CN207026742U - A kind of laser spot dynamic machining device - Google Patents
A kind of laser spot dynamic machining device Download PDFInfo
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- CN207026742U CN207026742U CN201720850697.0U CN201720850697U CN207026742U CN 207026742 U CN207026742 U CN 207026742U CN 201720850697 U CN201720850697 U CN 201720850697U CN 207026742 U CN207026742 U CN 207026742U
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Abstract
The utility model discloses a kind of laser spot dynamic machining device, belong to laser processing application technical field, it includes laser, beam-expanding collimation mirror, dynamic focusing mirror, guide-lighting mirror or xy bidimensional scanning galvanometer, can straight line back and forth movement mechanism, xy workbench and industrial computer, dynamic focusing mirror includes positive and negative focusing microscope group and a piece of negative focusing eyeglass, xy workbench is used to carry workpiece to be processed, negative focusing eyeglass is arranged on can be in straight line back and forth movement mechanism, industrial computer simultaneously and laser, can straight line back and forth movement mechanism be connected with xy workbench, beam-expanding collimation mirror, dynamic focusing mirror, the direction for the laser beam axis that guide-lighting mirror or xy bidimensional scanning galvanometer is launched along laser is set gradually.The utility model device overcomes serial processing problems caused by laser beam axis energy density distribution is uneven in traditional processing mode.
Description
Technical field
The utility model belongs to laser processing application technical field, and in particular to a kind of laser spot dynamic machining device.
Background technology
At present, the conventional method of Reciprocity of Laser ＆ Materials is to be fixed on certain for being applied material using laser spot
One position, then start laser beam and start to drill to material, cut, etch, weld etc. and process.
In laser processing procedure, laser spot is to be in transfixion state.This Laser Focusing processing mode is because swashing
Light focus on light beam be taper focal beam spot can cause it is uneven along in laser beam axis energy density distribution, i.e.,：In the energy of focal point
Metric density highest, focal point is more remote, and energy density is lower, as a result causes material to be heated along optical axis direction uneven.Focal point
It is high and be rapidly reached vaporization temperature that material absorbs amount of laser light energy density, be vaporized that evaporation material is more and fusing material compared with
It is few.And the material for leaving focal point absorbs that laser energy is relatively low, and causing to be vaporized evaporation material starts to gradually reduce, fusing material
It is stepped up.When from laser spot farther place, due to material, to absorb laser energy lower and be in molten state.
It is as follows to summarize the problem of this processing mode is present：
(1) during laser drill and cutting processing, because the vaporization of material more occurs in laser spot
Place, and the material outside focal point is in fusing compared with multimode, cause to be melted material far more than being vaporized evaporation material；
(2) it is few not only result in removal amount for a small amount of vaporization material, and caused deboost is also smaller；It is less
Deboost is difficult to more fusing material excluding area to be machined, cause substantial amounts of fusing material be set in again hole wall or
Cut on end wall, form re cast layer；
(3) re cast layer laser machined on hole wall will cause bellmouth and joint-cutting to be formed, and reduce the vertical of processing hole wall
Degree, influence to laser machine dimensional accuracy；
(4) re cast layer, which is formed, can also cause the roughness of Laser Processing to increase, while can also be formed as splitting in re cast layer
The defects of line, micro- stomata, coarse grains, laser processing quality is caused to decline；
(5) re cast layer and mother metal physical and chemical performance are inconsistent and adhesion is weaker, and this can also give subsequent treatment application
Some problems are brought, being such as coated with conducting film circuit in double teeming layer surface because of re cast layer micro-crack or can come off and breaking；
(6) melt material is more and vaporization less also result in forms a large amount of dross at material export processing, it is necessary to
By subsequent treatment；
(7) in the laser hot tearing separation process of transmission material, this edge focuses on laser beam axis Energy distribution not
, can cause it is uneven along thickness direction thermo parameters method, cause induction stress field skewness, cause separation
Micro-crack moves towards out of control；
(8) in laser beam welding, static focus hot spot can make appearance of weld poor, easily be produced in formed weld
The defects of stomata, slag inclusion, micro-crack；
(9) static laser spot can decline because energy density is far gone with focal point, cause material thermal conductivity loss to increase
Add, cause utilization ratio of laser energy to decline.
