CN206584014U - Burning chip test equipment - Google Patents
Burning chip test equipment Download PDFInfo
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- CN206584014U CN206584014U CN201720058827.7U CN201720058827U CN206584014U CN 206584014 U CN206584014 U CN 206584014U CN 201720058827 U CN201720058827 U CN 201720058827U CN 206584014 U CN206584014 U CN 206584014U
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- load plate
- chip
- probe
- probe card
- burning
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Abstract
A kind of burning chip test equipment, it includes pedestal, load plate, probe card, rack, drive mechanism and host apparatus.Load plate can be stacked on the pallet of carrying chip, and by reversible tray simultaneously and load plate can make multiple chip upside downs on load plate after stacked.Probe card is installed on pedestal, and probe card includes multiple probes.Rack is arranged on pedestal, and rack is to provide correspondence probe card after load plate is placed.Drive mechanism is arranged on pedestal, to traveling probe plate or load plate, so that the pin contact probe for the multiple chips being upside down on load plate.Host apparatus is electrically connected with probe card, during to probe in the pin contact probe plate of chip, multiple chips is tested or data recording.
Description
Technical field
The utility model is related to a kind of burning chip test equipment, and more particularly to one kind can synchronism detection, burning or pre-burning
Test the burning chip test equipment of multiple chips.
Background technology
Visit the development of integrated circuit (Integrated Circuit, IC) technology to be grant so that electronic product volume is increasingly
Miniaturization, not only facilitates people and carries, also provide powerful operation processing function.Chip is in technique, it is necessary to numerous by multiple tracks
Miscellaneous formality, after finished product completes, further needs the routine data of specific function being burnt in chip, so that chip can
To realize specific function.
Current chip is on burning program, and the carrier of burning is once only capable of placing single chip.Although by multiple carrier collection
Merge and use, synchronous many burnings can be achieved, but during due to burning, each chips need to be placed individually on carrier, cost many
Time, a large amount of chips are especially met when burning, will cause the waste of plenty of time cost.
Utility model content
Main purpose of the present utility model, which is to provide, a kind of synchronous burning or can test the burning tests of multiple chips and set
It is standby.
For up to above-mentioned purpose, the utility model provides a kind of burning chip test equipment, to burning or the multiple cores of test
Piece, the plurality of chip is placed on a pallet, and respectively has multiple pins, wherein, the burning chip test equipment includes：
One pedestal；
One load plate, is stacked on the pallet, and by the pallet and the load plate is overturn simultaneously this can be made many after stacked
Individual chip upside down is on the load plate so that each the plurality of pin of the chip dorsad load plate；
One probe card, is arranged on the pedestal, and the probe card includes multiple probes；
One rack, is arranged on the pedestal, to provide the load plate place after to should probe card so that the plurality of connect
Pin is directed at the plurality of probe；
One drive mechanism, is arranged on the pedestal, to the mobile probe card or the load plate, so as to be upside down on the load plate
The plurality of chip each probe of a plurality of pin pin therein contact；And
One host apparatus, is electrically connected with the probe card, and the host apparatus is used to when the pin contacts the respectively probe, right
The plurality of chip is tested or data recording.
Above-mentioned burning chip test equipment, the wherein rack include a sliding track mechanism, the load plate can releasably with
The sliding track mechanism is combined, and by the sliding track mechanism in the rack top offset.
Above-mentioned burning chip test equipment, the wherein drive mechanism are a pneumatic cylinder.
Above-mentioned burning chip test equipment, the quantity of the wherein probe card and the load plate is all multiple, and the respectively load plate
It is placed in after the rack, each corresponds to different probe cards.
Above-mentioned burning test equipment, wherein respectively the load plate is placed in after the rack, the plurality of load plate and the plurality of probe
The interlaced arrangement of plate is in line.
Above-mentioned burning chip test equipment, wherein further including a temperature adjustment casing, the probe card is adjusted positioned at the temperature
Save in casing, the temperature adjustment casing is to provide a test temperature, so that the host apparatus more can respectively should in pin contact
During probe, burn-in testing is carried out to the plurality of chip.
The utility model is described in detail below in conjunction with the drawings and specific embodiments, but not as to the utility model
Restriction.
Brief description of the drawings
The top view of the burning chip test equipment of Fig. 1 the utility model first embodiments；
The rearview of the burning chip test equipment of Fig. 2 the utility model first embodiments；
Fig. 3 A represent that the pallet for loading chip is placed on the schematic diagram of instrument；
Fig. 3 B represent the schematic diagram being stacked to load plate on pallet；
Fig. 3 C are represented while overturning the schematic diagram of load plate and pallet；
Fig. 3 D represent chip upside down in the schematic diagram on load plate；
The front view of the burning chip test equipment of Fig. 4 the utility model first embodiments；
The side view of the burning chip test equipment of Fig. 5 the utility model first embodiments；
Fig. 6 represents the enlarged diagram of part A shown in Fig. 5；
The schematic diagram of another embodiment of drive mechanism of Fig. 7 burning chip test equipments of the present utility model, represents to drive
Signal before motivation structure movement load plate；
The schematic diagram of another embodiment of drive mechanism of Fig. 8 burning chip test equipments of the present utility model, represents to drive
Signal after motivation structure movement load plate；
The front view of the burning chip test equipment of Fig. 9 the utility model second embodiments；
The front view of the burning chip test equipment of Figure 10 the utility model 3rd embodiments；
The step flow chart of Figure 11 burning chip method of testings of the present utility model.
Wherein, reference
The pedestal 10 of burning chip test equipment 1
The probe card 30 of load plate 20
The rack 40 of probe 31
The drive mechanism 50 of sliding track mechanism 41
The first end 511 of handlebar stem 51
The trace 53 of second end 513
The guide rail R of actuator 55
The controller 61 of host apparatus 60
The control device 70 of memory body 62
The pin 91 of chip 90
Pallet T instruments F
Aligning structure A transmission lines L
Embodiment
For technology contents of the present utility model can be known more about, it is described as follows especially exemplified by preferred embodiment.
Below please also refer to Fig. 1 to Fig. 9.The wherein burning chip test equipment of Fig. 1 the utility model first embodiment
Top view；The rearview of the burning chip test equipment of Fig. 2 the utility model first embodiments；Fig. 3 A represent to load chip
Pallet is placed on the schematic diagram of instrument；Fig. 3 B represent the schematic diagram being stacked to load plate on pallet；Fig. 3 C represent to carry while overturning
The schematic diagram of disk and pallet；Fig. 3 D represent chip upside down in the schematic diagram on load plate；The core of Fig. 4 the utility model first embodiments
The front view of piece burning test equipment；The side view of the burning chip test equipment of Fig. 5 the utility model first embodiments；Fig. 6
Represent the enlarged diagram of part A shown in Fig. 5；Another reality of drive mechanism of Fig. 7 burning chip test equipments of the present utility model
The schematic diagram of mode is applied, the signal before drive mechanism movement load plate is represented；Fig. 8 burning chip test equipments of the present utility model
The schematic diagram of another embodiment of drive mechanism, represents the signal after drive mechanism movement load plate.
As shown in Figures 1 and 2, in first embodiment of the present utility model, burning chip test of the present utility model is set
Standby 1 can be used to while multiple chips 90 are tested with (testing) or data recording (programming), wherein each chip
90 have multiple pins 91.In first embodiment of the present utility model, burning chip test equipment 1 includes pedestal 10, load
Disk 20, probe card 30, rack 40, drive mechanism 50, host apparatus 60 and control device 70.
As shown in Fig. 1 and Fig. 3 A-D, in first embodiment of the present utility model, multiple chips 90 can be first by each self-retaining
Ground is positioned in pallet T groove (the non-label of figure), still further, and pallet T herein is commonly used for carrying core to be existing
The pallet (tray) of piece 90, will not be damaged for protection chip 90 in transport process.In embodiment of the present utility model, carrying
The pallet T of multiple chips 90 can be by fixed placement in (as shown in Figure 3A), then, load plate 20 can be stacked and placed on a special instrument F
On pallet T (as shown in Figure 3 B), and by the aligning structure A on special instrument F so that towards pallet T's when load plate 20 is stacked
Multiple storage tank (not shown) can one by one just to pallet T groove, and each chip 90 is contained in storage tank and the common shape of groove
Into space in.Finally, after after being stacked and placed on load plate 20 on pallet T, by reversible tray T simultaneously and load plate 20 about 108
Ten degree (as shown in Figure 3 C), multiple chips 90 just can be upside down in each storage tank of load plate 20 so that each the multiple of chip 90 connect
Dorsad load plate 20 of pin 91.After upset, pallet T is removed from load plate 20, just the pin 91 of visible each chip 90 is exposed upward
(such as Fig. 3 D).
As shown in Fig. 1, Fig. 4 and Fig. 5, in first embodiment of the present utility model, probe card 30 is arranged at pedestal 10
On, pedestal 10 herein can for desktop or other be available for fixed object, include ground.Probe card 30 includes multiple probes
31, probe 31 is as made by metallic conductor.
As shown in Figures 1 and 2, in first embodiment of the present utility model, rack 40 is arranged on pedestal 10, is placed
Frame 40 with for load plate 20 it is placed thereon.Rack 40 is provided with a sliding track mechanism 41, two sides of load plate 20 removably with
Sliding track mechanism 41 is combined so that load plate 20 can be moved after being positioned on rack 40 by sliding track mechanism 41.When chip 90
From dislocation in pallet T and it is placed upside down in after load plate 20, load plate 20 can be then placed on rack 40 by user, and by slide rail
Mechanism 41 makes the load plate 20 be moved to the position (arrow F1 directions as shown in Figure 4) just to probe card 30, even if load plate 20
Correspondence probe card 30.
In first embodiment of the present utility model, drive mechanism 50 is on pedestal 10.As shown in Figures 4 and 5.Work as load
Disk 20 is moved into a job position and during just to probe card 30, it also simultaneously can be just right with drive mechanism 50, that is, now carries
Disk 20 is located between probe card 30 and drive mechanism 50.Then, user can control drive mechanism 50 and be moved towards probe card 30, with
Load plate 20 is set to move (arrow F2 directions as shown in Figure 5) towards probe card 30 under the passage of drive mechanism 50, so as to be placed in
The contact probe 31 of pin 91 of chip 90 on load plate 20.In specific embodiment of the utility model, drive mechanism 50 is gas
Cylinder pressure, but the utility model is not limited, other, which have, makes that object is lifted or the device or equipment of in-plane displancement can act also as
Drive mechanism 50 of the present utility model, such as hydraulic elevator or linkage.As shown in fig. 7, it is represented with linkage
It is used as the embodiment schematic diagram of drive mechanism 50.In specific implementation, drive mechanism 50 can include handlebar stem 51, trace 53
And actuator 55.Handlebar stem 51 has the end 513 of first end 511 and second, wherein the second end 513 is provided with two perforation；Handlebar stem
51 wear wherein one perforation by locking part (such as screw) and are rotatably fixed on pedestal 10.One end of trace 53
Connect actuator 55, the other end of trace 53 then wears another perforation by locking part and connects the second end of handlebar stem 521
513.Actuator 55 with trace 53 in addition to being connected, and combination is arranged in guide rail R.As shown in Figures 7 and 8, as operator people
The first end 511 of handlebar stem 51 is rotated into (arrow F3 directions as shown in Figure 8) towards the locality of actuator 55, trace 53
Under the drive of handlebar stem 51 and the spacing of guide rail R actuator 55 will be driven to be moved in a linear fashion towards probe card 30 (as schemed
The direction of arrow F4 shown in 8), load plate 20 of the position between actuator 55 and probe card 30 is elapsed towards probe card 30.
In addition, it is noted that in the present embodiment, though make the pin 91 and probe of chip 90 to move load plate 20
The probe 31 of plate 30 is contacted, and only art personnel are it should be appreciated that in specific implementation, the pin 91 of chip 90 is with visiting
The contact of pin 31 can also be realized by traveling probe plate 30, or move load plate 20 and probe card 30, this reality simultaneously or successively
Ad hoc fashion is not limited to new.
As shown in Fig. 2 in first embodiment of the present utility model, host apparatus 60 is by transmission line L and probe card
30 are electrically connected with.Controller 61 and memory body 62 are included in host apparatus 60, wherein memory body 62 stores a burning data.Control
Device 61 processed is used in 91 contact probe 31 of pin of chip 90, and multiple chips 90 are tested (testing), and will can burn
Record data recording (programming) to arrive among multiple chips 90, that is, carry out data recording action.Test and number due to chip
By art have a usually intellectual according to burning familiar, its concrete principle and content also sporadically appeared in many technologies or
Among patent document, therefore no longer repeat herein more.
As shown in figure 1, in first embodiment of the present utility model, control device 70 is electrically connected with drive mechanism 50,
Control device 70 is to provide user's operational control drive mechanism 50.User is moved to just to probe card 30 by load plate 20
Position after, the load plate 20 can be located between probe card 30 and drive mechanism 50.Now, by operating control device 70, for example
The startup button set on control device 70 is pressed, controllable drive mechanism 50 moves load plate 20 towards probe card 30, so that core
The contact probe 31 of pin 91 of piece 90.When load plate 20 is moved and when making 91 contact probe 31 of pin of chip 90, host apparatus 60
Just it can be stated as before taken off, multiple chips 90 are tested and/or data recording.
Then, it refer to organigrams of the Fig. 9 on second embodiment of the present utility model.
As shown in figure 9, in second embodiment of the present utility model, it is preceding to take off the load plate 10, probe card 30 and slide rail machine
The quantity of structure 41 is all multiple, and each load plate 10 of the multiple chips 90 of carrying is placed in after rack 40, can be by each sliding track mechanism
41 with the different probe card 30 of mobile correspondence, and multiple load plates 10 and the interlaced arrangement of multiple probe cards 30 are in line, i.e.,
Two-by-two will not continuous arrangement between multiple load plates 10.Each load plate 10 is being moved to the position just to each probe card 30 by user
Afterwards, by operating control device 70, you can control drive mechanism 50 once by all load plates 20 towards just to probe card 30
Mobile (being towards Z-direction displacement by taking Fig. 7 as an example), so that the contact probe 31 of pin 91 of whole chips 90.Due to this implementation
In example, multiple displacements of load plate 20 are once can control, and the pin 91 for comparing the more chips 90 of first embodiment is contacted simultaneously
Probe 31, thus compared to first embodiment, synchronously a greater amount of chips 90 can be tested, pre-burning or data recording it is dynamic
Make.
Then, it refer to organigrams of the Figure 10 on 3rd embodiment of the present utility model.
As shown in Figure 10, in 3rd embodiment of the present utility model, and before take off unlike embodiment, the utility model
Burning chip test equipment 1 further included temperature adjustment casing 80, and the preceding each member for taking off the burning chip test equipment 1
Part, in addition to host apparatus 60 and control device 70, during test all in temperature adjustment casing 80.Temperature adjustment casing 80 is to carry
Test temperature for being different from normal temperature, specifically, for the high and low temperature needed for carrying out burn-in testing (burn in test),
So that the controller 61 of host apparatus 60 more can carry out pre-burning survey in 91 contact probe 31 of pin of chip 90 to chip 90
Examination.Therefore, in 3rd embodiment of the present utility model, burning chip test equipment 1 is removed can be as described in before taking off embodiment, to core
Piece 90 tested and/or data recording outside, more test environment temperature can be adjusted by temperature adjustment casing 80, and to chip 90
Further carry out burn-in testing.In specific embodiment of the utility model, temperature adjustment casing 80 is industrial baking oven
(burn-in chamber), but the utility model is not limited, and temperature adjustment casing 80 or reliability environmental test are set
It is standby.By the burn-in testing of chip, by art to have a usually intellectual familiar, and its concrete principle and content are also
Sporadically appear among many technologies or patent document, therefore no longer repeat herein more.In addition, in the utility model 3rd embodiment
In, the function of the other elements of burning chip test equipment 1 and implementation are all same as described in first embodiment and second embodiment, therefore
This is that it is no longer repeated.
Finally, step flow charts of the Figure 11 on the method for burn-recording of chip of the present utility model is refer to, and is please joined in the lump
Fig. 1 is examined to Figure 10.
Burning chip method of testing of the present utility model takes off shown burning chip test equipment 1 before can be applicable to, be used to
Multiple chips 90 are tested in synchronous burning, or carry out burn-in testing to chip 90.As shown in Fig. 2 and Fig. 3 A-D, multiple chips
90 can first be positioned on pallet T, and multiple chips 90 respectively have multiple pins.Burning chip test equipment 1 includes load plate 20
And probe card 30, wherein probe card 30 include multiple probes 31；Here, the quantity of load plate 20 and probe card 30 can be respectively odd number
(as shown in Figure 1), or can be all multiple (as shown in fig. 9 or 10).The method for burn-recording of chip of the present utility model includes following
Each step.
First, step S1：Load plate is stacked on pallet, and reversible tray and load plate simultaneously, so that multiple chip upside downs
On load plate so that the pin of each chip dorsad load plate.
It can be placed on before burning, test and/or burn-in testing on the pallet T for example shown in Fig. 3 A due to chip 90, and
The pin 91 of chip 90 can down during placement.For will can once by the dislocation burning of multiple chips 90 or test carrying load plate 20
On, and it is put upside down, the first step of method for burn-recording is that load plate 20 is stacked on pallet T, and the upset support simultaneously after stacked
Disk T and load plate 20, so that multiple chips 90 are upside down on load plate 20 so that the pin 91 of each chip 90 dorsad load plate 20.It is described
Step specific implementation can join Fig. 3 A to Fig. 3 D and before take off explanation, only it is noted that the implementation of this step except can manually just
Outside formula is carried out, it can also assist to complete by automation equipment.
Step S2：Make load plate just to probe card, so that the pin of chip can be directed at probe.
After the completion of step S1, then, make to carry the load plates 20 of multiple chips 90 just to probe card 30, so that chip 90
Pin 91 can be directed at the probe 31 of probe card 30.As shown in figure 4, implementing, load plate can be assisted by a sliding track mechanism 41
20 move and move to exactly can just to chip 90 position, but the utility model is not limited.In addition, of the present utility model
When in burning chip test equipment 1 of the burning chip method of testing as shown in applying in such as Fig. 9 or Figure 10, the step S2 is
It is to make each load plate 20 respectively just to different probe cards 30, and makes multiple load plates 20 and multiple probe cards 30 are interlaced is arranged in
One straight line.
Step S3：Traveling probe plate or load plate, so that the probe of the pin contact probe plate of chip.
After making to carry the correspondence probe card 30 of load plate 20 of multiple chips 90, control probe card 30 or load plate 20 are moved,
So that the probe 31 of the contact probe plate 30 of pin 91 of chip 90.It can only select a control probe card 30 herein or load plate 20 is moved,
Or control both mobile simultaneously or successively, the utility model is not limited to specific move mode.The one of this step specific embodiment party
But it is not limited, to raise load plate 20 can moves (as shown in Figure 5) by a drive mechanism 50, and such as apply for example
When in the burning chip test equipment 1 shown in Fig. 7, the step S3 is can be using drive mechanism 50 come while raising each load plate 20
It is mobile, so that the pin 91 of the chip 90 in each load plate 20 contacts the probe 31 of each self-corresponding probe card 30.
Step S4：Multiple chips are tested and/or data recording.
After the probe 31 of the contact probe plate 30 of pin 91 of chip 90 is made, the host apparatus of burning chip test equipment 1
60 can start to test multiple chips 90 operation of (testing) and/or data recording (programming).
Finally, step S5 is carried out：Test temperature is provided, and pre-burning survey is carried out to the plurality of chip under the test temperature
Examination.
Complete after data recording, the temperature adjustment casing 80 for being further advanced by burning chip test equipment 1 provides test
Temperature, herein so-called test temperature include the high temperature and low temperature needed for carrying out burn-in testing, its temperature range is affiliated technology neck
Known to field technique personnel.Provide test temperature while, host apparatus 60 just can chip 90 pin 91 and probe card
30 probe 31 is in contact down, and the operation of burn-in testing (burn in test) is carried out for multiple chips 90.
Certainly, the utility model can also have other various embodiments, spiritual and its essence without departing substantially from the utility model
In the case of, those familiar with the art works as can make various corresponding changes and deformation according to the utility model, but
These corresponding changes and deformation should all belong to the scope of the claims appended by the utility model.
Claims (6)
1. a kind of burning chip test equipment, to burning or the multiple chips of test, the plurality of chip is placed on a pallet, and
Respectively there are multiple pins, it is characterised in that the burning chip test equipment includes：
One pedestal；
One load plate, is stacked on the pallet, and can be after stacked by while overturning the pallet and the load plate and making the plurality of core
Piece is upside down on the load plate so that each the plurality of pin of the chip dorsad load plate；
One probe card, is arranged on the pedestal, and the probe card includes multiple probes；
One rack, is arranged on the pedestal, to provide the load plate place after to should probe card so that the plurality of pin pair
Accurate the plurality of probe；
One drive mechanism, is arranged on the pedestal, to the mobile probe card or the load plate, so as to be upside down in being somebody's turn to do on the load plate
A plurality of pin pin therein for multiple chips contacts the respectively probe；And
One host apparatus, is electrically connected with the probe card, and the host apparatus is used to when the pin contacts the respectively probe, many to this
Individual chip is tested or data recording.
2. burning chip test equipment according to claim 1, it is characterised in that the rack includes a sliding track mechanism,
The load plate can be combined releasably with the sliding track mechanism, and by the sliding track mechanism in the rack top offset.
3. burning chip test equipment according to claim 1, it is characterised in that the drive mechanism is a pneumatic cylinder.
4. burning chip test equipment according to claim 1, it is characterised in that the quantity of the probe card and the load plate is all
To be multiple, and respectively the load plate is placed in after the rack, each corresponds to different probe cards.
5. burning test equipment according to claim 4, it is characterised in that respectively the load plate is placed in after the rack, and this is more
Individual load plate and the interlaced arrangement of the plurality of probe card are in line.
6. the burning chip test equipment according to any one of claim 1 to 5, it is characterised in that further include temperature tune
Casing is saved, the probe card is located in the temperature regulating chamber body, and the temperature adjustment casing is to provide a test temperature, so that the master
Machine device more can carry out burn-in testing when the pin contacts the respectively probe to the plurality of chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720058827.7U CN206584014U (en) | 2017-01-17 | 2017-01-17 | Burning chip test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720058827.7U CN206584014U (en) | 2017-01-17 | 2017-01-17 | Burning chip test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206584014U true CN206584014U (en) | 2017-10-24 |
Family
ID=60109844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720058827.7U Active CN206584014U (en) | 2017-01-17 | 2017-01-17 | Burning chip test equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206584014U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108318799A (en) * | 2017-01-17 | 2018-07-24 | 崇碁科技股份有限公司 | Burning chip test equipment and method |
| CN113820581A (en) * | 2021-11-19 | 2021-12-21 | 浙江杭可仪器有限公司 | Aging testing device easy to install |
| CN114701834A (en) * | 2022-04-29 | 2022-07-05 | 深圳格芯集成电路装备有限公司 | Chip turning device |
-
2017
- 2017-01-17 CN CN201720058827.7U patent/CN206584014U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108318799A (en) * | 2017-01-17 | 2018-07-24 | 崇碁科技股份有限公司 | Burning chip test equipment and method |
| CN113820581A (en) * | 2021-11-19 | 2021-12-21 | 浙江杭可仪器有限公司 | Aging testing device easy to install |
| CN113820581B (en) * | 2021-11-19 | 2022-02-18 | 浙江杭可仪器有限公司 | Aging testing device easy to install |
| CN114701834A (en) * | 2022-04-29 | 2022-07-05 | 深圳格芯集成电路装备有限公司 | Chip turning device |
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