CN100466873C - White light LED area lighting source module package method - Google Patents
White light LED area lighting source module package method Download PDFInfo
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- CN100466873C CN100466873C CNB2007101395840A CN200710139584A CN100466873C CN 100466873 C CN100466873 C CN 100466873C CN B2007101395840 A CNB2007101395840 A CN B2007101395840A CN 200710139584 A CN200710139584 A CN 200710139584A CN 100466873 C CN100466873 C CN 100466873C
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Abstract
The invention discloses a packaging method for white light LED surface light source module, which insists of processing steps such as making circuit boards, fixing crystal, bonding, packaging basic bond line and so on. The invention adopts steps: distributing multiparticulate miniwatt LED chips on a circuit board and packaging integrally to form a high power LED light source, dispersing the heat source, reducing heat productivity on a unit area, reducing heat dispersion requirement standard. Adopting white colloid as solid crystal glue can improve more than 70% of back face emergent light utilance. The basic bond line packaging makes microcosmic light source points distribute uniformly on a bigger area, reduce luminous intensity on a unit area. The light flux on a unit area of traditional LED light source is more than 100 lm/cm<2> generally, while light flux on a unit area of the invention is less than 51 lm/cm<2> generally, thereby glaring is overcame.
Description
Technical field
The present invention relates to the method for packing of a kind of LED, especially a kind of method for packing of white light LED area lighting source module.
Background technology
The application potential of led light source in the white-light illuminating field is very huge.The common manufacture method of white light LEDs is that blue-light LED chip is installed in the bowl-type reflection cavity, covers to be mixed with the thin resin layer of the YAG:Ce fluorescent material that can produce gold-tinted, about 200-500nm.The blue light part that led chip sends is absorbed by fluorescent material, the yellow light mix that another part blue light and fluorescent material send, thus obtain white light.
At present, the encapsulation of small-power white light LEDs is based on Φ 3, Φ 5, Φ 10 or straw hat type, Piranha.The encapsulation of large power white light LED is then to be encapsulated in high-power chip individual particles such as 1W, 3W or many particles on ceramic cartridge or the aluminium base shell.This encapsulating structure is simple, is highly suitable for indicator light, the application that flashlight, shot-light, searchlight etc. have emergent light directive property to require.But, field in the white light high-power applications, as being used for the ambient lighting fields such as operating illumination, field lighting and floodlighting of white light, present large power white light LED product exists also that light efficiency is not high enough, heat dissipation problem, dazzle that optical issue, price problem etc. are many to be difficult to commercial difficulty.
The manufacture method of large power white light LED product is formed by chip and can be divided into two classes at present:
A kind of is white light LEDs particle (as Φ 3, Φ 5, Φ 10 or straw hat type etc.) with the small-power Chip Packaging, and many groups of grains lump together, and realizes adding up of power, and tens light sources of forming several watts of little usefulness many are formed tens watts light source product with hundreds of.But because light source is made up of tens even up to a hundred the very high bright spots of light intensity, emission light has high light spot (dazzle point) on microcosmic, if be radiated at the not so good body surface of diffuse reflection performance, will feel many bright spots or even thorn eyespot are arranged, it is unintelligible to cause object to observe, and this phenomenon is particularly evident during the object in the viewing microscope field range during in microscope illumination in the light source applications of using some particle LED to form.The packaged LED lamp of many in addition particles is combined, and the surface configuration complexity is adsorbed dust easily, not easy to clean and influence attractive in appearance.Three, the packaged LED lamp of many particles is combined, and need select the single lamp of LED of characteristic unanimity, has increased the technology difficulty in the production process.Four, luminous efficiency is low.The reflector of aluminum frame is low to the integrated retroreflective efficient of white light, and light loss is bigger.