Therefore, it is necessary to new laser spot processing method or device be developed, can overcome present in prior art
Relevant issues.
Utility model content
For the disadvantages described above or Improvement requirement of prior art, the utility model proposes a kind of laser spot dynamic machining dress
Put, its general principle is in laser drill, cutting, welding, etching and hot tearing separate process, and laser spot is no longer solid
Fixed a certain position transfixion, but moved downward or upward along workpiece to be processed thickness optical axis direction with certain speed, or
Swing or spirally move up and down, the laser beam axis energy density distribution in overcoming in a manner of traditional processing with certain frequency linearity
Processing problems caused by uneven.
To achieve the above object, according to one side of the present utility model, there is provided a kind of laser spot dynamic machining side
Method, in process, speed dynamic mobile of the laser spot hot spot along optical axis to set.
In one embodiment of the present utility model, laser spot hot spot is with the speed that sets along workpiece to be processed thickness light
Direction of principal axis moves downward or upward.
In one embodiment of the present utility model, laser spot hot spot is moved with the frequency linearity set, or laser is burnt
Warble of the point hot spot to set, or laser spot hot spot are spirally moved up and down with the frequency set.
According to second of the present utility model aspect, there is provided a kind of laser spot dynamic machining dress for realizing as above method
Put, it include laser, beam-expanding collimation mirror, dynamic focusing mirror, guide-lighting mirror, can straight line back and forth movement mechanism, xy workbench and work
Control machine, wherein, dynamic focusing mirror includes positive and negative focusing microscope group and a piece of negative focusing eyeglass, and xy workbench is used to carry work to be processed
Part, negative focusing eyeglass be arranged on can in straight line back and forth movement mechanism, with can along moving linearly, industrial computer simultaneously with laser, can
Straight line back and forth movement mechanism is connected with xy workbench, can control the switch of laser respectively, can straight line back and forth movement mechanism
Movement and xy workbench movement, the laser beam axis that beam-expanding collimation mirror, dynamic focusing mirror, guide-lighting mirror are launched along laser
Direction is set gradually, and guide-lighting mirror is used for the laser reflection of laser transmitting to workpiece to be processed.
In one embodiment of the present utility model, when laser spot performs dynamic boring processing, industrial computer control swashs
Light device sends laser beam and controls the straight line back and forth movement mechanism in dynamic focusing mirror to drive speed of the negative focusing eyeglass to set
Move along a straight line forward or backward so that laser spot with the thickness optical axis direction of the speed that sets along workpiece to be processed upwards or
Move down, complete the processing of laser spot dynamic boring, then, industrial computer controls xy movable workbench workpiece to be processed to separately again
One position, above laser spot dynamic boring procedure is repeated, until completing all Drilling operations.
In one embodiment of the present utility model, in addition to focus lamp, focus lamp are arranged on guide-lighting mirror lower end, focus lamp
Carry out secondary focusing for the focusing laser beam that is exported to dynamic focusing, to obtain smaller focal beam spot diameter, so as to
In the hole for realizing brill smaller diameter or realize narrower cutting and weld seam.
According to 3rd of the present utility model aspect, a kind of laser spot dynamic machining for realizing as above method is additionally provided
Device, it include laser, beam-expanding collimation mirror, dynamic focusing mirror, can straight line back and forth movement mechanism, xy bidimensionals scanning galvanometer, xy
Workbench and industrial computer, wherein, dynamic focusing mirror includes positive and negative focusing microscope group and a piece of negative focusing eyeglass, and xy workbench is used to hold
Carry workpiece to be processed, negative focusing eyeglass be arranged on can in straight line back and forth movement mechanism, with can along moving linearly, industrial computer simultaneously with
Laser, can straight line back and forth movement mechanism, xy bidimensionals scanning galvanometer and xy workbench be connected, so that laser can be controlled respectively
Switch, can straight line back and forth movement mechanism movement, the movement of xy bidimensional scanning galvanometers and the movement of xy workbench, expand standard
The direction for the laser beam axis that straight mirror, dynamic focusing mirror, xy bidimensionals scanning galvanometer are launched along laser is set gradually, and xy bidimensionals are swept
Galvanometer is retouched to be used to focus on laser beam focus in the setting position of workpiece to be processed, the scanning of xy bidimensionals by what is exported from dynamic focus lamp
Galvanometer is made up of x directions reflecting optics and y directions reflecting optics, for controlling laser beam in x/y plane scanning machining track.
