the displacement of electroplate liquid intermediate ion with this, and forms uniform metal film in the pending workpiece surface.
As shown in Figure 10, the annealing process chamber 5 is disposed adjacent with the electroplating technology chamber 4, to pending after plating
Workpiece is made annealing treatment.
Specifically, anneal gas pipeline is connected with the annealing process chamber 5, is provided and moved back by the anneal gas pipeline
The gas needed during fire.
The electroplating device further includes mechanical arm, and the mechanical arm is arranged on the electroplating device, is treated to described
Processing workpiece is shifted, and including but not limited to the pending workpiece is positioned in the electroplating technology chamber 4, is treated described
Processing workpiece is transferred to from the electroplating technology chamber 4 in the annealing process chamber 5.
In conclusion the utility model provides a kind of plating liquid pool and electroplating device, including：The pond body of electroplate liquid is accommodated,
The waste-solution line and infusion pipeline being arranged on the outside of the pond body, the infusion pipeline are connected to the infusion port of the pond body, institute
State the first drain pipe and the second drain pipe that waste-solution line includes being connected to the leakage fluid dram of the pond body；Wherein, the first row
The liquid level of liquid pipe is less than the liquid level of the infusion port, and the liquid level of second drain pipe is higher than the liquid level of the infusion port, above-mentioned
Electroplate liquid pool, electroplating technology chamber and annealing process chamber and form electroplating device.Plating liquid pool and the electroplating device profit of the utility model
With law of connected vessels, two-way drain pipe is provided with the pond body of plating liquid pool, wherein liquid level all the way is higher than the liquid of infusion port
Position, avoids bubble from entering woven hose, and then avoid the air blister defect in electroplating process, it is ensured that electrodeposited coating planarization and conduction with this
Energy property, improves electroplating quality.So the utility model effectively overcomes various shortcoming of the prior art and has high industrial profit
With value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
God and all equivalent modifications completed under technological thought or change, should be covered by the claim of the utility model.
Claims (13)
1. one kind plating liquid pool, it is characterised in that the plating liquid pool includes at least：
Accommodate the pond body of electroplate liquid, the waste-solution line and infusion pipeline being arranged on the outside of the pond body, the infusion pipeline connection
In the infusion port of the pond body, the waste-solution line includes the first drain pipe and second row for being connected to the leakage fluid dram of the pond body
Liquid pipe；Wherein, the liquid level of first drain pipe is less than the liquid level of the infusion port, and the liquid level of second drain pipe is higher than institute
State the liquid level of infusion port.
2. plating liquid pool according to claim 1, it is characterised in that：Statistics plating liquid stream is provided with the infusion pipeline
The gauge table of amount.
3. plating liquid pool according to claim 1, it is characterised in that：It is provided with the infusion pipeline and extracts electroplate liquid
Pump.
4. plating liquid pool according to claim 1, it is characterised in that：The leakage fluid dram is arranged at the bottom of the pond body.
5. plating liquid pool according to claim 1, it is characterised in that：First drain pipe and second drain pipe lead to
Triple valve is crossed to be connected with the leakage fluid dram.
6. plating liquid pool according to claim 1, it is characterised in that：The plating liquid pool further includes a lid, the lid
Body is covered on the upper side opening of the pond body.
7. a kind of electroplating device, it is characterised in that the electroplating device includes at least：
Plating liquid pool, electroplating technology chamber and annealing process chamber as described in claim 1~6 any one；
The plating liquid pool accommodates electroplate liquid, provides electroplate liquid for the electroplating technology chamber or is recycled from the electroplating technology chamber
Electroplate liquid；
The electroplating technology chamber is connected with the infusion pipeline of the plating liquid pool, and electroplate liquid is obtained from the plating liquid pool, and complete
Into plating to workpiece to be handled；
The annealing process chamber is disposed adjacent with the electroplating technology chamber, and the pending workpiece after plating is made annealing treatment.
8. electroplating device according to claim 7, it is characterised in that：The plating liquid pool is adjacent with the electroplating technology chamber
Set.
9. electroplating device according to claim 7, it is characterised in that：The liquid level of the plating liquid pool is less than the galvanizer
The liquid level of skill chamber.
10. electroplating device according to claim 7, it is characterised in that：The electroplating technology chamber includes electroplating bath and setting
Plate in the electroplating bath.
11. electroplating device according to claim 10, it is characterised in that：The electroplating technology chamber is connected with power supply, wherein,
The anode of the power supply connects the plate in the electroplating bath, and the cathode of the power supply is connected in the electroplating bath
Pending workpiece.
12. electroplating device according to claim 7, it is characterised in that：Anneal gas are connected with the annealing process chamber
Pipeline, the gas needed in annealing process is provided by the anneal gas pipeline.
13. electroplating device according to claim 7, it is characterised in that：The electroplating device further includes mechanical arm, described
Mechanical arm is arranged on the electroplating device, and the pending workpiece is shifted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721208961.7U CN207244036U (en) | 2017-09-20 | 2017-09-20 | One kind plating liquid pool and electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721208961.7U CN207244036U (en) | 2017-09-20 | 2017-09-20 | One kind plating liquid pool and electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207244036U true CN207244036U (en) | 2018-04-17 |
Family
ID=61885782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721208961.7U Active CN207244036U (en) | 2017-09-20 | 2017-09-20 | One kind plating liquid pool and electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207244036U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109082700A (en) * | 2018-08-29 | 2018-12-25 | 北京遥感设备研究所 | A kind of automation electroplanting device and electroplating technology for thin film microstrip circuit |
| CN110528042A (en) * | 2019-08-28 | 2019-12-03 | 深圳赛意法微电子有限公司 | A kind of semiconductor devices electro-plating method and the activated bath for plating |
| CN112210813A (en) * | 2020-11-20 | 2021-01-12 | 硅密芯镀(海宁)半导体技术有限公司 | Accommodating cavity and wafer electroplating system comprising same |
-
2017
- 2017-09-20 CN CN201721208961.7U patent/CN207244036U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109082700A (en) * | 2018-08-29 | 2018-12-25 | 北京遥感设备研究所 | A kind of automation electroplanting device and electroplating technology for thin film microstrip circuit |
| CN110528042A (en) * | 2019-08-28 | 2019-12-03 | 深圳赛意法微电子有限公司 | A kind of semiconductor devices electro-plating method and the activated bath for plating |
| CN112210813A (en) * | 2020-11-20 | 2021-01-12 | 硅密芯镀(海宁)半导体技术有限公司 | Accommodating cavity and wafer electroplating system comprising same |
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