CN203387593U - Shooting module and mobile device including the shooting module - Google Patents
Shooting module and mobile device including the shooting module Download PDFInfo
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- CN203387593U CN203387593U CN201320483646.0U CN201320483646U CN203387593U CN 203387593 U CN203387593 U CN 203387593U CN 201320483646 U CN201320483646 U CN 201320483646U CN 203387593 U CN203387593 U CN 203387593U
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- heat conduction
- circuit board
- bed course
- flexible circuit
- conduction bed
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Abstract
Disclosed is a shooting module including a lens driving assembly, a support frame, a photosensitive chip, a flexible circuit board and a heat-conducting under layer. The support frame includes a first surface and a second surface which is arranged to be opposite to the first surface. The lens driving assembly is fit onto the first surface and the flexible circuit board is fit onto the second surface. The photosensitive chip is fit onto one side surface of the flexible circuit board, close to the support frame, and the heat-conducting under layer is fit onto the other side surface of the flexible circuit board. When long-time power-on causes heating of the photosensitive chip, heat is firstly transmitted to the flexible circuit board and then to the heat-conducting under layer through the flexible circuit board and through use of the thermal conductivity of the heat-conducting under layer, the heat can be dissipated in time via the heat-conducting under layer so that it is prevented that the effect of images is affected because of heat accumulation; at the same time, under a normal long-time work state of the shooting module, the heat can be dissipated in time so that it is prevented that the image quality of a camera is affected and the camera is too hot to handle and thus the service life of the shooting module is prolonged.
Description
Technical field
The utility model relates to the camera technical field, the mobile device that particularly relates to a kind of camera module and comprise this camera module.
Background technology
Camera module is after being assembled on mobile phone, while being verified through test organization (such as through the test of module factory and terminal client installation testing authentication etc.), or when mobile phone is taken pictures use, because conduction time is long, sensitive chip in camera module can generate heat, and be passed to the FPC(Flexible printed circuit in camera module, flexible circuit board) on, because the camera module heated time is long, the flexible circuit board coefficient of heat conduction is low, dissipation of heat is gone out not in time, finally cause the sensitive chip excess Temperature, thereby affect the image effect of mobile phone camera, especially for the camera that adopts high pixel (more than 500 ten thousand), and people rely on smart mobile phone gradually as shooting instrument commonly used, so the time that the camera module that contains high pixel is used is more and more longer, thereby image quality goes wrong can cause mobile phone photograph the time, the life-span of scalding one's hand and shortening camera module.
The utility model content
Based on this, be necessary do not go out and affect the problem of image effect, the mobile device that a kind of camera module addressed the above problem is provided and comprises this camera module for long the distributing of camera module heated time.
A kind of camera module, comprise lens driving assembly, support, sensitive chip, flexible circuit board and heat conduction bed course, described support comprises first surface and the second surface be oppositely arranged with described first surface, described lens driving component joint is installed on described first surface, described flexible circuit board fits in described second surface, described sensitive chip fits in the side surface of described flexible circuit board near described support, and described heat conductive pad layer fits in described flexible circuit board opposite side surface.
In embodiment, described heat conduction bed course is conductive fabric formula heat conduction bed course therein.
In embodiment, described heat conduction bed course Electrostatic Absorption is in described flexible circuit board therein.
In embodiment, described heat conduction bed course is bonded in described flexible circuit board therein.
In embodiment, described heat conduction bed course is plain weave shape conductive fabric formula heat conduction bed course therein.
In embodiment, described heat conduction bed course is latticed conductive fabric formula heat conduction bed course therein.
In embodiment, described heat conduction bed course is nickel plating conductive fabric formula heat conduction bed course, gold-plated conductive fabric formula heat conduction bed course, plating charcoal conductive fabric formula heat conduction bed course or aluminium foil fiber composite cloth formula heat conduction bed course therein.
In embodiment, described sensitive chip is electrically connected on described flexible circuit board by metal wire therein.
In embodiment, between described heat conduction bed course and described flexible circuit board, be fitted with stiffener therein.
A kind of mobile device, comprise camera module as above, described camera module comprises lens driving assembly, support, sensitive chip, flexible circuit board and heat conduction bed course, described support comprises first surface and the second surface be oppositely arranged with described first surface, described lens driving component joint is installed on described first surface, described flexible circuit board fits in described second surface, described sensitive chip fits in the side surface of described flexible circuit board near described support, and described heat conductive pad layer fits in described flexible circuit board opposite side surface.
Above-mentioned camera module and the mobile device that comprises this camera module, sensitive chip fits in the side surface of flexible circuit board near support, flexible circuit board opposite side surface is fitted with the heat conduction bed course, thereby after camera module is assembled on mobile phone, when being verified through test organization or taken pictures use, the heat that the electronic components such as sensitive chip produce first is passed to flexible circuit board, then be passed to the heat conduction bed course by flexible circuit board, utilize the thermal conductivity of heat conduction bed course, heat can distribute via the heat conduction bed course in time, avoid affecting image effect because of heat accumulation.While under the normal operating state for a long time of camera module, also can utilize the thermal conductivity of heat conduction bed course in time dissipation of heat to be gone out for the high-pixel camera head, avoids affecting the image quality of camera, prevents from scalding one's hand, and improves the life-span of camera module.
The accompanying drawing explanation
The structural representation that Fig. 1 is camera module;
The structural representation that Fig. 2 is another visual angle of camera module.
Embodiment
Refer to Fig. 1 and Fig. 2, a kind of camera module 100, comprise lens driving assembly 110, support 120, sensitive chip 130, flexible circuit board 140 and heat conduction bed course 150, described support 120 comprises first surface 121 and the second surface 122 be oppositely arranged with described first surface 121, described lens driving assembly 110 laminatings are installed on described first surface 121, described flexible circuit board 140 fits in described second surface 122, described sensitive chip 130 fits in the side surface of described flexible circuit board 140 near described support 120, described heat conduction bed course 150 fits in described flexible circuit board 140 opposite side surfaces.
Particularly, lens driving assembly 110 comprises camera lens 111 and voice coil motor 112, and wherein camera lens 111 is contained in voice coil motor 112, and voice coil motor 112 can be fitted and be installed on support 120 first surfaces 121 by glue.Support 120 offers through hole, and through-hole wall is provided with step wall near a side of first surface 121, and filter 190 is installed on step wall and over against lens driving assembly 110.Flexible circuit board 140 is electrically connected to sensitive chip 130 by metal wire 170, such as being electrically connected to sensitive chip by gold thread or aluminum steel.The two ends of flexible circuit board 140 1 side surfaces also are equipped with capacitance component 180 simultaneously, and capacitance component 180 and sensitive chip 130 are positioned at the same side of flexible circuit board 140, and now capacitance component 180, sensitive chip 130 and metal wire 170 all are contained in the host cavity formed by support 120, filter 190 and flexible circuit board 140.
In one embodiment, be fitted with stiffener between described heat conduction bed course 150 and described flexible circuit board 140.Such as stiffener can be steel disc 160 or plastic cement hardboard, the plastic cement hardboard can be for printed circuit board (PCB) (Printed Circuit Board, PCB) etc., and steel disc 160 or plastic cement hardboard are for reinforcement hardness, to reach the effect of protection metal wire 170.In the present embodiment, adopt steel disc 160 laminatings to be installed on the side surface of flexible circuit board 140 away from support 120, heat conduction bed course 150 fits in steel disc 160, and heat conduction bed course 150 fits in flexible circuit board 140 indirectly.Certainly, in other embodiments, also steel disc 160 or plastic plate can be set, heat conduction bed course 150 directly fits in flexible circuit board 140.
Above-mentioned camera module 100, sensitive chip 130 fits in the side surface of flexible circuit board 140 near support 120, flexible circuit board 140 opposite side surfaces directly or indirectly are fitted with heat conduction bed course 150, thereby after camera module 100 is assembled on mobile phone, when being verified through test organization or taken pictures use, the heat that sensitive chip 130 electronic components such as grade produce first is passed to flexible circuit board 140, then be passed to heat conduction bed course 150 by flexible circuit board 140, utilize the thermal conductivity of heat conduction bed course 150, heat can distribute via heat conduction bed course 150 in time, avoid affecting image effect because of heat accumulation.While under the normal operating state for a long time of camera module 100, also can utilize the thermal conductivity of heat conduction bed course 150 in time dissipation of heat to be gone out for the high-pixel camera head, avoids affecting the image quality of camera, prevents from scalding one's hand, and improves the life-span of camera module 100.
The very thin thickness of heat conduction bed course 150, for the thickness of whole camera module 100, can ignore.Such as in one embodiment, described heat conduction bed course 150 is conductive fabric formula heat conduction bed course.Be that heat conduction bed course 150 is for being made and formed by conductive fabric.The thin thickness of conductive fabric, conductive fabric generally imposes plated metal coating with fiber cloth (such as polyester fiber cloth) and makes it have metallic character and become conductive fibre fabric after pre-process.The thermal conductivity of conductive fabric is higher, conductive fabric is that soft material is made simultaneously, when camera module 100 is assembled on mobile phone, such as the conductive fabric formula heat conduction bed course in the present embodiment can well contact steel disc 160, thereby can utilize the dissipation of heat that the thermal conductivity of conductive fabric formula heat conduction bed course is sent sensitive chip 130 timely to go out.Further, because the cost of conductive fabric formula heat conduction bed course is lower, in the manufacturing process of camera module 100, the technique that conductive fabric formula heat conduction bed course directly or indirectly fits in flexible circuit board 140 is simple, can reduce artificial and cost of manufacture.The thermal conductivity that is appreciated that heat conduction bed course 150 is fine, good with respect to the thermal conductivity such as flexible circuit board 140 and steel disc 160 etc., specifically can select according to actual conditions.Thereby in other embodiments, heat conduction bed course 150 also can be the heat conduction bed course that other thermal conductivity is good.
But heat conduction bed course 150 Electrostatic Absorption are in described flexible circuit board 140, or heat conduction bed course 150 also can be bonded in described flexible circuit board 140.Such as heat conduction bed course 150 can directly adsorb and fit in flexible circuit board 140 by static, perhaps heat conduction bed course 150 by Electrostatic Absorption in steel disc 160 or plastic plate and indirectly fit in flexible circuit board 140, perhaps heat conduction bed course 150 by glue directly bonding fit in flexible circuit board 140, also or heat conduction bed course 150 be bonded in steel disc 160 or plastic plate and indirectly fit in flexible circuit board 140 by glue.Certainly, heat conduction bed course 150 can be for carrying the conductive fabric formula heat conduction bed course of glue-line, thereby be more convenient for heat conduction bed course 150 is conformed to flexible circuit board 140.When heat conduction bed course 150 is taked directly or indirectly to fit in flexible circuit board 140 with upper type, technique is simple, easy to operate, and cost is low.
In one embodiment, described heat conduction bed course 150 is plain weave shape conductive fabric formula heat conduction bed course or latticed conductive fabric formula heat conduction bed course.By adopting plain weave shape conductive fabric formula heat conduction bed course or latticed conductive fabric formula heat conduction bed course directly or indirectly to fit in flexible circuit board 140, can increase the area of dissipation of heat conduction bed course 150, when heat distributes by conductive fabric formula heat conduction bed course, transmit radiating effect better.
In one embodiment, described heat conduction bed course 150 is nickel plating conductive fabric formula heat conduction bed course, gold-plated conductive fabric formula heat conduction bed course, plating charcoal conductive fabric formula heat conduction bed course or aluminium foil fiber composite cloth formula heat conduction bed course.Be appreciated that conductive fabric formula heat conduction bed course is generally soft material and makes, and thermal conductivity is good, thereby the optional scope of conductive fabric material is large, heat conduction bed course 150 can adopt one of above-mentioned several materials or other material and make, and cost of manufacture is low, applied widely.
A kind of mobile device, comprise camera module as above, described camera module comprises lens driving assembly, support, sensitive chip, flexible circuit board and heat conduction bed course, described support comprises first surface and the second surface be oppositely arranged with described first surface, described lens driving component joint is installed on described first surface, described flexible circuit board fits in described second surface, described sensitive chip fits in the side surface of described flexible circuit board near described support, and described heat conductive pad layer fits in described flexible circuit board opposite side surface.
Be appreciated that, comprise that the mobile device of camera module has much as mentioned above, such as our common mobile phone, ipad, notebook computer and toy etc. mobile electronic device, and moved towards gradually commercialization, the following wearable intelligent equipment that may replace smart mobile phone and computer, such as iwatch, Google's glasses, intelligent bracelet, intelligent shoe, drumbeat T-shirt and glove-type mobile phone etc.
The above-mentioned mobile device that comprises this camera module, sensitive chip fits in the side surface of flexible circuit board near support, flexible circuit board opposite side surface is fitted with the heat conduction bed course, thereby after camera module is assembled on mobile phone, when being verified through test organization or taken pictures use, the heat that the electronic components such as sensitive chip produce first is passed to flexible circuit board, then be passed to the heat conduction bed course by flexible circuit board, utilize the thermal conductivity of heat conduction bed course, heat can distribute via the heat conduction bed course in time, avoids affecting image effect because of heat accumulation.While under the normal operating state for a long time of camera module, also can utilize the thermal conductivity of heat conduction bed course in time dissipation of heat to be gone out for the high-pixel camera head, avoids affecting the image quality of camera, prevents from scalding one's hand, and improves the life-span of camera module.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a camera module, it is characterized in that, comprise lens driving assembly, support, sensitive chip, flexible circuit board and heat conduction bed course, described support comprises first surface and the second surface be oppositely arranged with described first surface, described lens driving component joint is installed on described first surface, described flexible circuit board fits in described second surface, described sensitive chip fits in the side surface of described flexible circuit board near described support, and described heat conductive pad layer fits in described flexible circuit board opposite side surface.
2. camera module according to claim 1, is characterized in that, described heat conduction bed course is conductive fabric formula heat conduction bed course.
3. camera module according to claim 2, is characterized in that, described heat conduction bed course Electrostatic Absorption is in described flexible circuit board.
4. camera module according to claim 2, is characterized in that, described heat conduction bed course is bonded in described flexible circuit board.
5. camera module according to claim 2, is characterized in that, described heat conduction bed course is plain weave shape conductive fabric formula heat conduction bed course.
6. camera module according to claim 2, is characterized in that, described heat conduction bed course is latticed conductive fabric formula heat conduction bed course.
7. camera module according to claim 2, is characterized in that, described heat conduction bed course is nickel plating conductive fabric formula heat conduction bed course, gold-plated conductive fabric formula heat conduction bed course, plating charcoal conductive fabric formula heat conduction bed course or aluminium foil fiber composite cloth formula heat conduction bed course.
8. according to the described camera module of claim 1 to 7 any one, it is characterized in that, described sensitive chip is electrically connected on described flexible circuit board by metal wire.
9. camera module according to claim 8, is characterized in that, between described heat conduction bed course and described flexible circuit board, is fitted with stiffener.
