CN206557816U - A kind of high temperature resistant RFID electronic tire tags - Google Patents
A kind of high temperature resistant RFID electronic tire tags Download PDFInfo
- Publication number
- CN206557816U CN206557816U CN201720109351.5U CN201720109351U CN206557816U CN 206557816 U CN206557816 U CN 206557816U CN 201720109351 U CN201720109351 U CN 201720109351U CN 206557816 U CN206557816 U CN 206557816U
- Authority
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- China
- Prior art keywords
- film layer
- films
- high temperature
- temperature resistant
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 238000004073 vulcanization Methods 0.000 claims abstract description 20
- 238000007711 solidification Methods 0.000 claims abstract description 17
- 230000008023 solidification Effects 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 239000004696 Poly ether ether ketone Substances 0.000 claims abstract description 6
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 229920006269 PPS film Polymers 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000005486 sulfidation Methods 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 55
- 238000005516 engineering process Methods 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 244000144972 livestock Species 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Abstract
The utility model discloses a kind of high temperature resistant RFID electronic tire tags, including affixed film layer, solidification glue-line, antenna stack, vulcanization glue-line and release film layer are stacked gradually from top to bottom；The film layer is PEN films or PI films or PEEK films or PPS films or PEI films or PAI films；The solidification glue-line is epoxide-resin glue；The antenna stack includes RFID chip and etching metal level, and the RFID chip is fixed in etching metal layer itself in the way of reflow soldering.High temperature resistant RFID electronic tire tags of the present utility model, its resistance to elevated temperatures is strong, and RFID chip can be avoided to be damaged in sulfidation, and label bulk strength is high.
Description
Technical field
The utility model is related to electronic label technology field, and in particular to a kind of high temperature resistant RFID electronic tire tags.
Background technology
RFID (Radio Frequency Identification) technology, i.e. radio RF recognition technology, it is a kind of
The communication technology, can recognize specific objective by radio signals and read and write related data.The signal of radio is by being tuned into nothing
The electromagnetic field of line electricity frequency, sends out data from the label being attached on article, is recognized with automatic with following the trail of the article.
Label is contained can recognize within the information of Electronic saving, several meters.From unlike bar code, RF tag need not be located
Within identifier sight, it can also be embedded in and be tracked within object.
RFID system is for controlling, detect and track object, has been used to many industries.Label is being attached to one
Automobile in production, manufacturer just can follow the trail of the progress of this car on a production line；Warehouse can follow the trail of the place of medicine；Radio frequency mark
Label can also be invested on livestock and pet, the convenient identification to livestock and pet；Used in classic brands commodity, important certificate, recognize
In card protection and other items, it can effectively prevent spreading unchecked for counterfeit and shoddy goods.
From structure, RFID is a kind of simple wireless system, only two basic devices, including challenger and a lot
Transponder.Wherein, challenger is the equipment for reading label information, is made up of, may be designed as hand-held antenna, coupling element, chip
Formula read write line or fixed type reader-writer.And transponder refers generally to label, it is made up of etching metal and chip, each label has only
One electronic code, is attached on object and identifies destination object.And work letter office is right at present for RFID electronic tire tags (vulcanization mark)
During its standard is just examined, and RFID electronic tire tags (vulcanization mark) are used and focused on：Warehouse logisticses management, follow the trail of trace to the source with
And prevent from faking.
It follows that with the development of information age, radio frequency identification (RFID) system is applied in tire to tire
The technology that use state is monitored in real time turns into the development trend of current tire.Current existing RFID is being planted
When entering tire, because the pressure (＞ 30Bar) in curing temperature (250 DEG C) and vulcanizing tank in carcass sulfidation is all than larger,
In the case of high temperature and high pressure, label is easily damaged；In addition, RFID has certain thickness in itself, in mark
Label fill into the sulfidation of tire and easily form bubble, if there is bubble in tire, will substantially reduce the safety coefficient of tire.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of high temperature resistant RFID tire electronics
Label, its resistance to elevated temperatures is strong, and RFID chip can be avoided to be damaged in sulfidation, and label bulk strength is high.
