CN207133560U - Optics module with high heat dispersion - Google Patents
Optics module with high heat dispersion Download PDFInfo
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- CN207133560U CN207133560U CN201720956385.8U CN201720956385U CN207133560U CN 207133560 U CN207133560 U CN 207133560U CN 201720956385 U CN201720956385 U CN 201720956385U CN 207133560 U CN207133560 U CN 207133560U
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Abstract
The utility model discloses a kind of optics module, including：Base, microscope base and optical element；The microscope base is arranged on the base；The optical element is arranged on the microscope base, for modulating light beam；Wherein, the base includes：Chip, for launching or receiving the light beam；Circuit board, first through hole is provided with, the chip is provided with the first through hole；Substrate, for installing the chip and the circuit board, the substrate is provided with least one second through hole, and the area of second through hole is less than the area of the chip, to allow the chip to cover at least partly described second through hole.The utility model proposes optics module small volume and there is high heat dispersion, be mainly used in structure light depth camera.
Description
Technical field
Optics and electronic technology field are the utility model is related to, more particularly to a kind of optics module.
Background technology
Imaging modules or image camera are made up of lens, optical filter and imaging sensor, are widely used in consumer
Electronics, such as mobile phone, computer, in flat board equipment.With increase in demand of the consumer devices to imaging species, 3D imagings just obtain
Rapidly development.
In 3D imaging technique, structured light technique is most widely used, and the depth camera based on structured light technique is typically by more
Individual optics module composition, such as structured light projection module and imaging modules, with small electronic equipment such as mobile phone etc. to 3D into
The increasing demand of picture, optics module is to the requirements such as volume, power consumption, radiating also more and more higher.
However, traditional structure type is difficult to meet optics module small volume and the requirement with high heat dispersion simultaneously.
Utility model content
In order to solve to be difficult to the technical problem for meeting optics module small volume simultaneously and having high heat dispersion, this practicality is new
Type proposes a kind of optics module and depth camera.
Technical problem of the present utility model is solved by following technical scheme：
A kind of optics module, including：Base, microscope base and optical element；The microscope base is arranged on the base；The light
Learn element to be arranged on the microscope base, for modulating light beam；Wherein, the base includes：Chip, it is described for launching or receiving
Light beam；Circuit board, first through hole is provided with, the chip is provided with the first through hole；Substrate, for installing the chip and institute
Circuit board is stated, the substrate is provided with least one second through hole, and the area of second through hole is less than the area of the chip, with
The chip is allowd to cover at least partly described second through hole.In one embodiment, in order to further lift the chip
Heat dispersion, heat sink material is provided with second through hole.The heat sink material can include heat dissipating silicone grease.In another implementation
In example, the chip includes VCSEL array light source.Wherein, the VCSEL array light source can be by Semiconductor substrate and multiple
VCSEL light source forms.In addition, the multiple VCSEL light source can be arranged in the semiconductor with irregular two-dimensional pattern
On substrate.
In the utility model, the optical element can include：Lens, for receiving and converging the VCSEL array
The light beam of light source transmitting；Diffraction optical element, for outside emitting structural after the light beam of the reception after lens convergence
Change pattern beam.In addition, the chip can include imaging sensor, described image sensor include cmos image sensor or
Ccd image sensor.In other embodiments, the optical element can also include：Optical filter, for causing with certain wave
Long light beam passes through；Lens, for making exterior object be imaged in described image sensor.
Generally speaking, above-mentioned optics module, including beam module, for launching or receiving light beam；Power supply module, it is and described
Beam module connects, for being powered for the beam module；The power supply module includes through hole module, is set in the through hole module
There is the beam module；Radiating module, be connected with the beam module and power supply module, can carry simultaneously the beam module and
The power supply module, and the heat that beam module can be allowed to send passes through from radiating module；So as to can ensure that the optical mode
While group small volume, radiating is realized.
In addition, the utility model also proposed a kind of structure light depth camera, including：Any of the above-described optics module,
The optics module includes structured light projection module and imaging modules, and the structured light projection module is used for outside emitting structural
Pattern beam；The imaging modules, for gathering the structured pattern；Processor, calculated according to the structured pattern
Depth image.
The beneficial effect that the utility model is compared with the prior art includes：The utility model proposes optics module, circuit
Plate and substrate offer through hole respectively, and chip is inserted in the first through hole of circuit board reduces the overall body of optical fiber module
Product, circuit board and chip are arranged in substrate in addition, substrate can bearer circuit plate and chip, the face of second through hole
Product is less than the area of the chip, and chip can cover at least partly described second through hole, and second through hole can allow chip to send out
The heat gone out sheds, so as to which optics module of the present utility model ensures high heat dispersion while small volume is ensured.