Another kind method be with single or many high-power LEDs such as 1W, 3W Chip Packaging on the low thermal resistance shell, install large-area fin again additional, so that the high-power chip liberated heat is discharged, reduce the junction temperature of led chip, guarantee the led chip operate as normal.This method for packing is identical with the shortcoming 1 of last a kind of light source, even has more serious glare, must take the secondary optics measure during as the light source that closely uses.Thermal source concentrates on very little area, and heating power is bigger again, therefore needs extraordinary heat passage of design and bigger cooling surface area.Be exactly the problem that exists optical efficiency low equally in addition.
At the problem of dazzle, adopt following two kinds of methods to solve usually:
The one, on light source, add lid layer mixed light sheet (as transparent panel of frosted glass, anisotropic acrylic board, change light emission angle etc.) and dazzle point intensity is reduced and emergent ray is dispersed more, the drawback that this method is brought is the total light flux that has reduced emergent light.And structure becomes complicated, and it is complicated that volume becomes, and cost has increase in various degree.
The 2nd, light source irradiation is come out light emission by reflector on reflector again, form diffuse reflection on the reflector surface, emergent ray is dispersed more, this method also has the drawback of the total light flux that has reduced emergent light, and because considered secondary reflection, also can more complicated on the structural design.
In a word, in the field of white light high-power applications, present led light source product also exists heat radiation cost height, radiator structure complexity, luminous efficiency is low, glare problem is serious, the complex structure of change dazzle and influence problem such as luminous efficiency.
Summary of the invention
The technical issues that need to address of the present invention provide a kind of method for packing of large power white light LED modular surface light source, it makes simple, solve the heat dissipation problem that above-mentioned large power white light LED light source product exists at low cost, overcome dazzle, improved luminous efficiency.
The technical solution used in the present invention is: a kind of method for packing of white light LED area lighting source module, and it is made up of following processing step:
(1) makes wiring board, light-emitting area according to the power calculation permission, require to select supporting chip emission peak wavelength, light intensity and fluorescent material excitation wavelength range according to colour temperature, calculate required led chip quantity according to power requirement, input voltage as requested designs the series and parallel line construction then, according to the principle of the uniform dispersion of chip, make the wiring board of satisfactory series and parallel structure again, the PCB surface pad is gone up white welding resistance outward;
(2) solid brilliant, adopt white or transparent adhesive tape as crystal-bonding adhesive, in the chip back uniform gluing, on solid brilliant platform with chip attach pad correspondence position in the circuit board, put it into the interior 150 ℃ of bakings of baking box 1 hour then, crystal-bonding adhesive solidifies, and chip is securely fixed on the wiring board;
(3) bonding wire is going between on chip electrode and wiring board counter electrode bonding on the bonding platform, finishes circuit and connects;
(4) encapsulate basic glue-line, be fixed on the frame detecting qualified wiring board, frame and wiring board form a cavity, pour into transparent adhesive tape in cavity, leave standstill 3-5 hour, treat its curing, lay the phosphor gel layer then on substratum transparent.
Wiring board described in the present invention adopts copper-clad plate, and bond pad surface is gold-plated.Adopt aluminium base can reduce the system works temperature, but cost can increase.Bond pad surface nickel plating or naked copper, aluminium also can, preferential select to be difficult for to get rusty, be easy to bonding, material that reflecting rate is high.Frame adopts white PVC or other material, the preferential material of selecting to meet following condition: enough intensity, fire-retardant, heatproof-60 ℃～100 ℃, anti-aging, good heat conductivity are arranged, be easy to processing and be connected.The medial surface color is preferentially selected white for use.Medial surface participates in the repeatedly reflection of various wave band light in the light source module, and its reflective function can influence the emission light luminous flux of mixed light effect and whole light source module.The white crystal-bonding adhesive is selected white high temperature ink for use, and transparent crystal-bonding adhesive is selected transparent epoxy resin for use, certainly also can select other whites for use or transparent high temperature resistantly the glue of cohesive force be arranged as crystal-bonding adhesive; The transparent adhesive tape that encapsulates in the basic glue-line can be selected organic silica gel or epoxy resin for use; Phosphor gel is that epoxy resin and fluorescent material 100:1-100:5 ratio allotment by weight percentage form.Phosphor gel can also be that organic silica gel and fluorescent material 100:1-100:5 ratio allotment by weight percentage form, and re-lays one deck epoxy resin or clear glass or transparent acrylic then on the fluorescent material glue-line.