In one embodiment of the present utility model, in addition to scanning focused field lens, scanning focused field lens are arranged on xy two
Scanning galvanometer lower end is tieed up, the focusing laser beam for being exported to dynamic focusing mirror carries out secondary focusing, to obtain smaller focusing
Spot diameter, so as to bore the hole of smaller diameter for realizing or realize narrower cutting and weld seam.
In one embodiment of the present utility model, it is positive and negative focusing microscope group comprise at least a piece of negative focusing eyeglass and it is a piece of just
Focusing lens.
In the utility model, realizing the device critical component of the utility model laser spot dynamic machining method includes：One
Individual negative focusing eyeglass movable linearly and dynamic focusing mirror, the positive and negative focusing microscope group that dynamic focusing mirror includes one group of fixation are (positive and negative
Focusing on microscope group includes a piece of negative focusing eyeglass and a piece of positive focusing lens).Negative focusing eyeglass movable linearly moves installed in straight line
It on motivation structure, can carry out coming and going linear motion, change the laser light velocity angle of divergence, fixed positive and negative focusing microscope group is focused.
The operation principle of the utility model device is：When laser starts drilling, industrial computer controls laser and moved simultaneously
State focus lamp.Laser sends laser beam after beam-expanding collimation mirror beam-expanding collimation, is input to negative poly- during dynamic focusing mirror focuses on
Focus lens after being focused through fixed positive and negative focusing microscope group, import focused spot laser-beam divergence by guide-lighting mirror
Workpiece to be processed surface or internal a certain position.
When negative focusing eyeglass movable linearly is moved linearly forward or backward with certain speed, the laser light velocity angle of divergence also with
Change, the spot diameter projected on positive and negative focus lamp can also change, so as to change Laser Focusing focus in the position of optical axis,
So that laser spot moves downward or upward along workpiece thickness optical axis direction, laser spot dynamic boring function is realized.
In laser cutting, etching or welding process, industrial computer controls laser, dynamic focusing mirror and bidimensional work simultaneously
Platform.After laser sends laser beam, negative focusing eyeglass movable linearly, can be by laser spot with certain frequency straight line back and forth movement
Along workpiece thickness optical axis direction it is downward on move, while bidimensional workbench drive workpiece movement, realize laser spot dynamic cut
Cut and welding function.
The utility model laser spot dynamic machining method can be also engaged using dynamic focusing mirror with bidimensional scanning galvanometer,
Laser spot is realized to swing or spiral way moves up and down along workpiece to be processed thickness optical axis direction.
In general, by the contemplated above technical scheme of the utility model compared with prior art, can obtain down
Row beneficial effect：
Laser Focusing hot spot is processed along optical axis dynamic mobile mode, can improve laser along the uniform of optical axis energy density distribution
Property；Because Laser Focusing hot spot quickly moves along optical axis, absorptivity of the material along laser beam axis direction to laser energy can be improved,
The energy density for making rapidoprint be on laser beam axis to laser energy absorption at focus spot；Due to along laser beam axis
Material is in focal point processing, makes the increase of material vaporization amount, and fusing amount and heat conduction loss are reduced, and improve laser
The utilization rate of energy；
In Drilling operation, the increase of material vaporization amount will increase deslagging removal ability, reduce or eliminate re cast layer, change
Kind drilling taper；Fusing amount and heat conduction loss, which are reduced, to be beneficial to reduce and eliminate re cast layer, improves drilling taper；Material
Vaporization amount increases and fusing amount reduces and advantageously reduces or eliminate cutting drilling dross phenomenon；
In the laser hot tearing separation process of transmission material, laser spot quickly moves along optical axis, improves energy
Along optical axis direction skewness so that, the stress field induced along optical axis is evenly distributed along optical axis thermo parameters method evenly
Property strengthen, so as to realize control separation micro-crack trend；
In laser beam welding, focal beam spot quickly moves along optical axis can make gas pore in weld metal and slag inclusion be easier to escape
Go out, be advantageous to improve laser welded seam quality.
