CN206805325U - Thermoregulator and the container with thermoregulator - Google Patents

Abstract

The utility model discloses a kind of thermoregulator, including PTC calandrias, the PTC calandrias include the first heating surface and the second heating surface, also include heat carrier, heat carrier includes the first thermal conductive surface and the second thermal conductive surface, first heating surface is fitted on the first thermal conductive surface, and second heating surface and the second thermal conductive surface branch are used to be bonded heating object.The invention also discloses a kind of container with thermoregulator.Thermoregulator of the present utility model can be realized to be maximally utilized to heat caused by PTC calandrias；Simultaneously because temperature and PTC resistance that PTC calandrias can reach are corresponding, need to reach that how many temperature just configure the PTC of corresponding resistance and apply corresponding voltage, without additionally setting temperature control circuit just to can reach the purpose of constant temperature so that product structure is relatively simple.

Description

Thermoregulator and the container with thermoregulator

Technical field

It the utility model is related to electronics field, more particularly to thermoregulator and the container with thermoregulator.

Background technology

Temperature can be adjusted in several ways for prior art, wherein just including using PTC (thermistor) and half Conductor refrigerating sheet realizes the thermoregulator of temperature adjustment.

Heated using PTC, the one side of calandria made of PTC is usually directly attached to heated by prior art The surface of object, but the temperature of calandria another side will distribute to elsewhere and have lost heat；And use semiconductor refrigeration sheet , it is necessary to additionally set temperature control circuit when being heated, increase the complexity of circuit structure, and will after target temperature is reached Power-off, but after powering off its temperature will rapid drawdown, and after temperature control lower limit is reached again on electrical heating, temperature is difficult to keep, permanent Temp effect is poor；In addition, to the heating function of semiconductor refrigeration sheet is switched into refrigerating function, also need to set a circuit to turn again The energization polarity of semiconductor refrigeration sheet is changed, further increases the complexity of circuit.

Utility model content

Technical problem to be solved in the utility model is：The thermoregulator of high-efficiency heating is provided, and it is a kind of efficient Heating and the container with thermoregulator simple in construction.

In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is：

A kind of thermoregulator, including PTC calandrias, the PTC calandrias include the first heating surface and the second heating surface, Also include heat carrier, heat carrier includes the first thermal conductive surface and the second thermal conductive surface, and first heating surface fits in the first thermal conductive surface On, second heating surface and the second thermal conductive surface are respectively used to be bonded heating object.

Further, the heat carrier also includes heat conduction substrate, and the surface of the heat conduction substrate caves inward to form depression Portion, the sunk surface of the depressed part form first thermal conductive surface, and the heat conduction substrate forms described in the surface not being recessed Second thermal conductive surface, the PTC calandrias are located in groove, and the first heating surface fitting is located at the sunk surface of depressed part, institute It is concordant with the second thermal conductive surface to state the second heating surface.

Further, the PTC calandrias include thermosensitive resistor film, first electrode piece, second electrode piece and thermal shrinkable sleeve, institute State first electrode piece and second electrode piece is respectively arranged on the two sides of thermosensitive resistor film, the thermal shrinkable sleeve parcel first electrode piece, Thermosensitive resistor film and second electrode piece.

Further, the PTC calandrias also include thermally conductive insulating layer, and the thermally conductive insulating layer wraps up the thermal shrinkable sleeve.

Further, the heat carrier is metal heat conducting-body.

In order to solve the above-mentioned technical problem, another technical scheme that the utility model uses for：

A kind of container with thermoregulator, including chamber wall, in addition to semiconductor refrigeration sheet and above-mentioned temperature are adjusted Device is saved, the semiconductor refrigeration sheet is located at side of the heat carrier away from first thermal conductive surface and the second thermal conductive surface, temperature adjustment Device is by second thermal conductive surface and/or second heating surface fitting on the chamber wall.

Further, the chamber wall is provided with insulation material.

Further, in addition to heat abstractor, the semiconductor refrigeration sheet are connected with heat abstractor.

Further, the heat abstractor includes fin and radiator fan, the fin and the conductor refrigeration Piece is connected, and radiator fan is installed on a heat sink.

Further, the container is canister.

The beneficial effects of the utility model are：

In (1) first technical scheme, the first thermal conductive surface for designing heat carrier is used to absorb PTC calandrias away from heating object Heat simultaneously, and the heat is delivered on heating object by the second thermal conductive surface, realize to heat caused by PTC calandrias Maximally utilize；Simultaneously because temperature and PTC resistance that PTC calandrias can reach are corresponding, it is necessary to reach how many Temperature just configures the PTC of corresponding resistance and applies corresponding voltage, sets temperature control circuit just to can reach constant temperature without extra Purpose so that product structure is relatively simple；

In (2) second technical schemes, thermoregulator combination semiconductor refrigeration sheet is applied on container, thermoregulator For being heated to container, semiconductor refrigeration sheet be used for container refrigeration, while realize cold and hot function, with it is existing can realize it is cold and hot The product of function is compared, and temperature control circuit can be saved using PTC calandrias, and the heating utilization rate of this programme is higher, and semiconductor Refrigerating sheet freezes due to being served only for, and current polarity switching circuit is set to make its and can heating that can freeze, production without extra Product overall structure is relatively simple, and reliability is higher.

Brief description of the drawings

Fig. 1 is the structure chart of the thermoregulator of the utility model embodiment.

Fig. 2 is the cross section view of the PTC calandrias of the thermoregulator of the utility model embodiment.

Fig. 3 is that the thermoregulator of the utility model embodiment is arranged on the cross-sectional view on container.

Fig. 4 is the cross-sectional view of the container with thermoregulator of the utility model embodiment.

Label declaration：

100th, thermoregulator；

10th, PTC calandrias；11st, thermosensitive resistor film；12nd, first electrode piece；13rd, second electrode piece；

14th, thermal shrinkable sleeve；15th, thermally conductive insulating layer；

20th, heat carrier；21st, the first thermal conductive surface；22nd, the second thermal conductive surface；23rd, depressed part；

30th, semiconductor refrigeration sheet；

200th, container；210th, insulation material.

Embodiment

For detailed description technology contents of the present utility model, the objects and the effects, below in conjunction with embodiment and match somebody with somebody Accompanying drawing is closed to be explained in detail.

The design of the utility model most critical is：The two-sided caused heat of PTC calandrias is maximized by heat carrier Ground uses, and realizes the simplification of circuit structure using the single function of PTC calandrias and semiconductor refrigeration sheet, improves product Reliability.

Referring to Fig. 1, a kind of thermoregulator 100, including PTC calandrias 10, heat carrier 20, heat carrier 20 include first The thermal conductive surface 22 of thermal conductive surface 21 and second, the PTC calandrias 10 include the first heating surface and the second heating surface, PTC calandrias 10 The first heating surface fit on the first thermal conductive surface 21, the second heating surface of PTC calandrias 10 and the second thermal conductive surface 22 are used respectively In fitting heating object.

It was found from foregoing description, the beneficial effects of the utility model are：

First thermal conductive surface of heat carrier is used to absorb heat of the PTC calandrias away from heating object one side, and by the heat It is delivered to by the second thermal conductive surface on heating object, realizes and heat caused by PTC calandrias is maximally utilized；Simultaneously because The temperature and PTC resistance that PTC calandrias can reach are corresponding, it is necessary to reach that how many temperature just configure corresponding resistance PTC simultaneously applies corresponding voltage, without the extra purpose for setting temperature control circuit just to can reach constant temperature so that product structure compared with To be simple.

Preferably, as shown in figure 3, when heating object is a container, thermoregulator 100 can be located at the bottom of the container Portion, the heating surface of PTC calandrias 10 and the second thermal conductive surface 22 of heat carrier 20 is set to be close to the bottom surface of container；It is of course also possible to By it in the side wall of the container, it can equally play a part of heating container.

It is highly preferred that the container of the embodiment can be a kind of vehicle-mounted cold and hot cup, it can be put into cup and fill the another of beverage The cup of individual any material, by heating of the PTC calandrias to vehicle-mounted cold and hot cup, realizes and cup and beverage therein is added Heat.

It is possible to further which as shown in figure 1, the heat carrier 20 includes heat conduction substrate, the surface of heat conduction substrate concaves Fall into and form depressed part 23, the sunk surface of the depressed part forms first thermal conductive surface 21, and the heat conduction substrate is not in being recessed Surface form second thermal conductive surface 22, the PTC calandrias 10 are located in depressed part 23, the first hair of PTC calandrias 10 Hot face fits in the surface of depressed part 23, the second heating surface of PTC calandrias 10 and surface (i.e. the second thermal conductive surface of heat carrier 20 22) it is concordant.

Seen from the above description, PTC heat carriers are located in depressed part to facilitate and it are positioned, the hair of PTC calandrias The flush of hot face and heat carrier makes it can be applied on the heating object of surfacing.

Certainly, realize optimal heat-conducting effect to be close to the surface of heating object, heat carrier 20 it can also be provided that Match arc-shaped surface, the convex-concave surface on heating object surface etc..Corresponding, the heating surface of PTC calandrias can also be according to reality Situation is made adjustment.

Further, as shown in Fig. 2 the PTC calandrias 10 include thermosensitive resistor film 11, first electrode piece 12, second Electrode slice 13 and thermal shrinkable sleeve 14, first electrode piece 12 and second electrode piece 13 are respectively arranged on the two sides of thermosensitive resistor film 11, structure Into heating surface, thermal shrinkable sleeve 14 wraps up first electrode piece 12, thermosensitive resistor film 11 and second electrode piece 13.

Seen from the above description, two electrode slices are used to allow current to enough pass through thermosensitive resistor film by wire access power supply So as to produce heat, and thermal shrinkable sleeve is used to three being packaged.Thermal shrinkable sleeve typically uses PE materials.

Further, shown in Fig. 2, the PTC calandrias 10 also include thermally conductive insulating layer 15, and thermally conductive insulating layer 15 wraps up institute State thermal shrinkable sleeve 14.

Seen from the above description, thermally conductive insulating layer the parcel of miscellaneous part can be played insulation, heat conduction, moisture-proof, prevent it is different The functions such as thing entrance.

Further, the heat carrier 20 is metal heat conducting-body.

Seen from the above description, metal heat conducting-body heat-conducting effect is preferable, can preferably use copper, aluminium etc..

Referring to Fig. 4, a kind of container 200 with thermoregulator, including chamber wall, semiconductor refrigeration sheet 30 and temperature Adjuster 100, thermoregulator 100 are the thermoregulator 100 described in a upper technical scheme, and the semiconductor refrigeration sheet 30 is set In side of the heat carrier 20 away from the thermal conductive surface 22 of the first thermal conductive surface 21 and second, thermoregulator 100 passes through described second Thermal conductive surface 22 and/or second heating surface fitting are on the chamber wall.

The beneficial effect of the present embodiment is：

Thermoregulator combination semiconductor refrigeration sheet is applied on the container that can realize cold and hot function, thermoregulator For being heated to container, semiconductor refrigeration sheet be used for container refrigeration, compared with the existing product that can realize cold and hot function, adopt Can save temperature control circuit with PTC calandrias, and the heating utilization rate of this programme by contrast is higher, and semiconductor refrigeration sheet due to It is served only for freezing, current polarity switching circuit is set to make its and can heating that can freeze, product overall structure without extra Relatively simple, reliability is higher.

Further, as shown in figure 4, the wall of the container 200 is provided with insulation material 210.

It was found from foregoing description, insulation material can be incubated to container in heating or refrigeration.

Further, in addition to heat abstractor, the semiconductor refrigeration sheet are connected with heat abstractor.

Wherein, the heat abstractor includes fin and radiator fan, and fin is connected with the semiconductor refrigeration sheet, dissipates Hot-air fan is installed on a heat sink.

Seen from the above description, the setting of heat abstractor helps to take away the high temperature in the hot face of semiconductor refrigeration sheet, so as to protect Hinder the low temperature of huyashi-chuuka (cold chinese-style noodles).

Further, the container 200 is canister.

Seen from the above description, the thermal conductivity of canister is preferable, is advantageous to conduction and comes from thermoregulator or semiconductor The high temperature or low temperature of refrigerating sheet.