The purpose of this utility model is realized using following technical scheme：
A kind of high temperature resistant RFID electronic tire tags, including stack gradually from top to bottom affixed film layer, solidification glue-line,
Antenna stack, vulcanization glue-line and release film layer；The film layer be PEN films or PI films or PEEK films or PPS films or
PEI films or PAI films；The solidification glue-line is epoxide-resin glue；The antenna stack includes RFID chip and etching metal
Layer, the RFID chip is fixed in etching metal layer itself in the way of reflow soldering.
It is preferred that, the etching metal level is etching aluminium or copper sheet layer.
It is preferred that, printing coating is provided with the way of being coated with film layer upper surface.
It is preferred that, the surface of film layer is fixedly provided with rubber film layer.
It is preferred that, the thickness of rubber film layer is 0.001mm-0.25mm.
It is preferred that, the thickness of the film layer is 0.005mm-0.188mm.
It is preferred that, the thickness of solidification glue-line is 0.001mm-0.25mm.
It is preferred that, the thickness of the antenna stack is 0.003mm-0.25mm.
It is preferred that, the thickness of the vulcanization glue-line is 0.001mm-0.25mm.
It is preferred that, the thickness of the release film layer is 0.005mm-0.188mm.
Compared with prior art, the beneficial effects of the utility model are：1st, the RFID tag by stacking gradually from top to bottom
Affixed film layer, solidification glue-line, antenna stack, vulcanization glue-line and release film layer, good integral strength；Due to RFID chip be with
The mode of reflow soldering is fixed in etching metal layer itself, therefore can improve the resistance to elevated temperatures of the RFID tag.
2nd, antenna stack lower floor is provided with vulcanization glue-line, and vulcanization glue-line is identical with the vulcanizate material in tire vulcanization process, makes
Obtaining RFID tag can tightly fit in tire in sulfidation, can effectively prevent RFID tag and be formed in carcass
Bubble, substantially increases the safety coefficient of tire.
3rd, the lower floor of vulcanization glue-line is provided with release film layer, you can as peel ply, can improve whole as protection glue surface
The vulcanization glue surface of RFID tag, the not contaminated influence colloidality of glue surface is being protected before.
4th, antenna stack is bonded by solidifying glue-line and film layer, and fixed structure is firmly, easy to make, and further improves
RFID tag intensity；And antenna stack is fitted with film layer completely, when ensure that RFID tag is torn to pieces, farthest destroy
Metal level is etched, prevents RFID tag to be secondary use.And film layer is that PEN films or PI films or PEEK films or PPS are thin
Film or PEI films or PAI films, high-temperature resistant result are good, are prevented effectively from RFID tag and are damaged when filling into tire.
Brief description of the drawings
Fig. 1 is the structural representation of electronic tag of the present utility model.
In figure：10th, film layer；20th, glue-line is solidified；30th, antenna stack；40th, glue-line is vulcanized；50th, release film layer.
Embodiment
Below, with reference to accompanying drawing and embodiment, the utility model is described further：
A kind of high temperature resistant RFID electronic tire tags as shown in Figure 1, including affixed film is stacked gradually from top to bottom
Layer 10, solidification glue-line 20, antenna stack 30, vulcanization glue-line 40 and release film layer 50.Specific above-mentioned film layer 10 be PEN films or
PI films or PEEK films or PPS films or PEI films or PAI films, and solidify glue-line 20 for epoxide-resin glue.In addition, institute
Stating antenna stack 3030 includes RFID chip and etching metal level, and RFID chip is fixed in into etch gold in the way of reflow soldering
Belong to inside layer.