Brief description of the drawings
Fig. 1 is one of laser spot dynamic machining method that the utility model embodiment provides：Focus moves down signal
Figure；
Fig. 2 is one of laser spot dynamic machining method that the utility model embodiment provides：Focus moves up signal
Figure；
Fig. 3 is the laser spot for realizing one of the laser spot dynamic machining method dynamic that the utility model embodiment provides
Processing unit (plant) schematic diagram；
Fig. 4 is two schematic diagrames of the laser spot dynamic machining method that the utility model embodiment provides；
Fig. 5 is two laser spot for the realizing laser spot dynamic machining method dynamic that the utility model embodiment provides
Processing unit (plant) schematic diagram；
Fig. 6 is three device for realizing laser spot dynamic machining method that the utility model embodiment provides；
Fig. 7 is three device that another that the utility model embodiment provides realizes laser spot dynamic machining method,
The device carries out secondary focusing on the basis of Fig. 6 shown devices, for focusing on laser beam, and its light class diameter is smaller, for adding
The smaller welding of the smaller either width of work aperture diameter or joint-cutting；
Fig. 8 is the three of the laser spot dynamic machining method that the utility model embodiment provides：Spiral laser spot is moved
State drilling schematic diagram；
Fig. 9 is the three of the laser spot dynamic machining method that the utility model embodiment provides：Concentric-ring pattern laser spot
Dynamic boring schematic diagram；
Figure 10 is the three of the laser spot dynamic machining method that the utility model embodiment provides：Swing type laser spot is moved
State machining sketch chart.
Wherein, one of laser spot dynamic machining method refers to laser spot dynamic boring method；Laser spot dynamic adds
The two of work method refer to the cutting of laser spot dynamic, etching, scribing or welding method；The three of laser spot dynamic machining method are
Refer to laser spot dynamic screw or concentric-ring pattern drilling and swing type processing method.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining
The utility model, it is not used to limit the utility model.In addition, institute in each embodiment of the utility model disclosed below
As long as the technical characteristic being related to does not form conflict each other, can is mutually combined.
One of the utility model embodiment：Laser spot dynamic boring method.
As depicted in figs. 1 and 2, Fig. 1 is provided laser spot dynamic boring method general principle for the utility model embodiment
One of laser spot dynamic machining method：Focus moves down schematic diagram；Fig. 2 is the laser that the utility model embodiment provides
One of focus dynamic machining method：Focus moves up schematic diagram.
Specifically, the initial focus 1 for focusing on laser beam is located on surface or a certain position of workpiece to be processed 2.Laser
After launching laser beam, focus 1 starts to move down with certain speed, until after aperture 3 needed for being formed on workpiece 2, laser
Device stops sending laser beam, while initial position is returned in the position of laser spot 1.The initial focus 1 for focusing on laser beam also may be used
On the basal surface of workpiece to be processed 2 (as shown in Figure 2), at laser hair after laser beam, focus 1 starts with certain speed
Move up, until after aperture 3 needed for being formed on workpiece 2, laser stops sending laser beam, while the position of laser spot 1
Put and return initial position.
One of party's subtraction unit is realized as shown in figure 3, Fig. 3 realizes that laser spot is moved for what the utility model embodiment provided
The laser spot dynamic machining schematic device of one of state processing method.As seen from the figure, it includes laser 10, beam-expanding collimation mirror
11st, dynamic focusing mirror 12, guide-lighting mirror 16, xy workbench 17 and industrial computer 18., wherein, dynamic focusing mirror 12 includes can straight line shifting
Dynamic negative focusing eyeglass 13 and positive and negative focusing microscope group 14, negative focusing eyeglass 13 movable linearly is fixed on can straight line back and forth movement mechanism
On 15, positive and negative focusing microscope group 14 is made up of at least a piece of negative focusing mirror and a piece of positive focus lamp.Workpiece to be processed 2 is fixed on xy works
Make in the plane of platform 17, laser beam foucing is located at the setting position of workpiece 2.Industrial computer 18 controls laser 10, dynamic focusing simultaneously
Mirror 12 and xy workbench 17.
Method of work of Fig. 3 described devices in laser spot dynamic boring is as follows：
Industrial computer 18 control laser 10 send laser beam, and control in dynamic focusing mirror 12 can straight line back and forth movement machine
Structure 15 drives negative focusing eyeglass 13 to be moved along a straight line forward or backward with the speed of setting, makes laser spot 1 with the speed edge of setting
The thickness optical axis direction of workpiece 2 moves up or down that (thickness optical axis direction is the optical axis direction of laser beam, namely workpiece
2 thickness direction), complete the processing of laser spot dynamic boring.It is another that industrial computer 18 controls the travelling workpiece 2 of xy workbench 17 to arrive again
Individual position, above laser spot dynamic boring procedure is repeated, until completing all small hole machineds.
The two of the utility model embodiment：The cutting of laser spot dynamic, etching, scribing or welding.
The cutting of laser spot dynamic, etching, the general principle of scribing or welding method as shown in figure 4, Fig. 4 be this practicality newly
Two schematic diagrames of the laser spot dynamic machining method that type embodiment provides.
Specifically, the initial focus 1 for focusing on laser beam is located on surface or a certain position of workpiece to be processed 2.Laser
After sending laser beam, laser spot 1 starts to move up and down with the frequency of setting, while the relative laser beam focus 1 of workpiece to be added 2
Motion, after the joint-cutting needed for being formed, etching, scribing or weld seam 4, laser stops sending laser beam, while laser spot 1
Initial position is returned to, workpiece 2 stops movement.Industrial computer 18 controls laser 10 to send laser beam and control in dynamic focusing mirror 12
Can straight line back and forth movement mechanism 15, drive negative focusing eyeglass 13 to come and go linear motion with the frequency of setting, make laser spot 1 with
Thickness optical axis direction of certain frequency along workpiece 2 moves up and down, meanwhile, industrial computer 18 controls xy workbench 17 with certain again
Speed travelling workpiece 2, complete the cutting of laser spot dynamic, etching, scribing or welding processing.
The advantages of this laser spot dynamic machining method is that light path is simple, and laser spot dynamic machining scope is wider.
In order to obtain less focal beam spot diameter, laser spot dynamic machining square law device provided by the utility model it
Two as shown in Figure 5, and Fig. 5 is two laser spot for realizing laser spot dynamic machining method that the utility model embodiment provides
Dynamic machining schematic device.
Specifically, adding a focus lamp 20 after guide-lighting mirror 16, the focusing that focus lamp 20 exports to dynamic focusing swashs
Light beam carries out secondary focusing, can obtain less focal beam spot diameter, can be achieved to bore less bore dia and narrower cutting and
Weld width.
The method of work and figure of Fig. 5 realize laser spot dynamic machining method two laser spot dynamic machining device
3 described devices are identical.
One of above laser spot dynamic machining method, 2 two kinds of laser spot dynamic machining square law devices common spy
Point is that laser beam is motionless, but xy workbench drives workpiece movement, forms Laser Processing track.
The three of the utility model embodiment：In order to overcome Laser Processing speed slow, and laser Jiao can not be realized
The problem of point dynamic screw or concentric-ring pattern drilling and swing type are processed, the utility model provides the three of embodiment.
The three of laser spot dynamic machining method refer to laser spot dynamic screw or concentric-ring pattern drilling and swing type processing method.
Wherein, Fig. 8 is the three of the laser spot dynamic machining method that the utility model embodiment provides：Spiral laser is burnt
Point dynamic boring schematic diagram；Fig. 9 is the three of the laser spot dynamic machining method that the utility model embodiment provides：Concentric-ring pattern
Laser spot dynamic boring schematic diagram；Figure 10 is the three of the laser spot dynamic machining method that the utility model embodiment provides：
Swing type laser spot dynamic machining schematic diagram.
Fig. 6 is three device for realizing laser spot dynamic machining method that the utility model embodiment provides, can by figure
Know, the device is one xy bidimensionals scanning galvanometer 25 of addition after dynamic focusing mirror 12.Swash from the focusing of dynamic focus lamp output
Light beam focuses on a certain position of workpiece 2 after xy bidimensionals scanning galvanometer 25.Due to xy bidimensionals scanning galvanometer 25 be by x directions and
Y directions reflecting optics composition, can its light weight, inertia be small, can be in xy in x/y plane scanning machining track for controlling laser beam
Realize that arbitrarily complicated figure is processed in high-velocity scanning in plane.
The present embodiment device at work, industrial computer 18 simultaneously control in laser 10, dynamic focusing mirror 12 can straight line
Back and forth movement mechanism 15, xy workbench 17 and bidimensional scanning galvanometer 25.
If necessary to obtain less Laser Focusing spot diameter, one can be installed in the delivery outlet of xy bidimensionals scanning galvanometer 25
The scanning focused field lens 26 of proper focal length, secondary focusing is carried out to the focusing laser beam that dynamic focusing mirror 12 exports, sees Fig. 7 institutes
Show.Fig. 7 is that another that the utility model embodiment provides realizes three device of laser spot dynamic machining method, the device
On the basis of Fig. 6 shown devices, secondary focusing is carried out for focusing on laser beam, its light class diameter is smaller, for processing aperture
The smaller welding of the smaller either width of diameter or joint-cutting.
The present embodiment device operation principle is：In laser spot dynamic boring, industrial computer 18 controls laser 10 to send
Laser beam and control in dynamic focusing mirror 12 can straight line back and forth movement mechanism 15, drive negative focusing eyeglass 13 with certain speed
Move along a straight line forward or backward, while the control of xy bidimensionals scanning galvanometer 25 focuses on laser beam and scans track in x/y plane, so as to real
Now spiral laser spot dynamic boring (as shown in Figure 8) or concentric-ring pattern laser spot dynamic boring (as shown in Figure 9).
In the range of the field sweep of scanning galvanometer 25 after completion of processing, industrial computer 18 controls xy workbench 17 to move on to workpiece 2 newly
The field sweep of scanning galvanometer 25 in the range of continue Drilling operation until Drilling operation terminate.
In the cutting of laser spot dynamic, etching, scribing or welding, industrial computer 18 controls laser 10 to send laser beam simultaneously
Control in dynamic focusing mirror 12 can straight line back and forth movement mechanism 15, drive negative focusing eyeglass 13 to come and go fortune with certain frequency
It is dynamic, while the control of xy bidimensionals scanning galvanometer 25 focuses on laser beam and scans track in x/y plane, and swing type laser spot can be achieved and move
State cutting, etching, scribing or welding manner processing are (as shown in Figure 10).In the range of the field sweep of scanning galvanometer 25 after completion of processing,
The control xy of industrial computer 18 workbench 17, which moves on to workpiece 2 in the range of the new field sweep of scanning galvanometer 25, continues Laser Processing until whole
Work pieces process finishes.
In order to further illustrate the superiority of the utility model processing method, with reference to specific process embodiment to this
Utility model method describes in detail.
Example 1：
A pair of thickness of the utility model embodiment are used as 1mm Al2O3Ceramic material carries out laser spot and moved
State Drilling operation.
