CN206989108U - Backlight and LED light source - Google Patents
Backlight and LED light source Download PDFInfo
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- CN206989108U CN206989108U CN201720411713.6U CN201720411713U CN206989108U CN 206989108 U CN206989108 U CN 206989108U CN 201720411713 U CN201720411713 U CN 201720411713U CN 206989108 U CN206989108 U CN 206989108U
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- quantum dot
- insulating member
- heat insulating
- backlight
- light
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Abstract
LED technology field is the utility model is related to, more particularly to a kind of backlight and LED light source.The backlight includes support frame,PCB,Excitation source,Quantum dot diaphragm and heat insulating member,Support frame as described above includes bottom plate and side plate,The bottom plate is arranged on side plate edge and surrounds a storage tank,The PCB,Excitation source and heat insulating member are arranged in storage tank,PCB is fixed on accommodating trench bottom,The excitation source is fixed on PCB and is electrically connected with PCB,The quantum dot diaphragm arrangement is closed at storage tank notch and by the notch,The heat insulating member is arranged between excitation source and quantum dot diaphragm and the edge of the heat insulating member contacts with the side wall of storage tank,The light that the excitation source is sent first passes through heat insulating member,Projected again after quantum dot diaphragm,The LED light source includes LED lamp bead,In the LED lamp bead,Heat insulating member is arranged between LED chip and quantum dot diaphragm and the edge of heat insulating member is arranged in the side wall of storage tank.The backlight and LED light source all have the advantages of long lifespan.
Description
【Technical field】
LED technology field is the utility model is related to, more particularly to a kind of backlight and LED light source.
【Background technology】
LED is quite varied as application applied to lighting, in order to obtain more preferable gamut range, using LED core
Piece coordinates quantum dot diaphragm to be lighted, and obtains preferable illumination effect.And it is limited to the characteristic of quantum dot diaphragm in itself, it is existing
Do not grown using the light source life of quantum dot diaphragm, and quantum dot diaphragm is expensive, just constrains using quantum dot diaphragm light source
Promote the use of.
Therefore, the problem of short using the light source life of quantum dot diaphragm how is improved, into the demand in LED technology field！
【Utility model content】
To overcome the technical problem for applying the light source life of quantum dot diaphragm short, the utility model provides one kind and applied
The backlight and LED light source of quantum dot diaphragm and long lifespan.
The scheme that the utility model solves technical problem is to provide a kind of backlight, and the backlight includes support frame, PCB,
Excitation source, quantum dot diaphragm and heat insulating member, support frame as described above include bottom plate and side plate, and the bottom plate is arranged on side plate edge
A storage tank, the PCB are surrounded, excitation source and heat insulating member are arranged in storage tank, and PCB is fixed on accommodating trench bottom, institute
State excitation source to be fixed on PCB and be electrically connected with PCB, the quantum dot diaphragm arrangement is at storage tank notch and by described in
Notch is closed, and the heat insulating member is arranged between excitation source and quantum dot diaphragm and the edge of the heat insulating member is with housing
The side wall contact of groove, the light that the excitation source is sent first passes through heat insulating member, then is projected after quantum dot diaphragm.
Preferably, the position of side plate and the heat insulating member contact sets neck, and the edge of the heat insulating member puts in card
In groove, the depth of the neck is less than the thickness of side wall or neck penetrates the part of accommodating groove sidewall.
Preferably, the heat insulating member is infrared ray filter coating or graphene film.
Preferably, the PCB is transparent circuit substrate, and the backlight also includes fixture, and the fixture is described in
Transparent circuit substrate is fixed on accommodating trench bottom and makes transparent circuit substrate hanging relative to accommodating trench bottom.
Preferably, the backlight also includes reflection layer, the reflection layer be arranged on bottom plate and positioned at bottom plate and
Between transparent circuit substrate and/or reflection layer is arranged on side plate.
Preferably, the backlight also includes diffusion sheet and brightness enhancement film, the diffusion sheet, quantum dot diaphragm, and brightness enhancement film is put down
Row stacks successively in bottom plate, and its three edge is all fixed on the one end of side plate away from bottom plate, the notch is closed, the diffusion
Pitch of fins excitation source is closest.
Preferably, the backlight also includes packaging plastic, and the packaging plastic is filled in the storage tank, the backlight
Also include light guide plate, diffusion sheet, brightness enhancement film and the second reflection layer, the one side of the quantum dot diaphragm away from bottom plate is light extraction
Face, second reflection layer, light guide plate, diffusion sheet and brightness enhancement film are bonded stack successively, and the second reflection layer, light guide plate,
One end of diffusion sheet and brightness enhancement film is arranged on exiting surface, and exiting surface is covered.
The utility model also provides a kind of LED light source, and the LED light source employs LED lamp bead, and the LED lamp bead includes support,
PCB, LED chip, packaging plastic, quantum dot diaphragm and heat insulating member, the support include bottom plate and side plate, and the bottom plate is arranged on
Side plate edge surrounds a storage tank, and the LED chip and PCB are all located in storage tank, and the PCB is fixed on support, described
LED chip is fixed on PCB and is electrically connected with PCB, and the quantum dot diaphragm arrangement is at storage tank notch and by the groove
Mouthful closing, the heat insulating member is arranged between LED chip and quantum dot diaphragm and the edge of the heat insulating member is arranged on appearance
Put in the side wall of groove, the packaging plastic is filled in storage tank, and packaging plastic fills the space between LED chip and heat insulating member
Envelope, and the space embedding between heat insulating member and quantum dot diaphragm, the light that the LED chip is sent first passes through heat insulating member,
Projected again after quantum dot diaphragm.
Preferably, the position of side plate and the heat insulating member contact sets neck, and the edge of the heat insulating member puts in card
In groove, the depth of the neck is less than the thickness of side wall or neck penetrates the part of accommodating groove sidewall.
Preferably, the LED lamp bead also includes external positive pole and external negative pole, and the external positive pole and external negative pole are all solid
Due at least offering first through hole, the second through hole and third through-hole on support outer wall, the support, the LED chip passes through
The first through hole is connected with external positive pole, is electrically connected with by second through hole and external negative pole, and the LED lamp bead is also wrapped
Include heat sink, described heat sink in the third through-hole, and the inside of heat sink one end connection LED support, the other end is exposed outside,
And heat sink and external positive pole or external cathode contact.
Compared with prior art, in backlight of the present utility model, heat insulating member is arranged on excitation source and quantum dot film
Between the piece and edge of heat insulating member contacts with the side wall of storage tank, and the light that the excitation source is sent first passes through heat insulating member,
Projected again after quantum dot diaphragm from backlight, heat insulating member stops the luminous caused heat of excitation source, or heat-insulated
Part quickly quickly exports heat the outside of backlight, so that heat caused by excitation source is luminous can not pass to quantum dot
Diaphragm, solve the technical problem of quantum dot diaphragm heat short life, extend the life-span of quantum dot diaphragm, further increase
In the life-span of backlight, improve the promoted extension of the backlight using quantum dot diaphragm.
