CN206524304U - Unhairing edge system - Google Patents

Abstract

The utility model provides a kind of unhairing edge system, and it includes：For place wafer to bit platform, the edge of wafer has flash；And laser machine, laser machine is arranged on the side to bit platform, and laser machine projects laser rays with crevice projection angle, and laser machine projects laser rays to remove flash.

Description

Unhairing edge system

Technical field

The utility model is related to semiconductor relative manufacturing process, more particularly to a kind of burr removing that can remove wafer flash System.

Background technology

In field of semiconductor devices, the density of its device is constantly increasing, and its size reduces gradually, with constantly improve Product volume density in the semiconductor subassembly of diversified electronic building brick composition, also allows more components can be while being incorporated into given face In product.

Therefore, wafer-level packaging also begins to development, and in wafer-level packaging, integrated circuit is placed on the load with distribution On body, distribution can be used to connect integrated circuit or other electronic building bricks.Wherein, in the forming process of fan-out-type chip size packages In, component wafer is cut off, and good bare crystalline grain is then chosen from the component wafer cut off and is fixed on carrier, good bare crystalline particle swarm Between the fan-out package tie point that is formed comprising copper post, be then poured into epoxy resin and fill up good naked intercrystalline space, and cover Good bare crystalline particle shape is covered into fan-out-type wafer, then with die casting cured epoxy resin after, manufacture method can be ground to remove Part epoxy and other dielectric materials in copper post.

However, removing unnecessary epoxy resin using grinding manufacturing method therefor, excessive epoxy resin is easily removed, or move Except to cake core is fanned out in itself, causing to be fanned out to the damage of cake core.In addition, in grinding manufacturing method therefor, being fanned out to determining for cake core Position is fixed, it is impossible to carry out the operation of position correction compensation, can be in process of lapping if fan-out-type chip placement locations have deviation In, damage is fanned out to cake core, causes fraction defective to be lifted, and increases manufacturing cost.Therefore, lacking for grinding manufacturing method therefor how is improved Point, needs related dealer and solves.

Utility model content

Based on this, it is necessary to easily damage chip, chip fraction defective height, manufacture when being ground for traditional unhairing edge system The problem of cost is high can avoid excessively removing flash there is provided one kind, reduce fraction defective and produce, improve the burr removing of production efficiency System.

A kind of unhairing edge system, including：

For place the wafer to bit platform, the edge of the wafer has flash；And

Laser machine, the laser machine is arranged on the side to bit platform, and the laser machine is swashed with crevice projection angle projection Light, the laser machine projects the laser rays to remove the flash.

In one of the embodiments, described to have rotational structure to bit platform, the rotational structure can drive the crystalline substance Circle rotation.

In one of the embodiments, the laser machine rotates relative to the bit platform.

In one of the embodiments, the utility model also has alignment device, and the alignment device is arranged on described right Side of the bit platform away from the laser machine, offset of the alignment device to confirm the wafer.

In one of the embodiments, the offset is the external diameter spacing of the external diameter to bit platform and the wafer Deviation, the outside dimension to bit platform is less than the outside dimension of the wafer.

In one of the embodiments, the utility model also has mechanical arm, and the mechanical arm is to mobile described Wafer adjusts the offset.

In one of the embodiments, the alignment device is camera or 2D measuring equipments.

In one of the embodiments, the utility model also has a fan housing, and the fan housing is relative to described to bit platform Top surface is set, and the fan housing is with described to bit platform interval activity distance, and the fan housing can be relative to described to bit platform Operating range described in axial lift adjustment.

In one of the embodiments, the wafer is provided with multiple chips at equal intervals, and the cover scope of the fan housing is each The chip setting area.

In one of the embodiments, the crevice projection angle and the axial angle to bit platform are 45 degree.

The utility model has the following effects that：After wafer is moved to by mechanical arm, and bit platform is placed, laser machine with Crevice projection angle projects laser rays to remove flash, removes flash with crevice projection angle projection laser rays, can avoid excessively removing flash, Wafer is damage in itself, to reduce fraction defective generation；Meanwhile, with laser burr removing mode, when can reduce the processing of manufacture method Between, improve the efficiency of manufacture method.

In addition, confirming the offset of wafer by alignment device, it is with the center to bit platform with the center for determining wafer It is no identical, if when unequal, can be corrected, damaged with reducing the wafer produced by position error when manufacturing and processing Wound, to improve the processing precision of manufacture method.

Brief description of the drawings

Fig. 1 is the utility model burr removing system schematic (one).

Fig. 2 is the utility model burr removing system schematic (two), represents that fan housing is fallen, laser machine is projected with crevice projection angle Laser rays simultaneously removes flash.

Fig. 3 is Fig. 2 partial enlarged drawings.

Fig. 4 is the wafer close-up schematic view for removing Burr removal.

Fig. 5 is confirmation side-play amount schematic diagram.

Embodiment

In order that the purpose of this utility model, technical scheme and technique effect are more clearly understood, below in conjunction with accompanying drawing pair Specific embodiment of the utility model is described.It should be appreciated that specific embodiment described herein is only to explain this reality With new, it is not used to limit the utility model.

Refer to shown in Fig. 1 to Fig. 5, the utility model provides a kind of unhairing edge system, and it is included：

To bit platform 10, it has table top 11 and rotational structure 12, and rotational structure 12 can drive wafer 1 to rotate, wherein, rotation Rotation structure 12 can be driven rotary shaft or power source to drive rotary shaft to rotate by motor, in the utility model embodiment, table top 11 Linked with rotational structure 12, rotational structure 12 can drive table top 11 to rotate, table top 11 has oppositely arranged top 111 and bottom 112, the top 111 of table top 11 is placed with for wafer 1, and wafer 1 can be driven to rotate bit platform 10, wherein, the side of wafer 1 Multiple chips 3 that edge has flash 2 and set at equal intervals.In addition, in another embodiment of the utility model, rotational structure 12 with Wafer 1 is linked, and rotational structure 12 drives wafer 1 to be rotated relative to table top 11.

Specifically, having offset D between the external diameter of table top 11 and the external diameter of wafer 1, in the utility model, table top 11 is Toroidal, wafer 1 is toroidal, if the center of table top 11 and the center of wafer 1 are concentric circles, offset D is equal；If The center of table top 11 and the center of wafer 1 are not concentric circles, then offset D is unequal, wherein, offset D is according to the different chis of wafer 1 It is very little different.

Laser machine 20 is arranged at the side to bit platform 10, in the utility model, and laser machine 20 is relative to table top 11 Top 111 is set, and is separated by setting height with the top 111 of table top 11, and laser machine 20 projects laser rays with crevice projection angle A 21, after wafer 1 is moved to table top 11 by mechanical arm 30 to be placed, drive wafer 1 to rotate bit platform 10, while laser machine 20 Laser rays 21 is projected to remove flash 2, wherein, mechanical arm 30 can set different type of machines according to demand.Wherein, set height can Adjusted according to use demand, laser machine 20 can be made to project crevice projection angle A laser rays 21 to the flash 2 of wafer 1, moved The program of Burr removal 2, and the axial angle of crevice projection angle A and rotational structure 12 is in 45 degree, with crevice projection angle A by the flash 2 of wafer 1 Remove, only remove unnecessary flash 2, processing in manufacture method can be avoided excessively to injure wafer 1 itself, manufacture method is lifted Machining accuracy, reduce fraction defective produce, refer to shown in Fig. 3 and Fig. 4.

In the utility model another embodiment, after wafer 1 is moved to table top 11 by mechanical arm 30 to be placed, laser Machine 20 rotates relative to bit platform 10, and in rotary course, laser machine 20 projects laser rays 21 by hair with crevice projection angle A Side 2 is removed.

Alignment device 40, is arranged on to side of the bit platform 10 away from laser machine 20, alignment device 40 be camera or One kind in 2D measuring equipments, and 2D measuring equipments can be infrared equipment, Photoinduction device etc., alignment device 40 is to true Recognize the offset of wafer 1, the marginal position of wafer 1 is measured by alignment device 40, to calculate the offset of wafer 1.Wherein, When alignment device 40 is photographed on the top 111 of table top 11, the outside dimension of table top 11 is more than the outside dimension of wafer 1, to confirm two Offset D between person's external diameter；When alignment device 40 is photographed on the side of table top 11, it can confirm that wafer 1 apart from the depth of table top 11 Offset D；When alignment device 40 is photographed on the bottom 112 of table top 11, crystalline substance is less than to the outside dimension of table top 11 of bit platform 10 The outside dimension of circle 1, to confirm the offset D between both external diameters.

In the utility model embodiment, alignment device 40 be camera, alignment device 40 have phtographic lens 41 and Display screen (not shown), in the utility model, phtographic lens 41 is located at the bottom 112 of table top 11, and phtographic lens 41 is used To shoot to the offset D between the external diameter of bit platform 10 and the external diameter of wafer 1, and picture is shown on the display screen, work as platform When offset D between face 11 and wafer 1 is unequal, represents that both are not concentric circles, then offset is adjusted by mechanical arm 30 D, makes the offset D between table top 11 and wafer 1 equal, it is to avoid because of eccentricity issues, cause the processing of follow-up manufacture method to damage brilliant Circle 1, to lift the machining accuracy of manufacture method.

Fan housing 50, relative to the top surface setting to bit platform 10, in the utility model, fan housing 50 is relative to table top 11 Top 111 is set, and fan housing 50 is spaced an operating range with the table top 11 to bit platform 10, and fan housing 50 can be relative to rotational structure 12 axial lift adjustment operating range, the cover scope of fan housing 50 is each setting area of chip 3.

Possess operating range L between fan housing 50 and table top 11, mechanical arm 30 may move the top that wafer 1 moves to table top 11 111 or wafer 1 is moved away from by top 111；When fan housing 50 is fallen close to table top 11, its operating range L is adjusted to operating range L ', Wherein, injection dried and clean air or nitrogen in fan housing 50, make fan housing 50 produce toward one of the direction of wafer 1 air-flow, and air-flow The smog produced when can be by the dust particale or laser between each chip 3 is blown away, and keeps relative malleation by air-flow, and then is kept Wafer 1 is cleaned.In addition, in the utility model, distance between operating range L and table top 11 can be according to the processing journey of manufacture method Sequence is adjusted, and is separated by 1mm to 10mm between operating range L ' and each chip 3.

By to bit platform 10, alignment device 40 and mechanical arm 30, before Laser Processing, first confirm or adjust offset D, if offset D is unequal, represents that to bit platform 10 and wafer 1 ' be not concentric circles, then can be by mechanical arm 30 to wafer 1 ' positioning and offset D correction, until wafer 1 ' is adjusted to wafer 1 with being concentric circles to bit platform 10, remake follow-up manufacture Processing, to reduce because of position error, and the wafer 1 produced when manufacturing processing is damaged, accurate with the processing for improving manufacture method Degree.

In addition, projecting laser rays 21 by laser machine 20 with crevice projection angle A, the flash 2 of wafer 1 is removed, makes wafer 1 in system Make in the processing of method, it is to avoid injure wafer 1 itself, to possess the scope of script wafer 1, by this operation, lift manufacturer The machining accuracy of method, and procedure and the time of manufacture method can be shortened, lift the efficiency of manufacture method.

Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, the scope of this specification record is all considered to be.

Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that for the common skill of this area For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to Protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (10)

1. a kind of unhairing edge system, it is characterised in that including：

For place wafer to bit platform, the edge of the wafer has flash；And

Laser machine, the laser machine is arranged on the side to bit platform, and the laser machine projects laser rays with crevice projection angle, The laser machine projects the laser rays to remove the flash.

2. unhairing edge system according to claim 1, it is characterised in that described have rotational structure to bit platform, described Rotational structure can drive the wafer to rotate.

3. unhairing edge system according to claim 1, it is characterised in that the laser machine can be flat relative to the contraposition Platform rotates.

4. unhairing edge system according to claim 1, it is characterised in that also with alignment device, the alignment device is set Put described to side of the bit platform away from the laser machine, offset of the alignment device to confirm the wafer.

5. unhairing edge system according to claim 4, it is characterised in that the offset is the external diameter to bit platform The range difference between the external diameter of the wafer, the outside dimension to bit platform is less than the outside dimension of the wafer.

6. the unhairing edge system according to claim 4 or 5, it is characterised in that also with mechanical arm, the mechanical arm To the mobile wafer or the adjustment offset.

7. unhairing edge system according to claim 4, it is characterised in that the alignment device is that camera or 2D are measured Device.

8. unhairing edge system according to claim 1, it is characterised in that also with fan housing, the fan housing is relative to described The top surface of bit platform is set, the fan housing with it is described to bit platform interval activity distance, the fan housing can be relative to described To operating range described in the axial lift adjustment of bit platform.

9. unhairing edge system according to claim 8, it is characterised in that the wafer is provided with multiple chips, institute at equal intervals The cover scope for stating fan housing is each chip setting area.

10. unhairing edge system according to claim 1, it is characterised in that the crevice projection angle system with it is described to bit platform Axial angle be 45 degree.