Lasing light emitter in laser spot dynamic boring system is pulse width 25ns, repetition rate 100kHz, and wavelength is
1064nm, power output are 50W pulse laser, the removable negative focusing eyeglass scope 2mm in dynamic focusing mirror, and laser gathers
Burnt spot diameter is 50 μm and can be along optical axis moving range 20mm.Laser spot is located at material surface to be processed, drilling is set
When laser spot moved down with 0.5mm/s speed.
Test result indicates that：It it is 70 μm in the hole diameter that ceramics obtain, wall taper is less than 0.1 °, and hole wall is without re cast layer
And micro-crack, heat affected area are less than 1 μm.Orifice surface and bottom are substantially without residue.
Example 2：
Two pairs of thickness of the utility model embodiment are used to carry out laser spot for 20mm soda-lime glass material
The cutting separation processing of dynamic fire check.
Lasing light emitter in laser spot dynamic diced system is that wavelength is 1064nm, and power output is 100W continuous laser
Device, the removable negative focusing eyeglass scope 5mm in dynamic focusing mirror, Laser Focusing spot diameter are 0.1mm and can moved along optical axis
Dynamic scope 50mm.Laser spot is located in the middle part of material to be processed, sets fire check to cut in separation process laser spot to shake
Width is ± 2mm, frequency moves up and down for 50Hz.
Test result indicates that：Glass separating cut is smooth precipitous, no chipping phenomenon, breach end face flat smooth, and can enter
The camber line cutting separation of row certain curvature.
Example 3：
Three pairs of thickness of the utility model embodiment are used as 2mm Al2O3Ceramic material carries out laser scan type
Focus dynamic bores the aperture of 1mm diameters.
Lasing light emitter in laser spot dynamic boring system is pulse width 25ns, repetition rate 500kHz, and wavelength is
1064nm, power output are 50W pulse laser, the removable negative focusing eyeglass scope 2mm in dynamic focusing mirror, and laser gathers
Burnt spot diameter is 10 μm and can be along optical axis moving range 20mm.Laser spot is located at material surface to be processed, drilling is set
When laser spot moved down with 1mm/s speed, sweep speed 1m/s.
Test result indicates that：It is 1.02mm in the hole diameter that ceramics obtain, wall taper is less than 0.01 °, and hole wall is without weight
Cast layer and micro-crack, heat affected area are less than 0.5 μm.Orifice surface and bottom are without residue.
As it will be easily appreciated by one skilled in the art that preferred embodiment of the present utility model is the foregoing is only, not
To limit the utility model, any modification of all made within spirit of the present utility model and principle, equivalent substitution and change
Enter, should be included within the scope of protection of the utility model.
Claims (8)
1. a kind of laser spot dynamic machining device, it is characterised in that in process, the device is used to realize laser spot light
Speed dynamic mobile of the spot along optical axis to set, it include laser (10), beam-expanding collimation mirror (11), dynamic focusing mirror (12),
Light-guide device, can straight line back and forth movement mechanism (15), xy workbench (17) and industrial computer (18),
Under the control of industrial computer (18), dynamic focusing mirror (12), can straight line back and forth movement mechanism (15) and light-guide device be total to
Same-action, realize speed dynamic mobile of the laser spot hot spot along optical axis to set.
2. laser spot dynamic machining device as claimed in claim 1, it is characterised in that in process, the device is used for
The speed for realizing laser spot hot spot to set moves downward or upward along workpiece to be processed thickness optical axis direction, wherein, it is guide-lighting
Element is guide-lighting mirror (16),
Dynamic focusing mirror (12) includes positive and negative focusing microscope group (14) and a piece of negative focusing eyeglass (13),
Xy workbench (17) is used to carry workpiece to be processed (2), and negative focusing eyeglass (13) is arranged on can straight line back and forth movement mechanism
(15) on, moved linearly with energy edge,
Industrial computer (18) at the same with laser (10), can straight line back and forth movement mechanism (15) and xy workbench (17) be connected, with
Can control respectively laser (10) switch, can the movement of straight line back and forth movement mechanism (15) and the movement of xy workbench (17),
The side for the laser beam axis that beam-expanding collimation mirror (11), dynamic focusing mirror (12), guide-lighting mirror (16) are launched along laser (10)
To setting gradually,
Guide-lighting mirror (16) is used for the laser reflection of laser (10) transmitting to workpiece to be processed (2).
