CN206401347U - A kind of flip LED base plate for packaging - Google Patents
A kind of flip LED base plate for packaging Download PDFInfo
- Publication number
- CN206401347U CN206401347U CN201621112625.8U CN201621112625U CN206401347U CN 206401347 U CN206401347 U CN 206401347U CN 201621112625 U CN201621112625 U CN 201621112625U CN 206401347 U CN206401347 U CN 206401347U
- Authority
- CN
- China
- Prior art keywords
- base plate
- packaging
- flip
- pad
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A kind of flip LED base plate for packaging, is set around the pad of substrate and solder or conducting resinl is coated with solder mask, pad, and flip-chip is welded on pad.A kind of flip LED base plate for packaging of the utility model, can effectively solve solder or conducting resinl heating in welding process and be flowed after melting, the short circuit of chip positive and negative electrode be easily caused, so that the problem of causing wafer damage.
Description
Technical field
The utility model is related to LED flip chip technologies field, specifically a kind of flip LED base plate for packaging.
Background technology
, it is necessary to be coated by the mode such as silk-screen printing and spraying on the pad of substrate in current flip LED encapsulation process
Solder or conducting resinl, then the electrode of flip LED chips be connected to pad and welded by modes such as hot pressing or Reflow Solderings
Connect.But in welding process, due to that can be flowed after solder or conducting resinl heating thawing, if the solder of flowing causes chip
Both positive and negative polarity connection, which will result in short circuit, causes wafer damage, is a technical barrier of encapsulation field.
The content of the invention
In view of this, the utility model provides a kind of flip LED base plate for packaging, can effectively solve solder in welding process
Or flowed after conducting resinl heating thawing, the short circuit of chip positive and negative electrode is easily caused, so that the problem of causing wafer damage.
The technical scheme that the utility model is taken is：
A kind of flip LED base plate for packaging, coated around the pad of substrate be coated with solder mask, pad solder or
Conducting resinl, flip-chip is welded on pad.
The solder mask is liquid photo-imaging solder mask.
The solder mask thickness is 0.02-0.1mm.
The substrate is the composite of metal material, ceramic material or PPA and metal.
A kind of flip LED base plate for packaging of the utility model, solder mask is set using the region beyond the pad on substrate,
Flip-chip is avoided in welding process, positive and negative electrode causes short circuit and causes wafer damage.Especially for polycrystalline product, such as one
Individual lamp has more than 100pcs Flip chip chips, can greatly promote product yield, reduce cost.
Brief description of the drawings
Fig. 1 is the utility model base plan structural representation.
Fig. 2 is that the utility model substrate is used for the schematic cross-sectional view of Flip-Chip Using.
Embodiment
As shown in Figure 1 and Figure 2, a kind of flip LED base plate for packaging, coats solder mask 2, weldering around the pad 3 of substrate 1
Solder or conducting resinl are coated with disk 3, flip-chip 4 is attached on solder or conducting resinl, passes through hot pressing or reflux type
It is welded on pad 3.
The solder mask 2 is liquid photo-imaging solder mask.Principal component includes：1., epoxy and propylene with photosensitive property
Acid resin, such as:Third diphenol epoxy resin, novolac epoxy resin, middle phenol epoxy resin and urethane etc..2. it is, light-initiated
Agent：Such as thioxanthone, benzophenone, carbonyls, look into ketone, amido organo-metallic compound.3., filler：Such as silica
Powder.④：Curing agent：Such as aromatic series fat, acid anhydrides, miaow are sighed class.5. solvent：Such as ether-ether class.6. defoamer etc..
The painting method of the solder mask 2 typically uses silk screen process, similar with wet film.
The thickness of solder mask 2 is 0.02-0.1mm.The thickness of solder mask 2 is determined according to the thickness of copper foil on substrate 1
, the thick corresponding solder mask of copper foil will be thick.Thickness is that 0.02-0.1mm is optimally suitable for the utility model substrate
Thickness.Too thick influence flip-chip 4 is welded, too thin not have welding resistance effect.
The substrate 1 is the composite of metal material, ceramic material or PPA and metal.Its heat conduction of different materials
Property, insulating properties are different with temperature tolerance, according to the specific requirement and application of different products, from different materials.
Implementation steps：
Coated with solder or conducting resinl 7, are sticked after flip-chip 4 on the pad 3 of substrate 1, by way of hot pressing or backflow
Welding, is melted into liquid easily to around flowing, at this moment solder mask 2 just serves prevention weldering after solder or conducting resinl 7 are heated
Material or conducting resinl 7 to beyond pad 3 region flow effect so that avoid the positive electrode 6 of flip-chip 4, negative electrode 5 because
Flowing causes connection short circuit after solder or the heated thawing of conducting resinl 7.
Claims (3)
1. a kind of flip LED base plate for packaging, it is characterised in that：In substrate（1）Pad（3）Surrounding coating solder mask（2）, weldering
Disk（3）On be coated with conducting resinl, flip-chip（4）It is welded on pad（3）On, the solder mask（2）Thickness is 0.02-0.1mm.
2. a kind of flip LED base plate for packaging according to claim 1, it is characterised in that：The solder mask（2）For liquid light
Photo-imaged solder.
3. a kind of flip LED base plate for packaging according to claim 1, it is characterised in that：The substrate（1）For metal material
Matter, ceramic material or PPA and metal composite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621112625.8U CN206401347U (en) | 2016-10-11 | 2016-10-11 | A kind of flip LED base plate for packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621112625.8U CN206401347U (en) | 2016-10-11 | 2016-10-11 | A kind of flip LED base plate for packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206401347U true CN206401347U (en) | 2017-08-11 |
Family
ID=59508155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621112625.8U Expired - Fee Related CN206401347U (en) | 2016-10-11 | 2016-10-11 | A kind of flip LED base plate for packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206401347U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110444562A (en) * | 2019-08-16 | 2019-11-12 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
| CN112993121A (en) * | 2020-08-25 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Chip bonding method and micro light-emitting diode display |
| CN113328029A (en) * | 2020-02-28 | 2021-08-31 | 惠州市聚飞光电有限公司 | LED packaging device |
-
2016
- 2016-10-11 CN CN201621112625.8U patent/CN206401347U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110444562A (en) * | 2019-08-16 | 2019-11-12 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
| CN110444562B (en) * | 2019-08-16 | 2021-12-21 | 成都辰显光电有限公司 | Display panel and display device |
| CN113328029A (en) * | 2020-02-28 | 2021-08-31 | 惠州市聚飞光电有限公司 | LED packaging device |
| CN112993121A (en) * | 2020-08-25 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Chip bonding method and micro light-emitting diode display |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170811 Termination date: 20181011 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |