CN207038498U - More cantilever levels take brilliant, die bond mechanism and its use its bonder - Google Patents
More cantilever levels take brilliant, die bond mechanism and its use its bonder Download PDFInfo
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- CN207038498U CN207038498U CN201720362961.6U CN201720362961U CN207038498U CN 207038498 U CN207038498 U CN 207038498U CN 201720362961 U CN201720362961 U CN 201720362961U CN 207038498 U CN207038498 U CN 207038498U
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Abstract
The utility model discloses more cantilever levels to take brilliant, die bond mechanism, it is characterised in that including：Gantry is built bridge, and described gantry is built bridge for fixing following motors；Motor, the motor connect with gantry bridge company, for driving following soldering tip components to do circle rotation；Soldering tip component, for taking brilliant and die bond, the soldering tip component to include 2,3 or more than 3 soldering tips, the soldering tip can independently move up and down, and the soldering tip component is connected with the motor.The utility model beneficial effect：The structure built bridge by using gantry, greatly save working space, it need not consider that L-type support brings problem of stress concentration during design, by setting soldering tip component, for taking brilliant and die bond, at least two soldering tip, the soldering tip independently to move up and down, substantially increase and take the brilliant, efficiency of die bond, reduce production cost.
Description
Technical field
It the utility model is related to bonder field, and in particular to more cantilever levels take brilliant, die bond mechanism and its use its
Bonder.
Background technology
In semiconductor devices such as IC and LED encapsulation process, die bond is extremely important link.The process of die bond
It is：First by glue applying mechanism (the also referred to as dispensing module) dispensing on the die bond station of substrate, then by die bond mechanism (also referred to as die bond
Nation's head) semiconductor grain is taken out from wafer, and then be transferred on the die bond station for having put glue.In identical die bond yields
Under the conditions of (quality), the die bond efficiency of bonder is to evaluate the important indicator of bonder performance.
Existing bonder, such as Chinese patent application publication No. CN102543801A, a kind of bonder, take brilliant, die bond
Mechanism is as shown in figure 1, motor 2 to be mainly fixed on to one end of L-type support 1 by L-type support 1, and soldering tip cantilever 3 is with driving
Motor 2 is connected, and when taking brilliant and die bond, soldering tip cantilever 3 rotates to wafer platform 4 and takes crystalline substance, then soldering tip cantilever-rotating 180 degree to die bond
Point, 180 degree is rotated during work, the time difference needed back and forth is larger, and operating efficiency is lower, and so soldering tip cantilever 3 revolves
Turn to be influenceed by L-type support 1, working range is subject to certain restrictions during rotation, and L-type support is easily stressed concentration.
Utility model content
In order to overcome the above-mentioned deficiencies of the prior art, the utility model, which provides, a kind of can improve the more outstanding of operating efficiency
Arm level takes brilliant, die bond mechanism.
To reach above-mentioned purpose, technical scheme is used by the utility model solves its technical problem：
More cantilever levels take brilliant, die bond mechanism, it is characterised in that including：
Gantry is built bridge, and described gantry is built bridge for fixing following motors；
Motor, the motor connect with gantry bridge company, for driving following soldering tip components to do circumference rotation
Turn；
Soldering tip component, for taking brilliant and die bond, the soldering tip component to include 2,3 or more than 3 soldering tips, the soldering tip
Can independently it move up and down, the soldering tip component is connected with the motor.
It is using the beneficial effect of above-mentioned technical proposal：The structure built bridge by using gantry, greatly save work sky
Between, it need not consider that L-type support brings problem of stress concentration during design, by setting soldering tip component, for taking brilliant and die bond, extremely
Few 3 soldering tips, the soldering tip independently move up and down, and substantially increase and take the brilliant, efficiency of die bond, reduce production cost.
Further, the soldering tip component also includes linking arm, and the soldering tip passes through linking arm and the motor phase
Even.
It is using the beneficial effect of above-mentioned technical proposal：It is simple in construction by motor drive connection arm, rotate more
Flexibly.
