CN206413310U - Electronic equipment and its construction package - Google Patents
Electronic equipment and its construction package Download PDFInfo
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- CN206413310U CN206413310U CN201720081583.4U CN201720081583U CN206413310U CN 206413310 U CN206413310 U CN 206413310U CN 201720081583 U CN201720081583 U CN 201720081583U CN 206413310 U CN206413310 U CN 206413310U
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- electronic equipment
- ceramic member
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Abstract
The disclosure is directed to a kind of electronic equipment and its construction package.The construction package of the electronic equipment includes：Ceramic member and at least one structural member being engaged with the ceramic member, the ceramic member at the cooperation of at least one structural member with being provided with buffer part.The disclosure is by being molded some buffer parts, and the buffer part is arranged between ceramic member and structural member, so as to can both buffer the active force produced in assembling process, active force when electronic equipment runs into outside macroseism can also be buffered, the drop resistant anti-seismic performance of construction package is improved.
Description
Technical field
The application is related to field of terminal technology, more particularly to a kind of electronic equipment and its construction package.
Background technology
Ceramic material has smooth surface and excellent gripping feel, and has splendid hardness and abrasion resistance, because
And be increasingly being applied in the structure and part of the electronic equipments such as mobile phone, flat board.But, brittleness of ceramics is high, poor toughness
The characteristics of cause ceramics frangible, if ceramic member in electronic equipment is collided, extruded with other structures part, be easily caused pottery
Porcelain piece is chipping, or ceramic member causes to damage to other structures part, so as to limit the application of ceramics in the electronic device
Scope.
Utility model content
The disclosure provides a kind of electronic equipment and its construction package, to solve the deficiency in correlation technique.
According to the first aspect of the embodiment of the present disclosure there is provided the construction package of a kind of electronic equipment, including：
Ceramic member and at least one structural member being engaged with the ceramic member, the ceramic member and at least one described knot
Buffer part is provided with the cooperation of component.
Optionally, the buffer part is arranged at the default cooperation position corresponding to each structural member on the ceramic member surface
Put.
Optionally, the buffer part is arranged at the default cooperation position corresponding to the ceramic member on each structural member surface
Put.
Optionally, the buffer part uses the material with shock-absorbing capacity to manufacture.
Optionally, the buffer part by be applied to the ceramic member and/or the structural member matching surface it is gluing
Formed after layer solidification.
Optionally, the material of the structural member is ceramics or non-ceramic.
According to the second aspect of the embodiment of the present disclosure, the disclosure provides a kind of electronic equipment, including：
Electronic devices structure component as any one of above-mentioned embodiment；
Or, the electronic equipment of the electronic devices structure component processing technology manufacture as any one of above-mentioned embodiment
Construction package.
From above-described embodiment, the disclosure by being molded some buffer parts, and by the buffer part be arranged at ceramic member with
Between structural member, so as to can both buffer the active force produced in assembling process, electronic equipment can also be buffered and run into outside by force
Active force during shake, improves the drop resistant anti-seismic performance of construction package.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary and explanatory, not
The disclosure can be limited.
Brief description of the drawings
Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows the implementation for meeting the disclosure
Example, and be used to together with specification to explain the principle of the disclosure.
Fig. 1 is the construction package schematic diagram of a kind of electronic equipment shown in the exemplary embodiment of the application one.
Fig. 2 is the profile of construction package shown in Fig. 1 in the assembled condition.
Fig. 3 is the flow of the processing technology of the construction package of a kind of electronic equipment according to an exemplary embodiment
Figure.
Fig. 4 is the flow of the processing technology of the construction package of another electronic equipment according to an exemplary embodiment
Figure.
Fig. 5 is the flow of the processing technology of the construction package of another electronic equipment according to an exemplary embodiment
Figure.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects be described in detail in claims, the application.
It is the purpose only merely for description specific embodiment in term used in this application, and is not intended to be limiting the application.
" one kind ", " described " and "the" of singulative used in the application and appended claims are also intended to including majority
Form, unless context clearly shows that other implications.It is also understood that term "and/or" used herein refers to and wrapped
It may be combined containing one or more associated any or all of project listed.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the application
A little information should not necessarily be limited by these terms.These terms are only used for same type of information being distinguished from each other out.For example, not departing from
In the case of the application scope, the first information can also be referred to as the second information, similarly, and the second information can also be referred to as
One information.Depending on linguistic context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determining ".