On the basis of said structure, by the way that the release film layer 50 as protection face is torn the electronic tag can be made overall
It is implanted into tire；Simultaneously in RFID chip built-in product information, so tire product information can be read by RFID chip.In the mark
Using epoxide-resin glue due to the RFID tag film layer 10 affixed by stacking gradually from top to bottom, solidification glue-line in label
20th, antenna stack 30, vulcanization glue-line 40 and release film layer 50, therefore good integral strength.And solidification glue uses epoxide-resin glue, bond
Better performances, thus the fixed structure of antenna stack 30 can be effectively improved, strengthen the intensity of whole RFID tag.And antenna stack 30 is logical
Cross solidification glue-line 20 to bond with film layer 10, fixed structure is firmly, easy to make, and further improve RFID tag intensity；And
Antenna stack 30 is fitted with film layer 10 completely, when ensure that RFID tag is torn to pieces, farthest destruction etching metal
Layer, prevents RFID tag to be secondary use.
In addition, film layer 10 is PEN films or PI films or PEEK films or PPS films or PEI films or PAI films,
High-temperature resistant result is good, is prevented effectively from when RFID tag is used in high temperature environments and is damaged.At the same time because RFID chip is
Etching metal layer itself is fixed in the way of reflow soldering, therefore can further improve the resistance to elevated temperatures of the RFID tag.
Under the preferable resistance to elevated temperatures of the electronic tag, RFID tag can be prevented effectively from and damaged when filling into tire.
Certainly, it should be noted that, the lower floor of antenna stack 30 is provided with vulcanization glue-line 40, vulcanization glue-line 40 and tire vulcanization process
In vulcanizate material it is identical so that RFID tag can tightly fit in surface of tyre in sulfidation, can effectively keep away
Exempt from RFID tag and bubble is formed in carcass, substantially increase the safety coefficient of tire.
It is preferred that, the etching metal level is etching aluminium or copper sheet layer.
It is preferred that, printing coating is provided with the way of being coated with the upper surface of film layer 10, the high temperature resistant adhesive sticker can be achieved
Printable function, with reference to traditional bar code vulcanization label be easy to production.And RFID tag it is bad when still traceable use.Specifically should
It can be the coating suitable for printer used in the prior art to print coating.
It is preferred that, rubber film layer can be also fixedly provided with the surface of film layer 10, as enhancement layer, further strengthening should
The intensity of electronic tag, can protect RFID main bodys not to be damaged, and the rubber layer can also combine with tire, it is to avoid the electricity
Subtab produces bubble when being implanted into.The thickness of specific rubber film layer can be 0.001mm-0.25mm.
It is preferred that, the thickness of the film layer 10 is 0.005mm-0.188mm, and the thickness of film layer 10 can directly affect whole
The making temperature of individual RFID tag, and through utility model people it is demonstrated experimentally that RFID tag can be made suitable in the thickness range value
At a temperature of make, improve the performance of the RFID tag.
It is preferred that, the thickness of solidification glue-line 20 is 0.001mm-0.25mm, due to using epoxide-resin glue in the present embodiment
Belong to one kind of solidification glue, and its different adhesive property of the thickness of solidification glue is different, and through utility model people it is demonstrated experimentally that the thickness
The adhesive property of epoxide-resin glue is preferable in the range of angle value.
It is preferred that, the thickness of the antenna stack 30 is 0.003mm-0.25mm, because the thickness of antenna stack 30 is directly extraneous
To the destructive of RFID chip and to the reading performance of RFID chip, and through utility model people it is demonstrated experimentally that the thickness value model
The antenna stack 30 enclosed can improve antenna strength, it is to avoid RFID chip is damaged, and can also make the product information of RFID chip memory storage
It is read.
It is preferred that, the thickness of the vulcanization glue-line 40 is 0.001mm-0.25mm, likewise, vulcanizate falls within solidification glue
One kind, and its different adhesive property of thickness of solidification glue is different, and through utility model people it is demonstrated experimentally that in the range of values of thickness
The adhesive property of vulcanizate is preferable.
It is preferred that, the thickness of the release film layer 50 is 0.005mm-0.188mm, because release film layer 50 is in label surface
Anti-sticking effect is played, is more facilitated it is demonstrated experimentally that being operated in the above-mentioned range of values of thickness of release film layer 50 through utility model people.
