CN106845588B - High-temperature-resistant RFID (radio frequency identification) tire electronic tag and manufacturing method thereof - Google Patents
High-temperature-resistant RFID (radio frequency identification) tire electronic tag and manufacturing method thereof Download PDFInfo
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- CN106845588B CN106845588B CN201710063606.3A CN201710063606A CN106845588B CN 106845588 B CN106845588 B CN 106845588B CN 201710063606 A CN201710063606 A CN 201710063606A CN 106845588 B CN106845588 B CN 106845588B
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- 239000010410 layer Substances 0.000 claims abstract description 161
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- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 23
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- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920002530 polyetherether ketone Polymers 0.000 claims abstract description 20
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- 238000000576 coating method Methods 0.000 claims description 31
- 239000004636 vulcanized rubber Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
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- 238000005530 etching Methods 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 8
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- 238000007639 printing Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
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- 238000004073 vulcanization Methods 0.000 abstract description 7
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/022—Processes or apparatus therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses a high-temperature-resistant RFID tire electronic tag, which comprises a film layer, a curing adhesive layer, an antenna layer, a curing adhesive layer and a release film layer, wherein the film layer, the curing adhesive layer, the antenna layer, the curing adhesive layer and the release film layer are sequentially laminated and fixedly connected from top to bottom; the film layer is a PEN film or a PI film or a PEEK film or a PPS film or a PEI film or a PAI film; the solidified glue layer is epoxy resin glue; the antenna layer comprises an RFID chip and an etched metal layer, and the RFID chip is fixedly connected inside the etched metal layer in a reflow soldering mode. A method for manufacturing a high temperature resistant RFID tire electronic tag comprises the following steps; step two, a step two is carried out; step three, a step of performing; step four, a step four is carried out; step five and step six. The high-temperature-resistant RFID tire electronic tag disclosed by the invention has strong high-temperature resistance, can avoid damage of an RFID chip in a vulcanization process, and has high overall strength.
Description
Technical Field
The invention relates to the technical field of electronic tags, in particular to a high-temperature-resistant RFID (radio frequency identification) tire electronic tag and a manufacturing method thereof.
Background
RFID (Radio Frequency Identification), radio frequency identification, is a communication technology that can identify a specific target by radio signals and read and write related data. The radio signal is modulated to a radio frequency electromagnetic field to transmit data from a tag attached to the item to automatically identify and track the item. The tag contains electronically stored information that can be identified within a few meters. Unlike bar codes, the radio frequency tag need not be within the line of sight of the identifier, but can be embedded within the tracked object.
RFID systems are used to control, detect and track objects, and have been used in many industries. Attaching the tag to a car in production, so that the factory can conveniently track the progress of the car on the production line; the warehouse can track the positions of medicines; the radio frequency tag can be attached to livestock and pets, so that the livestock and the pets can be conveniently identified; the product can be used for high-grade branded goods, important certificates, authentication protection and other articles, and can effectively prevent the counterfeited and inferior products from being flooded.
Structurally, RFID is a simple wireless system with only two basic devices, including an interrogator and many transponders. The interrogator is a device for reading tag information, consists of an antenna, a coupling element and a chip, and can be designed into a handheld reader-writer or a fixed reader-writer. While transponders generally refer to tags, which are composed of etched metal and chips, each tag has a unique electronic code that is attached to an object to identify the target object. And the RFID tire electronic tag (vulcanized mark) is currently being examined by the industrial bureau of staff on the standard, and the use of the RFID tire electronic tag (vulcanized mark) is focused on: warehouse logistics management, tracking and tracing and preventing .
As is known from the above, with the development of the information age, the technology of applying a Radio Frequency Identification (RFID) system to a tire to monitor the usage state of the tire in real time has become a trend of the current tire. When the existing RFID electronic tag is implanted into a tire, the vulcanizing temperature (250 ℃) and the pressure (more than 30 Bar) in a vulcanizing tank are relatively large in the vulcanizing process of the tire body, so that the tag is extremely easy to damage under the conditions of high temperature and high pressure; in addition, the RFID electronic tag has a certain thickness, bubbles are easy to form in the vulcanization process of the tag patch into the tire, and if bubbles exist in the tire, the safety coefficient of the tire is greatly reduced.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide the high-temperature-resistant RFID tire electronic tag which has strong high-temperature resistance, can avoid damage of an RFID chip in the vulcanization process, and has high overall strength.
The invention adopts the following technical scheme:
a high temperature resistant RFID tire electronic tag comprises a film layer, a curing adhesive layer, an antenna layer, a curing adhesive layer and a release film layer which are sequentially laminated and fixedly connected from top to bottom; the film layer is a PEN film or a PI film or a PEEK film or a PPS film or a PEI film or a PAI film; the solidified glue layer is epoxy resin glue; the antenna layer comprises an RFID chip and an etched metal layer, and the RFID chip is fixedly connected inside the etched metal layer in a reflow soldering mode.
Preferably, the etched metal layer is an etched aluminum or copper sheet layer.
Preferably, a printing coating is arranged on the upper surface of the film layer in a coating manner.
Preferably, the surface of the film layer is also fixedly provided with a rubber film layer.
Preferably, the thickness of the rubber film layer is 0.001mm to 0.25mm.
Preferably, the thickness of the film layer is 0.005mm-0.188mm.
Preferably, the thickness of the cured bondline is 0.001mm to 0.25mm.
Preferably, the thickness of the antenna layer is 0.003mm-0.25mm.
Preferably, the thickness of the vulcanized rubber layer is 0.001mm-0.25mm.
Preferably, the thickness of the release film layer is 0.005mm-0.188mm.
The second purpose of the invention is to provide a manufacturing method of the high temperature resistant RFID tire electronic tag, which comprises the following steps:
step one, bonding a metal layer on the bottom surface of a PEN or PI or PEEK or PPS or PEI or PAI film layer through an epoxy resin adhesive layer;
comprises the following sub-steps:
step one comprises the following sub-steps:
step A, placing epoxy resin glue into a glue groove of a coating machine, and coating the epoxy resin glue on a PEN or PI or PEEK or PPS or PEI or PAI film layer through the coating machine;
step B, attaching aluminum or copper foil to the bottom surface of the PEN or PI or PEEK or PPS or PEI or PAI film layer coated with the epoxy resin glue to form a metal layer;
step C, curing the epoxy resin glue coated between the PEN or PI or PEEK or PPS or PEI or PAI film layer and the metal layer through an oven to form an epoxy resin glue layer; the temperature of the oven is 80-150 ℃;
etching the surface of the metal layer to form an antenna pattern;
comprises the following sub-steps:
a2, printing an antenna-like pattern on the aluminum or copper foil surface;
step B2, etching the antenna-shaped pattern, cleaning and etching the antenna-shaped pattern with ink, and forming an antenna pattern on the aluminum or copper foil surface;
manufacturing a positioning substrate by adopting an SMT reflow soldering technology, fixing an RFID chip on the positioning substrate, and coating lead-free solder paste on the end pin position of the RFID chip;
placing the terminal pins of the RFID chip on the wafer body, dispensing lead-free solder paste on the terminal pins of the RFID chip in a CSP (chip size package) flip-chip dispensing mode, and then cutting the wafer;
capturing RFID chips on the wafer in the fourth step in a CSP (chip scale package) pouring mode, and fixing the RFID chips on the antenna pattern in the second step in an SMT (surface mount technology) reflow soldering mode to form an antenna layer; the SMT reflow soldering temperature is 235-260 ℃, and the SMT reflow soldering time is 7-10 minutes;
and step six, coating a vulcanized rubber layer on the bottom surface of the antenna layer.
Preferably, the sixth step further comprises the following sub-steps:
step A2, putting the vulcanized glue solution into a glue groove of a coating machine, and coating the vulcanized glue solution on the bottom surface of the prepared antenna layer through the coating machine;
step B2, drying the vulcanized rubber solution coated on the bottom surface of the antenna layer through an oven to form a vulcanized rubber layer; the temperature of the oven is 70-95 ℃.
Compared with the prior art, the invention has the beneficial effects that: 1. the RFID tag is formed by sequentially laminating and fixedly connecting a film layer, a curing adhesive layer, an antenna layer, a vulcanized adhesive layer and a release film layer from top to bottom, and has good overall strength; because the RFID chip is fixedly connected in the etched metal layer in a reflow soldering mode, the high temperature resistance of the RFID tag can be improved.
2. The lower layer of the antenna layer is provided with the vulcanized rubber layer, and the vulcanized rubber layer is the same as the vulcanized rubber layer in the tire vulcanization process, so that the RFID tag can be tightly attached to the tire in the vulcanization process, the formation of bubbles in the tire body by the RFID tag can be effectively avoided, and the safety coefficient of the tire is greatly improved.
3. The lower layer of the vulcanized rubber layer is provided with a release film layer which can be used as a stripping layer and a protective rubber surface, so that the vulcanized rubber surface of the whole RFID label can be improved, and the protective rubber surface is not polluted to influence the rubber property before use.
4. The antenna layer is adhered to the film layer through the solidified adhesive layer, so that the fixed structure is firm, the manufacture is convenient, and the strength of the RFID tag is further improved; and the antenna layer is completely attached to the film layer, so that when the RFID label is torn, the etched metal layer is destroyed to the greatest extent, and the RFID label is prevented from being reused. The film layer is a PEN film or a PI film or a PEEK film or a PPS film or a PEI film or a PAI film, so that the high-temperature-resistant effect is good, and the RFID tag is effectively prevented from being damaged when the tire is repaired.
5. The high-temperature-resistant RFID tire electronic tag manufactured by the manufacturing method provided by the invention has good high-temperature resistance and high strength.
Drawings
Fig. 1 is a schematic structural diagram of an electronic tag according to the present invention.
In the figure: 10. a thin film layer; 20. curing the adhesive layer; 30. an antenna layer; 40. a vulcanized rubber layer; 50. and (3) a release film layer.
Detailed Description
The invention will be further described with reference to the accompanying drawings and detailed description below:
the high temperature resistant RFID tire electronic tag shown in FIG. 1 comprises a film layer 10, a cured adhesive layer 20, an antenna layer 30, a vulcanized adhesive layer 40 and a release film layer 50 which are sequentially laminated and fixedly connected from top to bottom. Specifically, the film layer 10 is a PEN film, a PI film, a PEEK film, a PPS film, a PEI film, or a PAI film, and the cured adhesive layer 20 is an epoxy adhesive. In addition, the antenna layer 3030 includes an RFID chip and an etched metal layer, and the RFID chip is fixedly connected to the inside of the etched metal layer by reflow soldering.
Based on the above structure, the electronic tag can be integrally implanted into the tire by tearing off the release film layer 50 serving as the protection surface; meanwhile, product information is built in the RFID chip, so that the tire product information can be read through the RFID chip. The epoxy resin adhesive is adopted in the tag, and the film layer 10, the curing adhesive layer 20, the antenna layer 30, the vulcanized adhesive layer 40 and the release film layer 50 are laminated and fixedly connected in sequence from top to bottom, so that the overall strength of the RFID tag is good. And the curing adhesive adopts epoxy resin adhesive with better adhesive property, so that the fixing structure of the antenna layer 30 can be effectively improved, and the strength of the whole RFID tag can be enhanced. The antenna layer 30 is adhered to the film layer 10 through the cured adhesive layer 20, so that the fixing structure is firm, the manufacture is convenient, and the strength of the RFID tag is further improved; and the antenna layer 30 is completely attached to the film layer 10, so that when the RFID tag is torn down, the etched metal layer is destroyed to the greatest extent, and the RFID tag is prevented from being reused.
In addition, the film layer 10 is a PEN film or a PI film or a PEEK film or a PPS film or a PEI film or a PAI film, so that the high temperature resistant effect is good, and the RFID tag is effectively prevented from being damaged when being used in a high temperature environment. Meanwhile, the RFID chip is fixedly connected in the etched metal layer in a reflow soldering mode, so that the high temperature resistance of the RFID tag can be further improved. Under the better high temperature resistance of the electronic tag, the damage of the RFID tag during tire repair can be effectively avoided.
Of course, it should be further noted that the lower layer of the antenna layer 30 is provided with the vulcanized rubber layer 40, and the vulcanized rubber layer 40 is made of the same material as the vulcanized rubber in the tire vulcanization process, so that the RFID tag can be tightly attached to the surface of the tire in the vulcanization process, thereby effectively avoiding the formation of bubbles in the tire body of the RFID tag, and greatly improving the safety factor of the tire.
Preferably, the etched metal layer is an etched aluminum or copper sheet layer.
Preferably, a printing coating is arranged on the upper surface of the film layer 10 in a coating mode, so that the printing function of the high-temperature-resistant self-adhesive can be realized, and the production is convenient by combining a traditional bar code vulcanized label. And the RFID tag can still be used in a tracking way when the RFID tag is bad. The print coating may in particular be a coating suitable for printers as used in the prior art.
Preferably, a rubber film layer is further fixed on the surface of the film layer 10, and is used as a reinforcing layer to further strengthen the strength of the electronic tag, so that the RFID main body can be protected from being damaged, and the rubber layer can be combined with a tire to avoid air bubbles generated during implantation of the electronic tag. The thickness of the rubber film layer may be specifically 0.001mm to 0.25mm.
Preferably, the thickness of the film layer 10 is 0.005mm-0.188mm, the thickness of the film layer 10 directly affects the manufacturing temperature of the whole RFID label, and the inventor experiment proves that the RFID label can be manufactured at a proper temperature in the thickness range, so that the performance of the RFID label is improved.
Preferably, the thickness of the cured adhesive layer 20 is 0.001mm-0.25mm, and since the epoxy resin adhesive is one of the cured adhesives in this embodiment, the cured adhesives have different adhesive properties due to different thicknesses, and experiments by the inventor prove that the epoxy resin adhesive has better adhesive properties within the range of the thickness.
Preferably, the thickness of the antenna layer 30 is 0.003mm-0.25mm, and the thickness of the antenna layer 30 is directly destructive to the RFID chip and the reading performance of the RFID chip, and the inventor experiment proves that the antenna layer 30 with the thickness range can improve the antenna strength, avoid the damage of the RFID chip and also enable the product information stored in the RFID chip to be read.
Preferably, the thickness of the vulcanized rubber layer 40 is 0.001mm-0.25mm, and the vulcanized rubber is one of the cured rubber, and the cured rubber has different thickness and different adhesive properties, and the inventor experiment proves that the adhesive properties of the vulcanized rubber in the thickness range are better.
Preferably, the thickness of the release film layer 50 is 0.005mm-0.188mm, and the inventor experiment proves that the operation is more convenient in the thickness range of the release film layer 50 because the release film layer 50 plays an anti-sticking role on the surface of the label.
The embodiment also provides a manufacturing method of the high-temperature-resistant RFID tire electronic tag, which comprises the following steps:
step one, bonding a metal layer on the bottom surface of a PEN or PI or PEEK or PPS or PEI or PAI film layer through an epoxy resin adhesive layer;
etching the surface of the metal layer to form an antenna pattern;
manufacturing a positioning substrate by adopting an SMT reflow soldering technology, fixing an RFID chip on the positioning substrate, and coating lead-free solder paste on the end pin position of the RFID chip; it should be noted that the positioning substrate may be a copper clad laminate in the prior art.
Placing the terminal pins of the RFID chip on the wafer body, dispensing lead-free solder paste on the terminal pins of the RFID chip in a CSP (chip size package) flip-chip dispensing mode, and then cutting the wafer; of course, the wafer selected in this step may be a silicon wafer used in the fabrication of semiconductor integrated circuits in the prior art.
Capturing RFID chips on the wafer in the fourth step in a CSP (chip scale package) pouring mode, and fixing the RFID chips on the antenna pattern in the second step in an SMT (surface mount technology) reflow soldering mode to form an antenna layer; the SMT reflow soldering temperature is 235-260 ℃, and the SMT reflow soldering time is 7-10 minutes;
the RFID chip is placed in the metal layer, namely the antenna layer is manufactured, and the RFID chip is welded under the temperature environment and the duration time to resist the high temperature.
And step six, coating a vulcanized rubber layer on the bottom surface of the antenna layer.
Therefore, the electronic tag manufactured through the steps has good high temperature resistance, damage can be avoided when the tag is implanted into a tire, and the manufactured tag is high in overall strength.
Step one comprises the following sub-steps:
step A, placing epoxy resin glue into a glue groove of a coating machine, and coating the epoxy resin glue on a PEN or PI or PEEK or PPS or PEI or PAI film layer through the coating machine;
step B, attaching aluminum or copper foil to the bottom surface of the PEN or PI or PEEK or PPS or PEI or PAI film layer coated with the epoxy resin glue to form a metal layer;
step C, curing the epoxy resin glue coated between the PEN or PI or PEEK or PPS or PEI or PAI film layer and the metal layer through an oven to form an epoxy resin glue layer; the temperature of the oven is 80-150 ℃;
the metal layer is convenient to bond with PEN or PI or PEEK or PPS or PEI or PAI film layer, and the whole strength and high temperature resistance of the manufactured label are good.
Meanwhile, the second step may specifically include the following sub-steps:
step A1, printing an antenna-like pattern on an aluminum or copper foil surface;
and step B1, etching the antenna-shaped pattern, cleaning and etching the antenna-shaped pattern, and forming the antenna pattern on the aluminum or copper foil surface. This step facilitates the fabrication of the antenna layer.
Preferably, in this embodiment, the sixth step further includes the following sub-steps:
step A2, putting vulcanized glue solution into a glue groove of a coating machine, and coating the vulcanized glue solution on the bottom surface of the manufactured antenna layer (namely, the PEN, PI, PEEK, PPS, PEI or PAI film layer with the wafer fixed thereon) through the coating machine;
step B2, drying the vulcanized rubber solution coated on the bottom surface of the antenna layer through an oven to form a vulcanized rubber layer; the temperature of the oven is 70-95 ℃.
It will be apparent to those skilled in the art from this disclosure that various other changes and modifications can be made which are within the scope of the invention as defined in the appended claims.
Claims (12)
1. The high temperature resistant RFID tire electronic tag is characterized by comprising a film layer, a curing adhesive layer, an antenna layer, a curing adhesive layer and a release film layer which are sequentially laminated and fixedly connected from top to bottom; the film layer is a PEN film or a PI film or a PEEK film or a PPS film or a PEI film or a PAI film; the solidified glue layer is epoxy resin glue; the antenna layer comprises an RFID chip and an etched metal layer, and the RFID chip is fixedly connected inside the etched metal layer in a reflow soldering mode.
2. The high temperature resistant RFID tire electronic tag of claim 1, wherein the etched metal layer is an etched aluminum or copper sheet layer.
3. The high temperature resistant RFID tire electronic tag of claim 1, wherein a print coating is disposed on the upper surface of the film layer in a coating manner.
4. The high temperature resistant RFID tire electronic tag of claim 1, wherein the surface of the film layer is further secured with a rubber film layer.
5. The high temperature resistant RFID tire electronic tag of claim 4, wherein the rubber film layer has a thickness of 0.001mm to 0.25mm.
6. The high temperature resistant RFID tire electronic tag of claim 1, wherein the film layer has a thickness of 0.005mm to 0.188mm.
7. The high temperature resistant RFID tire electronic tag of claim 1, wherein the cured adhesive layer has a thickness of 0.001mm to 0.25mm.
8. The high temperature resistant RFID tire electronic tag of claim 1, wherein the antenna layer has a thickness of 0.003mm to 0.25mm.
9. The high temperature resistant RFID tire electronic tag of claim 1, wherein the vulcanized rubber layer has a thickness of 0.001mm to 0.25mm.
10. The high temperature resistant RFID tire electronic tag of claim 1, wherein the thickness of the release film layer is between 0.005mm and 0.188mm.
11. A method for manufacturing the high temperature resistant RFID tire electronic tag of any one of claims 1-10, comprising the steps of:
step one, bonding a metal layer on the bottom surface of a PEN or PI or PEEK or PPS or PEI or PAI film layer through an epoxy resin adhesive layer;
comprises the following sub-steps:
step one comprises the following sub-steps:
step A, placing epoxy resin glue into a glue groove of a coating machine, and coating the epoxy resin glue on a PEN or PI or PEEK or PPS or PEI or PAI film layer through the coating machine;
step B, attaching aluminum or copper foil to the bottom surface of the PEN or PI or PEEK or PPS or PEI or PAI film layer coated with the epoxy resin glue to form a metal layer;
step C, curing the epoxy resin glue coated between the PEN or PI or PEEK or PPS or PEI or PAI film layer and the metal layer through an oven to form an epoxy resin glue layer; the temperature of the oven is 80-150 ℃;
etching the surface of the metal layer to form an antenna pattern;
comprises the following sub-steps:
step A1, printing an antenna-like pattern on an aluminum or copper foil surface;
step B1, etching the antenna-shaped pattern, cleaning and etching the antenna-shaped pattern with ink, and forming an antenna pattern on the aluminum or copper foil surface;
manufacturing a positioning substrate by adopting an SMT reflow soldering technology, fixing an RFID chip on the positioning substrate, and coating lead-free solder paste on the end pin position of the RFID chip;
placing the terminal pins of the RFID chip on the wafer body, dispensing lead-free solder paste on the terminal pins of the RFID chip in a CSP (chip size package) flip-chip dispensing mode, and then cutting the wafer;
capturing RFID chips on the wafer in the fourth step in a CSP (chip scale package) pouring mode, and fixing the RFID chips on the antenna pattern in the second step in an SMT (surface mount technology) reflow soldering mode to form an antenna layer; the SMT reflow soldering temperature is 235-260 ℃, and the SMT reflow soldering time is 7-10 minutes;
and step six, coating a vulcanized rubber layer on the bottom surface of the antenna layer.
12. The method for manufacturing the high temperature resistant RFID tire electronic tag of claim 11, wherein step six further comprises the sub-steps of:
step A2, putting the vulcanized glue solution into a glue groove of a coating machine, and making the bottom surface of the antenna layer with the vulcanized glue solution through the coating machine;
step B2, drying the vulcanized rubber solution coated on the bottom surface of the antenna layer through an oven to form a vulcanized rubber layer; the temperature of the oven is 70-95 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710063606.3A CN106845588B (en) | 2017-02-03 | 2017-02-03 | High-temperature-resistant RFID (radio frequency identification) tire electronic tag and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710063606.3A CN106845588B (en) | 2017-02-03 | 2017-02-03 | High-temperature-resistant RFID (radio frequency identification) tire electronic tag and manufacturing method thereof |
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| CN109146042A (en) * | 2017-06-27 | 2019-01-04 | 深圳市方卡科技股份有限公司 | A kind of production method of RFID washing label |
| TWI674205B (en) * | 2018-10-19 | 2019-10-11 | 相豐科技股份有限公司 | An electronic tire tag |
| CN109978121A (en) * | 2019-02-11 | 2019-07-05 | 昆山法拉第智能科技有限公司 | Tire with RFID chip |
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