In the technical scheme of the disclosure, the excellent specific property based on ceramic material, it is desirable in the housing unit of electronic equipment
In use ceramic material, such as back cover structure, middle frame structure of electronic equipment etc. more and more.
In order to make it easy to understand, the assembling with reference to the back cover structure and middle frame structure of the electronic equipment shown in Fig. 1 is illustrated
Figure, and Fig. 1 shown in Fig. 2 profile, technical scheme of this disclosure is described in detail.As shown in figure 1, electronic equipment
Including back cover structure 1 and middle frame structure 2, the back cover structure includes ceramic member 11 and the rear shell buckle being arranged on ceramic member 11
12, the middle frame structure includes structural member 21 and the center buckle 22 being arranged on structural member 21.During assembling, rear shell buckle 12 with
The phase clamping of center buckle 22, can form corresponding assembling gap, the assembling after the completion of assembling, between ceramic member 11 and structural member 21
Gap is at the cooperation between the ceramic member 11 and structural member 21.
Although there is above-mentioned assembling gap, the wink either assembled between ceramic member 11 and structural member 21
Between, or electronic equipment acted on by external force, may cause between ceramic member 11 and structural member 21 it is close to each other, contact, very
To mutual squeezing action power is produced, so that one side ceramic member 11 is because brittleness of ceramics is high and may chipping, the opposing party
Face ceramic member 11 may cause to damage because hardness is big to structural member 21, especially when structural member 21 is hard using plastics, metal etc.
In the case of material of the degree much smaller than ceramics.
Therefore, the disclosure can buffer dress by setting buffer part 3 at the cooperation between ceramic member 11 and structural member 21
Electronic equipment during matching somebody with somebody or after assembling is by the case of external impacts, and the buffer part 3 can keep out, absorb ceramics
Between part 11 and structural member 21 occur hit or extruding etc. and produce active force, reduction ceramic member 11 with it is any in structural member 21
The destroyed risk in side.
Similarly, for the electronic equipment shown in Fig. 1, can also be used on back cover structure 1 non-ceramic material, in
Ceramic material is used on mount structure 2, and by setting buffer part 3 at cooperation therebetween, equally can be by the buffer part 3
The active forces of the generations such as above-mentioned shock or extruding is kept out, absorbed, with reduce ceramic member 11 with it is any in structural member 21
The destroyed risk in side, here is omitted.
Still by taking the structure shown in Fig. 1 as an example.Coordinate the ceramic member 11 of (such as adjacent) for existing with for structural member 21, being somebody's turn to do
Structural member 21 can also use ceramic material, then when between ceramic member 11 and structural member 21 in assembling process or outer masterpiece
, equally can be 3 pairs by the buffer part by setting buffer part 3 at cooperation therebetween during with lower generation extruding or collision
The active force of the generation such as above-mentioned shock or extruding is kept out, absorbed, to reduce ceramic member 11 and either one in structural member 21
There is the unexpected risk such as fragmentation, here is omitted.
In addition, for other arbitrary structures in electronic equipment, if be related to it is adjacent and exist certain assembling gap,
Two structures of extruding or collision are likely to occur in assembling process or under external force effect, and at least one structure is ceramic member, that
The ceramic member there is fragmentation risk, rather than ceramic member is present by ceramic member crimp, damaged risk, so as to logical
Cross at the assembling gap between two structures and above-mentioned buffer part 3, the effect to generations such as above-mentioned shocks or extruding are set
Power is kept out, absorbed, and the unexpected risk such as occurs damaging to reduce any structure, here is omitted.
It is following to be carried out in detail with the cooperation between ceramic member 11 and structural member 21 to carry out Unify legislation to above-described embodiment
Describe in detail bright.
In one embodiment, buffer part 3 can be arranged on the surface of ceramic member 11 corresponding to each structural member 21
Default cooperation position.Wherein, in order to which the active force to assembling process enters row buffering, the buffer part 3 is using with shock-absorbing capacity
Material manufacture, in the present embodiment, the material with shock-absorbing capacity can be plastic material, for example can be by plastic material system
Make with ceramic member 11 or the pad of the matching surface shape adaptation of structural member 21.Certainly, buffer part 3 can also be all by others
The material that such as rubber has shock-absorbing capacity is made, and the disclosure is not limited this.
Similarly, buffer part 3 can be arranged at the pre- establishing for corresponding to the ceramic member 11 on each surface of structural member 21
Close position so that when structural member 21, ceramic member 11 are respectively fitted to electronic equipment, buffer part 3 can equally be located at structural member 21
At assembling gap between ceramic member 11, so as to realize corresponding pooling feature.
In another embodiment, buffer part 3 can correspond to the matching surface of structural member 21 by being applied on ceramic member 11
Formed after the adhesive layer solidification at place, such as the adhesive layer can be formed using UV glue (i.e. shadowless glue) or other kinds of glue.
Or, shape after buffer part 3 can be solidified by the adhesive layer for the matching surface being applied on structural member 21 corresponding to ceramic member 11
Into.Or, it can correspond to simultaneously on ceramic member 11 at the matching surface of structural member 21, correspond to ceramic member on structural member 21
Adhesive layer is smeared at 11 matching surface, and after formation buffer part 3 after its solidification.
From above-described embodiment, the disclosure can effectively be delayed by setting buffer part between ceramic member and structural member
The active force produced in assembling process due to the shock of ceramic member and structural member is rushed, so as to play guarantor to ceramic member and structural member
Shield is acted on.
For the construction package of above-mentioned electronic equipment, it can in several ways be processed and obtain, below to the structure
The processing technology of component is illustrated：
Fig. 3 is the flow of the processing technology of the construction package of another electronic equipment according to an exemplary embodiment
Figure.As shown in figure 3, the processing technology comprises the following steps：
In step 302, difference forming ceramic part and some structural members.
In the present embodiment, ceramic member can be molded using dry-pressing or Shooting Technique, and structural member is then based on
Different materials, can use corresponding processing mode.When the material of structural member is ceramics, it can use identical with ceramic member
Moulding process, when structural member material be non-ceramic when, can using injection or machining etc. mode to each structure
Part is molded.When structural member one-shot forming is difficult, secondary operation can also be carried out, for example, carries out machine again after moulding
Tool is processed, to obtain the structural member of complexity.
In the present embodiment, the machine-shaping mode of ceramic member and structural member can use for reference the technique described in step 202, this
Place is repeated no more.
In step 304, adhesive layer is smeared at each matching surface of ceramic member and/or some structural members.
In the present embodiment, adhesive layer is coated with the matching surface of ceramic member and/or structural member, after after adhesive layer solidification
Can be as the cushion pad sheet at ceramic member and structural member cooperation, to buffer external forces.
Within step 306, after after adhesive layer solidification, the ceramic member is carried out with charge-coupled with some structural members
Dress, makes the adhesive layer be located at each cooperation of the ceramic member and some structural members.
From above-described embodiment, the disclosure is applied at each matching surface of ceramic member and/or some structural members
Cushioning effect can be played between ceramic member and structural member after daub adhesion coating, and adhesive layer solidification, structure group is improved
The drop resistant anti-seismic performance of part, it is to avoid cause ceramic member or structural member to damage in assembling process, the yields of product can be improved,
And it can also avoid falling due to electronic equipment in routine use, be extruded etc. by external force and cause ceramic member or structural member
Damage, the service life of electronic equipment can be extended.
Fig. 4 is the flow of the processing technology of the construction package of a kind of electronic equipment according to an exemplary embodiment
Figure.As shown in figure 4, the processing technology comprises the following steps：
In step 402, difference forming ceramic part, some structural members and some buffering spacer pads.
In the present embodiment, the machine-shaping mode of ceramic member and structural member can use for reference the technique described in step 302,
Here is omitted.The buffering spacer uses the material with shock-absorbing capacity to manufacture, and the material can be plastic material, by plastic cement
Material manufacture is into the pad with ceramic member matching surface shape adaptation.
In step 404, some buffering spacers are respectively fixedly connected with to the ceramic member surface corresponding to each
The default cooperation position of individual structural member.
In the present embodiment, for ceramic member and the matching relationship of structural member, each buffering spacer is respectively fixedly connected with
To the default cooperation position for corresponding to each structural member on the ceramic member surface, to ensure the another of buffering spacer after the completion of assembling
Matching surface of the one side relative to structural member.
In a step 406, the ceramic member is subjected to cooperation assembling with some structural members, makes some cushion pads
Piece is located at the cooperation of the ceramic member and some structural members respectively.
Similarly, Fig. 5 is the processing work of the construction package of another electronic equipment according to an exemplary embodiment
The flow chart of skill.As shown in figure 5, the processing technology comprises the following steps：
In step 502, difference forming ceramic part, some structural members and some buffering spacers, the step may be referred to Fig. 4
Shown step 402.
In step 504, some buffering spacers are respectively fixedly connected with to some structural member surfaces and corresponded to
The default cooperation position of the ceramic member.
In the present embodiment, it is for ceramic member and the matching relationship of structural member, the buffering spacer of each shaping is solid respectively
Surely the default cooperation position for corresponding to ceramic member on some structural member surfaces is connected to, to ensure cushion pad after the completion of assembling
Matching surface of the another side of piece relative to ceramic member.
In step 506, the ceramic member is subjected to cooperation assembling with some structural members, makes some buffering spacers
At the cooperation for being located at the ceramic member and some structural members respectively.
From above-described embodiment, the disclosure is arranged at ceramics by being molded some buffering spacers, and by the buffering spacer
Between part and structural member, so as to can both buffer the active force produced in assembling process, electronic equipment can also be buffered and run into outside
Active force when portion's extruding or vibrations etc., improves drop resistant anti-seismic performance.
The disclosure also provides a kind of electronic equipment, including：
The construction package of electronic equipment as described in above-mentioned any one of embodiment；
Or, the electronic equipment knot of the electronic devices structure component processing technology manufacture as described in above-mentioned any one of embodiment
Structure component.
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice disclosure disclosed herein
Its embodiment.The application is intended to any modification, purposes or the adaptations of the disclosure, these modifications, purposes or
Person's adaptations follow the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope of the disclosure and spirit are by following
Claim is pointed out.
The preferred embodiment of the application is the foregoing is only, not to limit the application, all essences in the application
God is with principle, and any modification, equivalent substitution and improvements done etc. should be included within the scope of the application protection.
Claims (7)
1. the construction package of a kind of electronic equipment, it is characterised in that including：Ceramic member and it is engaged at least with the ceramic member
One structural member, the ceramic member at the cooperation of at least one structural member with being provided with buffer part.
2. the construction package of electronic equipment according to claim 1, it is characterised in that the buffer part is arranged at the pottery
Correspond to the default cooperation position of each structural member on porcelain piece surface.
3. the construction package of electronic equipment according to claim 1, it is characterised in that the buffer part is arranged at each knot
Correspond to the default cooperation position of the ceramic member in component surface.
4. the construction package of electronic equipment according to claim 1, it is characterised in that the buffer part, which is used, has buffering
The material manufacture of performance.
5. the construction package of electronic equipment according to claim 1, it is characterised in that the buffer part is described by being applied to
Formed after adhesive layer solidification at the matching surface of ceramic member and/or the structural member.
6. the construction package of electronic equipment according to claim 1, it is characterised in that the material of the structural member is ceramics
Or non-ceramic.
7. a kind of electronic equipment, it is characterised in that including：
Electronic devices structure component as any one of claim 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720081583.4U CN206413310U (en) | 2017-01-22 | 2017-01-22 | Electronic equipment and its construction package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720081583.4U CN206413310U (en) | 2017-01-22 | 2017-01-22 | Electronic equipment and its construction package |
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| Publication Number | Publication Date |
|---|---|
| CN206413310U true CN206413310U (en) | 2017-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720081583.4U Active CN206413310U (en) | 2017-01-22 | 2017-01-22 | Electronic equipment and its construction package |
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| Country | Link |
|---|---|
| CN (1) | CN206413310U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108347840A (en) * | 2017-01-22 | 2018-07-31 | 北京小米移动软件有限公司 | Construction package and its processing technology, the electronic equipment of electronic equipment |
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2017
- 2017-01-22 CN CN201720081583.4U patent/CN206413310U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108347840A (en) * | 2017-01-22 | 2018-07-31 | 北京小米移动软件有限公司 | Construction package and its processing technology, the electronic equipment of electronic equipment |
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