Further, the soldering tip component also includes rotating disk, and the rotating disk is connected with the motor, the soldering tip edge
The rotating disk it is circumferentially disposed, the soldering tip independently moves up and down relative to the axis of the rotating disk.
It is using the beneficial effect of above-mentioned technical proposal：By motor driving rotating disk, week of the soldering tip along the rotating disk
To setting, during rotation, it is easy to the operation of multistation.
Further, in addition to vision positioning device, the vision positioning device are arranged above the soldering tip component, institute
State vision positioning device and be provided with and take fisheye and die bond point, described fisheye or die bond point are taken when the soldering tip component rotates to
When, the soldering tip is positioned at the underface for taking fisheye and die bond point.
It is using the beneficial effect of above-mentioned technical proposal：By vision positioning device, positioning takes position during brilliant and die bond,
The efficiency of production positioning is improved, improves die bond quality.
Further, the soldering tip is a telescopic structure, and the soldering tip includes head rod, sleeve, the second connection
Bar and stage clip, the head rod are slidably connected with the sleeve, second connecting rod be arranged in the sleeve and with
The sleeve is fixedly connected, and one end of the stage clip is connected with the head rod, the other end of the stage clip and described the
One end connection of two connecting rods, tracheae are inserted in head rod and the second connecting rod and are connected with the suction nozzle, tracheae connection
There is vacuum extractor.
It is using the beneficial effect of above-mentioned technical proposal：Hard collision when preventing from taking crystalline substance between soldering tip and wafer.
Further, the head rod is circumferentially with groove, and the sleeve lining is provided with guide protrusions, described recessed
Groove coordinates with the guide protrusions.
It is using the beneficial effect of above-mentioned technical proposal：Groove can both slide up and down guide protrusions, can play again
Slide spacing effect.
The invention also discloses a kind of bonder, including substrate feeding device, point glue equipment and wafer decoupling device,
Characterized in that, also take brilliant, die bond mechanism including above-mentioned more cantilever levels.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of prior art.
Fig. 2 is structural representation of the present utility model.
Fig. 3 is the structural representation of 2 soldering tip linking arms of the utility model.
Fig. 4 is the structural representation of 3 soldering tip linking arms of the utility model.
Fig. 5 is the structural representation of 4 soldering tip linking arms of the utility model.
Fig. 6 is the structural representation of 2 soldering tip rotating disks of the utility model.
Fig. 7 is the structural representation of 3 soldering tip rotating disks of the utility model.
Fig. 8 is the structural representation of 4 soldering tip rotating disks of the utility model.
Fig. 9 is the structural representation of the telescopic soldering tip of the utility model.
Numeral and the title of the corresponding component represented by letter in figure：
1-L type supports；2nd, 12- motors；3- soldering tip cantilevers；4th, 14 1 wafer platform；Build bridge at 11- gantry；13- soldering tip groups
Part；15- soldering tips；16- linking arms；17- vision positioning devices；18- rotating disks；31- head rods；32- sleeves；33- second connects
Extension bar；34- stage clips；35- suction nozzles；36- tracheaes；311- grooves；321- guide protrusions.
Embodiment
With reference to specific embodiment, content of the present utility model is described in further detail：
In order to reach the purpose of this utility model, as Figure 2-3, it is in a kind of embodiment of the present utility model：It is more
Cantilever level takes brilliant, die bond mechanism, including：Gantry bridge formation 11, motor 12 and soldering tip component 13, gantry build bridge 11 for solid
Determine motor 12；Motor 12 is connected with gantry bridge formation 11, for driving soldering tip component 13 to do circle rotation；Soldering tip component
13, for taking brilliant and die bond, soldering tip component 13 includes the independent up and down motion of 16,2 soldering tips of 2 soldering tips 15 and linking arm 15, its
In each soldering tip 15 can be connected with sliding block slide rail, pass through leading screw and drive sliding block to move up and down, or motor driving cam
Then soldering tip 15 is driven to move up and down, soldering tip component 13 is connected with motor 12, and 2 soldering tips 15 pass through linking arm 16 and driving
Motor 12 is connected.The course of work is as follows：When taking fisheye, vision positioning device is positioned, and soldering tip, which moves downward, takes crystalline substance backward
Upper motion, linking arm rotate 180 degree, and now soldering tip turns to die bond point and the chip after taking-up is fixed on substrate, with present
One soldering tip turns to and takes fisheye, takes crystalline substance, the like, completion takes brilliant and die bond operation.
It is using the beneficial effect of above-mentioned technical proposal：The structure built bridge by using gantry, greatly save work sky
Between, it need not consider that L-type support brings problem of stress concentration during design, by setting soldering tip component, for taking brilliant and die bond, 2
Individual soldering tip, 2 soldering tips independently move up and down, and substantially increase the efficiency for taking brilliant die bond circle, reduce production cost, linking arm knot
Structure make it that overall structure is simpler, easy for installation.
It is in a kind of embodiment of the present utility model：As shown in figure 4, more cantilever levels take brilliant, die bond mechanism, including：
Gantry bridge formation 11, motor 12 and soldering tip component 13, gantry bridge formation 11 are used for fixed drive motor 12；Motor 12 and dragon
Door frame bridge 11 connects, for driving soldering tip component 13 to do circle rotation；Soldering tip component 13, for taking brilliant and die bond, soldering tip component
13 include the independent up and down motion of 16,3 soldering tips of 3 soldering tips 15 and linking arm 15, wherein each soldering tip 15 can be connected with sliding block
Slide rail, sliding block is driven to move up and down by leading screw, or motor driving cam and then drive soldering tip 15 move up and down, soldering tip
Component 13 is connected with motor 12, and 3 soldering tips 15 are connected by linking arm 16 with motor 12.The course of work is as follows：
When taking fisheye, vision positioning device is positioned, soldering tip moves downward take crystalline substance after move upwards, linking arm rotate 60 degree, now
One of soldering tip turns to die bond point and the chip after taking-up is fixed on substrate, and linking arm is rotated further by 60 degree, next weldering
Head, which turns to, takes fisheye, takes crystalline substance, the like, completion takes brilliant and die bond operation.
It is in a kind of embodiment of the present utility model：As shown in figure 5, more cantilever levels take brilliant, die bond mechanism, including：
Gantry bridge formation 11, motor 12 and soldering tip component 13, gantry bridge formation 11 are used for fixed drive motor 12；Motor 12 and dragon
Door frame bridge 11 connects, for driving soldering tip component 13 to do circle rotation；Soldering tip component 13, for taking brilliant and die bond, soldering tip component
13 include the independent up and down motion of 16,4 soldering tips of 4 soldering tips 15 and linking arm 15, wherein each soldering tip 15 can be connected with sliding block
Slide rail, sliding block is driven to move up and down by leading screw, or motor driving cam and then drive soldering tip 15 move up and down, soldering tip
Component 13 is connected with motor 12, and 4 soldering tips 15 are connected by linking arm 16 with motor 12, in addition to vision positioning dress
17 are put, vision positioning device 17 is arranged at the top of soldering tip component 13, and vision positioning device is provided with and takes fisheye and die bond point, works as soldering tip
Component rotates to when taking fisheye or die bond point, and soldering tip 15 is located at the underface for taking fisheye and die bond point, by vision positioning device,
Positioning takes position during brilliant and die bond, improves the efficiency of production positioning, improves die bond quality.The course of work is as follows：Taking fisheye
When, vision positioning device is positioned, soldering tip moves downward take crystalline substance after move upwards, linking arm rotates 90 degree, now soldering tip turn
Move die bond point the chip after taking-up is fixed on substrate, while next soldering tip turns to and takes fisheye, takes crystalline substance, two groups simultaneously
Operation, the like, completion takes brilliant and die bond operation.