The position of side wall and the heat insulating member contact of storage tank of the present utility model sets neck, and the edge of heat insulating member is stretched
Enter in neck, excitation source and quantum dot diaphragm isolate more thoroughly, heat insulating member heat-insulated or heat derives are carried on the back
The effect of light source is more preferable, further increases the life-span of quantum dot diaphragm, improves the life-span of backlight；It is or of the present utility model
Neck penetrates the part of side plate, and the heat insulating member in neck and the air contact outside the backlight, heat insulating member is heat
It is more preferable to export the effect of backlight, directly outside heat derives to backlight, further increases the life-span of quantum dot diaphragm,
Improve the life-span of backlight.
The transparent circuit substrate is fixed on accommodating trench bottom and makes transparent circuit substrate by fixture of the present utility model
It is hanging relative to accommodating trench bottom, the light that excitation source is sent preferably is passed through transparent circuit substrate, excitation source is not
Stopped by transparent circuit substrate, further reduce the heating of excitation source, improve the life-span of quantum dot diaphragm, improve the back of the body
The life-span of light source.
Backlight of the present utility model also includes reflection layer, and reflection layer is arranged on bottom plate and positioned at bottom plate and transparent
Between circuit substrate and/or reflection layer is arranged on side plate, and the light that reflecting layer reflected excitation light source is sent makes it from quantum dot
Diaphragm passes through, and improves the utilization rate of exciting light, improves the brightness of backlight.
Backlight of the present utility model also includes diffusion sheet and brightness enhancement film, the diffusion sheet, quantum dot diaphragm, and brightness enhancement film is put down
Row stacks successively in bottom plate, and its three edge is all fixed on the one end of side plate away from bottom plate, the notch is closed, the diffusion
Pitch of fins excitation source is closest, and spot light caused by excitation source is diffused into a uniform area source, blast by diffusion sheet
Film improves luminous efficiency, reduces rising angle.
Backlight of the present utility model also includes light guide plate, diffusion sheet, brightness enhancement film and the second reflection layer, the quantum dot
One side of the diaphragm away from bottom plate is exiting surface, second reflection layer, light guide plate, and diffusion sheet and brightness enhancement film are bonded folded successively
Put, and the second reflection layer, light guide plate, one end of diffusion sheet and brightness enhancement film is arranged on exiting surface, exiting surface is covered, backlight
The light that source is sent is uniform and brightness is high.
In LED light source of the present utility model, heat insulating member is arranged between LED chip and quantum dot diaphragm and heat insulating member
Edge be arranged in the side wall of storage tank, the light that the excitation source is sent first passes through heat insulating member, then by quantum dot film
Projected after piece from backlight, the luminous caused heat of heat insulating member stop LED chip, or heat insulating member are quickly fast heat
The outside of speed export LED lamp bead, so that heat caused by LED chip is luminous can not pass to quantum dot diaphragm, solves quantum
The technical problem of point diaphragm heat short life, the life-span of quantum dot diaphragm is extended, further increase the LED of LED light source
In the life-span of pearl, improve the promoted extension of the LED lamp bead of LED light source using quantum dot diaphragm.
LED light source of the present utility model is described heat sink in third through-hole also including heat sink, and described heat sink one end
The inside of LED support is connected, the other end is exposed outside, and heat sink and external positive pole or external cathode contact, the heat sink drop being exceedingly fast
The low temperature of electrode, the temperature for reducing LED chip is further speeded up, LED chip is maintained at a good state, reduced
The temperature of LED lamp bead, the temperature of quantum dot diaphragm is reduced, the life-span of quantum dot diaphragm is extended, further increases LED lamp bead
Life-span, improve the promoted extension of the LED lamp bead using quantum dot diaphragm.
【Brief description of the drawings】
Fig. 1 is the overlooking the structure diagram of the utility model backlight first embodiment.
Fig. 2 is the broken section structural representation of the utility model backlight.
Fig. 3 is the overlooking the structure diagram of the utility model support frame.
Fig. 4 is the cross section structure diagram at A-A in Fig. 3.
Fig. 5 is the overlooking the structure diagram of the utility model Shockproof gasket.
Fig. 6 is the close-up schematic view of the fixture at B in Fig. 2.
Fig. 7 is a kind of broken section structural representation of deformation of the utility model support frame.
Fig. 8 is the broken section structural representation of the second embodiment of the utility model backlight.
Fig. 9 is the cross-sectional view of the utility model 3rd embodiment LED lamp bead.
Figure 10 is the cross-sectional view of the utility model support.
Figure 11 is the propagation path schematic diagram of the light of the utility model LED lamp bead.
Figure 12 is a kind of cross-sectional view of deformation of the utility model LED lamp bead.
Figure 13 is the cross-sectional view of another deformation of the utility model LED lamp bead.
Figure 14 is the cross-section structure partial schematic diagram of the utility model LED light source.
【Embodiment】
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only solving
The utility model is released, is not used to limit the utility model.
Also referring to Fig. 1 and Fig. 2, first embodiment of the present utility model provides a kind of backlight 10, and it includes support
Frame 11, reflection layer 12, multiple fixtures 13, transparent circuit substrate 14 and LED chip 15.LED chip 15 is fixed on transparent electricity
It is electrically connected with base board 14 and with transparent circuit substrate 14, transparent circuit substrate 14 is fixed on support frame by multiple fixtures 13
On 11, reflection layer 12 is arranged between fixture 13 and support frame 11.Preferably, LED chip 15 be arranged on fixture 13 it
Between transparent circuit substrate 14 on.LED chip 15 is electrically conducted by transparent circuit substrate 14 so as to send light, reflection layer 12
LED chip 15 can be irradiated to the light reflection of reflection layer 12.The structure of the present embodiment is a direct LED backlight 10.
Also referring to Fig. 3 and Fig. 4, support frame 11 is made up of metal or plastic cement, it is preferable that it is accommodating that support frame 11 opens up one
Groove, i.e. support frame 11 include bottom plate 112 and side plate 114, and side plate 114 is fixed on the edge of bottom plate 112, so as to bottom plate 112 and thereon
Side plate 114 form foregoing storage tank, side plate 114 forms the notch in the end away from bottom plate 112.Light is set in storage tank
Reflecting layer 12, fixture 13, transparent circuit substrate 14 and LED chip 15.Fixture 13 is fixed on bottom plate 112, reflection layer
12 are arranged between fixture 13 and bottom plate 112.Preferably, the first fixing hole 1122 is offered on the bottom plate 112 of support frame 11,
First fixing hole 1122 can be through hole or blind hole, and the first fixing hole 1122 is used to fix peace by connected modes such as screw or bolts
Fixture 13 is filled, transparent circuit substrate 14 and the fixture 13 of LED chip 15 thereon are locked on bottom plate 112.Preferably, use
Four attachment screws of the first fixing hole 1122 or bolt etc. fix a fixture 13, so that fixture 13 firmly installs, no
It can loosen.It is appreciated that other modes can also be used to fix fixture 13, perforate is one preferable on bottom plate 112
Embodiment.
Reflection layer 12 is used for reflected illumination in light thereon, and it is preferably film material, so as to be an optical reflection film.Light
Reflecting layer 12 is layed on the bottom plate 112 of support frame 11, and when opening the first fixing hole 1122 on bottom plate 112, reflection layer 12 is right
Position is answered also to open up hole (figure does not regard) with mounting fixing parts 13.Selected as one kind, reflection layer 12 can also be arranged on side plate
On 114, so as to which LED chip 15 is reflected towards the light that the direction of side plate 114 is sent.It is appreciated that reflection layer 12 can omit
Set.
Please continue to refer to Fig. 2, fixture 13 includes fixing card 131 and Shockproof gasket 132, Shockproof gasket 132 and bottom plate 112
It is fixedly connected, transparent circuit substrate 14 is arranged on Shockproof gasket 132, and fixing card 131 and Shockproof gasket 132 fasten, and thoroughly
Bright circuit substrate 14 is clipped in the middle, and to realize that transparent circuit substrate 14 is fixed on bottom plate 112, and makes transparent circuit substrate 14 relative
It is hanging in bottom plate 112.Spacing is set between fixture 13, and the distance between two fixtures 13 are preferably 10-50mm, are preferably
10-30mm.When support frame 11 is given a shock, the vibrations of support frame 11 will not be directly passed to transparent circuit substrate 14, shockproof
Pad 132 absorbs the vibration energy of support frame 11, the vibrations of transparent circuit substrate 14 is reduced or eliminate, so as to reduce or disappear
Except influence of the vibrations to the LED chip 15 in transparent circuit substrate 14.Preferably, fixture 13 is exhausted from flexible solid-state
Edge material, more preferably plastic cement.
Also referring to Fig. 5 and Fig. 6, six holes, respectively four the second fixing holes 1322 are opened up on Shockproof gasket 132
With two the second mounting holes 1324.Four the first fixing holes 1122 on four the second fixing holes 1322 and support frame 11 are engaged
To fix Shockproof gasket 132.Shockproof gasket 132 is towards opening up the second storage tank 1326 on the surface of fixing card 131.Fixing card
131 towards opening up the first storage tank 1312 on the surface of Shockproof gasket.First storage tank 1312 and the second storage tank 1326 coordinate
To accommodate transparent circuit substrate 14.Preferably, the section of the first storage tank 1312 and the formed shape of the second storage tank 1326 with thoroughly
The cross sectional shape matching of bright circuit substrate 14.Opened up in fixing card 131 two the first mounting holes 1314 with Shockproof gasket 132
Two the second mounting holes 1324 coordinate, screw in screw etc. and Shockproof gasket 132 be fixedly connected with fixing card 131.It is appreciated that
Fixture 13 can also be that other structures fix transparent circuit substrate 14, and said structure is a preferred embodiment.
Deformed as one kind, when fixture 13 is fixed on transparent circuit substrate 14 on support frame 11, transparent circuit substrate
14 is hanging, and transparent circuit substrate 14 directly contacts with support frame 11, when backlight 10 includes 12 side of reflection layer, transparent electricity
Base board 14 directly contacts with reflection layer 12.
Transparent circuit substrate 14 is using transparent, insulation, preferably resistant to elevated temperatures material, high-boron-silicon glass, as high borosilicate
Glass plate, thereon laying-out.High-boron-silicon glass its have low thermal expansion, high temperature resistant, high intensity, high rigidity, high transmission rate and
The advantages of high chemical stability, and its sputtering for having had, the line arrangement become reconciled can be readily in high-boron-silicon glass
Upper laying-out, its light transmittance are high, do not hinder penetrating for the light that LED chip 15 sends, so that light will not produce substantial amounts of heat,
Reduce the operating temperature of backlight 10.The boron content of high-boron-silicon glass is 12.5%-13.5%, silicon content 78%-80%.
The fixture 13 of transparent circuit substrate 14 is fixed and hanging, the light that LED chip 15 thereon is sent is first passed through transparent circuitry base
Plate 14, then the reflection by air and reflectance coating, make reflecting effect more preferable.It is appreciated that transparent circuit substrate 14 can also adopt
With other opaque circuit substrates.It is appreciated that transparent circuit substrate 14 can use PCB (Printed Circuit Board,
Printed circuit board (PCB)) substitute, and PCB is fixed on bottom plate 112, it can also realize the luminous function of backlight.
LED chip 15 is used as excitation source, and its light sent is exciting light, and transmitting blue light, purple light, feux rouges can be selected in it,
The LED chip 15 of the different color lights such as green glow, ultraviolet light.LED chip 15 is welded on the circuit laid on high-boron-silicon glass, is made
LED chip 15 is realized and electrically conducted.LED chip 15 is in the transparent circuit substrate 14 between fixture 13 at least provided with least one
It is individual.The distance between two LED chips 15 between fixture 13 is 3-20mm, preferably 5-15mm, further excellent 8-12mm.
Distance of the LED chip 15 away from fixture 13 is at least 4mm, only has a small amount of light fixture 13 to hide in the light that LED chip is sent
Keep off and reflect.Preferably, the power of LED chip 15 is 0.2-1W, preferably 0.2w, 0.5w or 1w.It is appreciated that it can also select
Excitation source is used as by the use of other light-emitting devices.
Please continue to refer to Fig. 2, backlight 10 also includes diffusion sheet 16, quantum dot diaphragm 17, brightness enhancement film 18 and heat insulating member
19.Diffusion sheet 16, quantum dot diaphragm 17 and brightness enhancement film 18 are stacked successively parallel to bottom plate 112, and the edge of its three is all fixed on
At notch, notch is closed, wherein diffusion sheet 16 is nearest away from bottom plate 112, and heat insulating member 19 is arranged on diffusion sheet 15 and LED chip
Between 15, and the edge of heat insulating member 19 is arranged on side plate 114, the light that LED chip 15 is sent all is first passed through insulation part
Part 19 could enter diffusion sheet 16, quantum dot diaphragm 17 and brightness enhancement film 18.
Heat insulating member 19 stops the luminous caused heat of LED chip 15, or heat insulating member 19 is quickly heat transfer
To connected side plate 114, side plate 114 further quickly exports heat the outside of backlight 10, so that LED chip 15 is sent out
Heat caused by light can not pass to quantum dot diaphragm 17.The preferably film material of heat insulating member 19, as a thermal isolation film.It is preferred that
Ground, heat insulating member 19 are infrared ray filter coating or graphene film.The shape of heat insulating member 19 and size and support frame 11 are transversal
The shape in face is consistent with size.It is appreciated that neck (figure can be set at 114 positions contacted with heat insulating member 19 on side plate
Do not show), the depth of neck is less than on side plate 114 thickness, and now the size of heat insulating member 19 is more than storage tank in support frame 11
The size of cross section, the edge of heat insulating member 19 are put in neck, so as to which the light that LED chip 15 is sent will not be from heat insulating member
Revealed between 19 and side plate 114.It is appreciated that neck can penetrate the part of side plate 114, heat insulating member 19 and backlight in neck
Air contact outside source 10, further increase the heat conductivility of heat insulating member 19.