Compared with prior art, the present invention has obtained following beneficial effect:
1, the present invention adopts many particles low-power LED chip dispersed and distributed in the circuit board, and overall package forms high-power LED light source together, makes the thermal source dispersed and distributed, has reduced the caloric value on the unit are, and the radiating requirements standard is reduced.Small-power chip caloric value is low, can cover the copper layer by wiring board fast calorie spread is arrived whole PCB surface, realizes heat radiation by the PCB surface than the big hundred times of chip area, can reduce the working temperature of system effectively.General temperature can be controlled at below 50 ℃.Directly with the LED encapsulation in the circuit board, wiring board has avoided increasing extra heat radiation cost as thermal dissipating path to light source module of the present invention.Compare with the high power light source of the single lamp combination of LED, the bonding of led chip on support is connected with in the circuit board connection in series-parallel has been merged into an operation, reduced production technology, reduced production cost.With the high-power chip led light source relatively, also because the chip price cost is low and saved the shell of encapsulation usefulness, and bring more significant cost to reduce.
2, the present invention adopts white colloid as crystal-bonding adhesive, use transparent substrates led chip (as present Sapphire Substrate chip), the light that chip back sends emits expeditiously by white crystal-bonding adhesive, and the solid brilliant conducting resinl (grey) that adopts of traditional LED, the back side emergent light of chip is almost all absorbed, experimental results show that with the solid crystalline substance of method of the present invention and can improve the utilance of back side emergent light more than 70%.In addition, outside the wiring board surface pads on white welding resistance, and the medial surface that makes the light source block frame is white, all can decrease for the absorption loss water of light reflex time in the system.When on the white welding resistance that chip is fixed on wiring board, crystal-bonding adhesive also can adopt transparent colloid, utilizes white welding resistance that the back side emergent light of chip is emitted.
3, the encapsulation of the basic glue-line of the present invention makes the bigger distance of maintenance between phosphor powder layer and the chip, the middle transparent adhesive tape of filling, the thickness of substratum transparent is generally more than 4mm, and the light that chip is sent can be dispersed in before arriving the fluorescent material glue-line on the area than the big hundreds of times of chip list area.Fluorescent material is dispersed on the light source surface than the big hundred times of chip area, and the phosphor gel proportioning is generally 100:1～100:5 (percentage by weight of transparent adhesive tape and fluorescent material), than low tens times of the concentration of conventional white light LED phosphor gel.The thickness of fluorescent material glue-line generally is controlled at below the 2mm.And traditional LED encapsulation phosphor gel surface layer only is tens times to tens times of the chip list area.Therefore make the light source point on the microcosmic be evenly distributed on the bigger area, reduced the luminous intensity on the unit are.Tradition led light source unit are luminous flux is generally at 1001m/cm
2More than, and light source unit are luminous flux of the present invention is generally less than 51m/cm
2, therefore can overcome dazzle.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 does not encapsulate the structural representation of basic glue-line for the present invention;
Fig. 3 is circuit board structure schematic diagram among the present invention;
Fig. 4 is a chips fixed structure schematic diagram of the present invention.
Embodiment
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
At first select chip and fluorescent material and design and produce wiring board.Present embodiment adopts 460-465nm wave band blue chip, the chip method linear light is by force 160-180mcd, and voltage range is 3.0-3.5V, and chip size is 14 * 14mil, employing can be by 460-465nm light excited fluorescent powder, such as the grand TMT-00432-6065 fluorescent material in Taiwan.Present embodiment is according to power 1W, and wiring board is produced in the requirement of voltage 12V design.Adopt the circuit structure of four groups of series connection, every group of 8 chip parallel connections as shown in Figure 3,8 for wiring board covers the copper layer among the figure, and 9 is board substrate, and 10 is pad.Wiring board adopts half glass copper-clad plate in the present embodiment, and pad 10 is gold-plated, and pad is gone up white welding resistance outward.
Then as shown in Figure 4, as crystal-bonding adhesive 7 led chip is fixed on wiring board with white high temperature ink and covers on the copper layer 8, go between 4 on the bonding, finish circuit and connect.
As shown in Figure 1 and Figure 2, above-mentioned wiring board is fixed on the frame 1, and frame 1 adopts the fire-retardant engineering material of white PVC, and perfusion thickness is the organic silica gel 5 of 4.5mm in the cavity of frame 1 and wiring board 2 formation, lay phosphor gel 6 on the organic silica gel 5, the thickness of fluorescent material glue-line is 1.5mm.Phosphor gel is that epoxy resin and the fluorescent material ratio allotment of 100:4 by weight percentage form.Certainly, phosphor gel also can adopt the allotment of organic silica gel and fluorescent material to form, and re-lays one deck epoxy resin then in the above or pastes materials such as clear glass, transparent acrylic.
When powering up work, chip 3 sends blue light, and most of blue light is transmitted directly to the fluorescent material glue-line by substratum transparent, and another part blue light via line plate or frame reflection back arrive the fluorescent material glue-line.The small part blue light is in fluorescent material glue-line reflection or directly pass and emit, and most of blue light is absorbed by fluorescent material and inspires green glow, gold-tinted or ruddiness.The light that inspires part again directly shines outside the light source block, and part directive light source block is inner to shine outside the light source block again through reflection and refraction.So the light that this light source block sends is that to point to the phosphor powder layer be any direction at center.
The input power of present embodiment light source block is 1W, and light-emitting area reaches 21cm
2, as calculate the about 3.31m/cm of unit are luminous flux with luminous efficiency 701m/W
2, so the soft free from glare of light.The input power of light source block is 1W, and area of dissipation reaches 25cm
2, measurement result is when ambient temperature is 25 ℃ in actual the use, the light source block surface temperature can be stabilized in below 40 ℃.
Claims (5)
1, a kind of method for packing of white light LED area lighting source module is characterized in that it is made up of following processing step:
(1) make wiring board, select satisfactory chip, according to the principle of the uniform dispersion of chip, with many particles low-power LED chip distribution in the circuit board, the PCB surface pad is gone up white welding resistance outward;
(2) solid brilliant, adopt white or transparent adhesive tape as crystal-bonding adhesive, in the chip back uniform gluing, on solid brilliant platform with chip attach pad correspondence position in the circuit board, put it into the interior 150 ℃ of bakings of baking box 1 hour then, crystal-bonding adhesive solidifies, and chip is securely fixed on the wiring board;
(3) bonding wire is going between on chip electrode and wiring board counter electrode bonding on the bonding platform, finishes circuit and connects;
(4) encapsulate basic glue-line, be fixed on the frame detecting qualified wiring board, frame and wiring board form a cavity, pour into transparent adhesive tape in cavity, leave standstill 3-5 hour, treat its curing, lay the phosphor gel layer then on substratum transparent.
2, the method for packing of LED modular surface light source according to claim 1 is characterized in that: described wiring board adopts copper-clad plate, and bond pad surface is gold-plated.
3, the method for packing of LED modular surface light source according to claim 1, it is characterized in that: frame and wiring board described in the step (4) form the cavity of a dark 6-20mm, in cavity, pour into transparent adhesive tape, the thickness of substratum transparent is not less than 4mm, and the thickness of described fluorescent material glue-line is not more than 2mm.
4, the method for packing of white light LED area lighting source module according to claim 1 is characterized in that: described phosphor gel is that epoxy resin and fluorescent material 100:1-100:5 ratio allotment by weight percentage form.
5, the method for packing of white light LED area lighting source module according to claim 1, it is characterized in that: described phosphor gel is that organic silica gel and fluorescent material 100:1-100:5 ratio allotment by weight percentage form, and establishes one deck epoxy resin or clear glass or transparent acrylic then on fluorescent material glue-line upper berth.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2007101395840A CN100466873C (en) | 2007-10-19 | 2007-10-19 | White light LED area lighting source module package method |
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|---|---|---|---|
| CNB2007101395840A CN100466873C (en) | 2007-10-19 | 2007-10-19 | White light LED area lighting source module package method |
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| CN100466873C true CN100466873C (en) | 2009-03-04 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546801B (en) * | 2009-03-24 | 2011-03-16 | 深圳雷曼光电科技股份有限公司 | High-power LED packaging method |
| CN101799124A (en) * | 2010-02-02 | 2010-08-11 | 福建中科万邦光电股份有限公司 | Novel LED lamp tube module group |
| CN101859759A (en) * | 2010-06-03 | 2010-10-13 | 陕西科技大学 | White LED light source package |
| CN102345814A (en) * | 2010-07-29 | 2012-02-08 | 宏齐科技股份有限公司 | Simple detachable illuminating structure and illuminating light tube |
| CN102064240B (en) * | 2010-09-30 | 2016-01-27 | 福建省万邦光电科技有限公司 | The packaging technology of white light LED light source module |
| CN104948938B (en) * | 2014-03-27 | 2017-05-03 | 四川新力光源股份有限公司 | LED lamp, optical engine and optical engine manufacturing method thereof |
| CN105322075A (en) * | 2015-11-02 | 2016-02-10 | 江苏稳润光电有限公司 | Substrate, packaging structure and packaging method for novel tunable light source |
| CN106252338A (en) * | 2016-09-26 | 2016-12-21 | 江苏稳润光电有限公司 | A kind of method for packing of high heat conduction MCOB |
| CN113451335B (en) * | 2021-06-30 | 2022-09-23 | 厦门天马微电子有限公司 | Array substrate, preparation method thereof, display panel and display device |
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| CN2572501Y (en) * | 2002-09-29 | 2003-09-10 | 王国忠 | No reflection chamber LED dot matrix display |
| CN2664200Y (en) * | 2003-10-28 | 2004-12-15 | 夏志清 | A LED dot-matrix module having highly effective reflection hole |
| CN200961839Y (en) * | 2006-09-21 | 2007-10-17 | 赖金鸿 | LED lumination module |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2572501Y (en) * | 2002-09-29 | 2003-09-10 | 王国忠 | No reflection chamber LED dot matrix display |
| CN2664200Y (en) * | 2003-10-28 | 2004-12-15 | 夏志清 | A LED dot-matrix module having highly effective reflection hole |
| CN200961839Y (en) * | 2006-09-21 | 2007-10-17 | 赖金鸿 | LED lumination module |
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| CN101137255A (en) | 2008-03-05 |
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Denomination of invention: White light LED area lighting source module package method Effective date of registration: 20191120 Granted publication date: 20090304 Pledgee: Hebei re Guarantee Co.,Ltd. Pledgor: SHENTONG PHOTOELECTRICITY SCIENCE AND TECHNOLOGY CO.,LTD. Registration number: Y2019130000010 |
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Date of cancellation: 20201224 Granted publication date: 20090304 Pledgee: Hebei re Guarantee Co.,Ltd. Pledgor: SHENTONG PHOTOELECTRICITY SCIENCE AND TECHNOLOGY Co.,Ltd. Registration number: Y2019130000010 |
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Denomination of invention: Packaging Method for White LED Surface Light Source Module Effective date of registration: 20230907 Granted publication date: 20090304 Pledgee: China CITIC Bank Co.,Ltd. Shijiazhuang Branch Pledgor: SHENTONG PHOTOELECTRICITY SCIENCE AND TECHNOLOGY CO.,LTD. Registration number: Y2023980055913 |
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