CN206490087U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
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- CN206490087U CN206490087U CN201621445076.6U CN201621445076U CN206490087U CN 206490087 U CN206490087 U CN 206490087U CN 201621445076 U CN201621445076 U CN 201621445076U CN 206490087 U CN206490087 U CN 206490087U
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Abstract
The utility model discloses a kind of LED encapsulation structure, including support, LED wafer and packaging silicon rubber, LED wafer is arranged on support, packaging silicon rubber is coated in LED wafer, the positive and negative electrode of LED wafer is connected by packaging line and support, soldered ball is respectively equipped with the positive and negative electrode of LED wafer, if the upper surface of LED wafer is the reference plane of the bank of packaging line, the height of bank is more than 150um, the point referred to as solder joint that one end of bank is in contact with soldered ball, point in solder joint orthographic projection to LED wafer is referred to as subpoint, by solder joint and the line vertical with LED wafer is referred to as normal, it is 15 degree to 45 degree to pass through the tangent line of solder joint and the angle of normal on bank, it is between subpoint and LED wafer center that bank orthographic projection is at least part of to the line formed in LED wafer.The utility model effectively alleviates the tension force of gold thread in thermal shock, so that product is more difficult to dead lamp in thermal shock, lifts the cold-resistant thermal shock resistance properties of whole lamp bead.Substantially improve the life-span in LED product actual use.
Description
Technical field
The utility model is related to LED encapsulation technologies field, particularly a kind of LED encapsulation structure.
Background technology
With the rapid development of economy, energy crisis becomes increasingly conspicuous, energy shortage problem has turned into restricts our economic hairs
The shortage of the bottleneck of exhibition, especially fossil energy brings very big influence to our modern industries and people's lives.In the energy
In consumption, illumination is the second largest consumption field for being only second to industrial energy consumption.Thus implement energy-saving and emission-reduction in illuminating industry
It is imperative.Therefore, explosive growth trend was presented in LED illumination, it is contemplated that by 2017, global LED illumination production value
Will be more than 6,00000000000 yuan.
Compared to conventional light source, LED illumination has the features such as small volume, energy-conservation, long lifespan, high brightness are environmentally friendly, is passing through
After the continued operation of 50000 hours, moreover it is possible to maintain more than the 60% of initial lamp brightness.But at present in actual use, LED lamp
Not up to even much not up to just occurring in that dead lamp within 50000 hours.The reason for dead lamp occur is that LED product is normally being transported
During defeated, use, temperature change when external environment or LED switch is subjected to, due to LED lamp bead packaging plastic and leading
Glue produces stress to line when both lines thermal coefficient of expansion difference causes to expand with heat and contract with cold, so as to produce broken string and dead lamp.
The content of the invention
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art and provide a kind of LED encapsulation knot
Structure encapsulates new bank bonding wire mode there is provided a kind of LED, so that the proof stress ability of lifting lead wire, lifts the reality of LED product
Service life.
The utility model uses following technical scheme to solve above-mentioned technical problem：
According to the utility model proposes a kind of LED encapsulation structure, including support, LED wafer and packaging silicon rubber, LED is brilliant
Piece is arranged on support, and packaging silicon rubber is coated in LED wafer, and the positive and negative electrode of LED wafer is connected by packaging line and support,
Soldered ball is respectively equipped with the positive and negative electrode of LED wafer, if the upper surface of LED wafer is the reference plane of the bank of packaging line, bank
Height be more than point in 150um, the point referred to as solder joint that one end of bank is in contact with soldered ball, solder joint orthographic projection to LED wafer
Referred to as subpoint, is referred to as the tangent line and the folder of normal on normal, bank by solder joint by solder joint and the line vertical with LED wafer
Angle is 15 degree to 45 degree, and at least part of line formed in bank orthographic projection to LED wafer is in subpoint and LED wafer
Between center.
As a kind of further prioritization scheme of LED encapsulation structure described in the utility model, the height of bank is less than
200um。
As a kind of further prioritization scheme of LED encapsulation structure described in the utility model, packaging line is gold thread.
As a kind of further prioritization scheme of LED encapsulation structure described in the utility model, the purity of gold thread is higher than 20%.
As a kind of further prioritization scheme of LED encapsulation structure described in the utility model, fluorescence is included in packaging silicon rubber
Powder.
The utility model uses above technical scheme compared with prior art, with following technique effect：Gold thread bank work
It can continue more long, to greatly improve after modified technique before the proof stress ability of the effective lifting lead wire of improvement of skill, broken string
The actual life of LED product.
Brief description of the drawings
Fig. 1 is encapsulating structure schematic diagram of the present utility model.
Reference in figure is construed to：10- supports, 20- chips, 30- gold threads, 40- packaging silicon rubbers, 50- soldered balls.
Embodiment
The technical solution of the utility model is described in further detail below in conjunction with the accompanying drawings：
Fig. 1 is refer to, is the diagrammatic cross-section of the specific embodiment of LED encapsulation modified technique of the present utility model, specifically
Including：Support 10, LED wafer 20, gold thread 30, packaging silicon rubber (mixed fluorescent powder) 40, soldered ball 50.Soldered ball is gold thread sintering production
It is raw.
A kind of LED encapsulation structure, including support, LED wafer and packaging silicon rubber, LED wafer are arranged on support, encapsulate silicon
Glue is coated in LED wafer, and the positive and negative electrode of LED wafer is connected by packaging line and support, is divided on the positive and negative electrode of LED wafer
Not She You soldered ball, if reference plane of the upper surface of LED wafer for the bank of packaging line, the height of bank is more than 150um, bank
Point in the point referred to as solder joint that one end is in contact with soldered ball, solder joint orthographic projection to LED wafer is referred to as subpoint, by solder joint and with
It is 15 degree to 45 degree that the vertical line of LED wafer, which is referred to as on normal, bank by the tangent line of solder joint and the angle of normal, and bank is just thrown
It is between subpoint and LED wafer center that shadow is at least part of to the line formed in LED wafer.
The height of bank is less than 200um.
Packaging line is gold thread.
The purity of gold thread is higher than 20%.
Fluorescent material can be included in packaging silicon rubber.
The gold thread purity is higher, and wire is strengthened the ability to bear of stress in itself so that LED encapsulation structure reliability adds
By force；
The packaging silicon rubber is under the premise of use requirement is met, from the lower encapsulation silicon of hardness more low thermal coefficient of expansion
Glue, the stress that produces lifts reliability during reduction temperature change, it is ensured that product quality it is reliable and stable.
The utility model effectively improves LED lamp bead cold-and-heat resistent impact property using the gold thread of new structure, passes through control
The height and shape of gold thread bank, effectively alleviate the tension force of gold thread in thermal shock, thus product in thermal shock more
It is difficult to dead lamp, lifts the cold-resistant thermal shock resistance properties of whole lamp bead.Substantially improve the life-span in LED product actual use.
The gold thread of this shape of the utility model can bear more stress, so that lift reliability uses the longevity to improve
Life, this shape of the utility model has little influence on production capacity for LED encapsulation.
In addition to the implementation, it is noted that on the premise of utility model principle is not departed from, some change can also be made
The technical scheme of the embodiment entered and retouched, all use equivalent substitutions or equivalent transformation formation, all falling within the utility model will
In the protection domain asked.
Claims (4)
1. a kind of LED encapsulation structure, it is characterised in that including support, LED wafer and packaging silicon rubber, LED wafer is arranged on support
On, packaging silicon rubber is coated in LED wafer, and the positive and negative electrode of LED wafer is connected by packaging line and support, and LED wafer is just
Soldered ball is respectively equipped with negative electrode, if the upper surface of LED wafer is the reference plane of the bank of packaging line, the height of bank is more than
Point in 150um, the point referred to as solder joint that one end of bank is in contact with soldered ball, solder joint orthographic projection to LED wafer is referred to as subpoint,
By solder joint and the line vertical with LED wafer be referred to as on normal, bank by solder joint tangent line and normal angle be 15 degree extremely
45 degree, at least part of line formed in bank orthographic projection to LED wafer is between subpoint and LED wafer center.
2. a kind of LED encapsulation structure according to claim 1, it is characterised in that the height of bank is less than 200um.
3. a kind of LED encapsulation structure according to claim 1, it is characterised in that packaging line is gold thread.
4. a kind of LED encapsulation structure according to claim 3, it is characterised in that the purity of gold thread is higher than 20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621445076.6U CN206490087U (en) | 2016-12-27 | 2016-12-27 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621445076.6U CN206490087U (en) | 2016-12-27 | 2016-12-27 | A kind of LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206490087U true CN206490087U (en) | 2017-09-12 |
Family
ID=59769678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621445076.6U Active CN206490087U (en) | 2016-12-27 | 2016-12-27 | A kind of LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206490087U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799643A (en) * | 2017-09-29 | 2018-03-13 | 无锡昊瑜节能环保设备有限公司 | A kind of COB LED of double-side for automotive lighting |
| CN108550684A (en) * | 2018-06-16 | 2018-09-18 | 江门市中阳光电科技有限公司 | A kind of LED light source |
| WO2020052240A1 (en) * | 2019-03-27 | 2020-03-19 | 旭宇光电（深圳）股份有限公司 | Led packaging structure |
| CN111864530A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Wire bonding method and optical device |
-
2016
- 2016-12-27 CN CN201621445076.6U patent/CN206490087U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799643A (en) * | 2017-09-29 | 2018-03-13 | 无锡昊瑜节能环保设备有限公司 | A kind of COB LED of double-side for automotive lighting |
| CN108550684A (en) * | 2018-06-16 | 2018-09-18 | 江门市中阳光电科技有限公司 | A kind of LED light source |
| WO2020052240A1 (en) * | 2019-03-27 | 2020-03-19 | 旭宇光电（深圳）股份有限公司 | Led packaging structure |
| CN111864530A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Wire bonding method and optical device |
| CN111864530B (en) * | 2019-04-30 | 2022-04-26 | 深圳市聚飞光电股份有限公司 | Wire bonding method and optical device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180803 Address after: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Patentee after: Wenrui Photoelectric Co., Ltd., Jiangsu Address before: 212009 88 Wei Yi Road, Ding Mao Development Area, Zhenjiang, Jiangsu Patentee before: Jiangsu Wenrun Optoelectronic Technology Co., Ltd. |
|
| TR01 | Transfer of patent right |