Infrared ray filter coating can stop passing through for infrared ray, not stop passing through for visible ray, infrared ray filter coating is to infrared
The filter effect of line reaches more than 70%, it is seen that the translucent effect of light reaches more than 90%.Infrared ray contains heat energy, infrared ray filter
Mating plate reduces infrared radiation to diffusion sheet and quantum dot diaphragm 17, reduces the temperature of quantum dot diaphragm 17 to extend its longevity
Life.
Graphene film is cellular flat film, and it has very good intensity, flexible, conductive, heat conduction, optics special
Property, it can absorb substantial amounts of heat and outwardly transmit, and prevent the luminous caused heat of LED chip 15 from being delivered to quantum dot diaphragm
17, reduce the temperature of quantum dot diaphragm 17.And graphene film is more than or equal to 97% to the transmitance of visible ray, does not influence backlight
The brightness in source.
Diffusion sheet 16 is used to spot light caused by LED chip 15 diffuse into a uniform area source.
The be stimulated effect of exciting light that light source LED chip 15 sends of quantum dot diaphragm 17 produces emission spectrum.Quantum dot
Diaphragm 17 includes the quantum dot of two kinds and above color, under the irradiation of exciting light, emission spectrum is produced, by controlling exciting light
The chromaticity coordinates of the quantum dot of the centre wavelength in source and two or more colors, so that backlight 10 realizes 80%~110% NTSC
Gamut range.In the utility model embodiment, NTSC represents (U.S.) national television system committee, and NSTC gamut ranges are
The summation of color under NTSC standard.
Preferably, quantum dot diaphragm 17 includes red quantum dot, green quantum dot and blue quantum dot.Red quantum dot is
Refer to color corresponding to the emission spectrum of quantum dot as red.Green quantum dot refers to that color is corresponding to the emission spectrum of quantum dot
Green.Blue quantum dot refers to color corresponding to the emission spectrum of quantum dot for blueness.It is appreciated that its allochromatic colour can also be used
As excitation source, such as feux rouges, gold-tinted, green glow etc., the green quantum dot being stimulated sends green glow, is stimulated the LED chip of light
Red quantum dot send green glow, the blue quantum dot being stimulated sends blue light, and quantum dot is stimulated the red, green, blue three sent
White light is formed after kind Colored light mixing.
In other embodiments, quantum dot diaphragm 17 can also be set to include red quantum dot and green quantum dot, and
Selective exitation light source is that blue light excitation source makes backlight 10 produce white light.It is appreciated that three kinds of face of red, green, blue can be selected
The quantum dot of two kinds of colors in color, sent out from the light source for the light for sending a kind of remaining color as excitation source, excitation source
The light that the light and the quantum dot of other two color gone out is sent, include the light of three kinds of colors of red, green, blue, the light mixing of three kinds of colors
Send afterwards and white light.From during the quantum dot of two kinds of colors, being preferably red in the quantum dot of three kinds of colors of red, green, blue
Quantum dot and green quantum dot.
Quantum dot diaphragm 17 can be by red quantum dot, and green quantum dot and blue quantum press ratio mixing, and with encapsulation
Stir after glue mixing, coated between two layers of acrylic film, and be formed by curing through low temperature and pressure；Or quantum dot diaphragm 17 by
Red quantum dot, green quantum dot and blue quantum press ratio mixing, and are stirred after being mixed with packaging plastic, acrylic powder equal
It is even, and be formed by curing through low temperature and pressure.So as to which quantum dot diaphragm 17 forms following structure, quantum dot diaphragm 17 includes being formed two
Quantum layer between transparent film layer, the quantum layer are to include quantum dot and the packaging plastic film that uniformly hot pressing is formed after mixing, i.e.,
Red quantum dot, green quantum dot and blue quantum dot are mixed with quantum layer, transparent film layer is preferably acrylic film layer；Or institute
It is quantum dot to state quantum dot diaphragm 17, and packaging plastic and acrylic powder uniformly mix the film formed after hot pressing, the quantum dot film
Piece 17 is evenly distributed with quantum dot, packaging plastic and acrylic powder.Quantum dot diaphragm 17 can into or it is coiled it is prefabricated form, make
Used time, size as needed are cut.
Brightness enhancement film 18 is used to improve luminous efficiency, and reduces rising angle.
When in use, conductive for LED chip 15 by the circuit laid in transparent circuit substrate 14, LED chip 15 is sent
Light, transparent circuit substrate 14 is transparent, and the light that LED chip 15 is sent can pass through transparent circuit substrate 14, and fixture 13 is away from LED
Farther out, the light that fixture 13 is sent on LED chip 15 blocks influence less to chip 15, so that the heating of LED chip 15 is reduced,
Light is irradiated on reflection layer 12 through transparent circuit substrate 14, and reflection layer 12 reflects back light, and light passes through heat insulating member
19, heat insulating member 19 is filtered to the infrared ray in light, and diffusion sheet 16 is radiated to reduce, quantum dot diaphragm 17 and brightness enhancement film 18
Infrared ray, so as to reduce the temperature of quantum dot diaphragm 17, or heat insulating member 19 leads it towards the heat of the side of LED chip 15
Go out to the external world, so as to reduce the temperature of quantum dot diaphragm 17, light passes through diffusion sheet 16, quantum dot diaphragm 17, brightness enhancement film successively
Projected after 18 from backlight 10, exciting light passes through quantum dot diaphragm 17, and quantum dot diaphragm 17, which is stimulated, produces new light beam.
Referring to Fig. 7, as a kind of deformation, side plate 114 sets a concave step 1142 on the end away from bottom plate 112,
Diffusion sheet 16, quantum dot diaphragm 17 and brightness enhancement film 18 stack parallel to bottom plate 112 successively, and the edge of its three all rides upon spill
On step 1142, and notch is closed, wherein diffusion sheet 16 is nearest away from bottom plate 112.The light that LED chip 15 is sent is from support frame 11
All the light that LED chip 15 is sent is not revealed by diffusion sheet 16, quantum dot diaphragm 17 and brightness enhancement film 18 during injection, carry
The utilization rate of bloom, and ensure that colour temperature, colour gamut and the chromaticity coordinates of the white light that backlight 10 exports reach design objective.
Please continue to refer to Fig. 2, backlight 10 also includes buckling support 118, and buckling support 118 is fastened on support frame 11, fastens
Frame 118 is preferably fixed on diffusion sheet 16, quantum dot diaphragm 17 and brightness enhancement film 18 in the concave step 1242 of support frame 11.
