CN108347840A - Construction package and its processing technology, the electronic equipment of electronic equipment - Google Patents
Construction package and its processing technology, the electronic equipment of electronic equipment Download PDFInfo
- Publication number
- CN108347840A CN108347840A CN201710047656.2A CN201710047656A CN108347840A CN 108347840 A CN108347840 A CN 108347840A CN 201710047656 A CN201710047656 A CN 201710047656A CN 108347840 A CN108347840 A CN 108347840A
- Authority
- CN
- China
- Prior art keywords
- ceramic member
- electronic equipment
- several
- construction package
- cooperation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
Abstract
The disclosure is directed to the construction package of a kind of electronic equipment and its processing technology, electronic equipments.The construction package of the electronic equipment includes：Ceramic member and with the matched at least one structural member of the ceramic member, be equipped with buffer part at the cooperation of the ceramic member and at least one structural member.The disclosure is by being molded several buffer parts, and the buffer part is set between ceramic member and structural member, to can both buffer the active force generated in assembling process, active force when electronic equipment encounters external macroseism can also be buffered, the drop resistant anti-seismic performance of construction package is improved.
Description
Technical field
This application involves the construction package and its processing technology of field of terminal technology more particularly to a kind of electronic equipment, electricity
Sub- equipment.
Background technology
Ceramic material has smooth surface and excellent gripping feel, and has splendid hardness and abrasion resistance, because
And it is increasingly being applied in the structure and component of the electronic equipments such as mobile phone, tablet.But brittleness of ceramics is high, poor toughness
The characteristics of cause ceramics frangible, if ceramic member in electronic equipment is collided, squeezed with other structures part, be easy to cause pottery
Porcelain piece is chipping or ceramic member damages other structures part, to limit the application of ceramics in the electronic device
Range.
Invention content
The disclosure provides the construction package and its processing technology, electronic equipment of a kind of electronic equipment, to solve the relevant technologies
In deficiency.
According to the first aspect of the embodiments of the present disclosure, the construction package of a kind of electronic equipment is provided, including：
Ceramic member and with the matched at least one structural member of the ceramic member, the ceramic member and at least one knot
Buffer part is equipped at the cooperation of component.
Optionally, the buffer part is set to the default cooperation position for corresponding to each structural member on the ceramic member surface
It sets.
Optionally, the buffer part is set to the default cooperation position for corresponding to the ceramic member on each structural member surface
It sets.
Optionally, the buffer part uses the material with cushion performance to manufacture.
Optionally, the buffer part is by being applied to the gluing of the matching surface of the ceramic member and/or the structural member
It is formed after layer solidification.
Optionally, the material of the structural member is ceramics or non-ceramic.
According to the second aspect of the embodiment of the present disclosure, the processing technology of the construction package of a kind of electronic equipment is provided, including：
It is separately formed ceramic member and several structural members；
Adhesive layer is smeared at each matching surface of ceramic member and/or several structural members；
After adhesive layer solidification, the ceramic member and several structural members are carried out cooperation assembling by structural member, are made
The adhesive layer is located at each cooperation of the ceramic member and several structural members.
According to the third aspect of the embodiment of the present disclosure, the processing technology of the construction package of a kind of electronic equipment is provided, including：
It is separately formed ceramic member, several structural members and several buffering spacers；
Several buffering spacers are respectively fixedly connected with to corresponding to the pre- of each structural member on the ceramic member surface
If cooperation position；
The ceramic member and several structural members are subjected to cooperation assembling, several buffering spacers is made to be located at institute
At the cooperation for stating ceramic member and several structural members.
According to the fourth aspect of the embodiment of the present disclosure, the processing technology of the construction package of another electronic equipment is provided, is wrapped
It includes：
It is separately formed ceramic member, several structural members and several buffering spacers；
Several buffering spacers are respectively fixedly connected with to corresponding to the ceramic member on several structural member surfaces
Default cooperation position；
The ceramic member and several structural members are subjected to cooperation assembling, several buffering spacers is made to be located at institute
At the cooperation for stating ceramic member and several structural members.
According to a fifth aspect of the embodiments of the present disclosure, the disclosure provides a kind of electronic equipment, including：
Electronic devices structure component as described in any one of above-described embodiment；
Alternatively, the electronic equipment of the electronic devices structure component processing technology manufacture as described in any one of above-described embodiment
Construction package.
By above-described embodiment it is found that the disclosure is by being molded several buffer parts, and by the buffer part be set to ceramic member with
Between structural member, to can both buffer the active force generated in assembling process, electronic equipment can also be buffered and encounter outside by force
Active force when shake improves the drop resistant anti-seismic performance of construction package.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 is the construction package schematic diagram of a kind of electronic equipment shown in one exemplary embodiment of the application.
Fig. 2 is the sectional view of construction package shown in Fig. 1 in the assembled condition.
Fig. 3 is the flow according to the processing technology of the construction package of a kind of electronic equipment shown in an exemplary embodiment
Figure.
Fig. 4 is the flow according to the processing technology of the construction package of another electronic equipment shown in an exemplary embodiment
Figure.
Fig. 5 is the flow of the processing technology of the construction package of another electronic equipment shown according to an exemplary embodiment
Figure.
Specific implementation mode
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended
The example of consistent device and method of some aspects be described in detail in claims, the application.
It is the purpose only merely for description specific embodiment in term used in this application, is not intended to be limiting the application.
It is also intended to including majority in the application and "an" of singulative used in the attached claims, " described " and "the"
Form, unless context clearly shows that other meanings.It is also understood that term "and/or" used herein refers to and wraps
Containing one or more associated list items purposes, any or all may be combined.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the application
A little information should not necessarily be limited by these terms.These terms are only used for same type of information being distinguished from each other out.For example, not departing from
In the case of the application range, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as
One information.Depending on context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determination ".
In the technical solution of the disclosure, the excellent specific property based on ceramic material, it is desirable in the housing unit of electronic equipment
In use ceramic material, such as the back cover structure of electronic equipment, middle frame structure etc. more and more.
In order to make it easy to understand, the assembling with reference to the back cover structure and middle frame structure of electronic equipment shown in FIG. 1 is illustrated
The sectional view of figure and Fig. 1 shown in Fig. 2, is described in detail the technical solution of the disclosure.As shown in Figure 1, electronic equipment
Including back cover structure 1 and middle frame structure 2, which includes ceramic member 11 and the rear shell being arranged on ceramic member 11 buckle
12, which includes structural member 21 and the center being arranged on structural member 21 buckle 22.When assembly, rear shell buckle 12 with
Center buckles the clamping of 22 phases, and corresponding assembly gap, the assembly can be formed after the completion of assembly, between ceramic member 11 and structural member 21
At cooperation of the gap i.e. between the ceramic member 11 and structural member 21.
Although there are above-mentioned assembly gap, wink for either being assembled between ceramic member 11 and structural member 21
Between or electronic equipment by outer force effect, may cause between ceramic member 11 and structural member 21 it is close to each other, contact, very
To mutual squeezing action power is generated, to which one side ceramic member 11 may chipping, another party since brittleness of ceramics is high
Face ceramic member 11 due to its high hardness may damage structural member 21, especially hard using plastics, metal etc. when structural member 21
In the case of material of the degree much smaller than ceramics.
Therefore, the disclosure can buffer dress by the way that buffer part 3 is arranged at the cooperation between ceramic member 11 and structural member 21
With the electronic equipment in the process or after assembly by the case of external impacts, which can keep out, absorb ceramics
Between part 11 and structural member 21 occur hit or squeeze etc. and generate active force, reduce ceramic member 11 with it is any in structural member 21
The risk being just destroyed.
Similarly, for electronic equipment shown in FIG. 1, can also be used on back cover structure 1 non-ceramic material, in
Ceramic material is used on mount structure 2, and by the way that buffer part 3 is arranged at cooperation therebetween, it equally can be by the buffer part 3
The active force of the generations such as above-mentioned shock or extruding is kept out, is absorbed, with reduce ceramic member 11 with it is any in structural member 21
The risk being just destroyed, details are not described herein again.
Still by taking structure shown in FIG. 1 as an example.For there is the ceramic member 11 of cooperation (such as adjacent) with for structural member 21, it is somebody's turn to do
Structural member 21 can also use ceramic material, then when between ceramic member 11 and structural member 21 in assembling process or outer masterpiece
It, equally can be right by the buffer part 3 by the way that buffer part 3 is arranged at cooperation therebetween when being squeezed or collided with lower generation
The active force of the generations such as above-mentioned shock or extruding is kept out, is absorbed, to reduce ceramic member 11 and either one in structural member 21
There are the unexpected risks such as fragmentation, details are not described herein again.
In addition, for any other structure in electronic equipment, if be related to it is adjacent and exist certain assembly gap,
Two structures of extruding or collision are likely to occur in assembling process or under outer force effect, and at least one structure is ceramic member, that
The ceramic member there is fragmentation risk rather than ceramic member exists by ceramic member crimp, damaged risk, so as to logical
Above-mentioned buffer part 3 is set at the assembly gap crossed between two structures, the effect to generations such as above-mentioned shocks or extruding
Power is kept out, is absorbed, and the unexpected risk such as occurs damaging to reduce any structure, details are not described herein again.
It is following to be carried out in detail with the cooperation between ceramic member 11 and structural member 21 to carry out Unify legislation to above-described embodiment
It describes in detail bright.
In one embodiment, buffer part 3 can be set on 11 surface of the ceramic member corresponding to each structural member 21
Default cooperation position.Wherein, in order to which to the active force of assembling process, into row buffering, the buffer part 3 is using with cushion performance
Material manufacture, in the present embodiment, the material with cushion performance can be plastic material, such as can be by plastic material system
The gasket with 21 matching surface shape adaptation of ceramic member 11 or structural member made.Certainly, buffer part 3 can also be by other all
Such as there is rubber the material of cushion performance to be made, and the disclosure is limited not to this.
Similarly, buffer part 3 can be set to the pre- establishing for corresponding to the ceramic member 11 on 21 surface of each structural member
Close position so that when structural member 21, ceramic member 11 are respectively fitted to electronic equipment, buffer part 3 can equally be located at structural member 21
At assembly gap between ceramic member 11, to realize corresponding pooling feature.
In another embodiment, buffer part 3 can correspond to the matching surface of structural member 21 by being applied on ceramic member 11
It is formed after the adhesive layer solidification at place, for example UV glue (i.e. shadowless glue) may be used for the adhesive layer or other kinds of glue is formed.
Alternatively, buffer part 3 can be by shape after the adhesive layer solidification for the matching surface being applied on structural member 21 corresponding to ceramic member 11
At.Alternatively, can correspond on ceramic member 11 simultaneously at the matching surface of structural member 21, correspond to ceramic member on structural member 21
Adhesive layer is smeared at 11 matching surface, and forms buffer part 3 after its solidification.
By above-described embodiment it is found that the disclosure between ceramic member and structural member by being arranged buffer part, can effectively delay
The active force generated due to the shock of ceramic member and structural member in assembling process is rushed, to play guarantor to ceramic member and structural member
Shield acts on.
For the construction package of above-mentioned electronic equipment, can be processed to obtain in several ways, below to the structure
The processing technology of component is illustrated：
Fig. 3 is the flow of the processing technology of the construction package of another electronic equipment shown according to an exemplary embodiment
Figure.As shown in figure 3, the processing technology includes the following steps：
In step 302, ceramic member and several structural members are separately formed.
In the present embodiment, dry-pressing may be used or Shooting Technique is molded ceramic member, and structural member is then based on
Corresponding processing method may be used in different materials.When the material of structural member is ceramics, may be used identical as ceramic member
Moulding process, when the material of structural member be non-ceramic when, the modes such as injection molding or mechanical processing may be used to each structure
Part is molded.When structural member one-pass molding difficulty, secondary operation can also be carried out, such as carry out machine again after moulding
Tool is processed, to obtain complicated structural member.
In the present embodiment, the machine-shaping mode of ceramic member and structural member can use for reference the technique described in step 202, this
Place repeats no more.
In step 304, adhesive layer is smeared at each matching surface of ceramic member and/or several structural members.
In the present embodiment, it is coated with adhesive layer at the matching surface of ceramic member and/or structural member, after adhesive layer solidification
It can be as the cushion pad sheet at ceramic member and structural member cooperation, to buffer external forces.
Within step 306, it after adhesive layer solidification, the ceramic member and several structural members match is combined
Dress makes the adhesive layer be located at each cooperation of the ceramic member and several structural members.
By above-described embodiment it is found that the disclosure is applied in each matching surface of ceramic member and/or several structural members
Daub adhesion coating, and cushioning effect can be played between ceramic member and structural member after adhesive layer solidification, improve structure group
The drop resistant anti-seismic performance of part avoids that ceramic member or structural member is caused to damage in assembling process, can improve the yields of product,
And it can also be avoided in routine use since electronic equipment falls, is squeezed etc. by external force and causes ceramic member or structural member
Damage, can extend the service life of electronic equipment.
Fig. 4 is the flow according to the processing technology of the construction package of a kind of electronic equipment shown in an exemplary embodiment
Figure.As shown in figure 4, the processing technology includes the following steps：
In step 402, ceramic member, several structural members and several buffering spacer gaskets are separately formed.
In the present embodiment, the machine-shaping mode of ceramic member and structural member can use for reference the technique described in step 302,
Details are not described herein again.The buffering spacer uses the material with cushion performance to manufacture, which can be plastic material, by plastic cement
Material manufacture is at the gasket with ceramic member matching surface shape adaptation.
In step 404, several buffering spacers are respectively fixedly connected with each to corresponding on the ceramic member surface
The default cooperation position of a structural member.
In the present embodiment, for the matching relationship of ceramic member and structural member, each buffering spacer is respectively fixedly connected with
The default cooperation position for corresponding to each structural member on to the ceramic member surface, buffering spacer is another after the completion of being assembled with guarantee
Matching surface of the one side relative to structural member.
In a step 406, the ceramic member and several structural members are subjected to cooperation assembling, make several cushion pads
Piece is located at the cooperation of the ceramic member and several structural members.
Similarly, Fig. 5 is the processing work according to the construction package of another electronic equipment shown in an exemplary embodiment
The flow chart of skill.As shown in figure 5, the processing technology includes the following steps：
In step 502, it is separately formed ceramic member, several structural members and several buffering spacers, which can be with reference chart 4
Shown step 402.
In step 504, several buffering spacers are respectively fixedly connected with to corresponding on several structural member surfaces
The default cooperation position of the ceramic member.
In the present embodiment, for the matching relationship of ceramic member and structural member, each molding buffering spacer is solid respectively
Surely it is connected to the default cooperation position for corresponding to ceramic member on several structural member surfaces, to ensure cushion pad after the completion of assembling
Matching surface of the another side of piece relative to ceramic member.
In step 506, the ceramic member and several structural members are subjected to cooperation assembling, make several buffering spacers
It is located at the cooperation of the ceramic member and several structural members.
By above-described embodiment it is found that the disclosure is by being molded several buffering spacers, and the buffering spacer is set to ceramics
Between part and structural member, to can both buffer the active force generated in assembling process, electronic equipment can also be buffered and encountered outside
Active force whens portion's extruding or vibrations etc., improves drop resistant anti-seismic performance.
The disclosure also provides a kind of electronic equipment, including：
Such as the construction package of above-described embodiment any one of them electronic equipment；
Alternatively, such as the electronic equipment knot of above-described embodiment any one of them electronic devices structure component processing technology manufacture
Structure component.
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice disclosure disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and includes the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
The foregoing is merely the preferred embodiments of the application, not limiting the application, all essences in the application
With within principle, any modification, equivalent substitution, improvement and etc. done should be included within the scope of the application protection god.
Claims (10)
1. the construction package of a kind of electronic equipment, which is characterized in that including：Ceramic member and matched at least with the ceramic member
It is equipped with buffer part at one structural member, the ceramic member and the cooperation of at least one structural member.
2. the construction package of electronic equipment according to claim 1, which is characterized in that the buffer part is set to the pottery
Correspond to the default cooperation position of each structural member on porcelain piece surface.
3. the construction package of electronic equipment according to claim 1, which is characterized in that the buffer part is set to each knot
Correspond to the default cooperation position of the ceramic member in component surface.
4. the construction package of electronic equipment according to claim 1, which is characterized in that the buffer part, which uses, has buffering
The material of performance manufactures.
5. the construction package of electronic equipment according to claim 1, which is characterized in that the buffer part is described by being applied to
It is formed after adhesive layer solidification at the matching surface of ceramic member and/or the structural member.
6. the construction package of electronic equipment according to claim 1, which is characterized in that the material of the structural member is ceramics
Or non-ceramic.
7. the processing technology of the construction package of a kind of electronic equipment, which is characterized in that including：
It is separately formed ceramic member and several structural members；
Adhesive layer is smeared at each matching surface of ceramic member and/or several structural members；
After adhesive layer solidification, the ceramic member and several structural members are carried out cooperation assembling by structural member, are made described
Adhesive layer is located at each cooperation of the ceramic member and several structural members.
8. the processing technology of the construction package of a kind of electronic equipment, which is characterized in that including：
It is separately formed ceramic member, several structural members and several buffering spacers；
Several buffering spacers are respectively fixedly connected with to the pre- establishing for corresponding to each structural member on the ceramic member surface
Close position；
The ceramic member and several structural members are subjected to cooperation assembling, several buffering spacers is made to be located at the pottery
At the cooperation of porcelain piece and several structural members.
9. the processing technology of the construction package of a kind of electronic equipment, which is characterized in that including：
It is separately formed ceramic member, several structural members and several buffering spacers；
Several buffering spacers are respectively fixedly connected with to corresponding to the pre- of the ceramic member on several structural member surfaces
If cooperation position；
The ceramic member and several structural members are subjected to cooperation assembling, several buffering spacers is made to be located at the pottery
At the cooperation of porcelain piece and several structural members.
10. a kind of electronic equipment, which is characterized in that including：
Such as electronic devices structure component according to any one of claims 1 to 6；
Alternatively, the electronic equipment knot of the electronic devices structure component processing technology manufacture as described in any one of claim 7 to 9
Structure component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710047656.2A CN108347840A (en) | 2017-01-22 | 2017-01-22 | Construction package and its processing technology, the electronic equipment of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710047656.2A CN108347840A (en) | 2017-01-22 | 2017-01-22 | Construction package and its processing technology, the electronic equipment of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108347840A true CN108347840A (en) | 2018-07-31 |
Family
ID=62974734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710047656.2A Pending CN108347840A (en) | 2017-01-22 | 2017-01-22 | Construction package and its processing technology, the electronic equipment of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108347840A (en) |
Citations (8)
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| CN102117104A (en) * | 2010-01-06 | 2011-07-06 | 苹果公司 | Assembly of display module |
| CN102202477A (en) * | 2010-03-26 | 2011-09-28 | 深圳富泰宏精密工业有限公司 | Electronic device shell |
| CN102402038A (en) * | 2011-11-29 | 2012-04-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and manufacturing method for same |
| CN103974570A (en) * | 2013-01-25 | 2014-08-06 | 云辉科技股份有限公司 | Composite molded window protection structure and electronic device composed of composite molded window protection structure |
| CN105188291A (en) * | 2015-09-14 | 2015-12-23 | 小米科技有限责任公司 | Electronic equipment shell body and electronic equipment |
| CN105704268A (en) * | 2016-01-29 | 2016-06-22 | 华为技术有限公司 | A cover plate glass assembly |
| CN105960116A (en) * | 2015-03-08 | 2016-09-21 | 苹果公司 | Co-molded ceramic and polymer structure |
| CN206413310U (en) * | 2017-01-22 | 2017-08-15 | 北京小米移动软件有限公司 | Electronic equipment and its construction package |
-
2017
- 2017-01-22 CN CN201710047656.2A patent/CN108347840A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102117104A (en) * | 2010-01-06 | 2011-07-06 | 苹果公司 | Assembly of display module |
| CN102202477A (en) * | 2010-03-26 | 2011-09-28 | 深圳富泰宏精密工业有限公司 | Electronic device shell |
| CN102402038A (en) * | 2011-11-29 | 2012-04-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and manufacturing method for same |
| CN103974570A (en) * | 2013-01-25 | 2014-08-06 | 云辉科技股份有限公司 | Composite molded window protection structure and electronic device composed of composite molded window protection structure |
| CN105960116A (en) * | 2015-03-08 | 2016-09-21 | 苹果公司 | Co-molded ceramic and polymer structure |
| CN105188291A (en) * | 2015-09-14 | 2015-12-23 | 小米科技有限责任公司 | Electronic equipment shell body and electronic equipment |
| CN105704268A (en) * | 2016-01-29 | 2016-06-22 | 华为技术有限公司 | A cover plate glass assembly |
| CN206413310U (en) * | 2017-01-22 | 2017-08-15 | 北京小米移动软件有限公司 | Electronic equipment and its construction package |
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