3. laser spot dynamic machining device as claimed in claim 2, it is characterised in that perform dynamic boring in laser spot
During processing, industrial computer (18) control laser (10) send laser beam and control in dynamic focusing mirror (12) can straight line come and go fortune
Motivation structure (15) drives negative focusing eyeglass (13) to be moved along a straight line forward or backward with the speed of setting,
So that laser spot (1) is moved up or down with thickness optical axis direction of the speed of setting along workpiece to be processed (2),
The processing of laser spot dynamic boring is completed,
Then, industrial computer (18) controls the mobile workpiece to be processed (2) of xy workbench (17) to arrive another position again, repeats to swash above
Optical focus dynamic boring procedure, until completing all Drilling operations.
4. laser spot dynamic machining device as claimed in claim 3, it is characterised in that also including focus lamp (20), focus on
Mirror (20) is arranged on guide-lighting mirror (16) lower end, and focus lamp (20) is used to carry out secondary gather to the focusing laser beam of dynamic focusing output
Jiao, to obtain smaller focal beam spot diameter, so as to bore the hole of smaller diameter for realizing or realize narrower cutting and weldering
Seam.
5. laser spot dynamic machining device as claimed in claim 4, it is characterised in that positive and negative focusing microscope group (14) is at least wrapped
Include a piece of negative focusing eyeglass and a piece of positive focusing lens.
6. laser spot dynamic machining device as claimed in claim 1, it is characterised in that in process, the device is used for
The frequency linearity movement for realizing laser spot hot spot to set, or warble of the laser spot hot spot to set, or laser are burnt
Point hot spot is spirally moved up and down with the frequency set, wherein, light-guide device is xy bidimensionals scanning galvanometer (25),
Dynamic focusing mirror (12) includes positive and negative focusing microscope group (14) and a piece of negative focusing eyeglass (13),
Xy workbench (17) is used to carry workpiece to be processed (2), and negative focusing eyeglass (13) is arranged on can straight line back and forth movement mechanism
(15) on, moved linearly with energy edge,
Industrial computer (18) at the same with laser (10), can straight line back and forth movement mechanism (15), xy bidimensionals scanning galvanometer (25) and
Xy workbench (17) is connected, with can control respectively the switch of laser (10), can straight line back and forth movement mechanism (15) movement,
The movement of xy bidimensionals scanning galvanometer (25) and the movement of xy workbench (17),
The laser that beam-expanding collimation mirror (11), dynamic focusing mirror (12), xy bidimensionals scanning galvanometer (25) are launched along laser (10)
The direction of optical axis is set gradually,
The focusing laser beam focus that xy bidimensionals scanning galvanometer (25) is used to export from dynamic focus lamp is in workpiece to be processed (2)
Setting position,
Xy bidimensionals scanning galvanometer (25) is made up of x directions reflecting optics and y directions reflecting optics, for controlling laser beam in xy
Flat scanning machining locus.
7. laser spot dynamic machining device as claimed in claim 6, it is characterised in that also including scanning focused field lens
(26), scanning focused field lens (26) is arranged on xy bidimensionals scanning galvanometer (25) lower end, for what is exported to dynamic focusing mirror (12)
Focus on laser beam and carry out secondary focusing, to obtain smaller focal beam spot diameter, so as to bored for realizing the hole of smaller diameter,
Or realize narrower cutting and weld seam.
8. laser spot dynamic machining device as claimed in claim 7, it is characterised in that positive and negative focusing microscope group (14) is at least wrapped
Include a piece of negative focusing eyeglass and a piece of positive focusing lens.
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| CN107442930A (en) * | 2017-07-13 | 2017-12-08 | 华中科技大学 | A kind of laser spot dynamic machining method and device |
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