Referring to Fig. 8, the second embodiment as backlight 20 of the present utility model, backlight 20 includes support frame 21,
Reflection layer 22, fixture 23, transparent circuit substrate 24, LED chip 25, packaging plastic 31, quantum dot diaphragm 27 and heat insulating member
29.Support frame 21 includes bottom plate 212 and side plate 214, and side plate 214 is fixed on the edge of bottom plate 212, so as to bottom plate 212 and side plate
214 form a storage tank, and quantum dot diaphragm 27 is placed parallel to bottom plate 212, and the edge of quantum dot diaphragm 27 is set up and is fixed on
End of the side plate 214 away from bottom plate 212, quantum dot diaphragm 27 simultaneously close the notch of storage tank.Reflection layer 22, fixture
23, transparent circuit substrate 24, LED chip 25, packaging plastic 31 and heat insulating member 29 be all located in storage tank, and LED chip 25 is fixed
It is electrically connected with transparent circuit substrate 24 and with transparent circuit substrate 24, transparent circuit substrate 24 is fixed on bottom by fixture 23
On plate 212, reflection layer 22 is arranged between fixture 23 and bottom plate 212, and also fixture 23 is fixed to reflection layer 22
On bottom plate 212, heat insulating member 29 is arranged between quantum dot diaphragm 27 and LED chip 25, and the edge of heat insulating member 29 is set
On side plate 214, the light that sends LED chip 25, which all first passes through heat insulating member 29, could enter quantum dot diaphragm 27, encapsulate
Glue 31 fills the space between the space between heat insulating member 29 and quantum dot diaphragm 27 and heat insulating member 29 and bottom plate 212.
LED chip 25 is electrically conducted by transparent circuit substrate 24 so as to send exciting light, and exciting light is changed into through quantum dot diaphragm 27
White light.It is appreciated that the structure of above-mentioned direct-light-type backlight 10 and deformation are also applied for the structure of the present embodiment, such as fixture 23
Including Shockproof gasket 232 and fixing card 231, Shockproof gasket 232 and fixing card 231 are clipped in the middle transparent circuit substrate 24 and consolidate
It is fixed.Preferably, the LED chip 25 in backlight 20 only has a row in backlight 20, is side so as to the structure of the present embodiment
Light formula backlight 20.
Backlight 20 also includes diffusion sheet 26, brightness enhancement film 28, the reflection layer 222 of light guide plate 32 and second.Quantum dot diaphragm
27 one sides away from bottom plate 212 are that the second reflection layer 222, light guide plate 32, diffusion sheet 26 and brightness enhancement film 28 are successively on exiting surface
Fitting is stacked, and the second reflection layer 222, light guide plate 32, and one end of diffusion sheet 26 and brightness enhancement film 28 is arranged on exiting surface,
Exiting surface covers, and the second reflection layer 222, light guide plate 32, diffusion sheet 26 and brightness enhancement film 28 make exiting surface not light leak.Preferably,
The second reflection layer 222 on exiting surface, light guide plate 32, diffusion sheet 26 are vertical with the place plane of brightness enhancement film 28 and exiting surface.
LED chip 25 electrically conducts send exciting light after, the exciting light that LED chip 25 is sent can be launched in all directions, fixed LED
The transparent circuit substrate 24 of chip 25 is transparent, so as to which transparent circuit substrate 24 will not block the light that LED chip 25 thereon is sent,
And fixture 23 away from LED chip 25 farther out, it is little that the light sent on LED chip 25 blocks influence, so that the hair of LED chip 25
Heat is reduced, and light is irradiated on reflection layer 22 through transparent circuit substrate 24, and reflection layer 22 reflects light, reflected light according to
Secondary to be projected from heat insulating member 29, quantum dot diaphragm 27, so as to be converted to new light beam, new light beam projects from exiting surface, new
Light beam sequentially passes through diffusion sheet 26 and brightness enhancement film 28 after the refraction of light guide plate 32, so as to form a uniform area source, and and
The light of the second reflection layer of directive 222 can be reflected towards diffusion sheet 26 and blast by the second reflection layer 222 that light guide plate 32 is bonded
Film 28, the utilization rate of new light beam is improved, add the brightness of backlight 20.Preferably, side plate 214 away from bottom plate 212 one
End sets concave step 2142, and the thickness D1 of light guide plate 32 is more than the width D 2 of storage tank, so as to be sent from quantum dot diaphragm 27
Light be substantially all after the refraction of light guide plate 32 and sequentially pass through diffusion sheet 26 and brightness enhancement film 28 again, project light from brightness enhancement film 28
It is more uniform.
Light guide plate 32 includes bottom surface and front, and bottom surface and the second reflection layer 222 are bonded, and front and diffusion sheet 26 are bonded.
Light guide plate 32 is provided with light guiding points 322 on bottom surface, it is preferable that the light guiding points 322 close to the side of quantum dot diaphragm 27 are than remote
The light guiding points 322 of the side of quantum dot diaphragm 27 it is big, and close to the side of quantum dot diaphragm 27 light guiding points 322 than away from amount
The density of light guiding points 322 of the side of son point diaphragm 27 is sparse.New light beam from the exiting surface of quantum dot diaphragm 27 project when, light
Density is larger, and during exiting surface away from quantum dot diaphragm 27, the density of light is smaller, because of the light guiding points of close quantum dot diaphragm 27
322 is small and sparse, and the light guiding points 322 away from quantum dot diaphragm 27 are big and intensive, so as to which close quantum dot diaphragm 27 is by light guiding points
The white light of 322 refractions is few, and the white light reflected away from quantum dot diaphragm 27 by light guiding points 322 is more, so as to which light guide plate 32 adds newly
Light beam uniformity, new light beam passes through diffusion sheet 26, makes new light beam more uniform again.
It is applied to the present embodiment on the embodiment of quantum dot film and heat insulating member in first embodiment.
The utility model also provides a kind of display device, and display device employs foregoing backlight 10,20.
Referring to Fig. 9, as 3rd embodiment of the present utility model, the utility model provides a kind of LED lamp bead 40, including
Support 41, PCB42, LED chip 43, packaging plastic 44, quantum dot diaphragm 45, external electrode 46 and heat insulating member 49.In support 41
Sky forms a storage tank, LED chip 43, and PCB42 and heat insulating member 49 are all located in storage tank, and PCB42 is fixed on storage tank bottom
Portion, LED chip 43 are fixed on PCB42 and are electrically connected with PCB42, and quantum dot diaphragm 45 is located at the top of LED chip 43, its side
Going out along the storage tank notch for being fixed on support 41, heat insulating member 49 is arranged between LED chip 43 and quantum dot diaphragm 45, and every
The edge of thermal part 49 is arranged in the side wall of storage tank, and the light for sending LED chip 43 all first passes through heat insulating member 49
Quantum dot diaphragm 45 can be passed through, packaging plastic 44 is filled in storage tank, and packaging plastic 44 is between LED chip 43 and heat insulating member 49
Space embedding, and the space embedding between heat insulating member 49 and quantum dot diaphragm 45, external electrode 46 are fixed on support 41
Outer wall, PCB42 and external electrode 46 are electrically connected with.After LED chip 43 is electrically conducted by PCB42 and external electrode 46, LED
Chip 43 sends exciting light, and exciting light passes through packaging plastic 44, and after heat insulating member 49 and quantum dot diaphragm 45, excitation light becomes
New light beam.