Brief description of the drawings
Fig. 1 is the side view of the structure light depth camera system of the utility model one embodiment.
Fig. 2 is the side view of the structured light projection module of the utility model one embodiment.
Fig. 3 is the side view of the imaging modules of the utility model one embodiment.
Embodiment
Below against accompanying drawing and with reference to preferred embodiment, the utility model is described in further detail.
In order that the utility model embodiment technical problem to be solved, technical scheme and beneficial effect are more clear bright
In vain, below in conjunction with drawings and Examples, the utility model is further elaborated.It is it should be appreciated that described herein
Specific embodiment only to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on ", " being arranged at " or " being installed on " another element, it can be with
Directly on another element or it is connected on another element.When an element is known as " being connected to " another yuan
Part, it can be directly to another element or be indirectly connected on another element.In addition, connection can be used
Can also be used to circuit communication act in fixation.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of description the utility model embodiment and simplifies description, rather than instruction or the device or member that imply meaning
Part must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.
The utility model proposes the Optical devices of a kind of perfect heat-dissipating and small volume.Will be with knot in explanation below
Illustrated exemplified by the optics module of structure optical depth camera, but be not meant to that this scheme is only capable of applying in depth camera,
It is every in any other device to be directly or indirectly intended to be included in using the program in the scope of protection of the utility model.
Depth camera
The depth camera side schematic view based on structure light shown in Fig. 1.10 main building block of depth camera includes two
Individual optics module, it is structured light projection module 13, imaging modules 14, and mainboard 12 and processor 11 respectively, in some depths
RGB camera 16 is further provided with degree camera.Structured light projection module 13, imaging modules 14 and RGB camera 16 are typically mounted
In same depth camera plane, and same baseline is in, each module or camera correspond to a light portal 17.One
As, processor 11 is integrated on mainboard 12, and structured light projection module 13 passes through interface 15 and mainboard with imaging modules 14
Connection, described interface is FPC interfaces in one embodiment.Wherein, structured light projection module is used to throw into object space
Encoded structured light patterns are penetrated, imaging modules are handled to obtain object space after collecting the structured light patterns by processor
Depth image.In one embodiment, structured light patterns are infrared speckle pattern, pattern have distribution of particles relatively uniform but
With very high local irrelevance, local irrelevance here refers to that each sub-regions all have higher only in pattern
One property.Corresponding imaging modules 14 can be infrared camera.
Depth camera single at present is mostly as independent peripheral hardware, passes through the data-interfaces such as USB because volume is larger
It is connected with other equipment such as computer, mobile phone etc., and the information transfer such as depth obtained is carried out further to other equipment
Processing.It is more and more extensive with the application of depth camera, depth camera and other equipment are integrated, integrates and would is that future
Developing direction.Mainboard, processor and computer cell phone of depth camera etc. can be set at the integrated aspect of mainboard and processor
Standby mainboard, processor are integrated；In imaging modules and the integrated aspect of structured light projection module, computer etc. is large-scale at present sets
There is the scheme of correlation, but for micromodule equipments such as mobile phones, the structured light projection module of only small volume could meet will
Ask, additionally, due to structured light projection module power consumption is larger, heating is more, therefore optics module is possessed higher thermal diffusivity
It is highly desirable.Emphasis of the present utility model will propose a kind of optics module for possessing high-cooling property and small size.Next
Optics module is described in detail according to embodiment scheme of the present utility model.
Structured light projection module
Fig. 2 is according to the schematic diagram of the structured light projection module of one embodiment of the present utility model, structured light projection mould
Group includes base and microscope base 134 disposed thereon, and optical element is placed with microscope base 134.Base includes semiconductor light source core
Piece 131 (equivalent to beam module), substrate 132 and circuit board (equivalent to power supply module) 133, wherein circuit board 133 and
Semiconductor light source chips 131 are located on substrate 132.Circuit board 133 is provided with first through hole (equivalent to through hole module), for putting
Semiconductor light source chips 131 are put, are electrically connected between chip 131 and circuit board 133 to realize the control to chip 131, in one kind
In embodiment, realized and electrically connected by gold thread.Substrate 132 is provided with one or more second through holes, and the area of the second through hole is less than
The area of semiconductor light source chips 131 so that semiconductor light source chips 131 can cover at least partly the second through hole and and substrate
132 have enough contacts in order to be stably installed in substrate 132, and the heat distributed by chip 131 can be by the second through hole
Radiated.The substrate 132 of the second through hole is offered equivalent to radiating module, in other embodiments, radiating module can also
It is the waffle slab with permeability, or can also is fin, water filter plate etc..In order that obtain semiconductor light source chips 131
It can preferably radiate, heat sink material 137 is provided with the second through hole, for example coat heat dissipating silicone grease etc..