10. a mobile device, it is characterized in that, comprise camera module as described as claim 1 to 9 any one, described camera module comprises the lens driving assembly, support, sensitive chip, flexible circuit board and heat conduction bed course, described support comprises first surface and the second surface be oppositely arranged with described first surface, described lens driving component joint is installed on described first surface, described flexible circuit board fits in described second surface, described sensitive chip fits in the side surface of described flexible circuit board near described support, described heat conductive pad layer fits in described flexible circuit board opposite side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320483646.0U CN203387593U (en) | 2013-08-08 | 2013-08-08 | Shooting module and mobile device including the shooting module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320483646.0U CN203387593U (en) | 2013-08-08 | 2013-08-08 | Shooting module and mobile device including the shooting module |
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| Publication Number | Publication Date |
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| CN203387593U true CN203387593U (en) | 2014-01-08 |
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| CN201320483646.0U Expired - Fee Related CN203387593U (en) | 2013-08-08 | 2013-08-08 | Shooting module and mobile device including the shooting module |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104898351A (en) * | 2014-03-07 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module and camera device |
| CN104902146A (en) * | 2014-03-07 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module and camera device |
| CN105519090A (en) * | 2014-10-13 | 2016-04-20 | 深圳市大疆创新科技有限公司 | Image capturing module |
| CN106163209A (en) * | 2015-03-25 | 2016-11-23 | 小米科技有限责任公司 | Radiating subassembly and electronic equipment |
| CN107087088A (en) * | 2017-05-16 | 2017-08-22 | 奇酷互联网络科技（深圳）有限公司 | Camera module and mobile terminal |
| CN107995393A (en) * | 2017-12-01 | 2018-05-04 | 信利光电股份有限公司 | A kind of heat dissipation equipment and a kind of camera module |
| CN110022424A (en) * | 2016-03-12 | 2019-07-16 | 宁波舜宇光电信息有限公司 | Camera module and its photosensory assembly and manufacturing method |
| WO2022135256A1 (en) * | 2020-12-23 | 2022-06-30 | 华为技术有限公司 | Camera module and electronic device |
-
2013
- 2013-08-08 CN CN201320483646.0U patent/CN203387593U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902146B (en) * | 2014-03-07 | 2018-10-16 | 南昌欧菲光电技术有限公司 | Camera module and photographic device |
| CN104902146A (en) * | 2014-03-07 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module and camera device |
| CN104898351A (en) * | 2014-03-07 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Camera module and camera device |
| CN104898351B (en) * | 2014-03-07 | 2018-03-20 | 南昌欧菲光电技术有限公司 | camera module and camera device |
| CN105519090A (en) * | 2014-10-13 | 2016-04-20 | 深圳市大疆创新科技有限公司 | Image capturing module |
| US10250786B2 (en) | 2014-10-13 | 2019-04-02 | SZ DJI Technology Co., Ltd. | Image capturing module which has an image processing board disposed at a side edge of the body of the image capturing module |
| CN106163209B (en) * | 2015-03-25 | 2019-04-16 | 小米科技有限责任公司 | Radiating subassembly and electronic equipment |
| CN106163209A (en) * | 2015-03-25 | 2016-11-23 | 小米科技有限责任公司 | Radiating subassembly and electronic equipment |
| CN110022424A (en) * | 2016-03-12 | 2019-07-16 | 宁波舜宇光电信息有限公司 | Camera module and its photosensory assembly and manufacturing method |
| CN110022424B (en) * | 2016-03-12 | 2021-08-10 | 宁波舜宇光电信息有限公司 | Camera module and photosensitive assembly and manufacturing method thereof |
| CN107087088A (en) * | 2017-05-16 | 2017-08-22 | 奇酷互联网络科技（深圳）有限公司 | Camera module and mobile terminal |
| CN107995393A (en) * | 2017-12-01 | 2018-05-04 | 信利光电股份有限公司 | A kind of heat dissipation equipment and a kind of camera module |
| WO2022135256A1 (en) * | 2020-12-23 | 2022-06-30 | 华为技术有限公司 | Camera module and electronic device |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140108 Termination date: 20150808 |
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| EXPY | Termination of patent right or utility model |