Referring to Fig. 10, support 41 includes bottom plate 412 and side plate 414, side plate 414 is integrally formed at the edge of bottom plate 412,
Bottom plate 412 and side plate 414 surround foregoing storage tank, and end of the side plate 414 away from bottom plate 412 forms the notch, LED chip 43
The light sent projects from notch.Preferably, the shape of bottom plate 412 and the shape of notch are consistent, its can be it is square, it is circular or its
His irregular shape, it is preferably circular.Support 41 uses heatproof, and the opaque material of insulation, preferably poly- terephthalate is to benzene
Diamines, ceramics, or epoxy-plastic packaging material.
Through hole 416 is offered on bottom plate 412, so that necessary element connects with the element in the storage tank of support 41, such as
External electrode 46 and PCB42 are electrically connected with.The quantity of through hole 416 can open up as needed.It is appreciated that through hole 416 can also
It is opened on side plate 414.
Side plate 414 and bottom plate 412 are substantially vertical, and a concave step 418 is set in the one end of side plate 414 away from bottom plate 412,
The edge of quantum dot diaphragm 45 is ridden upon in concave step 418.The step surface width d of concave step 418 is 1-10mm, is preferably
1.5-5mm, so as to which the area for the quantum dot diaphragm 45 placed in concave step 418 is more than the area of accommodating trench bottom, it can make
The light that LED chip 43 on PCB42 is sent completely extends across quantum dot diaphragm 45.The height h of concave step 418 is equal to quantum dot film
The thickness of piece 45, being selected as one kind, the one end of side plate 414 away from bottom plate 412 tilts towards the direction away from LED chip 43, from
And the rising angle of LED lamp bead 40 is bigger.
Preferably, PCB42 is fixed on the center of accommodating trench bottom, is sent so as to the LED chip 43 being fixed on PCB42
Light to surrounding irradiate when, the ratio of light distribution is more uniform.The LED chip 43 fixed on PCB42 in single LEDs lamp bead 40 is at least
For one.Preferably, LED chip 43 fixed on the PCB42 in single LEDs lamp bead 40 one and only one, so as to LED lamp bead
40 small volumes, the use of quantum dot diaphragm 45 is saved, reduce the cost of LED lamp bead 40.
LED chip 43 sends exciting light as excitation source, and blue light, purple light, feux rouges, green glow, ultraviolet leds can be selected in it
Chip 43 etc., preferably blue-light LED chip or purple LED chip.LED chip 43 using formal dress or it is counter fill in the form of fix
Electrically conducted on PCB42 and with PCB42.For packed LED chip 43 when, using die bond processing procedure and beat wire processing procedure LED
Chip 43 is arranged on PCB42, the dispensing such as on PCB42, and LED chip 43 is placed at dispensing, and according to colloid property normal
Temperature solidifies colloid in heating, LED chip 43 is secured firmly on PCB42, and with gold thread, aluminum steel or other wires
LED chip 43 and PCB42 are electrically connected with.When instead to fill LED chip 43, LED chip 43 is arranged on using die bond processing procedure
On PCB42, such as in elargol, the solder joint pole on crystal bonding area and PCB at elargol LED chip 43 on point at PCB42 solder joint
Property it is corresponding place, and melt elargol according to the characteristic of elargol, heating, the crystal bonding area of LED chip 43 is welded with PCB42 solder joints
Connect, LED chip 43 is secured firmly on PCB42.Preferably, LED chip 43 is fixed on PCB42 using anti-dress mode, is not had to
Extra wire is reused, reduces the stop of the light sent to LED chip.The refractive index of LED chip 43 is 2.0-2.8.
Preferably, silica gel of the packaging plastic 44 from refractive index between 1.3-1.7, more preferably refractive index is in 1.4-
Silica gel between 1.54, and the silica gel light transmittance selected is more than or equal to 96%, so as to which luminous efficiency improves.
Heat insulating member 49 stops the luminous caused heat of LED chip 43, or heat insulating member 49 is quickly heat transfer
To connected side plate 414, side plate 414 further quickly exports heat the outside of LED lamp bead 40, so that LED chip 43
Heat caused by luminous can not pass to quantum dot diaphragm 45.The preferably film material of heat insulating member 49, as a thermal isolation film.Every
The shape of thermal part 49 is consistent with size with the shape of the cross section of support 41 with size.It is appreciated that can on side plate 414 with
The position that heat insulating member 49 contacts sets neck (not shown), and the depth of neck is less than the thickness of side plate 414, now heat insulating member
49 size is more than the size with the storage tank cross section of support frame 11, and the edge of heat insulating member 49 is put in neck, so as to LED
The light that chip 43 is sent will not be revealed between heat insulating member 49 and side plate 414.It is appreciated that neck can penetrate side plate 414
It is local, and make the heat insulating member 49 in storage tank and the air contact outside LED lamp bead 40, further increase heat insulating member
49 heat conductivility.Preferably, heat insulating member 49 is infrared ray filter coating or graphene film, selection of itself and first embodiment
Unanimously.
Quantum dot diaphragm 45 is located at the top of heat insulating member 49, and its edge is fixed on end of the side plate 414 away from bottom plate 412 simultaneously
Notch is closed, so as to which the light that LED chip 43 is sent mainly projects from the quantum dot diaphragm 45 at notch, namely quantum dot diaphragm
45 are located at the main light direction of LED chip 43.Preferably, the end in face and side plate 414 of the quantum dot diaphragm 45 away from bottom plate 412
Concordantly, so as to which side plate 414 will not block the light through quantum dot diaphragm 45, the luminous efficiency of LED lamp bead 40 is improved.Quantum dot
The thickness of diaphragm 45 is 2-3mm, and its thinner thickness, the refraction on light is substantially without influence.The selection of quantum dot diaphragm 45 and
The selection of quantum dot diaphragm is consistent in one embodiment.
External electrode 46 includes external positive pole 462 and external negative pole 464.Deformed as one kind, through hole 416 is included mutually solely
Vertical first through hole (figure not depending on) and the second through hole (scheming not regard), the LED chip 43 by the first through hole and it is external just
Pole 462 connects, is electrically connected with by the second through hole and external negative pole 464.External electrode 46 is preferably that material is that resistivity is low
Metal, more preferably copper, aluminium, silver.
Figure 11 is referred to, the refractive index of air is about 1, then the refractive index of LED chip 43 is more than the refractive index of packaging plastic 44,
The refractive index of packaging plastic 44 is more than the refractive index of air, so that when LED chip 43 launches light, what LED chip 43 was sent
Same light is more than the refraction angle B of air inlet in the refraction angle A for entering packaging plastic 44, so as to improve going out for LED lamp bead 40
Angular, make the light irradiation area of LED lamp bead 40 bigger.Preferably, refractive index of the refractive index of LED chip 43 than packaging plastic 44
Big 0.8-1.2, more preferably 1.0-1.2.Preferably, the refractive index of packaging plastic 44 is bigger 0.4-0.6 than the refractive index of air,
More preferably 0.5-0.6.Go out optical range so as to further improve LED lamp bead.
Please continue to refer to Fig. 9, LED lamp bead 40 also includes heat sink 47, and the through hole 416 includes third through-hole, described heat sink
47 third through-holes opened up through bottom plate 412, in the storage tank of heat sink 47 one end connection support 41, heat sink 47 other end it is exposed
Outside, so as to the heat derives in support 41, reducing PCB42 in the storage tank of support 41, LED chip 43, the He of packaging plastic 44
The temperature of quantum dot diaphragm 45.Preferably, heat sink 47 in the support 41 and PCB42 contacts, PCB42 heat derives more
It hurry up, further improve the cooling rate of LED chip 43, make the working condition of LED chip 43 more preferable, and extend quantum dot diaphragm 45
Life-span.
It is appreciated that heat sink 47 can also pass through the through hole 416 opened up on side plate 414.It is appreciated that heat sink 47 can have
More than one, can further speed up radiating.
Figure 12 is referred to, is deformed as one kind, one heat sink 47 is connected with external positive pole 162 or external negative pole 164, so as to enter
One step accelerates heat sink 47 heat conduction and radiating.It is appreciated that when having two heat sink 47, one of them and external positive pole 162 connect,
Wherein another and external negative pole 164 connects.
Figure 13 is referred to, is deformed as one kind, LED lamp bead 40 also includes reflection layer 48, and reflection layer 48 is arranged at appearance
Put on the inwall of groove, and between support 41 and PCB42, so as to the illumination that the LED chip 43 on PCB42 is sent, to be mapped to light anti-
When penetrating layer 48, reflection layer 48 reflects light, and light can only project at quantum dot diaphragm 45, so as to improve LED lamp bead 40
Brightness.
Figure 14 is referred to, the utility model also provides a kind of LED light source, and the LED light source employs above-mentioned LED lamp bead
40.LED light source includes LED lamp bead 40, support frame 51, diffusion sheet 52 and brightness enhancement film 53.The hollow formation of support frame as described above 51 includes
Second storage tank of one second notch 511, the LED lamp bead 40 are arranged at bottom and the fixation of the second storage tank, the diffusion
Piece 52 and brightness enhancement film 53 are stacked successively, and the edge of both is all fixed at the second notch 511, and remote positioned at support frame 51
One end of LED lamp bead 40, diffusion sheet 52 and brightness enhancement film 53 close the second notch 511, diffusion sheet 52 than brightness enhancement film 53 closer to
LED lamp bead 40.LED lamp bead 40 sends white light, uniform area source is formed after diffusion sheet 52, then by brightness enhancement film 53, make hair
Light effect further enhances.
Preferably, using face of the brightness enhancement film 53 away from LED lamp bead 40 as exiting surface, light and exiting surface that LED lamp bead 40 is sent
Minimum angles be that the distance between A, LED lamp bead 40 is D1, the distance of LED lamp bead 40 and the bottom edge of support frame 51 is
D2, distance of the LED lamp bead 40 away from exiting surface are H, then
D1≤2HcotA,
D2≤HcotA,
Partially overlapped so as to which the light sent between LED lamp bead 40 has, make LED light source illumination effect more preferable, coincidence distance
For D3, it is preferable that 0mm≤D3≤10mm.It is appreciated that the LED lamp bead 40 in LED light source can be a row or multi-row, can use
In straight-down negative LED light source and side-light type LED light source etc..
Compared with prior art, in backlight of the present utility model, heat insulating member is arranged on excitation source and quantum dot film
Between the piece and edge of heat insulating member contacts with the side wall of storage tank, and the light that the excitation source is sent first passes through heat insulating member,
Projected again after quantum dot diaphragm from backlight, heat insulating member stops the luminous caused heat of excitation source, or heat-insulated
Part quickly quickly exports heat the outside of backlight, so that heat caused by excitation source is luminous can not pass to quantum dot
Diaphragm, solve the technical problem of quantum dot diaphragm heat short life, extend the life-span of quantum dot diaphragm, further increase
In the life-span of backlight, improve the promoted extension of the backlight using quantum dot diaphragm.
The position of side wall and the heat insulating member contact of storage tank of the present utility model sets neck, and the edge of heat insulating member is stretched
Enter in neck, excitation source and quantum dot diaphragm isolate more thoroughly, heat insulating member heat-insulated or heat derives are carried on the back
The effect of light source is more preferable, further increases the life-span of quantum dot diaphragm, improves the life-span of backlight；Or the utility model
Neck penetrate the part of side plate, the heat insulating member in neck and the air contact outside the backlight, heat insulating member is warm
The effect of amount export backlight is more preferable, directly outside heat derives to backlight, further increases the longevity of quantum dot diaphragm
Life, improve the life-span of backlight.
The transparent circuit substrate is fixed on accommodating trench bottom and makes transparent circuit substrate by fixture of the present utility model
It is hanging relative to accommodating trench bottom, the light that excitation source is sent preferably is passed through transparent circuit substrate, excitation source is not
Stopped by transparent circuit substrate, further reduce the heating of excitation source, improve the life-span of quantum dot diaphragm, improve the back of the body
The life-span of light source.
Backlight of the present utility model also includes reflection layer, and reflection layer is arranged on bottom plate and positioned at bottom plate and transparent
Between circuit substrate and/or reflection layer is arranged on side plate, and the light that reflecting layer reflected excitation light source is sent makes it from quantum dot
Diaphragm passes through, and improves the utilization rate of exciting light, improves the brightness of backlight.
Backlight of the present utility model also includes diffusion sheet and brightness enhancement film, the diffusion sheet, quantum dot diaphragm, and brightness enhancement film is put down
Row stacks successively in bottom plate, and its three edge is all fixed on the one end of side plate away from bottom plate, the notch is closed, the diffusion
Pitch of fins excitation source is closest, and spot light caused by excitation source is diffused into a uniform area source, blast by diffusion sheet
Film improves luminous efficiency, reduces rising angle.
Backlight of the present utility model also includes light guide plate, diffusion sheet, brightness enhancement film and the second reflection layer, the quantum dot
One side of the diaphragm away from bottom plate is exiting surface, second reflection layer, light guide plate, and diffusion sheet and brightness enhancement film are bonded folded successively
Put, and the second reflection layer, light guide plate, one end of diffusion sheet and brightness enhancement film is arranged on exiting surface, exiting surface is covered, backlight
The light that source is sent is uniform and brightness is high.
In LED light source of the present utility model, heat insulating member is arranged between LED chip and quantum dot diaphragm and heat insulating member
Edge be arranged in the side wall of storage tank, the light that the excitation source is sent first passes through heat insulating member, then by quantum dot film
Projected after piece from backlight, the luminous caused heat of heat insulating member stop LED chip, or heat insulating member are quickly fast heat
The outside of speed export LED lamp bead, so that heat caused by LED chip is luminous can not pass to quantum dot diaphragm, solves quantum
The technical problem of point diaphragm heat short life, the life-span of quantum dot diaphragm is extended, further increase the LED of LED light source
In the life-span of pearl, improve the promoted extension of the LED lamp bead of LED light source using quantum dot diaphragm.