Fig. 4 is refer to, embodiment one of the present utility model is：

A kind of vehicle-mounted cold and hot cup, including for placing the container 200 of beverage can or cup, the bottom surface of container 200 is provided with temperature Adjuster 100, the bottom surface of thermoregulator 100 are provided with semiconductor refrigeration sheet 30, the side wall and thermoregulator 100 of container 200 and Insulation material 210 is provided with around semiconductor refrigeration sheet 30.

The structure of thermoregulator 100 is as shown in figure 1, the heat carrier 20 including PTC calandrias 10 and aluminum, heat carrier 20 Including heat conduction substrate, friendly depressed part 23 is set on heat conduction substrate, the sunk surface of depressed part 23 is the first thermal conductive surface 21, described to lead Hot basal body is the second thermal conductive surface 22 in the surface not being recessed, and PTC calandrias 10 are located in depressed part 23, PTC calandrias 10 First heating surface fits in the surface of depressed part 23, the second heating surface of PTC calandrias 10 and the surface (i.e. second of heat carrier 20 Thermal conductive surface 22) it is concordant.The heating surface of second thermal conductive surface 22 and PTC calandrias 10 is fitted in the bottom surface of container 200.

The bottom surface (hot face) of semiconductor refrigeration sheet 30 is connected (not shown) with heat abstractor, and heat abstractor includes radiating Piece and radiator fan, fin are connected with semiconductor refrigeration sheet 30, and radiator fan is installed on a heat sink.

In summary, thermoregulator provided by the utility model and container with this thermoregulator can be with more Simple structure realizes efficient heating and refrigeration.

Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every The equivalents made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in the technology neck of correlation Domain, similarly it is included in scope of patent protection of the present utility model.

Claims (10)

1. a kind of thermoregulator, including PTC calandrias, the PTC calandrias include the first heating surface and the second heating surface, its It is characterised by, in addition to heat carrier, heat carrier include the first thermal conductive surface and the second thermal conductive surface, first heating surface fits in On one thermal conductive surface, second heating surface and the second thermal conductive surface are respectively used to be bonded heating object.

2. thermoregulator according to claim 1, it is characterised in that the heat carrier also includes heat conduction substrate, described The surface of heat conduction substrate caves inward to form depressed part, and the sunk surface of the depressed part forms first thermal conductive surface, described Heat conduction substrate forms second thermal conductive surface in the surface not being recessed, and the PTC calandrias are located in groove, first heating Face fitting is located at the sunk surface of depressed part, and second heating surface is concordant with the second thermal conductive surface.

3. thermoregulator according to claim 1, it is characterised in that the PTC calandrias include thermosensitive resistor film, the One electrode slice, second electrode piece and thermal shrinkable sleeve, the first electrode piece and second electrode piece are respectively arranged on the two of thermosensitive resistor film Side, thermal shrinkable sleeve parcel first electrode piece, thermosensitive resistor film and the second electrode piece.

4. thermoregulator according to claim 3, it is characterised in that the PTC calandrias also include thermally conductive insulating layer, The thermally conductive insulating layer wraps up the thermal shrinkable sleeve.

5. thermoregulator according to claim 1, it is characterised in that the heat carrier is metal heat conducting-body.

6. a kind of container with thermoregulator, including chamber wall, it is characterised in that also including semiconductor refrigeration sheet and right It is required that the thermoregulator described in 1~5 any one, the semiconductor refrigeration sheet is located at heat carrier away from first thermal conductive surface With the side of the second thermal conductive surface, thermoregulator is located at institute by second thermal conductive surface and/or second heating surface fitting State on chamber wall.

7. the container according to claim 6 with thermoregulator, it is characterised in that the chamber wall is provided with insulation Material.

8. the container according to claim 6 with thermoregulator, it is characterised in that described also including heat abstractor Semiconductor refrigeration sheet is connected with heat abstractor.

9. the container according to claim 8 with thermoregulator, it is characterised in that the heat abstractor includes radiating Piece and radiator fan, the fin are connected with the semiconductor refrigeration sheet, and radiator fan is installed on a heat sink.

10. the container according to claim 6 with thermoregulator, it is characterised in that the container is canister.