CN207009476U - 一种大功率led芯片集成封装结构 - Google Patents
一种大功率led芯片集成封装结构 Download PDFInfo
- Publication number
- CN207009476U CN207009476U CN201720731857.XU CN201720731857U CN207009476U CN 207009476 U CN207009476 U CN 207009476U CN 201720731857 U CN201720731857 U CN 201720731857U CN 207009476 U CN207009476 U CN 207009476U
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- Prior art keywords
- power led
- substrate
- chip
- led chip
- optical glass
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- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000003292 glue Substances 0.000 claims abstract description 28
- 239000005304 optical glass Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000084 colloidal system Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 8
- 238000007788 roughening Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000005496 eutectics Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000003032 molecular docking Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 239000011261 inert gas Substances 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 4
- -1 enclosure wall Substances 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000006378 damage Effects 0.000 description 8
- 230000035882 stress Effects 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 238000004073 vulcanization Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 208000013668 Facial cleft Diseases 0.000 description 1
- 206010023126 Jaundice Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201720731857.XU CN207009476U (zh) | 2017-06-21 | 2017-06-21 | 一种大功率led芯片集成封装结构 |
Applications Claiming Priority (1)
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CN201720731857.XU CN207009476U (zh) | 2017-06-21 | 2017-06-21 | 一种大功率led芯片集成封装结构 |
Publications (1)
Publication Number | Publication Date |
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CN207009476U true CN207009476U (zh) | 2018-02-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201720731857.XU Expired - Fee Related CN207009476U (zh) | 2017-06-21 | 2017-06-21 | 一种大功率led芯片集成封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN207009476U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107248547A (zh) * | 2017-06-21 | 2017-10-13 | 鸿宝科技股份有限公司 | 一种大功率led芯片集成封装结构及其封装方法 |
WO2019219095A1 (zh) * | 2018-05-17 | 2019-11-21 | 海迪科(南通)光电科技有限公司 | 一种利用wlp的集成式led封装形式及其制备方法 |
-
2017
- 2017-06-21 CN CN201720731857.XU patent/CN207009476U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107248547A (zh) * | 2017-06-21 | 2017-10-13 | 鸿宝科技股份有限公司 | 一种大功率led芯片集成封装结构及其封装方法 |
WO2019219095A1 (zh) * | 2018-05-17 | 2019-11-21 | 海迪科(南通)光电科技有限公司 | 一种利用wlp的集成式led封装形式及其制备方法 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: High-power LED chip integrated packaging structure Effective date of registration: 20181221 Granted publication date: 20180213 Pledgee: China Everbright Bank Zhongshan branch Pledgor: HOMBO TECHNOLOGY PLC Registration number: 2018440020089 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191224 Granted publication date: 20180213 Pledgee: China Everbright Bank Zhongshan branch Pledgor: HOMBO TECHNOLOGY PLC Registration number: 2018440020089 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: High-power LED chip integrated packaging structure Effective date of registration: 20191227 Granted publication date: 20180213 Pledgee: China Everbright Bank Zhongshan branch Pledgor: HOMBO TECHNOLOGY PLC Registration number: Y2019980001363 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211110 Granted publication date: 20180213 Pledgee: China Everbright Bank Zhongshan branch Pledgor: HOMBO TECHNOLOGY PLC Registration number: Y2019980001363 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180213 |