Optical element is used for modulating light beam, and in structured light projection module 13, optical element is generally comprised for collimated light
Source chip 131 sends the lens or lens group 135 of light beam, and the light beam after lens 135 are collimated or assembled is diffracted optics member
Part (DOE) 136 receives and outwards launches structured pattern light beam, for example can form the light beam of random speckle pattern.
Semiconductor light source chips 131 include Semiconductor substrate and the light source in Semiconductor substrate, in an implementation
In example, light source includes edge-emitting laser or vertical cavity surface generating laser (VCSEL), and in one embodiment, light source includes
The array laser being made up of multiple VCSEL, multiple VCSEL are arranged on a semiconductor substrate in the form of two-dimensional pattern, X-Y scheme
Case can be that regular pattern can also be irregular pattern.
Circuit board 133 is used for the luminous of light source of powering and control to light source chip, can be printed circuit board (PCB), soft
Property circuit board (FPC), one kind in Rigid Flex or combination.
Substrate 132 is used to provide support to miscellaneous part, light source chip 131 can also be given to provide radiating, it is therefore preferred to
It is made up of hard material, such as metal, ceramics etc..In one embodiment, when substrate 132 is metal material, light source chip
131 can electrically connect with substrate 132, then by the connection of substrate 132 and circuit board 133 to realize indirect electrically connect.
Connection between all parts can be by any suitable mode, such as glue, bolt, stud or various ways
With reference to.
Imaging modules
Fig. 3 is the schematic diagram according to the imaging modules 14 of one embodiment of the present utility model.With structured light projection module
Unlike 13, chip here is semiconductor image sensor chip 141, and conventional has CMOS and two kinds of image sensings of CCD
Device chip, optical element, which has, in addition also distinguishes, and the optical element in imaging modules 14 mainly includes optical filter 145 and imaging is saturating
Mirror 146, the effect of wherein optical filter 145 are only to allow a range of light of light beam wavelength for being in that light source chip 131 is sent
Beam is by the way that in one embodiment, light source chip 131 launches near-infrared laser beam, wavelength 940nm, the effect of optical filter
It is so that wavelength light beam of the wave-length coverage in the certain sections of 940nm or so passes through.Lens 146 are used to be imaged, and can be single saturating
Mirror can also be lens group, in one embodiment, can also include voice coil motor, make it that it is automatic right that the module 14 is realized
Jiao, the effect of lens are so that exterior object is imaged on image sensor chip 141.
Accordingly, the utility model also provides a kind of manufacture method of optics module, including：Base and microscope base, institute are provided
Microscope base is stated on the base；Optical element is provided, the optical element is arranged on the microscope base, for modulating light
Beam；Wherein, the base includes：Chip, for launching or receiving the light beam；Circuit board, offer first through hole, the core
Piece is located in the first through hole；Substrate, for installing the chip and the circuit board, the substrate is provided with least one the
Two through holes, the area of second through hole are less than the area of the chip, and the chip covers second through hole；Described
Heat sink material is set in two through holes, the heat sink material is used for the heat dispersion for lifting the chip.
Either structured light projection module 13 or imaging modules 14, its polycrystalline substance pass through the circuit of opened hole above
Plate and substrate, the thickness of overall optics module is on the one hand reduced, on the other hand can improve the radiating of chip, lifting system
Stability.
Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to
Assert that specific implementation of the present utility model is confined to these explanations.For the utility model person of ordinary skill in the field
For, without departing from the concept of the premise utility, some equivalent substitutes or obvious modification, and performance can also be made
Or purposes is identical, the scope of protection of the utility model should be all considered as belonging to.
Claims (9)
- A kind of 1. optics module, it is characterised in that including：Base, microscope base and optical element；The microscope base is arranged on the base On；The optical element is arranged on the microscope base, for modulating light beam；Wherein, the base includes：Chip, for launching or receiving the light beam；Circuit board, first through hole is offered, the chip is provided with the first through hole；Substrate, for installing the chip and the circuit board, the substrate is provided with least one second through hole, and described second is logical The area in hole is less than the area of the chip, to allow the chip to cover at least partly described second through hole.
- 2. optics module as claimed in claim 1, it is characterised in that heat sink material is provided with second through hole, it is described Heat sink material is used for the heat dispersion for lifting the chip.
- 3. optics module as claimed in claim 2, it is characterised in that the heat sink material includes heat dissipating silicone grease.
- 4. optics module as claimed in claim 1, it is characterised in that the chip includes VCSEL array light source；It is described VCSEL array light source is made up of Semiconductor substrate and multiple VCSEL light sources.
- 5. optics module as claimed in claim 4, it is characterised in that the multiple VCSEL light source is with irregular two-dimensional pattern Form arranges on the semiconductor substrate.
- 6. optics module as claimed in claim 1, it is characterised in that the optical element includes：Lens, for receiving and converging the light beam of VCSEL array light source transmitting；Diffraction optical element, for outwards launching structured pattern light beam after receiving the light beam after lens convergence.
- 7. optics module as claimed in claim 1, it is characterised in that the chip includes imaging sensor, and described image passes Sensor includes cmos image sensor or ccd image sensor.
- 8. optics module as claimed in claim 1, it is characterised in that the optical element includes：Optical filter, for have the light beam of specific wavelength to pass through；Lens, for making exterior object be imaged on the image sensor.
- A kind of 9. structure light depth camera, it is characterised in that including：The optics module as described in claim 1~8 is any, the optics module include structured light projection module and imaging modules, The structured light projection module is used for outside emitting structural pattern beam；The imaging modules, for gathering the structured pattern；Processor, depth image is calculated according to the structured pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720956385.8U CN207133560U (en) | 2017-08-02 | 2017-08-02 | Optics module with high heat dispersion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720956385.8U CN207133560U (en) | 2017-08-02 | 2017-08-02 | Optics module with high heat dispersion |
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| CN207133560U true CN207133560U (en) | 2018-03-23 |
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| CN201720956385.8U Active CN207133560U (en) | 2017-08-02 | 2017-08-02 | Optics module with high heat dispersion |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107357118A (en) * | 2017-08-02 | 2017-11-17 | 深圳奥比中光科技有限公司 | Optics module with high heat dispersion |
| CN108594393A (en) * | 2018-04-04 | 2018-09-28 | Oppo广东移动通信有限公司 | Diffraction optical assembly, laser projection module, depth camera and electronic device |
| CN110530283A (en) * | 2018-05-23 | 2019-12-03 | 宁波舜宇光电信息有限公司 | Project structured light device and its manufacturing method |
| WO2020038078A1 (en) * | 2018-08-23 | 2020-02-27 | 南昌欧菲生物识别技术有限公司 | Photovoltaic module, depth extraction device and electronic device |
| TWI691776B (en) * | 2018-07-04 | 2020-04-21 | 鴻海精密工業股份有限公司 | Optical projection module |
-
2017
- 2017-08-02 CN CN201720956385.8U patent/CN207133560U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107357118A (en) * | 2017-08-02 | 2017-11-17 | 深圳奥比中光科技有限公司 | Optics module with high heat dispersion |
| CN108594393A (en) * | 2018-04-04 | 2018-09-28 | Oppo广东移动通信有限公司 | Diffraction optical assembly, laser projection module, depth camera and electronic device |
| TWI702391B (en) * | 2018-04-04 | 2020-08-21 | 大陸商Ｏｐｐｏ廣東移動通信有限公司 | Diffractive optical assembly, laser projection module, depth camera and electronic device |
| US11048155B2 (en) | 2018-04-04 | 2021-06-29 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Diffractive optical assembly, laser projection unit, and depth camera |
| CN110530283A (en) * | 2018-05-23 | 2019-12-03 | 宁波舜宇光电信息有限公司 | Project structured light device and its manufacturing method |
| TWI691776B (en) * | 2018-07-04 | 2020-04-21 | 鴻海精密工業股份有限公司 | Optical projection module |
| US10645352B2 (en) | 2018-07-04 | 2020-05-05 | Triple Win Technology(Shenzhen) Co. Ltd. | Optical projection module |
| WO2020038078A1 (en) * | 2018-08-23 | 2020-02-27 | 南昌欧菲生物识别技术有限公司 | Photovoltaic module, depth extraction device and electronic device |
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