In another embodiment of the present utility model, as shown in fig. 6, more cantilever levels take brilliant, die bond mechanism, bag
Include：Gantry bridge formation 11, motor 12 and soldering tip component 13, gantry bridge formation 11 are used for fixed drive motor 12；Motor 12
It is connected with gantry bridge formation 11, for driving soldering tip component 13 to do circle rotation；Soldering tip component 13, for taking brilliant and die bond, soldering tip
Component includes rotating disk 18 and 2 soldering tips 15, rotating disk 18 and is connected with motor 12, and 2 soldering tips 15 are along the circumferentially disposed of rotating disk, and 2
Individual soldering tip 15 independently moves up and down relative to the axis of rotating disk 18.The course of work is as follows：When taking fisheye, vision positioning device enters
Row positioning, soldering tip moves downward take crystalline substance after move upwards, rotating disk rotate 180 degree, now soldering tip turn to die bond point will take out after
Chip be fixed on substrate, while next soldering tip turns to and takes fisheye, takes crystalline substance, the like, completion takes brilliant and die bond to make
Industry.
It is using the beneficial effect of above-mentioned technical proposal：The structure built bridge by using gantry, greatly save work sky
Between, it need not consider that L-type support brings problem of stress concentration during design, by setting soldering tip component, for taking out wafer and solid
Determine wafer, 2 soldering tips, 2 soldering tips independently move up and down, and substantially increase the efficiency for taking brilliant die bond circle, reduce production cost,
Turntable structure make it that motion is more steady.
In another embodiment of the present utility model, as shown in fig. 7, more cantilever levels take brilliant, die bond mechanism, bag
Include：Gantry bridge formation 11, motor 12 and soldering tip component 13, gantry bridge formation 11 are used for fixed drive motor 12；Motor 12
It is connected with gantry bridge formation 11, for driving soldering tip component 13 to do circle rotation；Soldering tip component 13, for taking brilliant and die bond, soldering tip
Component includes rotating disk 18 and 3 soldering tips 15, rotating disk 18 and is connected with motor 12, and 3 soldering tips 15 are along the circumferentially disposed of rotating disk, and 3
Individual soldering tip 15 independently moves up and down relative to the axis of rotating disk 18.The course of work is as follows：When taking fisheye, vision positioning device enters
Row positioning, soldering tip moves downward take crystalline substance after move upwards, linking arm rotate 60 degree, now one of soldering tip turn to die bond point
Chip after taking-up is fixed on substrate, linking arm is rotated further by 60 degree, and next soldering tip, which turns to, takes fisheye, takes crystalline substance, successively
Analogize, completion takes brilliant and die bond operation.
It is using the beneficial effect of above-mentioned technical proposal：The structure built bridge by using gantry, greatly save work sky
Between, it need not consider that L-type support brings problem of stress concentration during design, by setting soldering tip component, for taking brilliant and die bond, 3
Individual soldering tip, 3 soldering tips independently move up and down, and substantially increase the efficiency for taking brilliant die bond circle, reduce production cost, turntable structure
So that motion is more steady.
In another embodiment of the present utility model, as shown in fig. 7, more cantilever levels take brilliant, die bond mechanism, bag
Include：Gantry bridge formation 11, motor 12 and soldering tip component 13, gantry bridge formation 11 are used for fixed drive motor 12；Motor 12
It is connected with gantry bridge formation 11, for driving soldering tip component 13 to do circle rotation；Soldering tip component 13, for taking brilliant and die bond, soldering tip
Component includes rotating disk 18 and 4 soldering tips 15, rotating disk 18 and is connected with motor 12, and 4 soldering tips 15 are along the circumferentially disposed of rotating disk, and 4
Individual soldering tip 15 independently moves up and down relative to the axis of rotating disk 18.The course of work is as follows：When taking fisheye, vision positioning device enters
Row positioning, soldering tip moves downward take crystalline substance after move upwards, rotating disk rotate 90 degree, now soldering tip turn to die bond point by after taking-up
Chip is fixed on substrate, while next soldering tip turns to and takes fisheye, takes crystalline substance, two groups of operations simultaneously, the like, complete to take
Brilliant and die bond operation.
It is using the beneficial effect of above-mentioned technical proposal：The structure built bridge by using gantry, greatly save work sky
Between, it need not consider that L-type support brings problem of stress concentration during design, by setting soldering tip component, for taking brilliant and die bond, 4
Individual soldering tip, 4 soldering tips independently move up and down, and substantially increase the efficiency for taking brilliant die bond circle, reduce production cost, turntable structure
So that motion is more steady.