LED light source of the present utility model is described heat sink in third through-hole also including heat sink, and described heat sink one end connects
The inside of logical LED support, the other end is exposed outside, and heat sink and external positive pole or external cathode contact, the heat sink reduction being exceedingly fast
The temperature of electrode, the temperature for reducing LED chip is further speeded up, the LED chip is maintained at a good state, reduced
The temperature of LED lamp bead, the temperature of quantum dot diaphragm is reduced, the life-span of quantum dot diaphragm is extended, further increases LED lamp bead
Life-span, improve the promoted extension of the LED lamp bead using quantum dot diaphragm.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Any modification made within the principle of utility model, equivalent substitution and improvement etc. all should include the scope of protection of the utility model
Within.
Claims (10)
- A kind of 1. backlight, it is characterised in that：The backlight includes support frame, PCB, excitation source, quantum dot diaphragm and heat-insulated Part, support frame as described above include bottom plate and side plate, and the bottom plate is arranged on side plate edge and surrounds a storage tank, the PCB, excites Light source and heat insulating member are arranged in storage tank, and PCB is fixed on accommodating trench bottom, the excitation source be fixed on PCB and and PCB is electrically connected with, and the quantum dot diaphragm arrangement is closed at storage tank notch and by the notch, and the heat insulating member is set Between excitation source and quantum dot diaphragm and the edge of the heat insulating member contacts with the side wall of storage tank, the excitation source The light sent first passes through heat insulating member, then is projected after quantum dot diaphragm.
- 2. backlight as claimed in claim 1, it is characterised in that：The position of side plate and the heat insulating member contact sets card Groove, the edge of the heat insulating member are put in neck, and the depth of the neck is less than the thickness of side wall or neck penetrates storage tank The part of side wall.
- 3. backlight as claimed in claim 1, it is characterised in that：The heat insulating member is infrared ray filter coating or graphene Film.
- 4. backlight as claimed in claim 1, it is characterised in that：The PCB is transparent circuit substrate, and the backlight also wraps Fixture is included, the transparent circuit substrate is fixed on accommodating trench bottom and makes transparent circuit substrate relative to appearance by the fixture It is hanging to put trench bottom.
- 5. backlight as claimed in claim 4, it is characterised in that：The backlight also includes reflection layer, the light reflection Layer is arranged on bottom plate and between bottom plate and transparent circuit substrate and/or reflection layer is arranged on side plate.
- 6. backlight as claimed in claim 1, it is characterised in that：The backlight also includes diffusion sheet and brightness enhancement film, described Diffusion sheet, quantum dot diaphragm, brightness enhancement film stack successively parallel to bottom plate, and its three edge is all fixed on side plate away from bottom plate One end, closes the notch, and the diffusion sheet is closest away from excitation source.
- 7. backlight as claimed in claim 1, it is characterised in that：The backlight also includes packaging plastic, and the packaging plastic is filled out Fill in the storage tank, the backlight also includes light guide plate, diffusion sheet, brightness enhancement film and the second reflection layer, the quantum Point one side of the diaphragm away from bottom plate is exiting surface, second reflection layer, light guide plate, and diffusion sheet and brightness enhancement film are bonded folded successively Put, and the second reflection layer, light guide plate, one end of diffusion sheet and brightness enhancement film is arranged on exiting surface, and exiting surface is covered.
- A kind of 8. LED light source, it is characterised in that：The LED light source employs LED lamp bead, and the LED lamp bead includes support, PCB, LED Chip, packaging plastic, quantum dot diaphragm and heat insulating member, the support include bottom plate and side plate, and the bottom plate is arranged on side plate side Along a storage tank is surrounded, the LED chip and PCB are all located in storage tank, and the PCB is fixed on support, the LED chip It is fixed on PCB and is electrically connected with PCB, the quantum dot diaphragm arrangement is closed at storage tank notch and by the notch, The heat insulating member is arranged between LED chip and quantum dot diaphragm and the edge of the heat insulating member is arranged on the side of storage tank On wall, the packaging plastic is filled in storage tank, packaging plastic the space embedding between LED chip and heat insulating member, and every Space embedding between thermal part and quantum dot diaphragm, the light that the LED chip is sent first pass through heat insulating member, then by quantum Projected after point diaphragm.
- 9. LED light source as claimed in claim 8, it is characterised in that：The position of side plate and the heat insulating member contact sets card Groove, the edge of the heat insulating member are put in neck, and the depth of the neck is less than the thickness of side wall or neck penetrates storage tank The part of side wall.
- 10. LED light source as claimed in claim 8, it is characterised in that：The LED lamp bead also includes external positive pole and external negative Pole, the external positive pole and external negative pole are all fixed on support outer wall, and first through hole is at least offered on the support, and second is logical Hole and third through-hole, the LED chip connected by the first through hole with external positive pole, passes through second through hole and external Negative pole is electrically connected with, and the LED lamp bead is described heat sink in third through-hole also including heat sink, and heat sink one end connection The inside of LED support, the other end is exposed outside, and heat sink and external positive pole or external cathode contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720411713.6U CN206989108U (en) | 2017-04-18 | 2017-04-18 | Backlight and LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720411713.6U CN206989108U (en) | 2017-04-18 | 2017-04-18 | Backlight and LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206989108U true CN206989108U (en) | 2018-02-09 |
Family
ID=61392085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720411713.6U Expired - Fee Related CN206989108U (en) | 2017-04-18 | 2017-04-18 | Backlight and LED light source |
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| Country | Link |
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| CN (1) | CN206989108U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598248A (en) * | 2018-06-13 | 2018-09-28 | 广东恒润光电有限公司 | A kind of novel light-emitting diode structure with quantum dot diaphragm |
| CN111077698A (en) * | 2019-12-17 | 2020-04-28 | Tcl华星光电技术有限公司 | Backlight module and liquid crystal display device |
| CN111443524A (en) * | 2020-04-15 | 2020-07-24 | 合肥京东方光电科技有限公司 | Direct type backlight module and display device |
| CN115032807A (en) * | 2022-08-11 | 2022-09-09 | 成都理工大学工程技术学院 | Three-dimensional imaging device and preparation method thereof |
-
2017
- 2017-04-18 CN CN201720411713.6U patent/CN206989108U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598248A (en) * | 2018-06-13 | 2018-09-28 | 广东恒润光电有限公司 | A kind of novel light-emitting diode structure with quantum dot diaphragm |
| CN111077698A (en) * | 2019-12-17 | 2020-04-28 | Tcl华星光电技术有限公司 | Backlight module and liquid crystal display device |
| CN111443524A (en) * | 2020-04-15 | 2020-07-24 | 合肥京东方光电科技有限公司 | Direct type backlight module and display device |
| CN115032807A (en) * | 2022-08-11 | 2022-09-09 | 成都理工大学工程技术学院 | Three-dimensional imaging device and preparation method thereof |
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| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180222 Address after: Wujiang District of Suzhou City, Jiangsu province 215000 Lili town FENHU Road No. 558 Patentee after: Hua Gong Semiconductor Industry Development Co., Ltd. Address before: 516000 Guangdong province Huizhou City Zhongkai high tech area Huihuan Pingnan Management District Ling Bei Hong Fenglin old factory Patentee before: Huizhou Huawei Semiconductor Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180209 Termination date: 20210418 |