CN203628347U - White light LED (light emitting diode) light source assembly - Google Patents
White light LED (light emitting diode) light source assembly Download PDFInfo
- Publication number
- CN203628347U CN203628347U CN201320775840.6U CN201320775840U CN203628347U CN 203628347 U CN203628347 U CN 203628347U CN 201320775840 U CN201320775840 U CN 201320775840U CN 203628347 U CN203628347 U CN 203628347U
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- China
- Prior art keywords
- led
- light
- light source
- white light
- blue chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000843 powder Substances 0.000 claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims description 27
- 238000005538 encapsulation Methods 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000741 silica gel Substances 0.000 claims description 13
- 229910002027 silica gel Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 239000002223 garnet Substances 0.000 claims description 6
- 229910052727 yttrium Inorganic materials 0.000 claims description 6
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 6
- 241000218202 Coptis Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000001354 calcination Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 6
- 239000003292 glue Substances 0.000 abstract 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
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Abstract
The utility model discloses a white light LED (light emitting diode) light source assembly, which comprises a yttrium aluminum garnet fluorescent powder glass substrate, at least one LED blue light chip and a connecting line, wherein the melting point of the substrate is 400 to 600 DEG C, the LED blue light chip is fixedly arranged on the surface of the substrate, in addition, the luminous surface of the LED blue light chip faces the substrate, and the connecting line is used for connecting the LED blue light chip and an external power supply. The white light LED light source assembly has the advantages that the LED glue light chip and the connecting circuit are arranged on the low-melting-point substrate, and the luminous angle limitation of an LED single-side lamp source in the prior art is broken through, so the wide-angle illumination can be realized through a simple manufacturing process, and in addition, the light outlet efficiency is higher; in addition, the melting temperature of the substrate of the white light LED light source assembly is low, no structural damage is caused on the fluorescent powder during the calcination, the glass content total reflection probability when the light is emergent from the fluorescent glass is lower, and the emergent efficiency is higher.
Description
Technical field
The utility model relates to lighting device, particularly relates to a kind of white light LED light source component.
Background technology
LED as the 4th generation lighting source, there is significant energy-conservation and life-span advantage.Along with social development, the lighting energy consumption problem in daily life becomes increasingly conspicuous, and therefore, the LED light fixture with remarkable power savings advantages is more and more subject to people's favor.But because LED luminescence chip belongs to spot light, luminous its light emitting anger that is subject to of LED limits, therefore general LED light fixture adopts LED array single surface light source.The light extraction efficiency of this kind of LED light fixture is not high, makes LED light fixture can not realize wide-angle illumination.
Utility model content
For above-mentioned prior art present situation, technical problem to be solved in the utility model is, a kind of white light LED light source component is provided, and it is luminous that it can realize wide angle, and light extraction efficiency is high.
In order to solve the problems of the technologies described above, a kind of white light LED light source component provided by the utility model, comprise yttrium aluminium garnet fluorescent powder glass basis, at least one LED blue chip and connection line, the fusing point of described matrix is 400-600 ℃, described LED blue chip is fixed on the surface of described matrix, and the light-emitting area of described LED blue chip is towards described matrix, and described connection line is for being connected described LED blue chip with external power source.
In an embodiment, be provided with encapsulation die cavity on the surface of described matrix therein, described LED blue chip sticks in described encapsulation die cavity.
In an embodiment, described LED blue chip is bonded in described encapsulation die cavity by fluorescent powder silica gel therein.
In an embodiment, between described LED blue chip and described encapsulation type cavity wall, be filled with fluorescent powder silica gel therein.
In an embodiment, when described matrix moulding, form described encapsulation die cavity therein, or form described encapsulation die cavity at described matrix surface by extruding a fluorescent powder silica gel cofferdam.
Therein in an embodiment, described connection line comprises two trunk circuit and by parallel described LED blue chip or be connected on the connection gold thread between these two trunk circuit.
In an embodiment, described trunk circuit is printed on described matrix surface and is formed by electrocondution slurry therein.
Compared with prior art, white light LED light source component of the present utility model, by LED blue chip and connection line are set on the matrix of low melting point, break through the lighting angle restriction of prior art LED one side lamp source, thereby with simple manufacturing process, realize wide angle luminous, and there is very high light extraction efficiency; And the matrix melt temperature of this white light LED light source component is low, when calcining, fluorescent material non-structure is destroyed, light is lower at glass content total reflection probability during from fluorescent glass outgoing, and outgoing efficiency is higher.
Accompanying drawing explanation
Fig. 1 is the perspective view of the white light LED light source component in one of them embodiment of the utility model.
Description of reference numerals: in above each figure, 10, white light LED light source component; 11, matrix; 11a, encapsulation die cavity; 12, LED blue chip; 13, trunk circuit; 14, connect gold thread; 15, fluorescent powder silica gel.
The specific embodiment
Also the utility model is elaborated below with reference to accompanying drawing in conjunction with the embodiments.It should be noted that, in the situation that not conflicting, the feature in following embodiment and embodiment can combine mutually.
Figure 1 shows that the perspective view of the white light LED light source component 10 in one of them embodiment of the utility model.White light LED light source component 10 comprises yttrium aluminium garnet fluorescent powder glass basis 11, at least one LED blue chip 12 and connection line, wherein, the fusing point of described matrix 11 is 400-600 ℃, and in described matrix 11, be mixed with the yttrium aluminium garnet fluorescent powder of 0.5-5wt%, described LED blue chip 12 is fixed on the surface of described matrix 11, and the light-emitting area of described LED blue chip 12 is towards described matrix 11, and described connection line is for being connected described LED blue chip 12 with external power source.The blue light that described LED blue chip 12 sends is injected in matrix 11, and activated yttrium aluminum garnet phosphor powder produces white light, and to all directions refraction, thereby with simple manufacturing process, realize wide angle luminous, and there is very high light extraction efficiency.And matrix 11 melt temperatures low (400-600 ℃) of this white light LED light source component 10, destroy fluorescent material non-structure when calcining, light is lower at glass content total reflection probability during from fluorescent glass outgoing, and outgoing efficiency is higher.
More preferably, be provided with encapsulation die cavity 11a on the surface of described matrix 11, described LED blue chip 12 sticks in described encapsulation die cavity 11a.Further, described LED blue chip 12 is bonded in by fluorescent powder silica gel on the inner bottom surface of described encapsulation die cavity 11a, is mixed with the yttrium aluminium garnet fluorescent powder of 5～10wt% in described fluorescent powder silica gel is sticky.Further, between described LED blue chip 12 and described encapsulation die cavity 11a inwall, be filled with fluorescent powder silica gel 15 silica gel, in described fluorescent powder silica gel 15, be mixed with the yttrium aluminium garnet fluorescent powder of 5～10wt%.
Further, when described matrix 11 moulding, form described encapsulation die cavity 11a, or form described encapsulation die cavity 11a on described matrix 11 surfaces by extruding a fluorescent powder silica gel cofferdam.
More preferably, described connection line comprises two trunk circuit 13 and by parallel described LED blue chip 12 or be connected on the connection gold thread 14 between these two trunk circuit 13.Described trunk circuit 13 is printed on upper formation the in described matrix 11 surfaces by electrocondution slurry further.It should be noted that, between the LED blue chip 12 of Fig. 1, be parallel way, but electrical connection between LED blue chip 12 described in the utility model can be by those skilled in the art are usual or can imagine the circuit connecting mode arbitrarily such as parallel connection and/or series connection obtaining.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.
Claims (7)
1. a white light LED light source component, it is characterized in that, comprise yttrium aluminium garnet fluorescent powder glass basis, at least one LED blue chip and connection line, the fusing point of described matrix is 400-600 ℃, described LED blue chip is fixed on the surface of described matrix, and the light-emitting area of described LED blue chip is towards described matrix, and described connection line is for being connected described LED blue chip with external power source.
2. white light LED light source component according to claim 1, is characterized in that, is provided with encapsulation die cavity on the surface of described matrix, and described LED blue chip sticks in described encapsulation die cavity.
3. white light LED light source component according to claim 2, is characterized in that, described LED blue chip is bonded in described encapsulation die cavity by fluorescent powder silica gel.
4. white light LED light source component according to claim 2, is characterized in that, between described LED blue chip and described encapsulation type cavity wall, is filled with fluorescent powder silica gel.
5. white light LED light source component according to claim 2, is characterized in that, forms described encapsulation die cavity when described matrix moulding, or forms described encapsulation die cavity at described matrix surface by extruding a fluorescent powder silica gel cofferdam.
6. according to the white light LED light source component described in any one in claim 1 to 5, it is characterized in that, described connection line comprises two trunk circuit and by parallel described LED blue chip or be connected on the connection gold thread between these two trunk circuit.
7. white light LED light source component according to claim 6, is characterized in that, described trunk circuit is printed on described matrix surface and is formed by electrocondution slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320775840.6U CN203628347U (en) | 2013-11-29 | 2013-11-29 | White light LED (light emitting diode) light source assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320775840.6U CN203628347U (en) | 2013-11-29 | 2013-11-29 | White light LED (light emitting diode) light source assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203628347U true CN203628347U (en) | 2014-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320775840.6U Expired - Fee Related CN203628347U (en) | 2013-11-29 | 2013-11-29 | White light LED (light emitting diode) light source assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203628347U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106838641A (en) * | 2017-02-09 | 2017-06-13 | 上海顿格电子贸易有限公司 | A kind of all-round luminous LED |
-
2013
- 2013-11-29 CN CN201320775840.6U patent/CN203628347U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106838641A (en) * | 2017-02-09 | 2017-06-13 | 上海顿格电子贸易有限公司 | A kind of all-round luminous LED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGDONG ELEC-TECH NVC LIGHTING CO., LTD. Free format text: FORMER OWNER: GUANGDONG ELECTECH INTERNATIONAL INC. Effective date: 20150212 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150212 Address after: 519000 Zhuhai science and technology innovation coastal area of Guangdong high tech Zone, the second phase of the land in the land of J3 block No. 3 plant Patentee after: GUANGDONG DEHAO LEISHI LIGHTING Co.,Ltd. Address before: 4 building, No. six, No. 18, Harbour Road, Tang Wan Town, Zhuhai, Guangdong, 519000 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 519000 Zhuhai science and technology innovation coastal area of Guangdong high tech Zone, the second phase of the land in the land of J3 block No. 3 plant Patentee after: ETI SOLID STATE LIGHTING (ZHUHAI) Ltd. Address before: 519000 Zhuhai science and technology innovation coastal area of Guangdong high tech Zone, the second phase of the land in the land of J3 block No. 3 plant Patentee before: GUANGDONG DEHAO LEISHI LIGHTING Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190918 Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: ELEC-TECH INTERNATIONAL CO.,LTD. Address before: 519000 Zhuhai science and technology innovation coastal area of Guangdong high tech Zone, the second phase of the land in the land of J3 block No. 3 plant Patentee before: ETI SOLID STATE LIGHTING (ZHUHAI) Ltd. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee after: Zhuhai Leishi Lighting Co.,Ltd. Address before: 519000 Guangdong city of Zhuhai province high tech Zone Tangjiawan town Jinfeng Road No. 1 office building on the third floor Room 301 Patentee before: ELEC-TECH INTERNATIONAL Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 |
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| CF01 | Termination of patent right due to non-payment of annual fee |