It will be apparent to those skilled in the art that technical scheme that can be as described above and design, make other various
It is corresponding to change and deformation, and all these change and deformation should all belong to the protection of the utility model claim
Within the scope of.
Claims (10)
1. a kind of high temperature resistant RFID electronic tire tags, it is characterised in that including stack gradually from top to bottom affixed film layer,
Solidify glue-line, antenna stack, vulcanization glue-line and release film layer；The film layer be PEN films or PI films or PEEK films or
PPS films or PEI films or PAI films；The solidification glue-line is epoxide-resin glue；The antenna stack include RFID chip and
Metal level is etched, the RFID chip is fixed in etching metal layer itself in the way of reflow soldering.
2. high temperature resistant RFID electronic tire tags as claimed in claim 1, it is characterised in that the etching metal level is etching
Aluminium or copper sheet layer.
3. high temperature resistant RFID electronic tire tags as claimed in claim 1, it is characterised in that in film layer upper surface to be coated with
Mode provided with printing coating.
4. high temperature resistant RFID electronic tire tags as claimed in claim 1, it is characterised in that the surface of film layer is fixedly provided with
Rubber film layer.
5. high temperature resistant RFID electronic tire tags as claimed in claim 4, it is characterised in that the thickness of rubber film layer is
0.001mm-0.25mm。
6. high temperature resistant RFID electronic tire tags as claimed in claim 1, it is characterised in that the thickness of the film layer is
0.005mm-0.188mm。
7. high temperature resistant RFID electronic tire tags as claimed in claim 1, it is characterised in that the thickness of solidification glue-line is
0.001mm-0.25mm。
8. high temperature resistant RFID electronic tire tags as claimed in claim 1, it is characterised in that the thickness of the antenna stack is
0.003mm-0.25mm。
9. high temperature resistant RFID electronic tire tags as claimed in claim 1, it is characterised in that the thickness of the vulcanization glue-line is
0.001mm-0.25mm。
10. high temperature resistant RFID electronic tire tags as claimed in claim 1, it is characterised in that the thickness of the release film layer
For 0.005mm-0.188mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720109351.5U CN206557816U (en) | 2017-02-03 | 2017-02-03 | A kind of high temperature resistant RFID electronic tire tags |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720109351.5U CN206557816U (en) | 2017-02-03 | 2017-02-03 | A kind of high temperature resistant RFID electronic tire tags |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206557816U true CN206557816U (en) | 2017-10-13 |
Family
ID=60010104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720109351.5U Withdrawn - After Issue CN206557816U (en) | 2017-02-03 | 2017-02-03 | A kind of high temperature resistant RFID electronic tire tags |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206557816U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106845588A (en) * | 2017-02-03 | 2017-06-13 | 中山金利宝胶粘制品有限公司 | A kind of high temperature resistant RFID electronic tire tags and preparation method thereof |
-
2017
- 2017-02-03 CN CN201720109351.5U patent/CN206557816U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106845588A (en) * | 2017-02-03 | 2017-06-13 | 中山金利宝胶粘制品有限公司 | A kind of high temperature resistant RFID electronic tire tags and preparation method thereof |
| CN106845588B (en) * | 2017-02-03 | 2024-02-13 | 中山金利宝新材料股份有限公司 | High-temperature-resistant RFID (radio frequency identification) tire electronic tag and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 528400 No. 1-2, North logistics park, Xiaolan Town industrial base, Zhongshan City, Guangdong Province Patentee after: Zhongshan jinlibao New Material Co.,Ltd. Patentee after: LIYANG KINGLABEL ADHESIVES PRODUCTS CO.,LTD. Address before: 528400 Yadong Industrial Development Zone, Xiaolan Town, Zhongshan City, Guangdong Province Patentee before: ZHONGSHAN KINGLABEL ADHESIVE PRODUCTS Co.,Ltd. Patentee before: LIYANG KINGLABEL ADHESIVES PRODUCTS CO.,LTD. |
|
| CP03 | Change of name, title or address | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20171013 Effective date of abandoning: 20240213 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20171013 Effective date of abandoning: 20240213 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |