CN108428614A - Unhairing edge system and burr removing method - Google Patents
Unhairing edge system and burr removing method Download PDFInfo
- Publication number
- CN108428614A CN108428614A CN201710080313.6A CN201710080313A CN108428614A CN 108428614 A CN108428614 A CN 108428614A CN 201710080313 A CN201710080313 A CN 201710080313A CN 108428614 A CN108428614 A CN 108428614A
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- wafer
- bit platform
- offset
- fan housing
- laser machine
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of unhairing edge system of present invention offer and burr removing method comprising：For place wafer to bit platform, the edge of wafer has flash；And laser machine, laser machine are arranged in the side to bit platform, laser machine projects laser rays with crevice projection angle, wherein laser machine projects laser rays to remove flash.When operation, wafer is placed on to bit platform, there is rotational structure, wafer to have flash bit platform；Rotational structure drives wafer rotation, confirms whether the offset of crystal round fringes is equal by alignment device；When offset is equal, laser machine projects laser rays with crevice projection angle and removes flash.
Description
Technical field
The present invention relates to semiconductor relative manufacturing process more particularly to it is a kind of can be by unhairing edge system that wafer flash removes
And burr removing method.
Background technology
In field of semiconductor devices, the density of device is constantly increasing, and its size reduces gradually, with constantly improve
Product volume density in the semiconductor subassembly of diversified electronic building brick composition, also allows more components that can be incorporated into given face simultaneously
In product.
Therefore, wafer-level packaging also begins to develop, and in wafer-level packaging, integrated circuit is placed on the load with wiring
On body, wiring can be used to connect integrated circuit or other electronic building bricks.Wherein, in the forming process of fan-out-type chip size packages
In, component wafer is cut off, then from good bare crystalline grain is chosen in the component wafer cut off fixed on carrier, good bare crystalline particle swarm
Between comprising copper post be formed by fan-out package tie point, be then poured into epoxy resin and fill up good naked intercrystalline space, and cover
Good bare crystalline particle shape is covered into fan-out-type wafer, then with die casting cured epoxy resin after, manufacturing method can be ground to remove
Part epoxy in copper post and other dielectric materials.
However, removing extra epoxy resin using grinding manufacturing method therefor, it is easy to remove excessive epoxy resin, or move
Except to cake core itself is fanned out to, causing the damage for being fanned out to cake core.In addition, in grinding manufacturing method therefor, it is fanned out to determining for cake core
Position is fixed, can not carry out the operation of position correction compensation, can be in process of lapping if fan-out-type chip placement locations have deviation
In, damage is fanned out to cake core, and fraction defective is caused to be promoted, and increases manufacturing cost.Therefore, how to improve lacking for grinding manufacturing method therefor
Point needs related dealer and solves.
Invention content
Based on this, it is high that chip, chip fraction defective height, manufacturing cost are easy to damage when being ground for traditional burr removing method
The problem of, providing one kind can avoid excessively removing flash, reduce fraction defective generate, improve production efficiency unhairing edge system and
Burr removing method.
A kind of unhairing edge system, including：
For place wafer to bit platform, the edge of the wafer has flash；And
Laser machine, the laser machine are arranged in the side to bit platform, and the laser machine is swashed with crevice projection angle projection
Light, the laser machine project the laser rays to remove the flash.
It is described in one of the embodiments, to there is rotational structure, the rotational structure drive the crystalline substance bit platform
Circle rotation.
The laser machine is rotated relative to the bit platform in one of the embodiments,.
The present invention also has alignment device, the alignment device setting flat in the contraposition in one of the embodiments,
Side of the platform far from the laser machine, the alignment device is confirming the offset of the wafer.
The offset is the outer diameter spacing of the outer diameter to bit platform and the wafer in one of the embodiments,
Deviation, the outer diameter to bit platform are less than the outer diameter of the wafer.
The present invention also has mechanical arm in one of the embodiments, and the mechanical arm is to the movement wafer
Or the adjustment offset.
The alignment device is camera or 2D measuring equipments in one of the embodiments,.
The present invention also has fan housing in one of the embodiments, and the fan housing is relative to the top surface to bit platform
Setting, the fan housing with it is described to bit platform interval activity distance, the fan housing can be relative to the axial direction to bit platform
Operating range described in lift adjustment, the wafer are equipped with multiple chips, ranging from each core of cover of the fan housing at equal intervals
Piece setting area.
The crevice projection angle and the axial angle to bit platform are 45 degree in one of the embodiments,.
For the purpose for reaching above-mentioned, the present invention also provides a kind of burr removing methods, include the following steps：
Wafer is placed on to bit platform, it is described to there is rotational structure, the wafer to have flash bit platform；The rotation
Rotation structure drives the wafer rotation, confirms whether the offset of the crystal round fringes is equal by alignment device；And it is described
When offset is equal, laser machine projects laser rays with crevice projection angle and removes the flash.
In one of the embodiments, when the offset is unequal, the rotational structure stops rotating, and passes through machinery
Arm moves the wafer, adjusts the offset.
In one of the embodiments, by the wafer be placed on it is described to bit platform before, it is flat that fan housing lifts away from the contraposition
Platform adjusts the fan housing and the operating range between bit platform, provides the space that the mechanical arm places the wafer.
In one of the embodiments, when the wafer be placed on it is described to bit platform after, the fan housing downgrades the work
Dynamic distance, and the multiple chip ranges being equipped in the wafer are covered, the fan housing generates the air-flow toward the wafer direction.
The alignment device is camera or 2D measuring equipments in one of the embodiments,.
The present invention has the following effects that：After wafer is moved to by mechanical arm to be placed to bit platform, laser machine is to project
Angle projects laser rays to remove flash, removes flash with crevice projection angle projection laser rays, can avoid excessively removing flash, damage
To wafer itself, to reduce fraction defective generation；Meanwhile with laser burr removing mode, the process time of manufacturing method can be reduced, is carried
The efficiency of high manufacturing method.
In addition, the offset of wafer is confirmed by alignment device, to determine that the center of wafer is with the center to bit platform
It is no identical, if when unequal, can be corrected, the wafer generated when processing damage is being manufactured due to position error to reduce
Wound, to improve the processing precision of manufacturing method.
Description of the drawings
Fig. 1 is burr removing system schematic (one) of the present invention.
Fig. 2 is burr removing system schematic (two) of the present invention, indicates that fan housing is fallen, laser machine projects laser with crevice projection angle
Line simultaneously removes flash.
Fig. 3 is Fig. 2 partial enlarged views.
Fig. 4 is the wafer close-up schematic view for removing Burr removal.
Fig. 5 is to confirm side-play amount schematic diagram.
Specific implementation mode
In order to make the purpose of the present invention, technical solution and technique effect be more clearly understood, below in conjunction with attached drawing to this hair
Bright specific embodiment is described.It should be appreciated that described herein, specific examples are only used to explain the present invention, and does not have to
It is of the invention in limiting.
It please referring to Fig.1 to shown in Fig. 5, the present invention provides a kind of unhairing edge system, it includes：
To bit platform 10, with table top 11 and rotational structure 12, rotational structure 12 can drive wafer 1 to rotate, wherein rotation
Rotation structure 12 can be driven rotary shaft or power source to drive rotary shaft rotation by motor, in embodiments of the present invention, table top 11 and rotation
Rotation structure 12 links, and rotational structure 12 can drive table top 11 to rotate, and table top 11 has oppositely arranged top 111 and bottom 112,
The top 111 of table top 11 is placed with for wafer 1, and wafer 1 can be driven to rotate bit platform 10, wherein the edge of wafer 1 has
The multiple chips 3 for having flash 2 and being arranged at equal intervals.In addition, in an alternative embodiment of the invention, rotational structure 12 and 1 chain of wafer
It connects, rotational structure 12 drives wafer 1 to be rotated relative to table top 11.
Specifically, having offset D between the outer diameter and the outer diameter of wafer 1 of table top 11, in the present invention, table top 11 is circle
Shape, wafer 1 are round, if the center of table top 11 and the center of wafer 1 are concentric circles, offset D is equal；If table top
11 center and the center of wafer 1 are not concentric circles, then offset D is unequal, wherein offset D has according to 1 size of different wafers
Institute is different.
Laser machine 20 is set to the side to bit platform 10, and in embodiments of the present invention, laser machine 20 is relative to table top 11
Top 111 be arranged, and be separated by a setting height with the top of table top 11 111, laser machine 20 projects laser rays with crevice projection angle A
21, after wafer 1 is moved to table top 11 by mechanical arm 30 to be placed, drive wafer 1 to rotate bit platform 10, while laser machine 20
Laser rays 21 is projected to remove flash 2, wherein different type of machines can be arranged in mechanical arm 30 according to demand.Wherein, setting height can
It is adjusted according to use demand, laser machine 20 can be enabled to project the laser rays 21 of crevice projection angle A to the flash 2 of wafer 1, moved
2 program of Burr removal, and the axial angle of crevice projection angle A and rotational structure 12 is in 45 degree, with crevice projection angle A by the flash 2 of wafer 1
It removes, only removes extra flash 2, can excessively injure wafer 1 itself to avoid being processed in manufacturing method, promote manufacturing method
Machining accuracy, reduce fraction defective generate, please refer to shown in Fig. 3 and Fig. 4.
In another embodiment of the invention, after wafer 1 is moved to table top 11 by mechanical arm 30 to be placed, laser machine 20
It is rotated relative to bit platform 10, and in rotary course, laser machine 20 projects laser rays 21 by flash 2 with crevice projection angle A
It removes.
Alignment device 40 is arranged to side of the bit platform 10 far from laser machine 20, alignment device 40 be camera or
One kind in 2D measuring equipments, and 2D measuring equipments can be infrared equipment, Photoinduction device etc., alignment device 40 is to true
The offset for recognizing wafer 1 measures the marginal position of wafer 1 by alignment device 40, to calculate the offset of wafer 1.Wherein,
When alignment device 40 is photographed on the top 111 of table top 11,11 outer diameter of table top is more than the outer diameter of wafer 1, to confirm two
Offset D between person's outer diameter；When alignment device 40 is photographed on the side of table top 11, it can be confirmed wafer 1 apart from 11 depth of table top
Offset D；When alignment device 40 is photographed on the bottom 112 of table top 11, crystalline substance is less than to 11 outer diameter of table top of bit platform 10
The outer diameter of circle 1, to confirm the offset D between the two outer diameter.
In embodiments of the present invention, alignment device 40 is camera, and alignment device 40 has phtographic lens 41 and display
Screen (not shown), in the present invention, phtographic lens 41 are located at the bottom 112 of table top 11, and phtographic lens 41 is shooting pair
Offset D between the outer diameter and the outer diameter of wafer 1 of bit platform 10, and picture is shown on the display screen, when table top 11 and crystalline substance
When offset D between circle 1 is unequal, indicates that the two is not concentric circles, then offset D is adjusted by mechanical arm 30, make table top
Offset D between 11 and wafer 1 is equal, avoids causing because of eccentricity issues the processing of follow-up manufacturing method from damaging wafer 1, to carry
Rise the machining accuracy of manufacturing method.
Fan housing 50, relative to the top surface setting to bit platform 10, in the present invention, top of the fan housing 50 relative to table top 11
111 settings, and fan housing 50 is spaced an operating range with the table top 11 to bit platform 10, fan housing 50 can be relative to rotational structure 12
Axial lift adjustment operating range, ranging from each 3 setting area of chip of cover of fan housing 50.
Possess operating range L between fan housing 50 and table top 11, mechanical arm 30 moves the top that wafer 1 moves to table top 11
111 or wafer 1 is moved away from by top 111；When fan housing 50 is fallen close to table top 11, operating range L is adjusted to operating range L ',
Wherein, injection dried and clean air or nitrogen in fan housing 50, make fan housing 50 generate toward one of 1 direction of wafer air-flow, and air-flow
The smog generated when can be by dust particale or laser between each chip 3 is blown away, and keeps opposite positive pressure by air-flow, and then is kept
Wafer 1 cleans.In addition, in the present invention, operating range L between table top 11 at a distance from can be made according to the processing program of manufacturing method
Adjustment, and it is separated by 1mm to 10mm between operating range L ' and each chip 3.
It please refers to Fig.1 to shown in Fig. 5, the embodiment of the present invention provides a kind of burr removing method, and it includes following steps：
Refering to Figure 1, fan housing 50 keeps operating range L with to the table top 11 of bit platform 10, when do not keep activity away from
When from L, then fan housing 50 is lifted away from and bit platform 10 is adjusted to enough operating range L, wafer is placed to provide mechanical arm 30
1 space.
It please refers to shown in Fig. 2, after wafer 1 is placed on the table top 11 to bit platform 10 by mechanical arm 30, fan housing 50
Operating range L ' is downgraded from operating range L, and is covered in 3 range of each chip.
Please refer to Fig.1 and Fig. 5 shown in, to bit platform 10 drive wafer 1 rotate, pass through the phtographic lens 41 of alignment device 40
Shooting confirms whether offset D is equal.When showing that screen shows that offset D is unequal, it is illustrated in figure 5 the wafer of dotted line
1 ', it indicates that wafer 1 ' and table top 11 are not concentric circles, then stops rotating to bit platform 10, wafer is moved by mechanical arm 30
1 ', offset D is adjusted, until wafer 1 ' is adjusted to the wafer 1 for being illustrated in figure 5 solid line presentation, expression wafer 1 is in table top 11
Concentric circles.
It please refers to shown in Fig. 3 and Fig. 4, after confirming that offset D is equal, wafer 1 is driven to rotate again to bit platform 10, and
Fan housing 50 persistently sends out air-flow toward 3 direction of each chip, rotates simultaneously in wafer 1, is swashed with crevice projection angle A projections by laser machine 20
Light 21 and the flash 2 for removing wafer 1.
In an alternative embodiment of the invention, after confirming that offset D is equal, fan housing 50 persistently sends out air-flow toward each chip 3
Direction, and laser machine 20 is rotating simultaneously relative to being rotated to bit platform 10, is swashed with crevice projection angle A projections by laser machine 20
Light 21 and the flash 2 for removing wafer 1.
By to bit platform 10, alignment device 40 and mechanical arm 30, before laser processing, first confirming or adjusting offset
D indicates that bit platform 10 and wafer 1 ' be not concentric circles if offset D is unequal, then can be by mechanical arm 30 to wafer
1 ' positioning and offset D correction, until wafer 1 ' adjust to wafer 1 with to bit platform 10 be concentric circles, remake follow-up manufacture
Processing to reduce because of position error, and is damaged manufacturing the wafer 1 that the when of processing generates, accurate with the processing for improving manufacturing method
Degree.
In addition, projecting laser rays 21 by laser machine 20 with crevice projection angle A, the flash 2 of wafer 1 is removed, wafer 1 is made to make
It makes in the processing of method, avoids injuring wafer 1 itself, to possess 1 range of script wafer, by this operation, promote manufacturer
The machining accuracy of method, and processing program and the time of manufacturing method can be shortened, promote the efficiency of manufacturing method.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (14)
1. a kind of unhairing edge system, which is characterized in that including：
For place wafer to bit platform, the edge of the wafer has flash；And
Laser machine, the laser machine are arranged in the side to bit platform, and the laser machine projects laser rays with crevice projection angle,
The laser machine projects the laser rays to remove the flash.
2. unhairing edge system according to claim 1, which is characterized in that it is described that there is rotational structure to bit platform, it is described
Rotational structure can drive the wafer to rotate.
3. unhairing edge system according to claim 1, which is characterized in that the laser machine can be flat relative to the contraposition
Platform rotates.
4. unhairing edge system according to claim 1, which is characterized in that also have alignment device, the alignment device to set
It sets described to side of the bit platform far from the laser machine, the alignment device is confirming the offset of the wafer.
5. unhairing edge system according to claim 4, which is characterized in that the offset is the outer diameter to bit platform
The range difference between the outer diameter of the wafer, the outer diameter to bit platform are less than the outer diameter of the wafer.