In actual applications, soldering tip quantity is not limited only to the quantity provided in embodiment, and soldering tip quantity can be as needed
Selection is two either 4 or 5 or more.
In another embodiment of the present utility model, in addition to vision positioning device 17, vision positioning device 17 are set
The top of soldering tip component 13 is placed in, vision positioning device is provided with and takes fisheye and die bond point, and fisheye or solid is taken when soldering tip component rotates to
During fisheye, soldering tip 15 is located at the underface for taking fisheye and die bond point.It is using the beneficial effect of above-mentioned technical proposal：Pass through vision
Positioner, positioning take position during brilliant and die bond, improve the efficiency of production positioning, improve die bond quality.
In another embodiment of the present utility model, soldering tip 15 is a telescopic structure, and soldering tip 15 includes first and connected
Extension bar 31, sleeve 32, the second connecting rod 33 and stage clip 34, head rod 31 are slidably connected with sleeve 32, the second connecting rod 33
Be arranged in sleeve 32 and be fixedly connected with sleeve 32, one end of stage clip 34 is connected with head rod 31, stage clip 34 it is another
End is connected with one end of the second connecting rod 33, and head rod 31 is circumferentially with groove 311, and it is convex that the inwall of sleeve 32 is provided with guiding
321 are played, groove 311 coordinates with guide protrusions 321, and tracheae 36 inserts in the connecting rod 33 of head rod 31 and second and and suction nozzle
35 connections, tracheae 36 are connected with vacuum extractor, and sleeve 32 can be made of elastomeric material, and groove 311 can both make guiding
Projection slides up and down, and can play again and slide spacing effect.It is using the beneficial effect of above-mentioned technical proposal：When preventing from taking crystalline substance
Hard collision between soldering tip and wafer.
In another embodiment of the present utility model, stage clip 34 may be replaced by electric pushrod.Using above-mentioned skill
The beneficial effect of art scheme is：Soldering tip unequal arm when taking brilliant and die bond can be made to work, such as when taking brilliant station, pass through electricity
Dynamic push rod promotes head rod stretching motion, the stroke that control head rod stretches out, can make soldering tip as far as possible close to wafer
Platform, completing moment takes crystalline substance, in fixed wafer work, can make soldering tip close proximity to welding substrate, greatly reduce take it is brilliant and
When the time of die bond, improving production efficiency, while can avoid the weld assembly from rotating, soldering tip is interfered with peripheral element.
The invention also discloses a kind of bonder, including substrate feeding device, point glue equipment and wafer decoupling device,
Characterized in that, also take brilliant, die bond mechanism including above-mentioned more cantilever levels.
Operation principle of the present utility model is as follows：Soldering tip is taking fisheye to take crystalline substance, and mark member is detected by vision inspection apparatus
Part carries out rotational positioning, and motor driving soldering tip component rotates to an angle, and soldering tip is in die bond point die bond.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and be carried out, the scope of protection of the utility model can not be limited with this,
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover in the scope of protection of the utility model
It is interior.
Claims (7)
1. cantilever level more than takes brilliant, die bond mechanism, it is characterised in that including:
Gantry is built bridge, and described gantry is built bridge for fixing following motors；
Motor, the motor connect with gantry bridge company, for driving following soldering tip components to do circle rotation；
Soldering tip component, for taking brilliant and die bond, the soldering tip component to include 2,3 or more than 3 soldering tips, the equal energy of soldering tip
Independent to move up and down, the soldering tip component is connected with the motor.
2. more cantilever levels according to claim 1 take brilliant, die bond mechanism, it is characterised in that the soldering tip component also wraps
Linking arm is included, the soldering tip is connected by linking arm with the motor.
3. more cantilever levels according to claim 1 take brilliant, die bond mechanism, it is characterised in that the soldering tip component also wraps
Include rotating disk, the rotating disk is connected with the motor, and the soldering tip is circumferentially disposed along the rotating disk, the soldering tip relative to
The axis of the rotating disk independently moves up and down.
4. take brilliant, die bond mechanism according to any described more cantilever levels of claim 1-3, it is characterised in that also including vision
Positioner, the vision positioning device are arranged above the soldering tip component, the vision positioning device be provided with take fisheye and
Die bond point, when the soldering tip component rotate to it is described take fisheye or the die bond point when, the soldering tip positioned at it is described take fisheye and
The underface of the die bond point.
5. more cantilever levels according to claim 4 take brilliant, die bond mechanism, it is characterised in that the soldering tip is one flexible
Formula structure, the soldering tip include head rod, sleeve, the second connecting rod and stage clip, the head rod and the sleeve
Be slidably connected, second connecting rod is arranged in the sleeve and is fixedly connected with the sleeve, one end of the stage clip with
The head rod connection, the other end of the stage clip are connected with one end of second connecting rod, and tracheae insertion first connects
In extension bar and the second connecting rod and setting suction nozzle is connected, tracheae is connected with vacuum extractor.
6. more cantilever levels according to claim 5 take brilliant, die bond mechanism, it is characterised in that the head rod
Groove is circumferentially with, the sleeve lining is provided with guide protrusions, and the groove coordinates with the guide protrusions.
7. bonder, including substrate feeding device, point glue equipment and wafer decoupling device, it is characterised in that also include such as right
It is required that any described more cantilever levels of 1-6 take brilliant, die bond mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720362961.6U CN207038498U (en) | 2017-04-07 | 2017-04-07 | More cantilever levels take brilliant, die bond mechanism and its use its bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720362961.6U CN207038498U (en) | 2017-04-07 | 2017-04-07 | More cantilever levels take brilliant, die bond mechanism and its use its bonder |
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| Publication Number | Publication Date |
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| CN207038498U true CN207038498U (en) | 2018-02-23 |
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| CN201720362961.6U Active CN207038498U (en) | 2017-04-07 | 2017-04-07 | More cantilever levels take brilliant, die bond mechanism and its use its bonder |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417514A (en) * | 2018-03-14 | 2018-08-17 | 深圳名飞远科技有限公司 | Welding head mechanism and LED bonders |
| CN110335840A (en) * | 2019-07-16 | 2019-10-15 | 安徽三优光电科技有限公司 | A kind of semiconductor production die bond structure |
| CN110890298A (en) * | 2019-12-16 | 2020-03-17 | 江苏新智达新能源设备有限公司 | High-efficient double-end solid brilliant device |
| CN111430271A (en) * | 2020-02-19 | 2020-07-17 | 苏州艾科瑞思智能装备股份有限公司 | Get brilliant and solid brilliant mechanism and solid brilliant machine |
-
2017
- 2017-04-07 CN CN201720362961.6U patent/CN207038498U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417514A (en) * | 2018-03-14 | 2018-08-17 | 深圳名飞远科技有限公司 | Welding head mechanism and LED bonders |
| CN110335840A (en) * | 2019-07-16 | 2019-10-15 | 安徽三优光电科技有限公司 | A kind of semiconductor production die bond structure |
| CN110890298A (en) * | 2019-12-16 | 2020-03-17 | 江苏新智达新能源设备有限公司 | High-efficient double-end solid brilliant device |
| CN111430271A (en) * | 2020-02-19 | 2020-07-17 | 苏州艾科瑞思智能装备股份有限公司 | Get brilliant and solid brilliant mechanism and solid brilliant machine |
| CN111430271B (en) * | 2020-02-19 | 2021-07-13 | 苏州艾科瑞思智能装备股份有限公司 | Get brilliant and solid brilliant mechanism and solid brilliant machine |
| WO2021164342A1 (en) * | 2020-02-19 | 2021-08-26 | 苏州艾科瑞思智能装备股份有限公司 | Die-taking and die-bonding mechanism and die bonder |
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Address after: Jiangsu province Suzhou City Branch Park 215513 Changshu economic and Technological Development Zone, Room 102 Patentee after: SUZHOU ACCURACY INTELLIGENT EQUIPMENT Co.,Ltd. Address before: Jiangsu province Suzhou City Branch Park 215513 Changshu economic and Technological Development Zone, Room 102 Patentee before: ACCURACY ASSEMBLY AUTOMATION LTD.,JIANGSU |
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