6. unhairing edge system according to claim 4 or 5, which is characterized in that also have mechanical arm, the mechanical arm
To the movement wafer or the adjustment offset.
7. unhairing edge system according to claim 4, which is characterized in that the alignment device is that camera or 2D are measured
Device.
8. unhairing edge system according to claim 1, which is characterized in that also there is fan housing, the fan housing is relative to described
To the setting of the top surface of bit platform, the fan housing with it is described to bit platform interval activity distance, the fan housing can be relative to described
Operating range described in axial lift adjustment to bit platform, the wafer are equipped with multiple chips, the cover of the fan housing at equal intervals
Ranging from each chip setting area.
9. unhairing edge system according to claim 1, which is characterized in that the crevice projection angle and the axis to bit platform
It it is 45 degree to angle.
10. a kind of burr removing method, includes the following steps：
Wafer is placed on to bit platform, it is described to there is rotational structure, the wafer to have flash bit platform；
The rotational structure drives the wafer rotation, by alignment device confirm the crystal round fringes offset whether phase
Deng；And
When the offset is equal, the laser machine projects laser rays with crevice projection angle and removes the flash.
11. burr removing method according to claim 10, which is characterized in that when the offset is unequal, the rotation
Rotation structure stops rotating, and moves the wafer by mechanical arm, adjusts the offset.
12. burr removing method according to claim 10, which is characterized in that be placed on the wafer described to bit platform
Before, fan housing lifts away from described to bit platform, adjusts the fan housing and the operating range between bit platform, provides the manipulator
Arm places the space of the wafer.
13. burr removing method according to claim 10, which is characterized in that when the wafer be placed on it is described to bit platform
Afterwards, fan housing downgrades the operating range, and covers in multiple chip ranges that the wafer is equipped with, and the fan housing is generated toward institute
State the air-flow in wafer direction.
14. burr removing method according to claim 10, which is characterized in that the alignment device is camera or 2D amounts
Survey device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710080313.6A CN108428614A (en) | 2017-02-15 | 2017-02-15 | Unhairing edge system and burr removing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710080313.6A CN108428614A (en) | 2017-02-15 | 2017-02-15 | Unhairing edge system and burr removing method |
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| Publication Number | Publication Date |
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| CN108428614A true CN108428614A (en) | 2018-08-21 |
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ID=63155341
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| CN201710080313.6A Pending CN108428614A (en) | 2017-02-15 | 2017-02-15 | Unhairing edge system and burr removing method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007324368A (en) * | 2006-06-01 | 2007-12-13 | Sekisui Chem Co Ltd | Substrate circumference treating apparatus and method therefor |
| JP2008283054A (en) * | 2007-05-11 | 2008-11-20 | Hitachi High-Technologies Corp | Wafer edge cleaner |
| CN103346108A (en) * | 2013-06-27 | 2013-10-09 | 上海华力微电子有限公司 | Device and method for improving smoothness of wafer edge |
| CN104091772A (en) * | 2014-07-11 | 2014-10-08 | 上海华力微电子有限公司 | Wafer edge amorphous carbon thin film removing device and method |
| JP2016129194A (en) * | 2015-01-09 | 2016-07-14 | 株式会社ディスコ | Wafer processing method |
-
2017
- 2017-02-15 CN CN201710080313.6A patent/CN108428614A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007324368A (en) * | 2006-06-01 | 2007-12-13 | Sekisui Chem Co Ltd | Substrate circumference treating apparatus and method therefor |
| JP2008283054A (en) * | 2007-05-11 | 2008-11-20 | Hitachi High-Technologies Corp | Wafer edge cleaner |
| CN103346108A (en) * | 2013-06-27 | 2013-10-09 | 上海华力微电子有限公司 | Device and method for improving smoothness of wafer edge |
| CN104091772A (en) * | 2014-07-11 | 2014-10-08 | 上海华力微电子有限公司 | Wafer edge amorphous carbon thin film removing device and method |
| JP2016129194A (en) * | 2015-01-09 | 2016-07-14 | 株式会社ディスコ | Wafer processing method |
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Application publication date: 20180821 |